• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The aligning device covers masks and substrate plates in the photolithographic prodn. of semiconductor components by the step and repeat process, accelerating the alignment, and making the different steps of the alignment process independent of each other. The substrate is held on a support permitting fine adjustment along the x and y axes, and rotation in the xy plane. The support is, in turn, mounted on a table with coarse adjustment in the x and y axes. The supports are linked for initial coarse adjustment and separated for the final fine adjustment.
    公开号:SU911439A1
    申请号:SU777770029
    申请日:1977-11-02
    公开日:1982-03-07
    发明作者:Эрхард Йакш
    申请人:Феб Карл Цейссйена(Инопредприятие)；
    IPC主号:
    专利说明:

    (5) DEVICE FOR COMBINING MASKS AND SUBSTRATES
    I
    The invention relates to a device for combining masks and substrates, in which the mask is centered relative to the optical axis of the projection device, which are located on the structure mask during design transfer to the surface of the semiconductor substrate, and the substrate for coarse and precise positioning is fixed on guides X and Y and turning in the XY plane an installation for receiving the substrate, which, in turn, is located on roughly rotated in the direction xx and y cross table.
    In the photolithographic fabrication of semiconductor elements, the structures present on the mask are transferred to the semiconductor substrate by means of projection or contact copying. For the manufacture of a subconductor device
    It requires a large number of masks with different structures, which sequentially serve to expose the same area of the substrate. For 3toro, before each new exposure, it is necessary by moving and rotating the mask and / or the substrate to make a combination of marked marks or already existing structures of the mask and the substrate. To achieve this, very sensitive movement of the mask or the substrate is necessary. In most cases, the suction cup to the flat surface of the substrate is. relative to the mask, with the mask being pre-positioned in the optical axis of the projection lens.
    If during the exposure the surface of the substrate is fully used, the displacement system with relatively short paths is used. For this purpose, those drive mechanisms that use such physical ones are suitable 59 The first arresting device is made in the form of pneumatically or electromagnetically controlled terminal clamping, and the micromanagement mechanism is movably in the direction of the optical axis of the Ive as the second articulator for c; the tool has an vacuum-suction device. A projection lens and a micro-steering mechanism can be installed in one common bridge, it is also possible to directly connect the microparking mechanism with a projection device Two acting on the installation for receiving the substrate of the control element are located perpendicular to each other in the directions of the X and Y axes, and the third control The element is parallel to the Y axis and the points of the application of both to the Y axis in parallel of the control elements lie; on the axis, X. Each control element consists of one active control element. conducting element and one passive slide for varying the lengths of the transmission control member for receiving installation on substrates. FIG. Figure 1 shows devices for combining a mask with placed and in the form of a raster in sections of the substrate ntesepx, section; in fig. 2 cross table with installation for receiving the substrate and micro-mechanism, side view; in fig. 3 installation for receiving the substrate, partially closed. Onojie 1 is a cross table 2 with the corresponding 2.1 drive systems for the X coordinate and 2.2 for the coordinate U. On the crossbar 2 on three ball bearings 4 there is an installation for supporting substrates 3. Ball bearings can be replaced with 6bttib support springs. On the installation for receiving the substrates 3, the fixed exposed substrate 5 Above in the bridge 6 of the Projection lens 7 there is a mask already installed relative to the optical axis A (not shown). Bridge 6 also contains a micro-control mechanism 9, which has the possibility of vertical shift-1 | not for small values of the nocpepvTBOM spring hinge 10. A vacuum suction device represented by a vacuum suction device 11, through three support springs 12, is connected to mechanism 9 by a microengine. To move around the axes X and Y and rotate the installation for receiving the substrates 3 around the intersection point of the axes X and Y, the micromanagement mechanism has three control elements 91 ,. 9-2, 9-3, the direction of action of the control element 9-1 to move in the X direction is changed by means of a spring hinge 13 to 0 (Fig. 3). The points of no force; control elements for movement in the etch 9.2 and rotation 9.3 lie on the X axis, so that the support of the Substrate 5 is provided around a specific axis of rotation that passes through the Provisional mark 8 contained on the Substrate 5. The control elements consist of one active control element 9.1.1,9.2.1,9-3.1 and one passive Slider 9-1-2, 9-2.2, 9.3-2 (Fig. 1). The Active Element may consist of electrically resistant material, the change in length of which is transferred by means of a passive slider to the installation for receiving substrates 3Ha of FIG. 2 shows the ball stop device 14 of the cross table 2 with the installation for receiving the substrates 3 Oyo consists of the ball A.A.li which, by means of the flat Spring 14.2, is fixed on the lower side of the device for the orientation of the substrates 3 and is connected to the piston 14.4 by means of the rod spring T4.3. The piston 14.4 slides in the cylinder T4. 5, having an inlet for air suction. When air is suctioned out, the ball 14.1 is drawn into the cone 14.6 and thus causes the connection of the installation for receiving the substrates 3 with the cross table 2. In this position, the cross table 2 moves the substrate 5 to the first one specified by the specific X and Y values. After coarse positioning, the alignment marks on the mask will not yet be aligned with the marks on the substrate. This will be done by a ball arresting device 14, i.e. The installation for receiving substrates 3 can now be moved a small value relative to the cross table 2. At the same time, the installation for receiving substrates 3 is connected via a vacuum suction device 11 with the microproper mechanism 9. When actuating control elements 9-1. 9-2
    3 I
    effects like electro or magnetostrictive.
    If for the complete exposure of the substrate surface several separate overlapping and sequential or arranged in raster order individual exposures are required, then in addition to the sensitive movement system with small paths, there must be a second movement system that allows large movements and is suitable for moving the substrate steps chato-step method.
    A known device for making masks from a photolac, containing a sensitively movable table, carrying a manufactured mask, mechanically connected to a cross table. With the help of a cross table, the mask is roughly positioned. Accurate positioning in the directions of the X and Y coordinates causes a non-power, precise setting mechanism acting between the two tables, working mainly on the physical effect (thermal expansion, electric or magnetostriction). If for exact positioning the mask must be rotated in the XY plane around a certain point, then an additional rotary table is needed, placed on a sensitively movable table and set in motion separately. ,
    The drawbacks of such a device are that the overall table system is relatively unstable due to the additional plane and is easily prone to oscillations, moreover, the danger of unwanted tipping around the X and Y axes is very high.
    When using the device not only for making the masks, but also for exposing the substrates in a step-by-step manner, there are also other significant disadvantages. Since this device has only one single, defined by the axis of the turntable, the pivot point, the basic requirements for each adjustment cannot be fulfilled, which is that, first, a full adjustment must be made from as few individual steps as possible. and, second, no adjustment step should affect the result of any predudy 394
    step. After each rotation of the substrate, the already established points in the X and Y direction must be adjusted again, since the crossing point of the X and Y coordinates does not accidentally lie on the axis of rotation of the turntable. In especially unfavorable cases, the adjustment steps must be repeated many times, so that a precise alignment time which is not justified is necessary to precisely align the mask with the substrate.
    It is also known a device in which moving along X and Y and turning
    5 tables, carrying the substrate, is achieved, using three actuators, the first of which lies in the same direction of the coordinates, and the other two are located to it under the right
    0 corners. By adjusting the two parallel actuators separately, the substrate is rotated.
    This device can be implemented not any point of rotation on the substrate, so that the exact installation of the substrate is possible only with a long iterative process. In addition, in a device with automatic control, the signal-to-path ratio is constantly changing.
    The purpose of the invention is to reduce the alignment and installation time, thereby reducing the time and cost of semiconductor manufacturing.
    5 items.
    The target is achieved by the fact that the 3 substrate device for coarse and precise positioning is fixed on the movable
    0 of the micromanagement mechanism in the X and Y directions and turning in the XY plane the device for receiving the substrate, which in turn is located on a roughly moving in
    5 directions X and. At the cross table, the cross table has a device that interacts with the installation for receiving the substrate during the coarse position:
    0 and a micromanagement mechanism having. Three well-known control elements, mounted stationary relative to the optical axis A of the projection device and connected to a second arresting device, which interacts with exact installation during precise positioning. to receive the substrate.
    79
    and 9-3, precise positioning of the substrate. After exposure of the first section, the micro-control mechanism 9 is disconnected from the installation for receiving the substrates 3 and the latter is again connected to the cross table 2. The cross table leads the substrate to the second operating position, after which the working steps are repeated until the substrate 5 fully exposed.
    The proposed device for combining masks and chip substrates in comparison with the known ones has the following advantages.
    For a certain movement of the substrate table, no centering is required} the adjustment movement of the control elements is completely converted to the desired direction of movement. With automatic combining, the signal obtained when deviating from a predetermined position is similarly converted into a setting motion; The control elements can be far away from the substrates, so that the errors contributing to the substrate are reduced, for example due to heat.
    The micromanagement mechanism may be relatively large. Good accessibility is also ensured by good maintenance, as well as quick change and alignment without unmounting the installation for receiving substrates; the installation for receiving substrates is not affected by wires from which to supply energy to the control elements.
    权利要求:
    Claims (7)
    [1]
    1. A device for combining masks and substrates of a microchip, in which the mask is mounted relative to the optical axis of the projection device, and the structures on the mask are projected onto a portion of the substrate surface, and the substrate for coarse and precise positioning is fixed on the apparatus for receiving the substrate moving in the X direction and Y and Povo, - - rotating in the plane X, Y with
    by the power of the micromanagement mechanism, and which, in turn, is mounted on the cross table, roughly moving in the X and Y direction, about t5 characterized by the fact that the cross table has the first locking device that interacts with the installation for receiving the substrate during the rough movement, and
    o micromanaging mechanism having three in a certain order located control elements fixedly mounted relative to the optical axis A of the projection device
    5 and is coupled with a second arresting device that interacts with an installation for receiving a substrate with precise movement.
    [2]
    2. The device according to claim 1, h and 0 h and y, e. So that the first locking device is made in the form of a pneumatically or electrically acting terminal clamp fastening.
    five
    [3]
    3. The device according to claim 1, wherein the micro-steering mechanism is movable along the direction of the optical axis A and as the second arresting device
    0 has a vacuum suction device.
    [4]
    4. The device according to claim 1, wherein the projection device and the micromanagement mechanism are housed in a common jumper.
    [5]
    5. The device according to Claim 1, characterized in that the micro-control mechanism is directly connected with the projection device.
    0
    [6]
    6. Device pop. 1, t tl iz a y shche e s. the fact that the two control elements connected to the installation for receiving the substrate are perpendicular to each other
    5 along the X and -Y axes, and the third control element is located parallel to the Y axis and the points. Both of the attachments to the Y axis parallel to the lying control elements lie on the X axis.
    [7]
    7. The device according to claim 1, wherein the control elements consist of one active control element and one passive slider.
    / / / 9.2 / j fj.2 / / / / "(7 f.f
    ug./.ff / /
    类似技术:
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    同族专利:
    公开号 | 公开日
    DD128165B1|1979-12-27|
    DE2747439A1|1978-06-01|
    FR2375631A1|1978-07-21|
    DD128165A1|1977-11-02|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    RU191704U1|2019-06-03|2019-08-19|Открытое Акционерное Общество "Научно-Исследовательский Институт Полупроводникового Машиностроения |Block for centering semiconductor wafers on a vacuum stage in a photolithography cluster line before carrying out technological operations|
    US4473293A|1979-04-03|1984-09-25|Optimetrix Corporation|Step-and-repeat projection alignment and exposure system|
    EP0111660A3|1979-04-03|1984-10-03|Eaton-Optimetrix Inc.|Photometric printing apparatus|
    US4573791A|1979-04-03|1986-03-04|Optimetrix Corporation|Step-and-repeat projection alignment and exposure system|
    US4452526A|1980-02-29|1984-06-05|Optimetrix Corporation|Step-and-repeat projection alignment and exposure system with auxiliary optical unit|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DD19567476A|DD128165B1|1976-11-09|1976-11-09|DEVICE FOR COVERING MASKS AND SUBSTRATE DISCS|
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