• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A catalytic lacquer for the production of printed circuit boards using basic materials and metal deposition methods. The lacquer has the following composition: a binding agent based on synthetic or natural materials; water; a metal salt; a complex former; and a reducing agent. The binding agent may be a water soluble or dispersable compound. The metal salt may be a water soluble palladium, copper, silver, gold or nickel salt, preferably the sulphate. The complex former may be in the form of a compound forming stable complexes with metal ions. The reducing agent may be in the form of formaldehyde, hydrazine or its derivatives, boron compounds, sorbitols, phosphites, or hydrophosphites. The lacquer may also include an organic solvent or solvent mixture, preferably methylene chloride. A filler and stabilizer may also be included in the composition of the lacquer. The lacquer may be applied to base materials by means of silk screen printing, and then dried so that the metal seed layer is strengthened by the action of a metal deposition reduction bath.
    公开号:SU893136A3
    申请号:SU772514605
    申请日:1977-08-04
    公开日:1981-12-23
    发明作者:Хейманн Курт；Рольфф Рольф
    申请人:Шеринг Аг (Инофирма)；
    IPC主号:
    专利说明:

    (54) CATALYTIC MANUFACTURING VARNISH The invention relates to a catalytic varnish for the manufacture of printed circuits using basic materials and a metal deposition process. In practice, a variety of methods for manufacturing printed circuits are carried out. The so-called subtractive method by which printed circuit boards are made both unilateral and bilateral with pass-through connections through the holes is widespread. In the subtractive method, as is well known, the material comes from a one-sided kashirova material that undergoes a negative printing process (light printing or photo printing). In the technique of preparing feedthrough contacts, usually the walls of the openings occupy palladium processes, on which then a conductive connection of the upper and lower sides is made using chemical copper plating. A thin layer of copper / chemically deposited on the walls of the holes should be strengthened on them by means of a very thick layer of copper. Naturally printed imprints galvanic copper grows not only on the walls of the holes, but also on the conductive paths. Conductive paths for the subsequent etching process must be galvanically coated with a material that is resistant to etching, such as tin-lead mixture or tin. Prior to the subsequent etching of the boards, the screen printing varnish is removed and the released copper surfaces are etched with a corresponding etching solution. On average, depending on the type of printed circuit applied, 60 to 70% of copper I is etched. The output of such etching solutions containing significant amounts of copper is very high in production and in all cases represents costly problems of wastewater and protection the environment. With the additive method, on the other hand, glue is applied to the boards, which is then subjected to chemical etching to achieve a sufficiently high adhesive strength, advantageously from the chrome mixture. Then the board is activated in the usual way and thereafter
    Copper is coated with chemical layer up to 4 Sjtt, including possible holes. Then, in a known manner, either by screen printing or by photo printing, a negative circuit of the desired printed circuit board is applied, and with noMOUtti of the subsequent electroplating of copper, the desired thickness of the conductive paths is applied, for example 30ju,.
    The following work steps correspond to the work steps of the described subtractive method 2
    The additive method makes it possible to manufacture considerably thinner conductive paths, since the etching process must etch only 4 - .5 (. The thickness of the chemically applied copper layer, but even this requires many working steps. In addition, in each case the board is pre-coated with glue, in order to achieve good adhesion strength, applied later on the layers of this surface, must be roughened.
    The closest to the technical essence of the invention is a catalytic varnish for the manufacture of printing plates and diagrams, including a water-soluble salt of a hydrophilic film-forming (binder) colloid capable of forming water-soluble salts with multivalent metals (ammonium alginate, Na-polyacrylates, Na-carboxymethylcellulose), salt polyvalent metal (copper sulfate), ammonia, a source of bichromate ions, a non-volatile substance with an acidic reaction, for example p-toluenesulfonic acid, fillers, water 3.
    However, when drying a known coating material, ammonia is removed and the metal salt forms an insoluble complex along with the colloid. The oxidizing agent serves solely to accelerate the curing of the formed film.
    The known composition is inactive with respect to the metal-forming baths, whereby a metal layer does not deposit on the applied surface of the board.
    The purpose of the invention is the formation of a meteschic embryonic layer on the applied surface of the board after you | Sushiva.
    The goal is achieved by the fact that a catalytic varnish for the manufacture of printed circuits, including a binder, copper sulfate, a filler and water, contains as a binder selected from the group consisting of a mixture of methylcellulose and Guar in a ratio of 2: 1 starch and 50% acrylic emulsion in the ratio of 5: 20g as filler aerosil and additionally ethylenediaminetetra-acetic acid as complexing agent, formaldehyde as reducing agent and rhodamine as stabilizer Ator in the following ratio of components, g:
    Binder 3-25
    Copper sulfate10
    Ethylenediaminetetraacetic acid 10-15 Formaldehyde
    AerosilO, 5
    Rhodamine 0.0001
    Water40-65
    In the case of use as a carboxymethylcellulose binder binder, it is contained in an amount of 3 g; when the binder is a mixture of methylcellulose and guar in a 2: 1 ratio, its amount is 3 g, when the binder is a mixture of starch and an acrylic emulsion in a ratio of 5:20 - its amount is 2b g.
    The catalytic varnish may additionally contain 5 g of methylene chloride and 0.0001 g of lauryl ether sulfate.
    The proposed lacquer reduces the number of process steps as compared to the known method of manufacturing the conductive layer, since after applying the lacquer, mainly by screen printing, and drying this varnish, the formed metal layer is enhanced when exposed to the bath / metal precipitator. shoots with palladium, as well as pickling. The use of a bonding agent is no longer required.
    In addition, the metal layer when applied with lacquer is deposited extremely finely and evenly distributed, so that extremely small layer thicknesses can be made, for example, only 0.067 / t, which have exceptional adhesive strength.
    For applying lacquer to base materials, conventional printing methods can be applied, in which the desired sample of conductors is applied to the substrate in a positive printing method, preferably by screen printing. The main boards are plastic-based boards, such as paper, phenolic resin, epoxy glass, flexible thermoplastic, I, and -frame ceramic materials.
    Drying of the applied lacquer can be done by prolonged drying at room temperature or by heating up to 400 ° C. For this, hot air ovens and radiant lamps are used.
    权利要求:
    Claims (3)
    [1]
    To thicken the formed metal layer with a thickness of approximately 0.03 / A. a conventional recovery bath can be used to release the metal, which allows the layer to grow to 50 / bt-. Example 1. Composition of varnish, g: Carboxymethylcellulose 3 Colloidal silicic acid (Aerosil) 0, Water63, Copper sulphate. Yu Ethyleidiamine tetraacetic acid13 Formaldehyde (37% solution) Yu Stabilizer (rhodamine), mg0.1 The NaOH solution has a pH value of 12.8. A screen printing machine is filled with a catalytic lacquer and the sample is printed on a plastic board through a stencil mounted on a plastic board. Then it is burned at 200 ° C for 7 minutes. In addition, copper ions are reduced by copper, and at the same time an adhesive strong bond is obtained between the shell and the surface of the plastic. The board thus treated is immersed in a chemical copper bath and from copper is thickened to 30-50, and .. Then the board is washed and dried. Now it can be equipped with constructive details. PRI mme R 2. Composition of varnish, g: Methylcellulose Guar Aerosil Water. Copper sulphate Ethylene diamine tetraacetic acid Formaldehyde (37% solution) Stabilizer (rhodamine), mg Methylene chloride: pH is adjusted to 12.8 with NaOH solution. The use of this varnish is made in accordance with Example 1. Example 3: Composition of varnish, g: Starch 5 Acrylate emulsion (50%) 20 Aerosil0, Water. 41, Copper sulphate10 Ethylenediaminetetraacetic acid13 Formaldehyde Stabilizer (rhodamine), mg 0 / Wetting agent (lauryl ether sulfate), mg 0, The pH value is adjusted to 12.5 with 30% NaOH. The use of this varnish is made in accordance with Example 1. The lacquers of examples 1-3 of the proposed invention have the following properties: Adhesive strength, N / CM25 Hardness (impact strength), kJ / m 50 Strength, N Thickness of the lacquer layer, µm, according to For example, 150 275 3100 A layer of metallic crystals of crystallization of these varnishes is strengthened by treating the metal-forming bath to a thickness of 30 - 35 / x. The known varnish has the same properties as adhesion strength, hardness, strength and consistency. However, in contrast to the lacquers obtained according to the invention, they are inactive with respect to the metal-forming baths, since the metal layer does not precipitate. Claim 1. Catalytic lacquer for the manufacture of printed circuits, including binder, copper sulfate, filler and water, characterized in that, in order to form a metallic germinal layer on the applied surface of the board after drying, it contains as a binder selected from groups containing carboxymethylcellulose, cm; a mixture of methylcellulose and guar in a ratio of 2: 1; a mixture of starch and a 50% acrylic emulsion in a ratio of 5:20; aerosil and, additionally, ethylenediaminetetraacetic acid as a filler acid as a complexing agent, formaldehyde as a reducing agent, and childbirth as a stabilizer in the following ratio of components, g: Binder 3-25 Copper sulphate. U Ethylenediaminetetraacetic acid 10-15 Formaldehyde Aerosil0,5 Rhodamine0.0.001 Water40-65
    [2]
    2. Luck under item 1, including carbo. xymethylcellulose, distinguished by the fact that it contains 3 g of carboxymethylcellulose. 3. Varnish on p. 1 ,. comprising a mixture of methylcellulose and guar in a 2: 1 ratio, characterized in that it contains 3 g of a mixture of methylcellulose and guar. 4. A varnish according to claim 1, comprising a mixture of starch and an acrylic emulsion in a ratio of 5:20, characterized in that it contains 25 g of a mixture of starch and an acrylic emulsion. 893 5. Luck in accordance with claim 1, distinguished by the fact that it additionally contains 5 g of methylene chloride. . 6. Varnish according to claim 1, of which it additionally contains q0001 g of lauryl ether sulfate. Sources of information taken into account during the examination of 1368 1. Kata ytischer .Lack Zur hersteCeung von gedruckten SchaStungen Gagvanotechnik, 1974, 65, 8, p. 659. 2 For vk FRG and tjitscht / - 1e70
    [3]
    3. Patent of England I 1252826, class, 6 C, 1971 (prototype).
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    同族专利:
    公开号 | 公开日
    JPS5319565A|1978-02-22|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US3361580A|1963-06-18|1968-01-02|Day Company|Electroless copper plating|
    DE1266099B|1965-02-20|1968-04-11|Schering Ag|Bath for the reductive copper deposition|
    US3560257A|1967-01-03|1971-02-02|Kollmorgen Photocircuits|Metallization of insulating substrates|
    US3372059A|1967-04-24|1968-03-05|Dow Chemical Co|Chemical reduction process for silver, copper, or nickel deposition|
    FR1548401A|1967-08-16|1968-12-06|
    US4002786A|1967-10-16|1977-01-11|Matsushita Electric Industrial Co., Ltd.|Method for electroless copper plating|
    US3520723A|1968-01-25|1970-07-14|Eastman Kodak Co|Process for forming a metallic layer on a substrate|
    US3607317A|1969-02-04|1971-09-21|Photocircuits Corp|Ductility promoter and stabilizer for electroless copper plating baths|
    US3904783A|1970-11-11|1975-09-09|Nippon Telegraph & Telephone|Method for forming a printed circuit|
    US3925578A|1971-07-29|1975-12-09|Kollmorgen Photocircuits|Sensitized substrates for chemical metallization|
    US3959547A|1971-07-29|1976-05-25|Photocircuits Division Of Kollmorgen Corporation|Process for the formation of real images and products produced thereby|
    US3915717A|1973-11-12|1975-10-28|Rca Corp|Stabilized autocatalytic metal deposition baths|
    DE2418654A1|1974-04-18|1975-11-06|Langbein Pfanhauser Werke Ag|PROCESS FOR ELECTRONIC SURFACE METALIZATION OF PLASTIC OBJECTS AND A SUITABLE ACTIVATING BATH TO PERFORM THE PROCESS|
    US3930072A|1974-06-28|1975-12-30|Universal Oil Prod Co|Stabilization of metal plating baths|US4719145A|1983-09-28|1988-01-12|Rohm And Haas Company|Catalytic process and systems|
    US4581301A|1984-04-10|1986-04-08|Michaelson Henry W|Additive adhesive based process for the manufacture of printed circuit boards|
    US4581256A|1984-11-19|1986-04-08|Chemline Industries|Electroless plating composition and method of use|
    US5147453A|1987-11-03|1992-09-15|Basf Corporation|Paint compositions containing silver metal flake pigment|
    US5288313A|1990-05-31|1994-02-22|Shipley Company Inc.|Electroless plating catalyst|
    US5120578A|1990-05-31|1992-06-09|Shipley Company Inc.|Coating composition|
    US5075039A|1990-05-31|1991-12-24|Shipley Company Inc.|Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles|
    US5076841A|1990-05-31|1991-12-31|Shipley Company Inc.|Coating composition|
    DE4107644A1|1991-03-09|1992-09-10|Bayer Ag|HYDROPRIMER FOR METALLIZING SUBSTRATE SURFACES|
    DE4111817A1|1991-04-11|1992-10-15|Bayer Ag|FORMULATION FOR ACTIVATING SUBSTRATE SURFACES FOR THEIR CURRENT METALIZATION|
    US5158604A|1991-07-01|1992-10-27|Monsanto Company|Viscous electroless plating solutions|
    US5419954A|1993-02-04|1995-05-30|The Alpha Corporation|Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof|
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    US20020068127A1|2000-12-04|2002-06-06|Francis Durso|Process for selectively plating areas of a substrate|
    KR20080011206A|2005-04-20|2008-01-31|아그파-게바에르트|Process for contact printing of pattern of electroless deposition catalyst|
    KR20190017553A|2017-08-11|2019-02-20|삼성전자주식회사|Film frame, display substrate manufacturing system and display substrate manufacturing method|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE19762635457|DE2635457C2|1976-08-04|1976-08-04|Catalytic varnish and its use in the manufacture of printed circuits|
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