• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The addition of copper, either as a thin film or as an alloy constituent, to nickel-chromium alloys improves the adhesion of such alloys to polymeric substrates and coatings.
    公开号:SU747433A3
    申请号:SU2378250
    申请日:1976-07-06
    公开日:1980-07-07
    发明作者:Луис Воссен Джон (Младший)；Рассел Нимэн Фредерик；Фредерик Николз Джордж
    申请人:Рка Корпорейшн (Фирма)；
    IPC主号:
    专利说明:

    The invention relates to the preparation of a laminate based on a metal coated metal material.
    Most metals have a g weak bond with polymers. Therefore, before applying the metal, the surface of the polymer is suitably treated, for example, by oxidation, roughness, or JQ using an intermediate agent.
    A layered product made of ABS plastic, coated with a layer of copper 30 μm thick and a layer of jg nickel and cobalt 15 μm thick l is known.
    A layered product is known, containing a substrate of acrylonitrile butadiene styrene polymer, a layer of copper deposited on it with a thickness of 20–15–20 μm and a nickel-chromium layer 2.
    The known laminate product is characterized by insufficient adhesion between the layers.
    The purpose of the invention is to increase adhesion between the layers.
    The goal is achieved by the fact that the polymer substrate is made of vinyl polymer, the copper layer is 25-50 A thick and the chromo-ZO layer is
    2
    Nickel alloy thickness of 200-400 A contains, wt%:
    Nickel65-80
    Hrom10-30
    IronErest
    A layer of nickel-chromium alloy is additionally lined with a layer of copper with a thickness of 25-50 A and a film of polystyrene.
    According to one embodiment of the method for producing a laminate according to the invention, a polystyrene substrate is placed in a vacuum chamber and connected to the positive pole of a current source, for example, to a pole of a flat magnetron. The vacuum chamber is provided with a negative copper electrode and another nickel-chromium alloy electrode to be applied to the substrate. The chamber is then evacuated until a vacuum is created in the range from approximately to 3x, after which a small amount of inert gas, such as argon, is supplied to it until a pressure of approximately 15 mT is created in it. It should be noted that pressure is not a critical factor for this purpose and can vary from 2 to 100 mT.
    When using a flat magnetron in the chamber as a current source, the voltage can vary from 300 to 1000 V, and the current can reach 10 A, depending on the desired deposition rate and the size of the electrode.
    Copper electro is first turned on to start copper deposition on the base, which continues until a thin copper layer of approximately 25-50 A is obtained. Then the current supply to the copper electrode is stopped and the nickel-nickel electrode is put into operation to spray an alloy layer of the desired thickness. , usually in the range from 200 to 400 I. In the case when it is necessary to apply a polymer coating on top of a nickel-chromium alloy layer, a third layer of copper can also be applied on top of a layer of chromium-nickel alloy to ensure the presence of onkogo copper layer on the interface between the metal and polymer coating.
    Thin copper films have excellent adhesion properties to polymer bases, especially vinyl ones. In addition, copper films adhere well to chromium-nickel alloy coatings and polymer coatings, especially to styrene polymer coatings.
    Copper can be sprayed simultaneously with a nickel-chromium alloy in the same vacuum chamber. In this case, a nickel-chromium alloy electrode should be used, in which there is pure copper inserted into the cutouts made for this in the electrode. The size and location of the copper in the electrode is selected on the basis of the creation based on the desired coating layer. A current is then applied to the alloy and copper electrode to carry out a sputtering operation, which continues until it is received on the basis of a layer with a thickness of approximately 200 to 400 X.
    As shown by electron spectroscopy as applied to chemical analysis, there is no chemical coating between the copper-containing cutting layer and / or polymer base or coating.
    Below are examples illustrating the invention, but not limiting it, and in the examples all parts and percentages are given by weight,
     Example 1. Two working-from flat magnetron sputtered electrodes are placed in a vacuum chamber: one from copper and the other from Inconel 600, which is a alloy of 76.8 ± 3% nickel, 13.8 ± 3% chromium and 8, 5 ± 2% of iron (plus a small amount of impurities). The size of both cathodes is 20.96 X 9.04 cm. Above the electrodes at a distance of approximately
    i according to, g LLTPP 1; 1T, 1 Pyatl Tchiyaiilov
    With a diameter of 30.48 cm and rotate it at a speed of 40 rpm.
    Next, the chamber is evacuated to a vacuum of 3x10 T, after which argon is fed into the chambers, bringing the pressure in the chamber to about 15 mT. Then a voltage of 360 V is applied to the copper electrode with a current of 0.3 A. Under these conditions, the deposition rate is between 80 and 100 A / min. Copper deposition is continued for approximately 30 s or until a layer with a thickness of approximately 50 S is obtained, after which the electrode is disconnected.
    An InconelBOO electrode is then switched on by applying a voltage of 650 V to it with a current of 1.5 A, which ensures the deposition of electrode material at a speed ranging from about 330 to 400 A / min. This process is continued for approximately 30 s or until a layer of approximately 200 A is obtained, after which the electrode is turned off.
    Alternatively, the copper electrode is reactivated in order to apply another layer of copper approximately 50 A thick over the layer of Inconel-600.
    The metallic coating is tested for adhesion to the base by placing the product for 120 hours at a temperature of 90 ° F (32 ° C) and a relative humidity of 90% in an air atmosphere with tape applied to the surface of the product by braking. When removing the brake tape, no peeling of the covering layer was detected.
    权利要求:
    Claims (2)
    [1]
    Replacement is usually carried out in the usual order, for which it is produced: P1T deposition of the coating layer on very thin alumina discs with subsequent observation of the discs under a microscope during their bending. Tests have shown that the compressive strength of an Inconel-600 coating with a thickness of approximately 225 A has an RHxx.0 dyne / cm, and a three-layer disk coating is only 6-10 dyne / cm. Example 2. The process is carried out according to example 1, except The sputtering electrode is made of Inconel-600, in which two slits are made with a size of 0.64–15.24 cm, one slot at a distance of 1.225 3.11 cm from one longitudinal edge of the electrode and parallel to the latter, and the other at a distance NII 1,245 3.16 cm from the second longitudinal edge of the electrode and parallel to the latter. A 1/4 0.64 cm wide copper rod is inserted into the slot along its length so that the edge is flush with the electrode surface. Such dimensions are chosen so that the central line of one of the copper rods is located in the center of one sprayed track in the electrode, and the other rod is located on the inner edge of the second track in the electrode. The chamber is evacuated until a negative pressure is obtained and argon is fed into it, bringing the total pressure to 1.5-10 T. Then a current of 1.5 is applied to the electrode with a voltage of 650 V, which provides a deposition rate of approximately 330 D 400 8 / min This operation takes about 30 seconds or until a layer of approximately 200 X is obtained. The metal coating thus obtained is subjected to a test for adhesion to the substrate using a brake band for this purpose, as in Example 1. No damage was found to the tape when removing the tape. The compressive strength of the resulting metal coating, measured in Example 1, 5-10 dyn / cm. A metal-coated vinyl disc prepared for example 1 (second option) or in Example 2 is coated with a styrene polymer as follows. A vacuum chamber equipped, as indicated above, was evacuated to about 3-10 T, after which nitrogen was fed to it, up to about 810 T. pressure. Then monomeric styrene was introduced into the chamber, bringing the chamber to 13-10-15. -10 T. The metal-coated disk is suspended above a flat magnetron over a distance of approximately 5.08 cm, having an electrode of 8, 8 cm in size, and the indicated energy source creates a voltage of 680 V at a current frequency of approximately 10 kg. 30 s and the disk is lowered to the level of the electrode, together with it the rotation speed is approximately 40 rpm for 2 minutes to provide a coating of about 350 styrene polymer. The compressive strength of the coating obtained is 3-10 dyne / cm. 1. Laminated product containing a polymer substrate, a copper layer and a nickel-chromium alloy layer, differing in that, in order to increase the adhesion between the layers, the polymer substrate is made of vinyl polymer, the copper layer is 25-50 A thick and the layer Nickel-chromium alloy with a thickness of 200-400 A contains, wt%: Nickel 65-80 Chrome 10-30 Iron Else 2. Layered product according to claim 1, characterized in that the layer of the chromium-nickel alloy is additionally lined with a layer of copper 25-30 A thick and a film of polystyrene. Sources of information taken into account in the examination 1.La meta261zzazion materie pl astiche, Sab anotecnica, 1973, 24, 4, p. 68-71.
    [2]
    2.Crouch P.C. The performance of p6ated ABS - p & astic during atmospheric exposure. Thans. Jnst. Metag. Finish, 1973, 51, 3, p. 117-123 (prototype).
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    同族专利:
    公开号 | 公开日
    JPS5215584A|1977-02-05|
    US4101402A|1978-07-18|
    NL7608202A|1977-01-27|
    JPS5412514B2|1979-05-23|
    AU1556076A|1978-01-12|
    AU501496B2|1979-06-21|
    MX3508E|1981-01-14|
    FR2318734B1|1981-09-25|
    ZA764242B|1977-07-27|
    BR7604680A|1977-08-02|
    IT1065884B|1985-02-25|
    FR2318734A1|1977-02-18|
    AR208783A1|1977-02-28|
    US3984907A|1976-10-12|
    BE844483A|1976-11-16|
    ATA541776A|1978-04-15|
    DE2632520A1|1977-02-10|
    AT347200B|1978-12-11|
    CA1080603A|1980-07-01|
    ES449930A1|1977-12-01|
    PL103465B1|1979-06-30|
    引用文献:
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    GB686031A|1950-05-26|1953-01-14|British Dielectric Res Ltd|Manufacture of metallised polytetrafluorethylene and products thereof|
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    US2834724A|1956-04-26|1958-05-13|Mendes Abraham Piza|Method of electroplating plastic articles|
    US2993806A|1956-12-17|1961-07-25|Gen Tire & Rubber Co|Metal coating of plastics|
    US3069286A|1958-08-07|1962-12-18|Du Pont|Preparation of metallized perfluorocarbon resins|
    US3150939A|1961-07-17|1964-09-29|Ibm|High density record carrier|
    NL6412402A|1963-10-29|1965-05-03|
    US3558290A|1968-04-02|1971-01-26|Union Carbide Corp|Plated plastic printing plates|
    US3591352A|1968-12-04|1971-07-06|Nibot Corp|Processes for selectively plating one component of multi-component plastic articles and articles produced thereby|
    FR2077770B1|1970-02-12|1973-03-16|Michelin & Cie|
    US3842217A|1971-03-22|1974-10-15|Rca Corp|Record fabrication of a capacitive type storage medium|
    US3909517A|1971-03-22|1975-09-30|Rca Corp|Disc records with groove bottom depth variations|
    US3842194A|1971-03-22|1974-10-15|Rca Corp|Information records and recording/playback systems therefor|
    US3843399A|1972-04-19|1974-10-22|Rca Corp|Metallized video disc having an insulating layer thereon|
    US3901994A|1974-02-04|1975-08-26|Rca Corp|Metallized video disc having a dielectric coating thereon|
    US3984907A|1975-07-25|1976-10-12|Rca Corporation|Adherence of metal films to polymeric materials|
    US3982066A|1975-07-25|1976-09-21|Rca Corporation|Metal coating for video discs|US3984907A|1975-07-25|1976-10-12|Rca Corporation|Adherence of metal films to polymeric materials|
    US4077052A|1977-05-04|1978-02-28|Rca Corporation|Video disc capacitive recording means with a conductive bilayer|
    US4077051A|1977-05-04|1978-02-28|Rca Corporation|Video disc with a conductive layer having an oxygen content gradient|
    US4072985A|1977-05-04|1978-02-07|Rca Corporation|Video disc with a dielectric layer formed from styrene and nitrogen|
    JPS54152076A|1978-05-22|1979-11-29|Mitsubishi Motors Corp|Production of plastic molded products with metal thin layer|
    US4247600A|1978-07-28|1981-01-27|Minolta Camera Kabushiki Kaisha|Metallized plastic camera housing and method|
    US4296178A|1979-05-18|1981-10-20|Varian Associates, Inc.|Article comprising a substrate and chromium alloy coating|
    JPS6321259B2|1980-02-21|1988-05-06|Pioneer Electronic Corp|
    EP0071651B1|1981-07-23|1987-06-03|Ibm Deutschland Gmbh|Magnetic-disc substrate with plastics core|
    US4351697A|1982-01-04|1982-09-28|Western Electric Company, Inc.|Printed wiring boards|
    US4446197A|1982-07-23|1984-05-01|The Goodyear Tire & Rubber Company|Ion beam deposition or etching re rubber-metal adhesion|
    US4517066A|1982-07-23|1985-05-14|The Goodyear Tire & Rubber Company|Ion beam deposition or etching re rubber-metal adhesion|
    JPS6344819B2|1982-11-17|1988-09-07|Polyplastics Kk|
    DE3248147A1|1982-12-27|1984-06-28|Siemens AG, 1000 Berlin und 8000 München|METALIZED PLASTIC MOLDED PARTS FOR TECHNICAL HOUSING FOR SHIELDING AGAINST ELECTROMAGNETIC INTERFERENCE|
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    US4767674A|1984-01-27|1988-08-30|Dainichi-Nippon Cables, Ltd.|Metal cored board and method for manufacturing same|
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    JPS61932U|1984-06-08|1986-01-07|
    US4996584A|1985-01-31|1991-02-26|Gould, Inc.|Thin-film electrical connections for integrated circuits|
    US4863808A|1985-09-13|1989-09-05|Gould Inc.|Copper-chromium-polyimide composite|
    US4911811A|1988-07-14|1990-03-27|The Stanley Works|Method of making coated articles with metallic appearance|
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    DE3934092A1|1989-10-12|1991-04-18|Leybold Ag|DEVICE FOR COATING A PLASTIC SUBSTRATE, PREFERABLY A POLYMETHYLMETHACRYLATE SUBSTRATE WITH ALUMINUM|
    JPH03130357A|1989-10-17|1991-06-04|Yoshida Kogyo Kk <Ykk>|Synthetic resin molding goods having metallic thin film on surface and its production|
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    JP2005317836A|2004-04-30|2005-11-10|Nitto Denko Corp|Wiring circuit board and method of manufacturing the same|
    JP4732147B2|2005-11-21|2011-07-27|豊田合成株式会社|Resin product, method for producing the same, and method for forming metal film|
    US20110038565A1|2008-04-21|2011-02-17|Nv Bekaert Sa|Means for closing a bag having a degradable, biodegradable and/or compostable coating|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    US05/599,130|US3984907A|1975-07-25|1975-07-25|Adherence of metal films to polymeric materials|
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