• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    LASER PROCESSING HYDROGEL MATERIALSABSTRACTA method of forming one or more perforations, holes, or capillaries in a hydrogel material, hydrocolloid material, hydrogel adhesive or silicone adhesive comprising directing a focal point of a laser beam to a surface of the material or adhesive at one or more locations to form one or more perforations, holes, or capillaries having a selected diameter. The perforated hydrogel material or adhesive can be used in wound care dressings, wearable sensors, or devices intended to contact living tissue. The perforated material or adhesive may also be provided in contact with an exudate holding mechanism such as an open cell foam material to further increase the exudate absorbance of the hydrogel or hydrocolloid wound care dressing.
    公开号:SE2150081A1
    申请号:SE2150081
    申请日:2019-07-03
    公开日:2021-01-26
    发明作者:Alexandra Swanson；Daniel B Miller；Ken Arvey；Kimberly Hill
    申请人:Preco Inc；
    IPC主号:
    专利说明:

    [1] [0001] Wound care dressings absorb wound exudates and fluids to encourage healingof the wound. Hydrogels have been used in wound care dressings and help regulate the fluidexchange on an external surface of the wound. Compounds from the hydrogel that assist inhealing the skin layers, Veins and tissues are exchanged with sodium and other dischargefrom the wound.
    [2] [0002] Water and fluids losses from wounded skin are almost 20 times greater thanwater loss through norrnal, intact skin. Thus, the water perrneability of dressings shouldcontrol the extensive dehydration as well as building up of exudates and scabs, withoutaffecting the epithelialization or cell proliferation processes, as provided by hydrogels.
    [3] [0003] Hydrogels are vastly hydrophilic macromolecular networks which areproduced by chemical or physical crosslinking of soluble polymers. Hydrogels can swell andde-swell water in a reversible direction. Hydrogels have been used in wound dressingmaterials, showing optimal conditions for healing bums and other surface wounds.
    [4] [0004] Holes have been formed in hydrogel sheets for use as wound dressings. Theprior art methods of forrning holes are so called "contact" methods, in that an instrumentcontacts the hydrogel material to form a hole. As described in U.S. patent 5,076,265, holesmay be drilled out of the hydrogel sheet using hollow needles or syringes, or they may beformed by casting the hydrogel sheets in molds having a series of upward projections suchthat on removal of the sheets from the mold, appropriate holes are made.
    [5] [0005] Additionally, hydrogel adhesives are produced by filling the hydrogel withnanoparticles. The hydrogel adhesives are used in wound care dressings having increasedadherence to the surface of the wearer's skin. These adhesive hydrogels can remain adheredto the skin surface, even if the wearer is sweating or exposed to other moisture. Traditionalwound care dressings lose their ability to stick to skin in the presence of water; howeveradhesive materials based on hydrogels overcome this problem. The hydrogel adhesives aregenerally filled with nanoparticles made from materials like polystyrene. The adherenthydrogel material is "tacky" or "sticky," thus inhibiting the ability to further increase theabsorption of the hydrogel dressing by preventing contact methods from easily forrning holes in the material.
    [6] [0006] FIG. 1 is a picture of a Silicone adhesive material laser processed to forrnvarying holes and shapes according to methods described herein.
    [7] [0007] FIG. 2 is a picture of a polyurethane foam having an adhesive backing andlaser processed to form varying holes and shapes according to methods described herein.[0008] FIG. 3 is a picture of a silicone adhesive, hydrogel having a scrim andpolyurethane foam laser processed to form varying holes and shapes according to methodsdescribed herein.
    [9] [0009] FIG. 4 is a picture of a hydrogel material having a scrim and laser processed toform varying holes and shapes according to methods described herein.
    [10] [0010] FIG. 5 is a picture of a polyurethane foam laser processed to form protrusions,or standing bosses, according to methods described herein.
    [11] [0011] FIG. 6 is a picture of a hydrogel material laser processed to form hydrogel“donuts” according to methods described herein.
    [12] [0012] FIG. 7 is a picture of a silicone adhesive laser processed to form varying holes and shapes according to methods described herein.
    [13] [0013] FIG. 8 is a micrograph of holes formed in a hydrogel material using a prior artmethod.[0014] FIG. 9 is a micrograph of a hole formed in a hydrogel material using a laser beam according to methods described herein, Wherein the holes are approximately 50 micronin diameter.
    [15] [0015] FIG. 10 is a micrograph of holes formed in a hydrogel material using a laserbeam according to methods described herein, Wherein the holes are approximately 50 micronin diameter.
    [16] [0016] FIG. 11 is a micrograph of a hole formed in a hydrogel material by a pinmethod of the prior art Wherein the hole is closing naturally due to the method of formationand the material tendency to refloW or refill.
    [17] [0017] FIG. 12 is a micrograph of a hole formed in a hydrogel material by a pinmethod of the prior art Wherein the hole is closing naturally due to the method of formationand the material tendency to refloW or refill.
    [18] [0018] FIG. 13 is a micrograph of a hole formed in a hydrogel material by a laserbeam according to methods described herein and Wherein the hole has been compressed or“squished” and the resistance of the hole to deformation is illustrated.
    [19] [0019] An aspect of the present disclosure relates to a method of forrning one or moreperforations, holes, or capillaries, in a hydrogel material using a laser beam to ablate thesurface of the hyrdogel material.
    [20] [0020] Another aspect of the present disclosure relates to a method of directing a laserbeam to a surface of a hydrogel adhesive material and forrning one or more capillaries in thehydrogel adhesive material Wherein the hydrogel adhesive material can be used in a Woundcare dressing.
    [21] [0021] Yet another aspect of the present disclosure relates to a method of forrning oneor more perforations, holes, or capillaries in an adhesive material comprising directing a focalpoint of a laser beam to a surface of the adhesive material and vaporizing the adhesivematerial at one or more locations to form one or more perforations, holes, or capillarieshaving a selected diameter.
    [22] [0022] Another aspect of the present disclosure relates to a method of forrning one ormore perforations, holes, or capillaries in a material in a non-contact manner Whichcomprises directing a focal point of a laser beam to a surface of the material and vaporizingthe material at one or more locations to form one or more perforations, holes, or capillarieshaving a selected diameter, Wherein the material is one of a hydrogel material, a hydrocolloidmaterial, or a silicone adhesive.
    [23] [0023] In any one of the embodiments described herein the hydrogel material orhydrogel adhesive having one or more capillaries formed by the laser beam may come incontact With an exudate holding mechanism in the Wound care dressing.
    [24] [0024] In any one of the embodiments described herein the material comprises aWound care dressing or component, or a body contact sensor.
    [25] [0025] In any one of the embodiments described herein the laser energy of the laserbeam is suff1cient to cauterize the material When forrning the one or more perforations, holes,or capillaries such that the one or more perforations, holes, or capillaries substantially retaintheir laser processed shape and diameter and resist closing or otherwise prevent the flow ofthe material from closing the one or more perforations, holes, or capillaries.
    [26] [0026] In any one of the embodiments described herein the adhesive material is oneof a hydrogel adhesive or a silicone adhesive. A Wound care dressing comprising theperforated adhesive can be provided. The Wound care dressing comprising the perforatedadhesive may be in contact With an exudate holding mechanism. The exudate holding mechanism is an open cell foam material such as polyurethane foam.
    [27] [0027] Yet another aspect of the present disclosure relates to a method of cauterizinga material with a laser beam for forrning one or more perforations, holes, or capillaries in thematerial in a non-contact manner comprising directing a focal point of a laser beam to asurface of the material and vaporizing the material at one or more locations to form one ormore perforations, holes, or capillaries having a selected diameter, and cauterizing aperimeter of the one or more perforations, holes, or capillaries so that the one or moreperforations, holes, or capillaries retains its shape and diameter, wherein the material is oneof a hydrogel material, a hydrocolloid material, or a silicone adhesive.
    [28] [0028] When processing the hydrogel material or hydrogel adhesive, the laser beamwavelength may range from about 5 micron to about 10 micron or greater. For example, if aC02 laser is used, the wavelength may be set to about 5 micron and used to produce holeshaving a diameter of about 85 micron or less than 85 micron in diameter. If a C02 laser isused, the wavelength may be selected from one of about 10.6 micron, about 10.2 micron andabout 9.36 micron to produce holes in the material having a diameter greater than about 85micron or a diameter less than about 85 micron. The diameter of the hole produced by laserprocessing according to the methods described herein is selected and may be as small asabout 35 micron.
    [29] [0029] A method of laser processing a material that forms a gel in water, such as ahydrogel or a hydrocolloid material, to form one or more capillaries in the material isdescribed herein. While the disclosure that follows is directed to a hydrogel material asdescribed, the methods and systems described herein can also be applied to additional gel orlike materials, including but not limited to silicone adhesives, hydrocolloids, polyurethane(“PU”) f1lms and PU foams. The materials may be processed according to the methodsdescribed herein for use in wound care dressings and/or other devices including but notlimited to body contact sensors.
    [30] [0030] In one embodiment, a laser processing system directs a laser beam toward asurface of the hydrogel material to produce one or more capillaries therein. What is meant bycapillary as used throughout this disclosure is an elongated tube-like structure. Also includedwithin the term capillary are other structures which may be formed in the hydrogel materialusing the laser beam, including but not limited to, holes having a selected diameter,perforations, Wells or reservoirs, or the hydrogel may otherwise be cut or shaped by the laser beam.
    [31] [0031] Laser processing, for example, includes scoring and/or perforating the materialas well as the production of capillaries, Wells or reservoirs in a material. The material asreferred to hereinafter may be a hydrogel material or a hydrogel adhesive as described infurther detail below. Again, as noted above, the material may also be a hydrocolloid or anabsorbent and/or adherent material such as a silicone adhesive. The laser beam energy andlaser processing system optics are selected to ablate the material in a target area (e. g., an areaon the surface of the material at or near the laser beam focal point) to a depth equal to, or lessthan the thickness of the material depending on the ultimate use of the material. Thus, thelaser beam may be used to form perforations, holes, or reservoirs in a material, where theperforations or the reservoirs also have a selected diameter.
    [32] [0032] In further detail, a laser processing system referred to herein is a system forprocessing (e.g., perforating, scoring, or cutting) a material through the use of laser beamtechnology. Lasers provide a very efficient method of cutting, scoring, perforating orotherwise preparing selected materials for various end uses over the old mechanical systems,which may include die systems or pin type roller perforators. Lasers cut, score, or perforatethe material through the use of a collimated amplif1ed beam of light that terrninates in a focalpoint. It is at or near the focal point of the beam that processing typically occurs. Intenseenergy at the focal point processes the material in what can be described as essentially avaporizing, buming or ablating process. The method of processing the hydrogel materialsdescribed herein is a "non-contact" method where, for example, capillaries are formed in thehydrogel material without a physical component contacting or disturbing the hydrogelmaterial. This is in contrast to the prior art methods of altering the structure of the hydrogelmaterial with a physical cutting or molding process.
    [33] [0033] The prior art methods of altering the structure of gel materials and adhesives islimited to forrning holes of a large diameter (e.g., greater than 500 micron) and these holesgenerally de-forrn or re-f1ll when formed in a gel material. Further, the mechanicalcomponents for cuttings these gel and adhesive materials tend to quickly accumulate the gelor adhesive material thereon as it sticks to the surface of the cutter. In contrast, the methodsand systems described herein ablate away or cauterize the material to form a stable hole andthe laser method also produces a so-called “gap” around the cut profile of the hole. That is,there is a clearance around the hole that the hole retains its shape and does not refill with thegel material.
    [34] [0034] The laser energy is focused on a surface of the material to vaporize a hole in the material. The laser processing system comprises a focusing lens for focusing the laser _5_ energy on the material surface. The diameter of the hole produced is generally directly relatedto the diameter of the focused spot of the laser in combination with how well the material"reacts" to the wavelength of the laser beam. What is meant by "reacts" is the ability of thematerial to absorb light or heat at the selected wavelength.
    [35] [0035] An assembly for laser processing the material as described herein comprises alaser source in communication with optics for directing the beam or multiple beams to thematerial for processing. The material for processing may also be referred to herein after as a"substrate" The substrate may be stationary during laser processing, while the laser beammoves to produce one or more holes or perforations etc. in the substrate. Additionally oraltematively, the substrate may be a moving web such that the substrate moves through thelaser assembly during laser processing. This allows a web of substrate to be processedcontinuously while passing below the laser beam concurrently during processing to produce aplurality of holes, perforations or capillaries on the substrate. The substrate can have avarying thickness and may or may not include a “scrim” or substrate to add strength and/orstructure to the hydrogel or other material being laser processed.
    [36] [0036] A focal point(s) of the laser beam(s) is/are directed to a surface of the substrateusing a process referred to as "camming", which requires controlling and directing the laserbeam(s) for precision perforation (or scoring) along a selected pattem. A controller sendscommands to the laser processing assembly to direct and pulse the laser beam(s) precisely asthe substrate is positioned for processing (whether the substrate is stationary or moving) toperforate or otherwise process the substrate according to the selected pattem. The pattem maycomprise rows and/or columns of aligned perforations, random pattems of perforations. Thelaser beam(s) may be pulsed when processing the substrate to produce one or morecapillaries, holes, perforations or reservoirs.
    [37] [0037] The laser assembly may comprise, for example, a CO laser, a C02 laser orother lasers and/or laser wavelengths (e.g., UV wavelength) for producing the holes in thematerials described herein. The laser system and settings are selected based on theconstruction of the material being processed. For example, a laser wavelength is selectedbased on its ability to ablate or cauterize the selected material composition, the materialthickness, and the hole diameter and wall size selected. When processing the hydrogelmaterial or hydrogel adhesive, the laser beam wavelength may range from about 5 micron toabout 10 micron or greater. For example, if a CO laser is used, the wavelength may be set toabout 5 micron and used to produce holes having a diameter of about 85 micron or less than 85 micron in diameter. If a C02 laser is used, the wavelength may be selected from one of _6_ about 10.6 micron, about 10.2 micron and 9.36 micron to produce holes in the materialhaving a diameter greater than about 85 micron or a diameter less than about 85 micron. Thediameter of the hole produced by laser processing according to the methods described hereinis selected and may be as small as about 35 micron. The diameter of hole in Which the laserbeam can be produced is smaller than the holes formed by conventional methods of forrningholes in a hydrogel for example (e.g., a diameter less than the diameter of holes formed bymechanical cutting processes such as die cutting, pin type rollers etc.).
    [38] [0038] The methods described herein utilize a laser beam to ablate or cauterize thehydrogel or other material to form the hole. When a hole is mechanically formed in ahydrogel that is about 90% Water, the material tends to re-forrn or re-f1ll such that the hole isprone to closing up or shrinking. The holes formed by the prior art methods tend to occludeafter formation. However, When using the method as described herein, the holes are formedby ablating the material Which prevents and substantially eliminates the re-flow and the holesformed are retained in shape and diameter.
    [39] [0039] The methods and assemblies described herein include producing articles madefrom hydrogel materials, hydrogel adhesive materials or the other materials described herein,such as Wound care dressings or other devices commonly used in Wound management, Woundcare, and other fields Where hydrogel materials can be used. For example, the materials canbe processed according to the methods described herein and incorporated into body contactsensors, or other electronic circuits and devices as the materials have a Water concentrationthat allows the materials to conduct electricity. For example the method of this disclosuremay be used to form via holes in such electronic circuits or devices. The disclosure,assembly and methods described herein can be used in substantially the same manner toperforate, score, cut, or produce capillaries, Wells or reservoirs in the material regardless ofthe term used in describing the method or assembly.
    [40] [0040] In one embodiment, the hydrogels processed by the methods and assemblydescribed herein may be synthesized by chemical crosslinking of acrylamide and methylene-bis-acrylamide including polysaccharides. Hydrogels can also be synthesized fromcrosslinked hydrophilic polymers, e.g. polyvinyl alcohol, polyvinyl pyrrolidone, orpolyethylene oxide. There are various types of hydrogels Which can be used as polymericdressings, including those based on natural polymers such as chitosan, glucan, alginates, andhyaluronan, those based on a combination of biopolymers and/or synthetic polymers including PVA-biopolymer composite membranes, and those based on PVA-nanoparticles- composite membranes or other nanoparticle composite membranes Which produce a hydrogeladhesive.
    [41] [0041] The hydrogel materials described herein are those that can absorb and retainthe Wound exudates, Which promote f1broblast proliferation and keratinocyte migration. Thetight mesh size of hydrogel structures protects the Wound from infection and preventsmicroorganisms and bacteria from entering the Wound. Although hydrogels are made With orfrom a variety of different compounds, hydrogels are usually considered to be about 90percent Water that is suspended in a gel base. The hydrogel is thus mostly Water in ahydrophilic polymer matrix. The hydrogel assists in providing the appropriate amount ofmoisture to the Wound While absorbing exudate to assist the Wound With healing.
    [42] [0042] The hydrogel materials are also conductive materials such that the materialsprocessed according to this disclosure can also be incorporated into other devices such assensors or body contact sensors.
    [43] [0043] The hydrogel material or hydrogel adhesives are compounds that are primarilycomprised of Water suspended in a gel base, such as a compound comprising about 80% orgreater Water, or about 90% or greater Water, Where the Water is suspended in a polymericmatrix or gel base.
    [44] [0044] Further, the materials processed With the assembly and/or according to themethods described herein include adhesive materials such as silicone adhesives and/orhydrogel adhesives. Hydrogel adhesives are hydrogels having an increased ability to adhere(e.g., stick) to the Wearer's skin. Nanoparticles may be incorporated in to the hydrogel toincrease the adherence of the dressing to skin, especially for athletic applications or Whereinthe skin is prone to sWeat.
    [45] [0045] Many hydrogel Wound care dressings comprise glycerin and Water as glycerinattracts, holds, and binds Water to itself and When incorporated into a Wound care dressing,binds Water into the dressing. Polymerical hydrogel membranes may also be used for Woundcare dressings and include PVA-based hydrogel dressings. Polymers used in hydrogelsinclude chitosan, dextran, alginate/gelatin and collagen/glycosaminoglycan. Other materialsmay include custom polypeptides, and blends such as chitosan/sodium alginate/poly(vinylacetate).
    [46] [0046] The hydrogel material, including adhesives processed according to themethods described herein may be provided in various configurations for laser processing.These configurations include but are not limited to amorphous masses of hydrogel material Which are conforrnable to the shape of a Wound or substrate, hydrogel sheets, and hydrogel _g_ impregnated substrates (e.g. gauze, rope, non-Woven sponge). The hydrogel materials mayalso be incorporated into devices having one or more layers and/or one or more layers of thedevice comprise an exudate holding mechanism, such as a polyurethane foam or likematerial. The hydrogel materials may also be cut and shaped With the laser method andsystems described herein for incorporation into other devices as a conductive and/orabsorbent material.
    [47] [0047] A laser perforated hydrogel material or hydrogel adhesive materialincorporated into a dressing for a Wound increases the ability of the dressing to handleexudate and move the exudate away from contact With the extemal surface of the Wound orthe skin of the Wearer. What is meant by exudate is generally a fluid composed of serum,f1brin and/or White blood cells having leaked into air by exposed tissues or other fluid exudedfrom the area near or at the Wound.
    [48] [0048] The method of laser processing described herein produces capillary openingsin the hydrogel, hydrocolloid, or adhesive material that can transport the exudate absorbed bythe hydrogel away from the Wound area. The exudate may then be transported through thecapillaries as noted previously. The exudate holding mechanism may be a polyurethane foamor like material incorporated into the dressing. The dressing may comprise a layer of suchholding mechanism in contact With the laser perforated hydrogel material or adhesive. Inaddition, holes or pockets in the hydrogel or adhesive material can increase holding capacityof the hydrogel material When compared to a non-perforated hydrogel or other non-perforatedWound care or dressing materials.
    [49] [0049] Laser perforating the hydrogel, hydrocolloid or adhesive material can alsoprolong the Wearability of the dressing or Wound care device in Which the hydrogel isincorporated. By perforating the material, a Moisture Vapor Transmission Rate (MVTR) ofthe dressing or Wound care device is increased. Increasing the MVTR in dressings or Woundcare devices has been proven to extend the duration the dressing or device can be in contactWith or Wom on the skin surface. This is further increased in the dressing utilizing thehydrogel adhesive and adherence is increased.
    [50] [0050] Laser processed hydrogels according to the present disclosure also have anadded advantage of being perforated and/or shaped into conf1gurations not possible usingtraditional methods. These traditional methods in addition to those described previously inthis application include flatbed or rotary die presses for cutting, perforating or shaping the material.
    [51] [0051] Hydrogel materials generally tend to, or are designed to, stick to things oncontact or covered With. This is further increased in the hydrogel adhesive or siliconeadhesive materials. Because nanoparticles can be incorporated into the hydrogel materials toform the hydrogel adhesive and to increase the adherent properties of a hydrogel dressing forprolonged use, the materials have increased tackiness or stickiness. These sticky materials aredifficult to perforate With traditional methods. Due to the non-contact nature of digital laserprocessing the material as described herein, the adherent or sticky nature of the hydrogelmaterial and adhesives is not a limiting factor in selecting the diameter of the capillary orperforation produced by the laser beam. For example, the sticky nature of the hydrogelmaterial limits the size of the perforations (preventing small perforations such as capillaries,Which are hair-like (e.g., on the order of less than 100 micron) in diameter from being made)and limits the thickness (preventing thin Walls from being formed) of a Wall section that canbe manufactured.
    [52] [0052] As noted briefly above, the diameter of a hole that can be formed by the lasermethods and systems described herein and the Wall thickness depends on a balance of thelaser beam type and/or Wavelength, the thickness of the material being processed, thecomposition of the material being processed (e. g., does it absorb the Wavelength or transmitthe Wavelength) and the desired hole dimeter. Prior art methods are carried out on thickermaterials and the holes are larger. In the instant disclosure, the materials processed can bethinner (reduced thickness) and the hole diameter reduced. For example, in a thinner materiala hole as small as about 35 micron can be produced having a Wall (thickness/depth) as smallas about 500 micron.
    [53] [0053] Referring to FIGS. 1-7, and specifically FIG. 6, for example, the laser systemand methods described herein can also be used to form “donuts” in the materials describedherein, including silicone adhesives and hydrogel materials. In the prior art, such “donuts” aremade by dispensing the material around a hole, in a manner similar to depositing a glue.HoWever, as illustrated in FIG. 6, the “donut” shape, the aperture With a raised perimeterWall, is formed using a laser system and method as described here.
    [54] [0054] Referring to FIGS. 8-13, the prior art method of forrning holes in a gelmaterial, e. g., using “pins” is compared to the use of laser energy as described herein. It canbe seen that the holes formed by the methods described herein are precise and retain theirshape, Whereas the holes formed by pins have uneven edges and the gel material flows torefill the hole. To make the pin perforations in FIGS. 8, ll and 12, a lmm (1000 micron) pin Was used and the resulting holes Were significantly smaller and so irregular that the holes _10- were difficult to measure for purposes of diameter and wall thickness. Attempting to producelaser holes in the same or substantially same diameter in the same thickness of hydrogelmaterial, the laser produced holes, as illustrated in FIGS. 9, 10 and 13 were approximately 50micron in diameter and have clean edges and are substantially round. Referring specif1cally toFIG. 13, pressure was applied to “squish” or cause the holes made with laser in the hydrogelto reflow and close but the holes remained intact. The cauterizing effect of the laser beamcaused the holes to re-open and remain open after a short time.
    [55] [0055] It is also noted that the laser methods described herein for producing holes andother shapes in the various gel and adhesive materials described herein produces body contactsensors and/or wound care devices that have an improved performance when wom. Forexample, as the holes and shapes formed in the gel or adhesive materials via laser processinginclude a cauterized perimeter that retains the shape and inner cavity of the hole or shape,these sensors or devices can bend or move when wom without compressing or closing theholes. For applications such as bandages, the laser processed gel and/or adhesive materialsthen do not suffer from a reduction in capacity for holding fluid when wom by a user,especially when the bandage is wrapped around a wound (e. g., around an arm, or leg ratherthan a flat surface). This also allows a body contact sensor to retain conductivity when womduring activity or on a non-flat surface of a user.
    [56] [0056] As used herein, the term hydrocolloid refers to a hydrocolloid that is capableof being used in wound care dressings and devices, and/or refers to a hydrocolloid that cansuff1ciently withstand discoloration (from heating). The hydrocolloid is a substance thatproduces a gel with water and is able absorb fluids while also having an adhesioncharacteristic.
    [57] [0057] As used. lififrein, the term "Ltauterize" or "cauteiffizin g" refers to a wall orperimeter formed by the laser and sufficient to retain the surrounding material, thesurrounding material being the same material as the wall material. When subjected tosuff1cient heat, the material forms a more rigid wall and/or a seal. Essentially, the wallformed is a barrier that prevents the reflow of the hydrocolloid, hydrogel or silicone adhesiveso that the perforation that was formed thus retains its shape.
    [58] [0058] In the method described herein, the digital laser process is used to laserperforate the hydrogel material in a non-contact manner. This non-contact processing methodallows the hydrogel materials to be cut into shapes and/or perforated with holes having a size otherwise not possible to achieve by conventional mechanical converting methods. _11_
    权利要求:
    Claims (14)
    [1] 1. l. A method of forrning one or more perforations, holes, or capillaries in a material in anon-contact manner comprising directing a focal point of a laser beam to a surface of thematerial and Vaporizing the material at one or more locations to form one or more perforations,holes, or capillaries having a selected diameter, Wherein the material is one of a hydrogel material, a hydrocolloid material, or an adhesiVe material.
    [2] 2. The method of claim l, Wherein the material comprises a Wound care dressing orcomponent.
    [3] 3. The method of claim 1, Wherein the material comprises a body contact sensor.
    [4] 4. The method of claim l, Wherein a laser energy of the laser beam is sufficient to cauterize the material When forrning the one or more perforations, holes, or capillaries such that the oneor more perforations, holes, or capillaries substantially retain their laser processed shape and diameter and resist closing.
    [5] 5. The method of claim 1, Wherein the adhesiVe material is one of a hydrogel adhesive or a silicone adhesive.
    [6] 6. The method of claim l, Wherein the material is an adhesiVe material, and further comprising providing a Wound care dressing comprising the perforated adhesive.
    [7] 7. The method of claim 6, Wherein the perforated adhesiVe is in contact With an exudate holding mechanism.
    [8] 8. The method of claim 7, Wherein the exudate holding mechanism is an open cell foam material such as polyurethane foam.
    [9] 9. The method of claim l, Wherein the material is an adhesive material, and Wherein alaser energy of the laser beam is suff1cient to cauterize the adhesiVe material When forrningthe one or more perforations, holes, or capillaries such that the one or more perforations,holes, or capillaries substantially retain their laser processed shape and diameter and resist closing.
    [10] 10. The method according to claim 1, further comprising cauterizing a perimeter of the oneor more perforations, holes, or capillaries so that the one or more perforations, holes, or capillaries retains its shape and diameter.
    [11] 11. The method of claim 10, Wherein the adhesive material is a silicone adhesive.
    [12] 12. The method of claim 10 or 11 Wherein the laser beam has a WaVelength in the range of about 5 micron to about 10 micron or greater.
    [13] 13. The method of claim 10 or 11 Wherein the laser beam has a Wavelength set to about 5micron and the perforations, holes, or capillaries produces have a diameter of about 85 micron or less.
    [14] 14. The method of claim 10 or 11 Wherein the laser beam has a Wavelength selected fromone of about 10.6 micron, about 10.2 micron, and about 9.36 micron and the perforations, holes, or capillaries produces have a diameter of about 85 micron or greater.
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    同族专利:
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    US20200009690A1|2020-01-09|
    引用文献:
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    EP0925141A2|1996-08-27|1999-06-30|British Polythene Limited|Apparatus for perforating web like materials|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    US201862694204P| true| 2018-07-05|2018-07-05|
    PCT/US2019/040570|WO2020010238A1|2018-07-05|2019-07-03|Laser processing hydrogel materials|
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