Member exchanger, method of controlling member exchanger, ic inspection method, ic handler, and ic i

专利摘要:
The holding conveyance provided with the holding | maintenance part 5a, 6a which comprises a drive shaft by two axes, connects the drive system 4 which rotationally drives a drive shaft to one end of each drive shaft, and hold | maintains IC on each other end side. The mechanisms 5 and 6 are connected, and each holding conveyance mechanism 5 and 6 is comprised so that operation is possible independently.
公开号:KR20020087960A
申请号:KR1020027013410
申请日:2002-01-31
公开日:2002-11-23
发明作者:후지모리히로아키；마에다마사미
申请人:세이코 엡슨 가부시키가이샤；
IPC主号:

专利说明:

MEMBER EXCHANGER, METHOD OF CONTROLLING MEMBER EXCHANGER, IC INSPECTION METHOD, IC HANDLER, AND IC INSPECTOR}
[2] Background Art Conventionally, for example, in a characteristic inspection process of an integrated circuit (IC), an IC handler for arranging a plurality of ICs sequentially at an inspection position and performing inspection is used. The IC handler is provided with a holding unit for sucking and holding the IC. The holding part holds the IC in the supply and receiving part, supplies the retained IC to the test socket provided at the test position, and when the IC is tested for electrical characteristics, takes the IC out of the test socket and returns it to the discharge position. It is supposed to run repeatedly.
[3] In the characteristic inspection process using an IC handler, it is required to inspect many ICs in a short time. For this reason, it is the most important thing to shorten the index time which is the time which takes out the IC which test | inspected is completed from the test | inspection part, and returns the next IC device to the test | inspection part, ie, the replacement time of the holding | maintenance part with respect to an inspection part.
[4] As a conveying apparatus for a conventional electronic component which aims to shorten the index time, there is a technique disclosed in the specification of US Patent No. 5,330,043. 19 shows a schematic view of the conveying apparatus. This conveying apparatus is slidable by the drive shaft 102 which is rotationally driven with the support block 101 at one end, the guide blocks 103 and 104 attached to the side surface of the support block, and the through-hole of the guide block 103. Is fixed to the shaft portion 105 in the direction of the shaft 105a having an angle of 45 degrees with respect to the rotational shaft 102a of the drive shaft 102, and fixed to one end of the shaft portion 105 and reciprocating in the direction of the shaft 105a. ) Is slidably supported by the pick-up head 107 which performs the movement and the through-hole of the guide block 104 and has an angle of 45 degrees with respect to the rotational axis 102a of the drive shaft 102 and also with respect to the axis 105a. And a pick-up head 108 which is fixed to one end of the shaft part 106 and performs a forward and backward (reciprocation) motion in the direction of the axis 106a, and the drive shaft (106) provided in the vertical axis 106a direction. Rotation of the 180 degrees of 102 causes the pickup head 107 and the pickup head 108 to be replaced with each other. There is sex.
[5] In the conveying apparatus comprised in this way, the conveyor (not shown) in which supply and discharge of components is performed is arrange | positioned on the horizontal surface, and the test | inspection part (not shown) is arrange | positioned on the vertical surface. In the figure, the pick-up head 107 is in a state in which a non-inspected part (not shown) is adsorbed and held by a suction cup (not shown) opposite to the inspection part, and the pick-up head 108 is vertically downwards. The parts which have been inspected are adsorbed and held in opposition to a conveyor (not shown) which executes the supply. From this state, the pick-up head 107 presses the component which slides in the right direction and hold | maintains it to a test | inspection part, and a test | inspection is carried out. On the other hand, the pick-up head 108 discharges the components which have been slid down and adsorbed and held on the conveyor, and thereafter picks up a new component from the conveyor belt that has once been raised and moved in the meantime, and returns to the position before the slide.
[6] Thereafter, the drive shaft 102 rotates 180 degrees, the pickup head 107 holding the inspected part reaches the conveyor, and the pickup head 108 holding the uninspected part faces the inspection unit. Is reached, the same processing is performed on the inspection unit side and the supply discharge side (conveyor side). Then, this time, the drive shaft 102 rotates in the reverse direction, the pick-up head 108 holding the parts after the inspection is placed on the conveyor, and the pickup head 107 holding the uninspected parts faces the inspection unit. To reach the same time. As described above, this technique allows the inspection shaft to be inspected on one side and discharge and supply of the component after inspection by the two pickup heads used simultaneously while rotating the drive shaft 102 forward and backward by 180 degrees. This technique aims to shorten the time.
[7] However, in the above conveying apparatus, since the pickup heads 107 and 108 are connected to the same drive shaft 102, the alignment of the pickup head 107 on the inspection unit side and the alignment of the pickup head 108 on the supply discharge side are simultaneously performed. There is a problem that it is necessary to execute, and that the position cannot be corrected independently of each other.
[8] By the way, two pick-up heads attached to the drive shaft at an angle of 45 degrees with respect to the above-described mechanism, that is, the drive shaft to be rotationally driven, and are orthogonal to each other are alternately conveyed between the supply discharge position and the inspection position by rotation of the drive shaft. The apparatus is often used in the inspection process of electronic components in high temperature and low temperature environment. In this inspection process, the inspection is performed by keeping the inside constant at a specific set temperature within a temperature range of, for example, about -55 to 150 degrees. It is carried out. The set temperature is appropriately changed and the mechanism is operated under each set temperature. However, when the temperature difference between the previous set temperature and the current set temperature is large, the length of the mechanism part changes due to thermal expansion or expansion. There has been a problem that the position of the pickup head changes from the previous position alignment. For this reason, it is necessary to correct such a position deviation, but it was very difficult to correct both positions simultaneously.
[9] In addition, in the electrical measurement of the electronic components in the inspection unit, a stable measurement environment without vibration or the like is required, but in the conventional mechanism, both pickup heads are integrally formed, and one pickup head is processed by the inspection unit. While the other pick-up head performs the discharge of the electronic component after the inspection and the supply operation of the next component, and high speed is also required in this discharge and supply operation, the vibration of the supply portion and the discharge portion side accordingly There is a possibility that the pick-up head may be delivered to the side, and there is a possibility that any adverse influence may be caused on the measurement of the electronic component.
[10] The present invention has been made in view of the above, and a first object of the present invention is to provide a member delivery device, a control method of a member delivery device, an IC inspection method, an IC handler, and an IC inspection device that can further shorten the index time. .
[11] In addition to the first object, the present invention is capable of independently performing positional correction and stably carrying out the processing in the processing unit while reducing the influence of vibration, and a control method of the receiving and receiving device. It is a second object to provide an IC inspection method, an IC handler, and an IC inspection apparatus.
[12] Summary of the Invention
[13] (1) A receiving and receiving device for a member according to an aspect of the present invention includes a plurality of drive shafts disposed coaxially and each having a drive system at one end and rotationally driven by the drive system, and a holding portion for holding the member, It is provided with the several holding | maintenance conveyance mechanism each attached to a drive shaft.
[14] (2) A receiving and receiving device for a member according to another aspect of the present invention includes a first drive shaft and a second drive shaft disposed coaxially and each having a drive system at one end and rotationally driven by the drive system, and a first holding member for holding the member. It is provided with the 1st holding conveyance mechanism provided with a part, and attached to the said 1st drive shaft, and the 2nd holding conveyance mechanism attached to the said 2nd drive shaft, and provided with the 2nd holding part which hold | maintains a member.
[15] According to said (1) and (2), since each holding conveyance mechanism operates independently, when one holding conveyance mechanism is carrying out when receiving the member hold | maintained by the holding part to a predetermined position, It is possible to operate the other holding and transport mechanism in a state where each member holds the member in the holding portion, and to shorten the index time. Moreover, since each axis can be driven to rotate by an independent drive system, the influence of vibration can be prevented from mutually exerting.
[16] (3) According to another aspect of the present invention, in the above-mentioned member (2), in the above-mentioned (2), the second drive shaft is formed into an internal hollow shape, and the first drive shaft is inserted into the second drive shaft to coaxially pass through it. It is placed.
[17] (4) In the receiving and receiving device of a member according to another aspect of the present invention, in (3) above, one end of the drive measurement of the first drive shaft and the second drive shaft is axially supported by a bearing, respectively, and the other end side thereof. In the present invention, a spacer for maintaining a space between the drive shafts is disposed at a space between the first drive shaft and the second drive shaft.
[18] According to the above (3) and (4), it is possible to prevent the influence of vibration from being influenced by being driven while the gap between the first drive shaft and the second drive shaft is maintained.
[19] (5) In any one of the above (2) to (4), in the transfer device for the member according to another aspect of the present invention, in the first holding and transporting mechanism, the holding surface of the first holding portion is 45 degrees relative to the drive shaft. It attaches to a 1st drive shaft so that an angle may be formed, and the 2nd holding conveyance mechanism is affixed to a 2nd drive shaft so that the holding surface of a 2nd holding | maintenance part may make an angle of 45 degrees with respect to the said drive shaft.
[20] According to the above (5), the rotation of the drive shaft enables the transfer of the members between the positions provided on the surfaces perpendicular to each other.
[21] (6) In any one of said (2)-(5), the said 1st holding | maintenance conveyance mechanism is a direction of orthogonal to the said holding surface in any one of said (2)-(5) in the member conveying apparatus which concerns on another aspect of this invention. It has a 1st support mechanism which slidably supports, and the said 2nd holding conveyance mechanism has a 2nd support mechanism which slidably supports the said 2nd holding part in the direction orthogonal to the holding surface.
[22] (7) In the transfer device of the member according to another aspect of the present invention, in (6), the first holding and transport mechanism is connected to the first drive shaft and the first support mechanism to be attached to the first drive shaft. Moreover, the said 2nd holding conveyance mechanism connects the said 2nd drive shaft and the said 2nd support mechanism, and is attached to the said 2nd drive shaft.
[23] (8) In the hand-receiving apparatus of the member which concerns on another aspect of this invention, in any one of said (2)-(7), the said 1st holding conveyance mechanism and the said 2nd holding conveyance mechanism are rotated by each said drive shaft. This is to alternately move between the supply receiving part which supplies a member and the processing part which performs a predetermined process with respect to the said member, and performs the operation which receives the member of the said supply receiving part sequentially to the said processing part.
[24] (9) In the receiving and receiving device of a member according to another aspect of the present invention, in the above (8), the first holding conveying mechanism and the second holding conveying mechanism perform processing in the processing unit by rotation of the respective drive shafts. The operation of discharging the finished member to the discharge receiver is performed.
[25] According to the above (9), the operation of not only receiving the member to the processing unit but also receiving the processed member to the discharge receiving unit can be performed.
[26] (10) In the member conveying apparatus which concerns on another viewpoint of this invention, in any one of said (2)-(9), the said 1st holding part and the said 2nd holding part are each provided with the some holding head. .
[27] According to said (10), it becomes possible to hold | maintain and convey a some member simultaneously.
[28] (11) The hand-carrying apparatus of the member which concerns on another viewpoint of this invention is provided with the adsorption means which adsorb | sucks and holds a member to the said holding head in said (10).
[29] According to said (11), it becomes possible to adsorb | suck and hold a member.
[30] (12) In the member delivery device according to another aspect of the present invention, in the above (11), the plurality of holding heads are arranged in a linear shape.
[31] (13) In the member delivery device according to another aspect of the present invention, in the above (11), the plurality of holding heads are arranged in a matrix.
[32] (14) In the receiving and receiving apparatus for a member according to another aspect of the present invention, in the above (8) or (9), the processing unit performs electrical property inspection of the member as a predetermined treatment.
[33] (15) In the method for controlling a member delivery device according to one aspect of the present invention, in the delivery device for any one of the members (2) to (13), the first drive shaft and the second drive shaft are each independently. It is to drive.
[34] According to the above (15), since each of the first drive shaft and the second drive shaft is driven independently, when one of the holding conveyance mechanisms is carrying out the transfer, when the member held by the holding portion is delivered to a predetermined position, The control which makes the other holding conveyance mechanism stand by in the state which hold | maintained the member in each holding part is attained, and it becomes possible to shorten an index time.
[35] (16) A control method of a member delivery device according to another aspect of the present invention is the delivery device of the member according to the above (8) or (9), wherein the first holding and conveying mechanism is located in the processing unit. The second holding and conveying mechanism in a state where the untreated member is held in the supply and delivery unit is made to stand by at a standby point by the rotation of the second drive shaft.
[36] According to said (16), since the one holding conveyance mechanism was made to hold | maintain the other holding conveyance mechanism in the state which hold | maintained the unprocessed member in the supply and receiving part while the holding conveyance mechanism was located in a process part, the movement distance to a process part is short. The index time can be shortened.
[37] (l7) In the method for controlling a member receiving device according to another aspect of the present invention, in (16), the waiting point is within 180 degrees around the drive shaft with respect to the processing unit in a plane orthogonal to the drive shaft. It is set to the position specified by the angle.
[38] According to the above (17), since the standby point is set at a position specified at an angle within 180 degrees around the drive shaft with respect to the processing unit in a plane orthogonal to the drive shaft, the conventional mechanism is fixed at a position opposite to 180 degrees with a conventional mechanism. Since the movement distance at the time of moving a holding | maintenance part to a processing part can be shortened, and index time can be shortened, it can be set arbitrarily according to the shape of a holding part etc. within the said range.
[39] (18) In the control method of the receiving and receiving device according to another aspect of the present invention, in the above (16) or (17), the standby point is close to the first holding portion and the second holding portion does not interfere with each other. Is set in position.
[40] (19) In the control method of the receiving and receiving device according to another aspect of the present invention, in any one of the above (16) to (18), each of the drive shafts when receiving the member from the supply receiving part to the processing part Alternately rotate the direction of rotation. .
[41] (20) The control method for a member delivery device according to another aspect of the present invention is the drive shaft according to any one of (16) to (18), wherein the member receives the member from the supply delivery section to the processing section. It is to make the rotation direction of the same direction.
[42] (21) The control method of the receiving and receiving device according to another aspect of the present invention is the method according to any one of the above (16) to (20), wherein the first holding conveying mechanism or the second holding conveying mechanism is obtained after the treatment. After the member is discharged from the discharge sorghum part, the member is held in the supply sorghum part and then waited at the standby point.
[43] According to the above (21), it is possible not only to hold and convey the member from the supply receiving part to the processing part, but also to perform the operation of passing the member after the processing to the discharge receiving part.
[44] (22) In the control method of the receiving and receiving device according to another aspect of the present invention, in any one of the above (16) to (21), the member is an IC, and the electrical treatment of the IC is performed as a predetermined process in the processing unit. Is to run a property check.
[45] According to the above (22), the above effects can be obtained in the so-called IC handler.
[46] (23) An IC inspection method according to one aspect of the present invention is an IC inspection method in which an electrical characteristic inspection of an IC is performed under a predetermined temperature environment, the IC supply method of supplying an uninspected IC and an electrical process of the uninspected IC. The supply position and the non-inspection which supply an uninspected IC using the water-receiving apparatus of any one of said (1)-(14) which have a test | inspection process which examines a characteristic, and the discharge process which discharge | releases the tested IC. The IC transfer is performed between the processing position for checking the electrical characteristics of the IC and the discharge position for discharging the inspected IC.
[47] According to the above (23), since the transfer device of the member according to any one of the above (1) to (14) is used for the transfer of the IC, the index time can be shortened, the inspection efficiency is excellent, and the vibration It is possible to obtain an IC inspection method that can be prevented from affecting and inspection in a stable measurement environment.
[48] (24) The IC inspection method according to another aspect of the present invention further includes a temperature adjusting step of adjusting the temperature of the unchecked IC under the predetermined temperature environment in (23), wherein the temperature adjusting step is performed by the above-mentioned. The uninspected IC is temperature-controlled under the predetermined temperature environment by accommodating a plurality of trays accommodating a plurality of inspection ICs and circulating the tray in a chamber that maintains the inside under a predetermined temperature environment.
[49] (25) An IC handler according to one aspect of the present invention includes a receiving device of any one of the above (1) to (14), wherein the member is an IC, in order to execute an electrical characteristic test of the IC. An IC handler for conveying an IC to the processing unit, wherein the IC handler has a supply unit, a supply mechanism, a supply shuttle, a mobile stacking mechanism, a discharge shuttle, a discharge unit and a discharge mechanism, and a delivery device of the member. It is provided with a supply receiving part, The said supply receiving part is comprised by the structure which provided two or more trays for receiving an unexamined IC in the said holding conveyance mechanism, The said supply part has a plurality of supply trays which receive a plurality of untested ICs, The mechanism includes a supply adsorption mechanism for adsorbing and holding an IC, a plane moving mechanism for moving the supply adsorption mechanism in a planar direction, and the supply adsorption mechanism in a direction orthogonal to this plane. And a lifting mechanism for operating the feeder, and by moving the suction device for feeding by the plane moving mechanism and the lifting mechanism, the untested IC is taken out of the supply tray of the supply portion, and the untested IC is supplied to the supply shuttle. And the supply shuttle receives the unchecked IC taken out of the supply tray by the supply adsorption mechanism of the supply mechanism from the supply adsorption mechanism at the first unchecked IC receiving position, and then the The supply receiver receives an operation of moving the unchecked IC to the first unchecked IC receiver position for receiving the supply receiver of the member receiver and returning to the first unchecked IC receiver position when the receiver ends. Furthermore, it is comprised so that it may run above, and the said mobile loading mechanism is equipped with the mobile loading adsorption mechanism which can move up and down, And, by the mobile loading adsorption mechanism, the suction shuttle lifts and lowers the unchecked IC from the supply shuttle located at the first unchecked IC receiving position, and raises and lowers the supply shuttle to the first unchecked IC receiving position. Move the unchecked IC to the tray of the feed receiving portion shown directly below it by moving, wherein the feed receiving portion is placed one of the plurality of trays immediately below the first unchecked IC receiving position. Position the second unchecked IC receiving position and the second unchecked IC receiving position for receiving the unchecked IC in the holding conveyance mechanism, and applying the unchecked IC to the holding conveying mechanism at the second unchecked IC receiving position. After the receipt, the empty tray is moved to the second unchecked IC receiving position, and the tray containing the unchecked IC to be tested next is stored in the second unchecked. Wherein the plurality of trays are circulated sequentially so as to move to an IC receiving position, and the discharge shuttle is taken out of the tray of the supply receiving portion by the holding conveyance mechanism, and the inspected IC processed by the processing portion is removed. After receiving at the inspected IC receiving position located directly above the second unchecked IC receiving position, the IC is moved to the inspected IC receiving position for receiving the inspected IC to the discharge mechanism, and when the receiving ends, And returning to the inspected IC receiving position from above the supply receiving portion, wherein the discharge portion has a plurality of discharge trays for accommodating a plurality of inspected ICs. The discharge mechanism includes a discharge suction mechanism for suctioning and holding an IC, and the discharge suction. A plane moving mechanism for moving the mechanism in a planar direction, and a lifting mechanism for operating the discharge supply mechanism in a direction orthogonal to the plane, and moving the discharge adsorption mechanism by the lateral movement mechanism and the lifting mechanism. By doing so, it is configured to take out the inspected IC from the discharging shuttle located at the inspected IC receiving position, and discharge the inspected IC to the discharging tray of the discharging unit according to the inspection result in the processing unit.
[50] According to the above (25), an IC handler having the above effects can be obtained.
[51] (26) An IC handler according to another aspect of the present invention is characterized by the above-mentioned (25), comprising a chamber for accommodating the supply and receiving portion therein and maintaining the inside under a predetermined temperature environment. The unchecked IC is allowed to reach the predetermined temperature while being housed in the plurality of trays of the supply receiving portion.
[52] (27) The IC handler according to another aspect of the present invention further includes a hot plate according to (26), which heats up to the normal temperature before discharging the inspected IC to the discharge unit.
[53] According to the above (27), it is possible to prevent condensation of the inspected IC when the electrical characteristic inspection at low temperature is carried out.
[54] (28) In the IC handler according to another aspect of the present invention, in any one of (25) to (27), the movable loading mechanism is disposed just above the first unchecked IC receiver position.
[55] (29) An IC inspection apparatus according to an aspect of the present invention includes a test head including the processing unit, a tester connected to the test head and performing an electrical characteristic test of an IC in the processing unit, and an IC returned to the processing unit. It is provided with the IC handler in any one of said (25)-(28).
[56] According to the above (29), an IC inspection apparatus having the above effect can be obtained.
[1] BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a member handing device, a method for controlling a member handing device, an integrated circuit (hereinafter, abbreviated as "IC") handler, and an IC inspection device. It relates to a receiving and receiving device for a member for carrying out supply and discharge of electronic components to a process, a control method for a receiving and receiving device for a member, an IC inspection method, an IC handler, and an IC inspection device.
[57] 1 is a front sectional view of a component receiving device of one embodiment of the present invention;
[58] FIG. 2 is a sectional front view of an essential part of the holding and conveying mechanism of FIG. 1; FIG.
[59] 3 is a side view of FIG.
[60] 4 is a schematic perspective view of the holding and conveying mechanism of FIG. 1;
[61] 5 is a block diagram showing the configuration of the apparatus of FIG. 1;
[62] FIG. 6 is a schematic perspective view showing a state in which the inner shaft is rotated 60 degrees in FIG. 4; FIG.
[63] 7 is an explanatory diagram of a waiting point;
[64] FIG. 8 is a schematic perspective view showing a state in which the inner shaft is further rotated 120 degrees in FIG. 4 and the outer shaft is rotated 180 degrees; FIG.
[65] 9 is a diagram showing a linear arrangement example of a holding unit;
[66] 10 is a diagram showing a linear arrangement example of a holding unit;
[67] 11 is a diagram showing an arrangement example of a matrix shape of a holding portion;
[68] 12 is a diagram illustrating a case where one holding unit is arranged;
[69] FIG. 13 is a schematic perspective view of a holding conveyance mechanism in the case of FIG. 9;
[70] 14 is a schematic perspective view of the holding and conveying mechanism in the case of FIG. 9;
[71] FIG. 15 is a schematic perspective view of a holding conveyance mechanism in the case of FIG. 9;
[72] 16 is a schematic side view of an IC handler;
[73] 17 is a schematic plan view of an IC handler;
[74] FIG. 18 is a diagram showing an overall configuration of an IC inspection apparatus including the IC handler shown in FIGS. 16 and 17.
[75] 19 is a schematic perspective view showing a conventional conveying apparatus.
[76] 1 is a front sectional view of the member receiving device of the present invention, FIG. 2 is a front sectional view of the holding conveying mechanism of FIG. 1, FIG. 3 is a side view of FIG. 2, FIG. 4 is a schematic perspective view of the holding conveying mechanism of FIG. It is a block diagram which shows the structure of the apparatus of FIG. In the present embodiment, an IC handler for conveying an IC as a member to a processing unit that performs electrical property inspection as a predetermined process will be described as an example. Moreover, in this IC handler, the inside of the chamber heat insulation wall 10 is temperature-controlled by the set temperature, and electrical property test | inspection is performed in high temperature or low temperature.
[77] As shown in Fig. 1, the IC handler includes a supply and delivery unit 1 for supplying an untested IC, a processing unit 2 for conducting an electrical characteristic test of the IC, and an internal hollow shape that is coaxially 2 The drive shaft 3 which consists of the structure arrange | positioned inside and outside the shaft, the drive system 4 for rotationally driving each drive shaft 3 connected to one end of the drive shaft 3, and the other end of the drive shaft 3, respectively. Holding conveyance mechanisms 5 and 6 connected to each other and moving between the supply (discharge) position and the processing position by the rotation of the respective drive shafts 3, and the discharge receiving portion 7 through which the IC after inspection is discharged; Supply discharge slide mechanism drive unit 8 disposed on the outer wall of chamber heat insulating wall 10 so as to face the supply water supply unit 1 and the discharge water supply unit 7 to drive the supply discharge cylinder 8a, and the chamber heat insulation. The processing slice is disposed on the outer wall of the wall 10 so as to face the processing unit 2 and drives the processing cylinder 9a. The drive mechanism 9 is constituted. In addition, especially in FIG. 1, the holding conveyance mechanism 5 is shown on the supply receiving part 1, and the holding conveyance mechanism 6 is shown on the processing part 2 is shown.
[78] The supply-receiving part 1 is a part which supplies an unexamined IC, Comprising: The structure by which the unexamined IC was accommodated in the state which piled up several trays was piled up, and the tray of the uppermost top stopped at the supply position P1. When all ICs are removed by suction, the tray of the next stage is comprised so that it may move up to the supply position P1 by the drive means not shown. In this supply and receiving part 1, IC is supplied in a horizontal position.
[79] The processing unit 2 is provided with an inspection pad (not shown) corresponding to an external terminal of the IC, and is a portion for performing electrical characteristic inspection of the IC by contact of the external terminal of the IC with the inspection pad. Is installed on a vertical surface of the chamber insulation wall 10, and is configured to inspect the IC in a vertical position.
[80] The drive shaft 3 is pivotally inserted into the through-hole 11 provided in the chamber heat insulation wall 10 and is inclined at 45 degrees with respect to the supply and reception part 1 and the processing part 2, and the chamber heat insulation wall 10 Is supported. As described above, the drive shaft 3 has an internal hollow structure, and two axes are arranged on the inner side and the outer side on the same shaft, and the drive system for driving the respective shafts on the upper end side of the inner shaft 3a and the outer shaft 3b ( 4) is connected, and the holding conveyance mechanisms 5 and 6 are attached to the lower end side, respectively, and the holding conveyance mechanisms 5 and 6 are each able to operate independently.
[81] In addition, the drive shaft 3 has the center of the processing part 2 and the supply and reception part 1 arrange | positioned in the same plane, and the processing part 2 and the supply and reception part 1 are located in the axisymmetric position with respect to this drive shaft 3. Is placed.
[82] The drive system 4 is comprised by the drive element which can stop the inner shaft 3a and the outer shaft 3b in arbitrary positions, and the holding conveyance mechanisms 5 and 6 are other than the supply-receiving part 1 and the processing part 2 It is made to be able to stop at arbitrary positions (for example, the standby point mentioned later). For this reason, it is set as the structure provided with the servomotor and the speed reducer which decelerates the rotation of the said motor, for example.
[83] In this drive system 4, the pulleys 17a and 17b and the drive belts 19a and 19b provided so that rotation by the drive of the servo motors 13a and 13b rotate integrally with the motor shafts 15a and 15b are provided. It is transmitted to the input shafts 23a and 23b to the reduction gears 21a and 21b. As a result, the inner shaft 3a is integrated with the bearing 25a and the rotating member 27a and rotates, and the outer shaft 3b is the bearing 25b. ) Is rotated integrally with the rotating member 27b.
[84] The drive system 4 configured as described above is connected in a cylindrical shape at the lower end side of the cylindrical member 31 accommodated in the receiving member 29 fixed to the chamber insulating wall 10 and fixed to the outer periphery of the bearings 25a and 25b. It is attached to the chamber heat insulation wall 10 by the member 33. As shown in FIG.
[85] FIG. 2 is an enlarged view of the holding conveying mechanism of FIG. 1, FIG. 3 is a side view of FIG. 2, and FIG. 4 is a schematic perspective view of the holding conveying mechanism of FIG. 1.
[86] The holding conveyance mechanisms 5 and 6 each have holding portions 5a and 6a for holding the IC, and each holding portions 5a and 6a hold and hold the IC by the suction head 41. And 36). Here, four holding heads are provided, and each holding head has the structure attached to the lower surface side of the mounting plate 43 linearly. The pair of shaft parts 45 and 46 are fixed to the upper surface side of the mounting plate 43, and the holding and conveying mechanisms 5 and 6 support the pair of shaft parts 45 and 46 so as to be slidable. The holding parts 5a and 6a are slidably supported in the direction orthogonal to the holding surface by a supporting mechanism.
[87] The support mechanism includes a bearing 49 for axially supporting the shaft portions 45 and 46 and a pair of outer cylinder members 47a in the axial direction for holding the bearing 49 on the shaft portions 45 and 46. And a connecting plate 55 fixed between the outer cylinder member 47 disposed outside the outer cylinder member 47 and the outer cylinder member 47. Moreover, the spring 51 is fitted in the upper part of the outer cylinder member 47, and in the state shown in figure, the holding head 35 is always upward and pressurized in the direction which positions the holding head 36 to the right direction. . In addition, the pair of shaft portions 45 and the shaft portions 46 are disposed inside and outside on the upper surface of the mounting plate 43 so as not to interfere with each other.
[88] The holding conveyance mechanisms 5 and 6 configured in this way are attached to the lower end of the driving shaft 3 so that the holding surfaces of the holding portions 5a and 6a have an angle of 45 degrees with respect to the driving shaft 3, and the inner shaft 3a and the outer shaft Rotation of 3b moves between the supply and reception part 1 (the discharge and reception part 7) and the processing part 2, respectively. Moreover, the installation to each axis of each holding conveyance mechanism is performed using the connecting members 53 and 57 and the said support mechanism (in particular, the connecting plate 55 here) which are each split longitudinally in the direction of the drive shaft 3, The holding conveying mechanism 5 is attached to the inner shaft 3a by having one end of the connecting member 53 fixed to the connecting plate 55 and the other end fixed to the inner shaft 3a, while the holding conveying mechanism 6 is connected. One end of the member 57 is fixed to the connecting plate 55, and the other end is fixed to the outer shaft 3b, thereby being attached to the outer shaft 3b. Moreover, the spacer 59 which has a shaft hole is fitted in the inner shaft 3a from the outside, and the space | interval with the outer shaft 3b is maintained.
[89] The supply discharge cylinder 8a driven by the supply discharge slide mechanism drive unit 8 resists the elastic portion of the spring 51 against the shaft portion 45 of the holding and transfer mechanism 5 located in the supply receiving unit 1. It presses, and the holding | maintenance part 5a moves to an axial direction by this. Further, the drop amount of the supply and discharge cylinder 8a is set to the first predetermined amount or the second predetermined amount (first predetermined amount> second predetermined amount), and the holding portion 5a is supplied with the supply position (by the respective set values). P1) or discharge position P2.
[90] In addition, the processing cylinder 9a driven by the processing slide mechanism drive unit 9 moves to the left by a predetermined amount against the elastic force of the spring 51 of the holding and transporting mechanism 6 located in the processing unit 2. Thus, the shaft portion 46 is pressurized, whereby the holding portion 6a is positioned at the processing position P3.
[91] Each holding head 35, 36 has a bolt 61 which is a guide for the slide operation, and the shaft positioning pin 61a of the bolt 61 is the processing part 2, the supply and receiving part 1, and the discharge water supply. It is inserted into the positioning hole (not shown) provided in the part 7, and is positioned correctly. Moreover, the spring 67 is attached between the plate 63 which abuts on the lower surface side of the mounting plate 43, and the plate 65 to which the said bolt 61 is fixed, and each holding head 35 and 36 is carried out. The IC is configured to reliably conform to the test pad of the processing unit 2 when the IC held by the processing unit is pressurized by the processing unit 2.
[92] The discharging and receiving part 7 is configured to reciprocate in the horizontal direction on the horizontal plane, and after the supply of the IC is performed at the supply position P1, the discharge receiver 7 slides to the left side from the evacuation position and waits at the discharge position P2, and discharges. After receiving the tested IC, it slides to the right to return to the evacuation position.
[93] Fig. 5 is a block diagram showing the configuration of the member handing apparatus of the embodiment of the present invention.
[94] As shown in the figure, the vacuum solenoid valves 71a and 71b connected to the servo motors 13a and 13b respectively driving the inner shaft 3a and the outer shaft 3b, the suction head 41, and a vacuum device (not shown). ), The processing slide mechanism driver 9 for driving the processing cylinder 9a, the supply and reception unit 1, the discharge and reception unit 7, the supply and discharge mechanism mechanism 8, and these The controller 72 which controls each component, the processing part 2 which performs an electrical characteristic test of IC, and the host controller 73 which controls the whole IC handler including the controller 72 and the processing part 2 is provided. It is comprised in one structure, and the controller 72 and the host controller 73 have the program which controls each part which is a control object, respectively.
[95] Hereinafter, the operation of the IC handler configured as described above will be described with reference to the drawings.
[96] When the holding part 6a which adsorbed-held the untested IC by the suction head 41 of each holding head 36 is located on the processing part 2 by rotation of the outer shaft 3b, the processing slide mechanism drive part ( 9 drives to move the processing cylinder 9a to the left in a predetermined amount, whereby the holding portion 6a moves to the processing position P3, and each holding head 36 carries the suctioned and held IC. Press the test pad of 2) to perform the test.
[97] On the other hand, the holding part 5a is in the state which sucked and hold | maintained the IC which already tested by the adsorption head 41 of each holding head 35, and the inner shaft 3a rotates at the same time as the rotation of the outer shaft 3b mentioned above. By rotating 180 degrees in the same direction as the above, it reaches the discharge delivery part 7 which was already waiting at the discharge position P2. Then, the slide mechanism drive part 8 for supply discharge drives, and the supply discharge cylinder 8a will fall 2nd predetermined amount, and will push down the shaft part 45 against the elastic force of the spring 51. As shown in FIG. Thereby, each holding head 35 of the holding | maintenance part 5a descends gradually to the discharge receiver 7 in the state correctly positioned by the guide of the axial part positioning pin 61a of the bolt 61. As shown in FIG. Then, when the holding head 35 descends to the discharge position P2, the vacuum solenoid valve 71a is closed and the suction of the suction head 41 is opened to discharge the inspected IC on the discharge receiving part 7 and After that, it rises and waits. In the meantime, the discharge conveyance part 7 which received discharge | emission of the inspected IC slides to a right direction, and moves to an evacuation position, to deliver the inspected IC to the next process.
[98] When evacuation of the discharge delivery part 7 appears, the supply delivery part 1 waiting in the supply position P1 below the discharge position P2 appears in the position facing the holding part 5a. The drive unit 8 drives to lower the first predetermined amount of the supply discharge cylinder 8a, whereby the holding unit 5a reaches the supply position P1 below the previous position. Then, the vacuum solenoid valve 71a opens, and the vacuum apparatus which is not shown in figure operates, and each holding head 35 adsorb | sucks and hold | maintains IC to the adsorption head 41 on the uppermost tray of the supply and receiving part 1. After the adsorption, the supply and discharge slide mechanism drive unit 8 is driven to raise the supply and discharge cylinder 8a. As a result, the holding unit 5a is supplied to the supply and discharge cylinder 8a by the elastic force of the spring 51. With the rise of, it gradually rises and returns to the top position.
[99] As described above, the holding unit 5a executes the discharge operation of the inspected IC and the supply operation of the uninspected IC while the holding unit 6a is located in the processing unit 2 and performs processing such as electrical property inspection. If the holding unit 6a is still located in the processing unit 2 and performing processing or the like even after returning to the top position after the completion of such operation, the predetermined amount of the inner shaft 3a is reduced in order to shorten the index time. (60 degrees here), it rotates and makes the holding | maintenance part 5a stand by at a standby point.
[100] FIG. 6: is a schematic perspective view which shows the holding conveyance mechanisms 5 and 6 at this time, FIG. 7: is explanatory drawing of a waiting point, In particular, in FIG. 6, it hold | maintains in the direction of the arrow B on the extension line of the rotating shaft A. In FIG. It is the figure which looked at the conveyance mechanisms 5 and 6. FIG. In addition, in FIG. 7, the broken line shows the holding | maintenance part 5a (namely, the holding part 5a when it is located in supply position P1 or discharge position P2) before moving to a standby point.
[101] As shown in the figure, by rotating the inner shaft 3a by 60 degrees, the holding section 5a is provided to the processing section 2 around the driving shaft 3 (rotation shaft A) in a plane orthogonal to the driving shaft 3. Wait at a position of 120 degrees relative to As a result, as is apparent from the drawing, the moving distance can be shortened to 2/3 as compared with the case of moving from the position of 180 degrees with respect to the processing unit 2 to the processing unit 2, and the index time can be shortened. In addition, this waiting point is set as close to the process part 2 as possible. Specifically, it depends on the number of simultaneous measurements (here 4), the arrangement method of the holding head (here, straight line shape), and the size of the holding part (holding head), and the holding part 5a located at the standby point. ) Is set to a position where it does not interfere with the other holding part 6a located in the processing unit 2.
[102] And the holding | maintenance part 6a finishes the test | inspection of the IC adsorbed-held by the suction head 41 of the holding head 36, and the processing cylinder 9a which moved to the right direction by the processing slide mechanism drive part 9 is carried out. In addition to the operation of the movement in the right direction to return to the rightmost position. After the return, the outer shaft 3b is rotated 180 degrees in the same direction as the rotational direction of the inner shaft 3a according to the movement to the standby point, and the holding portion 6a moves away from the processing portion 2 to the discharge receiving portion 7. do. At the same time, the inner shaft 3a is further rotated by 120 degrees, and the holding part 5a moves to the processing part 2 from the standby point with the unchecked IC being held by the suction head 41. 8 is a schematic perspective view of each holding and conveying mechanism showing this state.
[103] The holding part 5a which reached the processing part 2 slides to the processing position P3 by the same operation | movement as the holding part 6a mentioned above, and presses an untested IC to the processing part 2, and test | inspects it. Thus, when the holding | maintenance part 5a is processing in the processing part 2, the holding part 6a is delayed until the holding part 5a reaches the processing part 2, and reaches the discharge delivery part 7, By the same operation as that of the holding section 5a described above, the IC which has already been processed is discharged to the discharge delivery section 7 waiting at the discharge location P2, and the IC is adsorbed and held from the supply delivery section 1. Subsequent processing is repeated of the operation | movement which substituted the holding part 5a and the holding part 6a mentioned above.
[104] In this manner, the uninspected IC is adsorbed and held and returned to the processing unit 2 while the inner shaft 3a and the outer shaft 3b are rotated, respectively, and the IC after the inspection is transferred from the processing unit 2 to the discharge receiving unit 7. Execute repeatedly. In addition, the rotation direction of the drive shaft 3 at the time of moving the holding | maintenance part from the supply and receiving part 1 to the processing part 2 may be made to alternate, and may always be made the same direction. In the former case, the holding unit rotates in the reverse direction after the processing in the processing unit 2 to return to the discharge receiving unit 7 and the supply receiving unit 1, and in the latter case, the holding unit moves to the processing unit 2. It rotates in the same direction as the rotational direction at the time, and returns to the discharge delivery section 7 and the supply delivery section 1.
[105] As described above, according to the present embodiment, the holding conveying mechanisms 5 and 6 can be operated independently, and the holding portion holding the next uninspected IC is made to stand by at the standby point while the IC is being inspected. The index time can be shortened as compared with the conventional conveying apparatus having two pickup heads attached to the drive shaft so that the drive shaft is constituted by one axis and in a plane orthogonal to the drive shaft so that the drive shaft is 180 degrees opposite to the center of the drive shaft. Become.
[106] Moreover, since the drive system of each axis was set as the independent structure, it becomes possible to perform the position correction of each independent holding part, respectively. Thereby, it can respond flexibly to the positional deviation by thermal expansion or expansion and contraction by a change of setting temperature.
[107] Independent driving systems reduce the inertia of each driving system, enable high speed and high speed rotation of the drive system, and increase the speed, leading to shortening of the index time.
[108] In addition, by using an independent drive system, since the vibration at the time of operation is hardly transmitted directly to the other drive system, it becomes possible to reduce the influence that the vibrations have on each other on the processing performed in each holding unit. For this reason, it becomes possible to perform processes, such as measurement of the electrical characteristic in the process part 2, stably.
[109] In addition, although the case where four holding parts were arrange | positioned linearly was illustrated in the said Example, arrangement shape and number are not limited to this, For example, you may make it arrange | position as follows. Another arrangement example will be described with reference to FIGS. 9 to 12.
[110] 9 to 12 each show an arrangement example.
[111] 9 and 10 show an example of a linear arrangement (inline arrangement), and in particular, Fig. 9 is a circumferential direction with the rotation axis A (drive shaft 3) as the origin in a plane orthogonal to the drive shaft 3. FIG. 10 shows a case where two are arranged in the radial direction in the coplanar plane with the rotation axis A (drive shaft 3) as the origin. 11 shows an example of arrangement in a matrix form, and particularly shows a case in which four arrangements are made. 12 shows the case where one is arranged.
[112] In addition, in the present embodiment, the case where the standby point is set to a position of 120 degrees with the rotation axis A (drive shaft 3) as the origin in a plane orthogonal to the drive shaft 3 with respect to the processing unit 2 has been described as an example. However, the present invention is not limited thereto, and as described above, the number of simultaneous measurements, the arrangement method of the holding head, and the size of the holding part (holding head) are appropriately set. For example, in the example of FIGS. 9 to 12, when the linear arrangement in the circumferential direction by two simultaneous measurements (see FIG. 9) is set to 90 degrees, for example, when the linear arrangement in the radial direction by two simultaneous measurements (Fig. 9). 10), for example, is set at, for example, 60 degrees, four simultaneous measurements are set at, for example, 90 degrees in the case of a matrix-like arrangement (see FIG. 11), and for example, is set at, for example, 60 degrees (see FIG. 12). . In this case, for example, by miniaturizing the holding portion, it is possible to further set the standby point in the vicinity of the processing portion 2. In any case, it is preferable that the standby point is set in the vicinity of the processing unit 2, and the setting range of the standby point is the processing unit 2 around the rotation axis A (drive shaft 3) in a plane orthogonal to the driving shaft 3. It is within 180 degrees with respect to), and can be arbitrarily set according to the shape of a holding part within the said range about the thing which was fixed by 180 degrees with the conventional mechanism.
[113] In the case where the standby point is set from 60 degrees to 120 degrees in this manner, the moving distance when the holding section holding the uninspected IC is replaced by the processing section 2 is 1/3 to 2/3 moving compared with the conventional one. Since the distance can be shortened, the index time can be drastically shortened, and further, the processing capacity and productivity of the component delivery device (here, the IC handler) can be improved.
[114] In addition, as mentioned above, the rotation direction of the drive shaft 3 at the time of conveying the uninspected IC from the supply and reception part 1 to the process part 2 may always be made the same direction, and may be replaced alternately. . In the case of the holding part at each waiting point in the case where it replaced, the case of FIG. 9 (that is, the case where the linear position is arrange | positioned in the circumferential direction by two simultaneous measurements and the waiting position is set to 90 degree) is shown to an example, FIGS. As shown in FIG. In addition, the standby position can be provided on either side with respect to the processing unit 2, and FIG. 13 shows that the holding unit 6a is waited at a position of -90 degrees with respect to the processing unit 2, and FIG. The case is illustrated. In addition, FIG. 15 shows the case where the holding section 5a is held at a position of 90 degrees with respect to the processing section 2 when the holding section 6a is located in the processing section 2.
[115] In addition, in this embodiment, when moving from the supply and reception part 1 to the processing part 2, it is made to wait at a waiting point once, but when the process in the processing part 2 is already complete | finished, it is not made to wait at the waiting point. It can also be made to move directly to the processing unit (2). In this case, the inner shaft 3a and the outer shaft 3b are rotated 180 degrees at the same time, and the holding section 5a and the holding section 6a are the processing section 2 and the supply and delivery section 1 (the discharge delivery section 7), respectively. )] At the same time. In this case, it becomes the same operation as the conventional conveying apparatus, and a part of the above effects are not exhibited, but effects such as reduction of vibration transmission to the other holding part and independent positioning at each holding part are possible. You can still get it.
[116] In addition, in this embodiment, although the case where the member is conveyed between the positions provided on the mutually orthogonal planes was demonstrated, conveyance in the same plane may be sufficient.
[117] By the way, in the above, although the member receiving apparatus shown in FIG. 1 was described as an IC handler, it is exactly a part of the mechanism part which comprises an IC handler (henceforth, the mechanism part shown in FIG. 1 is called an IC receiving part), and FIG. 16 and 17, the overall configuration of the IC handler and its operation will be described.
[118] 16 is a schematic side view of the IC handler, and FIG. 17 is a schematic plan view of the IC handler.
[119] In addition to the IC receiver 600 described above, the IC handler 200 supplies a supply unit 300 for storing a plurality of untested LCs, an empty tray accommodating portion 310 for accommodating an empty tray, and an unchecked IC supplying portion. IC handler internal conveyance for supplying the supply mechanism 400 conveyed from 300 to the below-mentioned supply shuttle 500, and the untested IC received from the said supply mechanism 400 to IC receiver 600. The supply shuttle 500, the discharge shuttle 700 for conveyance inside the IC handler for discharging the inspected IC from the IC receiver 600, and the discharged IC described later from the discharge shutter 700. When the low temperature test (for example, 10 degrees Celsius or less) is performed in the discharge mechanism 800 conveyed to the part 900, the discharge part 900 which classifies and stores the tested IC, and a chamber, the low temperature test | inspection The warmed IC to temporarily return it to room temperature to prevent condensation before returning it to the outlet 900 A and a hot plate 1000.
[120] In addition, the discharge shuttle 700 is installed in the discharge receiving part 7 of FIG. 1, and this discharge shuttle 700 is shown to move left and right in FIG. 1, but in FIG. 16, the direction is perpendicular to the ground. The layout structure moving in the (Y direction) is shown.
[121] The supply unit 300 is configured to be capable of stacking and supporting a plurality of supply trays for storing a plurality of uninspected ICs, and includes a supply elevator 301 for moving the stacked plurality of supply trays up and down. When all the ICs are removed by the adsorption, the next stage feed tray is pushed upward to be positioned at the top. In addition, the empty tray is moved to and loaded by the empty tray accommodating portion 310 by the tray transport arm 910.
[122] The supply mechanism 400 is provided on the lower surface of the movable arm 401 and the movable arm 401 mounted on the lower surface of the Y-direction rail 405 (part of which is omitted in FIG. 17) so as to be reciprocated in the Y direction. A supply suction hand 403 (not shown in Fig. 17) is mounted to be capable of reciprocating in the X direction and to perform a lifting operation. The suction hand 403 sucks and holds the IC from the supply tray at the top of the supply unit 300, and ascends, moves immediately above the unchecked IC receiving position P4, and descends to unchecked IC receiving position P4. It is to supply the unchecked IC held by adsorption to the supply shuttle 500 located in.
[123] The supply shuttle 500 is configured to be capable of reciprocating in the X direction, and has an unchecked IC receiving position P4 and an unchecked for receiving the unchecked IC from the suction cup 403 for supply of the supply mechanism 400. It is alternately located at the unchecked IC receiver position P5 for passing the IC to the IC receiver 600, and at the unchecked IC receiver position P4, from the suction hand 403 for supply of the supply mechanism 400. Upon receipt of the unchecked IC receiving position, it moves to the unchecked IC receiving position P5, and is moved by an unillustrated mobile stacking mechanism that is disposed directly above the unchecked IC receiving position P5 at the IC receiving position P5. When the unchecked IC is picked up and emptied, the operation of returning to the unchecked IC receiving position P4 is repeatedly executed.
[124] The mobile loading mechanism which is not shown in figure is provided with the suction hand which can move up and down, and supplies the untested IC picked up from the supply shuttle 500 located in the untested IC receiver position P5 by the lifting operation of the said suction hand. Of the two trays at the uppermost end in the section 1, it corresponds to the unchecked IC receiving position P6 on the front side of FIG. 17 (just below the unchecked IC receiving position P5 described above (see FIG. 16), and FIG. Same as the supply position P1 of 1].
[125] In addition, in the supply-receiving unit 1, as described above, a plurality of trays in which a plurality of untested ICs are stored are stored in a stacked state. The trays are stacked. Of the plurality of trays, the uppermost tray on one side located at the unchecked IC receiving position P6 is pushed down when receiving the unchecked IC from the mobile stacking mechanism, and at the same time, at the unchecked IC receiving position P7. The tray at the top of the other stationary stop moves to the front of FIG. 17 and moves to the unchecked IC receiving position P6, while the tray next to the unchecked IC receiving position P7 is pushed upward. It is supposed to be located at the unchecked IC receiver position P7. In this manner, the supply and delivery unit 1 is configured to sequentially circulate a plurality of trays stacked in two rows before and after.
[126] In addition, in the supply / receiving part 1, the tray on which the untested IC is burned is circulated in the chamber insulation wall 10 as described above to perform temperature control, and the untested IC on the tray gradually approaches the test temperature. When the untested IC receiver position P7 is reached, the test temperature is reached. And the untested IC which reached | attained the test | inspection temperature from the tray stopped at the untested IC receiver position P7 is picked up by the above-mentioned maintenance conveyance mechanism 5 or the maintenance conveyance mechanism 6 for inspection, When the tray at the inspection IC receiving position P7 becomes empty, the empty tray at the inspection IC receiving position P7 moves to the inspection inspection IC receiving position P6 as described above, and the tray after storing the inspection IC is not received. Is pushed up to move to the unchecked IC receiver position P7.
[127] On the other hand, the unchecked IC picked up by the holding conveying mechanism 5 or the holding conveying mechanism 6 from the tray at the unchecked IC receiving position P7 is the holding conveying mechanism 5 or the holding conveying mechanism 6. The inspected IC receiving position (described later) which is provided for inspection by the processing unit 2 and held immediately above the unchecked IC receiving position P7 by the holding conveying mechanism 5 or the holding conveying mechanism 6 ( It is loaded on the discharge shuttle 700 waiting at P8) and replaced.
[128] The discharge shuttle 700 is configured to be capable of reciprocating in the Y direction, and receives the inspected IC for receiving the inspected IC provided to the inspector from the processing section 2 from the maintenance conveyance mechanism 5 or the maintenance conveyance mechanism 6. Positioned at the position P8 and the inspected IC receiving position P9 for passing the inspected IC to the discharge mechanism 800 alternately, the holding conveying mechanism 5 or the holding at the inspected IC receiving position P8. Receiving the IC inspected from the conveyance mechanism 6 moves to the inspected IC receiving position P9 and when the IC inspected by the discharging mechanism 800 is lifted up and emptied, the inspected IC receiving position P8 Repeat the operation to return to.
[129] The discharge unit 900 is configured to be capable of stacking a plurality of discharge trays for recovering the inspected IC, and when the discharge tray set at the top is filled by the inspected IC, the full discharge tray is moved downward. Discharge elevators 901, 903, and 905 and discharge trays 907, 909, and 911, and the discharge trays and discharge trays 907, 909, and 911 in these discharge elevators 901, 903, and 905. ICs inspected by the A are sorted and stored according to the inspection result. Moreover, in the discharge elevators 901,903,905, when a full discharge tray is moved downward, the empty tray is carried by the tray conveyance arm 910 from the empty tray accommodating part 310, and is located in the uppermost position.
[130] Similar to the supply mechanism 400, the discharging mechanism 800 has a movable arm 801 mounted on the lower surface of the Y-direction rail 405 so as to be reciprocated in the Y direction, and on the lower surface of the movable arm 801 in the X direction. And an adsorption hand (not shown) which is mounted to be capable of reciprocating movement and performs a lifting operation. The suction hand sucks and holds the inspected IC from the discharge shuttle 700 located at the inspected IC water transfer position P9, and ascends it, and then lifts the lifted elevators 901 and 903 of the discharge unit 900 according to the inspection result. One of each of the top discharge trays 905, or one of the discharge trays 907, 909, and 911 moves on the discharge tray, and the lowered and discharged IC is discharged to the discharge tray.
[131] The IC handler 200 configured as described above first conveys the untested IC from the supply unit 300 to the supply shuttle 500 located at the untested IC receiving position P4 by the supply mechanism 400. Then, the supply shuttle 500 is moved to the unchecked IC receiving position P5, and the unchecked IC is moved from the supply shuttle 500 located at the unchecked IC receiving position P5 by a lifting mechanism (not shown). In the supply receiving part 1, it loads and replaces on the tray located in the untested IC receiving position P6.
[132] And the untested IC which reached | attained the test | inspection temperature from the tray located in the untested IC receiver position P7 by the circulation movement of the tray performed by the supply and receiving part 1 is carried by the maintenance conveyance mechanism 5 or the maintenance conveyance mechanism. It extracts by (6), conveys it to the process part 2, and test | inspects it. The maintenance conveyance mechanism 5 or the maintenance conveyance mechanism 6 conveys the inspected IC device on the discharge shuttle 700 which waited at the inspected IC receiving position P8. Then, the discharge shuttle 700 is moved to the inspected IC receiver position P9, and the IC inspected by the discharge mechanism 800 is discharged from the discharge shuttle 700 located at the inspected IC receiver position P9. Discharge to the unit 900. In addition, when the inspection is carried out at a low temperature state, before the tested IC is returned to the discharge unit 900, it is once returned to the hot plate 1000, returned to room temperature, and then returned to the discharge unit 900. .
[133] As mentioned above, since the structure and operation | movement of the whole IC handler 200 became clear, the IC test | inspection apparatus provided with IC handler 200 is demonstrated by following drawing.
[134] It is a figure which shows the whole structure of the IC test | inspection apparatus provided with the IC handler shown to FIG. 16 and FIG.
[135] As shown in the figure, the IC inspection apparatus 210 has a configuration including a test head 220, a tester 230, and an IC handler 200 shown in Figs. The test pad of the above-described processing unit 2 is precisely installed in the test head 220, and the IC test apparatus 210 conveys the IC on the test pad installed in the test head 220 by the IC handler 200. Then, the tester 230 connected to the test head 220 executes an electrical characteristic test of the IC on the test pad, and the IC handler 200 returns the IC to an appropriate location according to the test result and classifies it.
[136] Since the IC inspection apparatus 210 comprised in this way is equipped with the IC handler 200 which assembled the delivery apparatus of the member of this invention, the IC inspection apparatus 210 which can shorten an index time and is excellent in inspection efficiency is obtained. Can be.
[137] In addition, in this embodiment, although the IC handler which conveys IC is demonstrated as an example of the receiving apparatus of a member, it is not limited to this.
[138] In addition, in this embodiment, although the IC test | inspection apparatus applied to the case of test | inspecting IC in a high temperature or low temperature environment was demonstrated as an example, the water-receiving apparatus of the member of this invention is an IC test | inspection apparatus in the case of testing IC in an environment of normal temperature. Needless to say, it is applicable to.
[139] In addition, although the low temperature test (for example, 10 degrees Celsius or less) was demonstrated as the example in this Example, it cannot be overemphasized that the temperature setting in a chamber can be arbitrarily set according to the environment in which IC is used.

权利要求:
Claims (29)
[1" claim-type="Currently amended] A plurality of drive shafts disposed coaxially and each of which has a drive system at one end thereof and is rotationally driven by the drive system;
It is provided with the holding | maintenance part which hold | maintains a member, and the some holding conveyance mechanism attached to each of the said several drive shaft is provided
Handing device of member.
[2" claim-type="Currently amended] A first drive shaft and a second drive shaft disposed coaxially and each of which has a drive system at one end thereof and is rotationally driven by the drive system;
A first holding and conveying mechanism having a first holding portion for holding a member and attached to said first drive shaft;
And a second holding and conveying mechanism attached to the second drive shaft, the second holding portion holding a member.
Absence transmission device.
[3" claim-type="Currently amended] The method of claim 2,
The second drive shaft is configured to have an internal hollow shape, and the first drive shaft is inserted into the second drive shaft, characterized in that arranged on the coaxial
Absentee
[4" claim-type="Currently amended] The method of claim 3, wherein
A spacer for supporting one end of the drive measurement of the first drive shaft and the second drive shaft in the axial direction, respectively, and maintaining the distance between the drive shafts at the other end at an interval between the first drive shaft and the second drive shaft. Characterized in that
Absence transmission device.
[5" claim-type="Currently amended] The method according to any one of claims 2 to 4,
The first holding conveyance mechanism is attached to the first drive shaft such that the holding face of the first holding part is at an angle of 45 degrees with respect to the drive shaft, and the holding face of the second holding conveying mechanism is 45 degrees with respect to the drive shaft. It is attached to the second drive shaft to form an angle
Absence transmission device.
[6" claim-type="Currently amended] The method according to any one of claims 2 to 5,
The said 1st holding conveyance mechanism is equipped with the 1st support mechanism which slidably supports the said 1st holding part in the direction orthogonal to the holding surface, The said 2nd holding conveyance mechanism is orthogonal to the holding surface. And a second support mechanism for slidably supporting in a direction to
Absence transmission device.
[7" claim-type="Currently amended] The method of claim 6,
The first drive shaft and the first support mechanism are connected to each other to attach the first holding and transfer mechanism to the first drive shaft, and the second drive shaft and the second support mechanism are connected to connect the second sustain and transfer mechanism to the second. Characterized in that attached to the drive shaft
Absence transmission device.
[8" claim-type="Currently amended] The method according to any one of claims 2 to 7,
The first holding conveying mechanism and the second holding conveying mechanism are alternately moved between a supply receiving part for supplying members by the rotation of the respective drive shafts and a processing part for performing a predetermined process on the members, A receiving and receiving device for a member, characterized in that the feeding and receiving section is sequentially delivered to said processing section.
[9" claim-type="Currently amended] The method of claim 8,
The said 1st holding conveyance mechanism and the said 2nd holding conveyance mechanism discharge | release the member which completed the process in the said process part to the discharge delivery part by rotation of each said drive shaft, It is characterized by the above-mentioned.
Absence transmission device.
[10" claim-type="Currently amended] The method according to any one of claims 2 to 9,
The first holding portion and the second holding portion are each provided with a plurality of holding heads.
Absence transmission device.
[11" claim-type="Currently amended] The method of claim 10,
The holding head is provided with suction means for holding and holding the member.
Absence transmission device.
[12" claim-type="Currently amended] The method of claim 11,
The plurality of holding heads are arranged in a linear shape, characterized in that
Absence transmission device.
[13" claim-type="Currently amended] The method of claim 11,
A plurality of holding heads are arranged in a matrix shape.
[14" claim-type="Currently amended] The method according to claim 8 or 9,
The processing unit performs an electrical characteristic test of the member as a predetermined process.
Absence transmission device.
[15" claim-type="Currently amended] In the hand-carrying apparatus of any one of Claims 2-13, the said 1st drive shaft and the said 2nd drive shaft drive each independently, It is characterized by the above-mentioned.
The control method of the conveyance apparatus of a member.
[16" claim-type="Currently amended] In the hand-carrying apparatus of the member of Claim 8 or 9 WHEREIN: The said 2nd holding conveyance mechanism of the state which hold | maintained the unprocessed member in the said supply and receiving part while the said 1st holding conveyance mechanism is located in the said process part, Of the member, wherein the second drive shaft waits at the standby point by rotation of the second drive shaft.
Control method of sorghum device.
[17" claim-type="Currently amended] The method of claim 16,
The standby point is a position specified at an angle of less than 180 degrees around the drive shaft with respect to the processing unit in a plane orthogonal to the drive shaft;
The control method of the conveyance apparatus of a member.
[18" claim-type="Currently amended] The method according to claim 16 or 17,
The standby point is set to a position close to the first holding portion and the second holding portion does not interfere with each other.
The control method of the conveyance apparatus of a member.
[19" claim-type="Currently amended] The method according to any one of claims 16 to 18,
The rotation direction of each said drive shaft at the time of passing a member from the said supply receiving part to the said process part is alternately replaced, It is characterized by the above-mentioned.
The control method of the conveyance apparatus of a member.
[20" claim-type="Currently amended] The method according to any one of claims 16 to 18,
The rotation direction of each said drive shaft at the time of receiving a member from the said supply receiving part to the said process part makes the same direction characterized by the above-mentioned.
The control method of the conveyance apparatus of a member.
[21" claim-type="Currently amended] The method according to any one of claims 16 to 20,
After the said 1st holding | maintenance conveyance mechanism or the said 2nd holding | maintenance conveyance mechanism is discharged | emitted from the said discharge receiving part after a member after a process, it is made to hold | maintain at the standby point, characterized in that
The control method of the conveyance apparatus of a member.
[22" claim-type="Currently amended] The method according to any one of claims 16 to 21,
The member is used as an IC, and the processing unit performs an electric characteristic test of the IC as a predetermined process.
The control method of the conveyance apparatus of a member.
[23" claim-type="Currently amended] In the IC inspection method which performs the electrical characteristic inspection of IC under predetermined temperature environment,
Supply process for supplying unchecked IC,
An inspection process for inspecting electrical characteristics of the uninspected IC;
Has a discharge process to discharge the tested IC,
The supply position which supplies an unexamined IC, the process position which examines the electrical characteristic of an unexamined IC, and the inspected IC are discharged | emitted using the receiving apparatus of the member of any one of Claims 1-14. IC is carried out between discharge position to be characterized by
IC inspection method.
[24" claim-type="Currently amended] The method of claim 23,
And a temperature adjusting step of controlling the temperature of the unchecked IC under the predetermined temperature environment, and the temperature adjusting step accommodates a plurality of trays for storing the plurality of unchecked ICs, And circulating the tray in a holding chamber to control the temperature of the uninspected IC to the predetermined temperature environment.
[25" claim-type="Currently amended] An IC handler comprising the receiving device of any one of claims 1 to 14, wherein the member is an IC, and returns LC to the processing unit in order to perform an electrical characteristic test of the IC.
The IC handler includes a supply unit, a supply mechanism, a supply shuttle, a mobile stacking mechanism, a discharge shuttle, a discharge unit, and a discharge mechanism,
The delivery device of the said member is provided with a supply delivery part, The said supply delivery part becomes the structure provided with two or more trays for receiving an unchecked IC in the said holding conveyance mechanism,
The supply unit has a plurality of supply trays for storing a plurality of untested ICs,
The supply mechanism includes a supply adsorption mechanism for adsorbing and holding an IC, a plane moving mechanism for moving the supply adsorption mechanism in a planar direction, and a lifting mechanism for operating the supply adsorption mechanism in a direction orthogonal to the plane. And by moving the supply adsorption mechanism by the plane moving mechanism and the elevating mechanism, the unchecked IC is taken out from the supply tray of the supply portion, and the unchecked IC is supplied to the supply shuttle.
The supply shuttle receives the uninspected IC taken out from the supply tray by the supply adsorption mechanism of the supply mechanism from the supply adsorption mechanism at the first uninspected IC receiving position, and then receives the uninspected IC. Move to a first uninspected IC receiving position for receiving by the supply receiving part of the receiving apparatus of the member, and returning to the first unchecked IC receiving position when the receiving is completed so as to perform upwardly than the supply receiving part; Composed,
The mobile stacking mechanism includes a mobile stacking adsorption mechanism capable of lifting and lowering, and the mobile stacking adsorption mechanism lifts and lowers the uninspected IC from the supply shuttle located at the first unchecked IC receiving position by the mobile stacking absorption mechanism. Whereby the supply shuttle moves to the first unchecked IC receiving position to move the unchecked IC to the tray of the supply receiving part shown immediately below it,
The supply receiving part receives a second uninspected IC receiving position of one of the plurality of trays immediately below the first unchecked IC receiving position, and a second unsuccessfully for receiving the unchecked IC to the holding conveying mechanism. After placing the unchecked IC in the holding and transporting mechanism at the second unchecked IC receiving position, and moving the empty tray to the second unchecked IC receiving position, the next inspection Configured to move the tray containing the unchecked IC to execute the second test to the second unchecked IC receiving position, thereby circulating the plurality of trays sequentially,
The discharge shuttle is taken out from the tray of the supply receiving portion by the holding conveying mechanism, and received the inspected IC processed by the processing portion at the inspected IC receiving position located directly above the second unchecked IC receiving position. Thereafter, moving the inspected IC to the inspected IC receiving position for receiving the discharge mechanism and returning to the inspected IC receiving position when the culling is completed above the supply and receiving section;
The discharge unit has a plurality of discharge trays for storing a plurality of inspected ICs, and is configured to classify and store the inspected ICs according to the inspection result in the processing unit.
The discharge mechanism includes a discharge suction mechanism for holding and holding the IC, a plane moving mechanism for moving the discharge suction mechanism in a planar direction, and a lift mechanism for operating the discharge supply mechanism in a direction orthogonal to the plane. And by moving the discharge adsorption mechanism by the lateral movement mechanism and the elevating mechanism, the inspected IC is taken out of the discharge shuttle located at the inspected IC water transfer position, and the discharge portion according to the inspection result in the processing portion. And to discharge the IC inspected by the discharge tray.
IC handler.
[26" claim-type="Currently amended] The method of claim 25,
A chamber for accommodating the supply and receiving part therein and maintaining the inside under a predetermined temperature environment, wherein the uninspected IC is stored in the plurality of trays of the supply and receiving part at the predetermined temperature by the chamber. Characterized in that
IC handler.
[27" claim-type="Currently amended] The method of claim 26,
It further comprises a hot plate for heating up to room temperature before discharging the inspected IC to the discharge unit
IC handler.
[28" claim-type="Currently amended] The method according to any one of claims 25 to 27,
And the mobile loading mechanism is disposed directly above the first unchecked IC receiver position.
IC handler.
[29" claim-type="Currently amended] A test head having the processing unit,
A tester connected to the test head and executing an electrical characteristic test of an IC in the processing section;
The IC handler of any one of Claims 25-28 which returns an IC to the said process part was provided.
IC inspection device.

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同族专利:

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公开号 | 公开日

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EP1286168A1|2003-02-26|

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US20020195313A1|2002-12-26|

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EP1286168B1|2006-11-29|

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WO2002063322A1|2002-08-15|

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DE60216380T2|2007-09-20|

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TW531480B|2003-05-11|

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DE60216380D1|2007-01-11|

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KR100530410B1|2005-11-22|

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US6984973B2|2006-01-10|

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KR100521956B1|2005-10-14|

---

EP1286168A4|2005-08-10|

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KR20040111686A|2004-12-31|

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JPWO2002063322A1|2004-06-10|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2001-02-08|Priority to JP2001032191

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2001-02-08|Priority to JPJP-P-2001-00032191

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2002-01-31|Application filed by 세이코 엡슨 가부시키가이샤

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2002-11-23|Publication of KR20020087960A

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2005-11-22|Application granted

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2005-11-22|Publication of KR100530410B1

优先权:

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申请号 | 申请日 | 专利标题

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JP2001032191|2001-02-08|

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JPJP-P-2001-00032191|2001-02-08|