• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Electronic box comprising: a support plate (2) having a mounting front face (4), at least one electronic chip (4) having a rear face (8) fixed on the front face of mounting the support plate and a front face (9), a cover (20) encapsulating said chip, comprising a peripheral wall (22), a front wall (21) and an inner partition (24) passing locally above said chip and defining two cavities (39, 40), a bonding material (34) interposed between on the one hand the support plate and the chip and on the other hand the peripheral wall and the bonnet wall; housing in which at least the end portion of said inner partition (24) of the cover (20), adjacent to the front face (9) of the chip, has at least one suitable accumulation and containment recess (32) at least partly receiving the gluing material.
    公开号:FR3055509A1
    申请号:FR1657951
    申请日:2016-08-26
    公开日:2018-03-02
    发明作者:Karine Saxod；Jean-Michel Riviere
    申请人:STMicroelectronics Grenoble 2 SAS；
    IPC主号:
    专利说明:

    ® FRENCH REPUBLIC
    NATIONAL INSTITUTE OF INDUSTRIAL PROPERTY © Publication number:
    (to be used only for reproduction orders)
    ©) National registration number
    055 509
    57951
    COURBEVOIE © Int Cl 8 : H 05 K5 / 03 (2017.01)
    PATENT INVENTION APPLICATION
    A1
    ©) Date of filing: 26.08.16. © Applicant (s): STMICROELECTRONICS (GRE- (© Priority: NOBLE 2) SAS - FR. @ Inventor (s): SAXOD KARINE and RIVIERE JEAN- MICHEL. Date of public availability of the request: 02.03.18 Bulletin 18/09. ©) List of documents cited in the report preliminary research: Refer to end of present booklet (© References to other national documents © Holder (s): STMICROELECTRONICS (GRENOBLE related: 2) SAS. ©) Extension request (s): © Agent (s): CASALONGA & ASSOCIES.
    ELECTRONIC UNIT COMPRISING A GROOVE HOOD.
    FR 3 055 509 - A1
    Electronic housing comprising: a support plate (2) having a front mounting face (4), at least one electronic chip (4) having a rear face (8) fixed on the front mounting face of the support plate and a front face (9), a cover (20) for encapsulating said chip, comprising a peripheral wall (22), a front wall (21) and an interior partition (24) passing locally above said chip and delimiting two cavities (39, 40), a bonding material (34) interposed between on the one hand the support plate and the chip and on the other hand the peripheral wall and the partition of the cover;
    housing in which at least the end portion of said internal partition (24) of the cover (20), adjacent to the front face (9) of the chip, has at least one accumulation and confinement recess (32) suitable to receive at least partially the bonding material.
    5 7 3 24a ΙΠ
    14 13

    i
    Electronic box including a grooved cover
    The present invention relates to the field of electronic boxes, in particular those which include electronic chips including transmitters and / or sensors of light radiation.
    Electronic boxes are known which comprise a mounting plate on which are mounted a first detecting electronic chip provided with first and second light radiation sensors and a second transmitting electronic chip provided with a light radiation emitter and which include a chip encapsulation cover.
    This cover includes a peripheral wall, a front wall and an internal partition passing locally above the first chip, between its sensors. The partition delimits two cavities so that the transmitter of the transmitter chip and the first sensor of the receiver chip are located in one of the cavities and the second sensor of the receiver chip is located in the other cavity. The front wall of the cover has an opening in front of the transmitter of the transmitter chip and an opening in front of the second sensor of the receiver chip, in which optical elements such as glass plates or optical lenses are placed. Generally, the cover is fixed to the mounting plate and to the receiving chip by means of a bonding material. The cover and the bonding material are opaque.
    Thus, the light radiation from the emitting chip is emitted to the outside, the first sensor of the receiving chip receives the light radiation from the emitting chip in the corresponding cavity and the second sensor from the detecting chip captures the external light radiation. A proximity detector can thus be produced in which the signals from the sensors of the receiving chip are processed to detect the presence or absence of an object in front of the housing. Such a proximity sensor can be mounted in a mobile phone to, for example, automatically turn off the screen when it is close to a user's ear.
    During manufacture, cords of bonding material are extended on the support plate and on the chip and the cover is placed on these cords. However, due to the difficulties in calibrating the cords, several drawbacks appear.
    There is a risk that the bonding material, interposed between the partition and the receiving chip, will flow by capillary action until it reaches and corrodes the studs before connection of the chip, and / or until at least partially at least l 'one of the sensors of this chip, so that this sensor is no longer able to correctly detect light radiation. The bonding material can also flow, by capillary action, along the internal walls of the cover, until reaching the optical elements placed in the openings of the front wall of the cover. In case of discontinuity of the bonding material, the light radiation present in one of the cavities can penetrate into the other cavity, so that the detections of light radiation by the sensors of the receiving chip are distorted. In addition, the solidity of the hood attachment, in particular of its partition on the receiving chip, is random.
    According to one embodiment, an electronic box is proposed which comprises a support plate having a front mounting face, at least one electronic chip having a rear face fixed on the front mounting face of the support plate and a front face. , an encapsulation cover of said chip, comprising a peripheral wall, a front wall and an internal partition passing locally above said chip and delimiting two cavities, and a bonding material interposed between on the one hand the support plate and the chip and on the other hand the peripheral wall and the partition of the cover.
    At least the end part of the cover partition, adjacent to the front face of the chip, has at least one accumulation and confinement recess capable of receiving at least part of the bonding material.
    Said hood partition can be supported on the front face of the chip.
    Said recess may include at least one accumulation and confinement groove extending longitudinally to the partition.
    The peripheral wall and the interior partition of the cover may have edges which are located at a distance from the front face of the support plate and from the sides of the chip, the bonding material comprising layers between them.
    Said accumulation and confinement groove can extend at least above the front face of the chip and up to opposite edges of the latter.
    Said recess may comprise at least one main accumulation and containment groove extending longitudinally to the partition and secondary accumulation and containment grooves extending longitudinally to the internal partition and located on either side of the main groove.
    The end part of the cover partition, adjacent to the front face of the chip, may comprise at least one opening extending transversely to the internal partition and forming a vent.
    The cover and the bonding material may be opaque.
    Said chip may include light radiation sensors located on either side of said partition, in said cavities, the front wall of the cover may include an opening opposite the sensor located in one of the cavities. Another electronic chip can be fixed on the support plate and can be located in the other cavity, this other chip being able to comprise a light radiation emitter, the front wall of the cover comprising another opening opposite this emitter.
    Elements allowing light to pass through can be mounted in said hood openings.
    An electronic unit will now be described by way of example, illustrated by the drawing in which:
    Figure 1 shows a longitudinal middle section of an electronic unit, according to I-I of Figure 2; 2 shows a flat section of the electronic unit of Figure 1, along II-II;
    3 shows a cross section of the electronic unit of Figure 1, along III-III; Figures 4 to 7 show local sections of the electronic unit, showing alternative embodiments.
    An electronic unit 1, illustrated in FIGS. 1 to 3, comprises an opaque support plate 2 including an integrated network 3 of electrical connection and having a mounting front face 4 and a rear face 5
    The electronic unit 1 comprises a receiving electronic chip 6 mounted on the mounting front face 4 of the support plate 2 by means of a layer of adhesive 7 interposed between the mounting front face 4 and a rear face 8 of the receiving chip
    6. In its front face 9, the receiving chip 6 is provided with two light radiation sensors 10 and 11 which are distant from each other.
    The electronic unit 1 comprises a transmitting electronic chip 12 mounted on the mounting front face 4 of the support plate 2 by means of a layer of adhesive 13 interposed between the mounting front face 4 and a rear face 14 of the emitting chip 12. In its front face 15, the emitting chip 12 is provided with a light radiation emitter 16.
    The chips 6 and 12 are located at a distance from the peripheral edge of the support plate 2 and at a distance from each other and are placed so that the sensors 10 and 11 and the transmitter 16 are aligned in a median direction longitudinal.
    The chips 6 and 12 are electrically connected to the electrical connection network 3 thanks respectively to electrical connection wires 17 and 18 which respectively connect the front pads of the support plate 2, connected to the electrical connection network 3, and the front pads chips 6 and 12. The front studs of the support plate 2 are located at a distance from the peripheral edge of this support plate 2.
    The rear face 5 of the support plate 2 is provided with studs 19 for external electrical connection, connected to the electrical connection network 3, with a view to electrically connecting, via the electrical connection network 3, the chips 6 and 12 to an external component, for example a printed circuit board.
    The electronic unit 1 also comprises an opaque encapsulation cover 20 for the electronic chips 6 and 12. This cover 20 can be made of a plastic material such as a thermosetting resin.
    The encapsulation cover 20 is bowl-shaped and comprises a front wall 21 which is arranged parallel to the support plate 2, at a distance above the chips 6 and 12 and the electrical wires 17 and 18, and a peripheral wall 22 which projects rearwardly from the front wall 21 and which extends laterally at the periphery and at a distance from the chips 6 and 12 and the electrical wires 17 and 18. The peripheral wall 22 has a rear edge d end 23 adjacent to a peripheral zone of the front face 4 of the support plate 2.
    The encapsulation cover 20 further comprises a transverse internal partition 24 which projects from the front wall 21 and from two opposite internal sides 22a and 22b of the peripheral wall 22, forming a bridge providing a passage 24a crossed by the receiving chip 6 and which passes locally above the receiving chip 6, between and at a distance from the sensors 10 and 11.
    Thus, the internal partition 24 has a rear end edge 25 adjacent to the front face 9 of the receiving chip 6, opposite lateral edges 26 and 27 adjacent to corresponding opposite flanks 28 and 29 of the receiving chip 6 and edges rear end 30 and 31 adjacent to the front face 4 of the support plate 2, on either side of the receiving chip 6. The opposite lateral edges 26 and 27 constitute the sides of the passage 24a and the rear edge d end 25, which joins the opposite lateral edges 26 and 27, constitutes the bottom of the passage 24a.
    The rear end edge of the peripheral wall 22 is fixed to a peripheral zone of the front face 4 of the support plate 2 by means of a layer of adhesive 23.
    Optionally, the rear end edge 25 is supported on the front face 9 of the receiving chip 6. The opposite lateral edges 26 and 27 are spaced from the corresponding opposite flanks 28 and 29 of the receiving chip 6. The rear edges d the end 30 and 31 and the rear edge 23 of the peripheral wall 22 are spaced from the front face 4 of the support plate 2 and extend in the same plane parallel to the front face 4 of the support plate 2.
    The rear end portion of the interior partition 24, including the rear end edge 25, is provided with an accumulation and confinement recess 32 open on the side of the front face 9 of the receiver chip 6.
    According to an alternative embodiment, this recess comprises an accumulation and confinement groove 33 which extends longitudinally to the partition 24, at least over a portion located between the sensors 10 and 11. According to the example shown, the groove d accumulation and confinement 33 extends from one side to the other of the receiving chip 6, possibly up to the opposite lateral edges 26 and 27 and is for example of rectangular section.
    The encapsulation cover 20 is fixed by means of an opaque bonding material 34 interposed between on the one hand the support plate 2 and the receiving chip 6 and on the other hand the peripheral wall 22 and the internal partition 24 cover 20.
    Thus, the bonding material 34 comprises a layer of adhesive 35 interposed between on the one hand the rear edge 23 of the peripheral wall 22 and the rear end edges 30 and 3 1 of the internal partition 24 and on the other hand the front face 4 of the support plate 2, layers of adhesive 36 and 37 interposed between the opposite lateral edges 26 and 27 of the interior partition 24 and the corresponding opposite sides 28 and 29 of the receiving chip 6 and a bead of adhesive which at least partially fills the accumulation and confinement groove 33 and which is interposed between this groove 33 and the front face 9 of the receiving chip 6.
    Optionally, a layer of bonding material 34 could be interposed between the rear edge 25 of the interior partition 24 and the front face of the receiving chip 6, for example to fill the surface defects of the chip and of the partition.
    As a result, the encapsulation cover 20 delimits, in front of the front face 4 of the support plate 2, two cavities 39 and 40 situated on either side of the internal partition 24, inside which are respectively located on the one hand the sensor 10 of the receiving chip 6 and the emitter 16 of the transmitting chip 12 and on the other hand the sensor 11 of the receiving chip 6.
    The layer 35, the layers 36 and 37 and the cord 38 are continuous and are in the extension of each other, so that there is no gap which could allow the light to pass through one of the cavities 39 and 40 in the other.
    The front wall 21 of the cover 20 has openings 41 and 42 located respectively opposite the transmitter 16 and the sensor 11. In these openings 41 and 42, the front wall 21 of the cover 20 is provided with optical shutter elements 43 and 44 allowing light to pass through, for example in the form of pellets or lenses.
    According to one mode of operation, the transmitter 16 of the transmitter chip 12 emits light radiation towards the outside through the optical element 43. This light radiation present in the cavity 39 is picked up by the sensor 10 of the receiver chip 6. The sensor 11 of the receiving chip 6 captures the external light radiation through the optical element 44.
    The signals from the sensors 10 and 11 are processed by the receiving chip 4 and / or an external electronic component to detect the presence or absence of an object in front of the cover 20 and produce a command.
    The electronic unit 1 can be manufactured in the following manner.
    The electronic chips 6 and 12 being mounted on the support plate 2 and the electrical wires being put in place, cords of bonding material 34, for example made of a liquid or pasty resin, are extended on the front face 4 of the plate support 2 and on the front face 9 and the sides 28 and 29 of the chip 6, in accordance with desired quantities.
    Then, the encapsulation cover 20 is put in place on these extended cords, which are compressed until the rear end edge 25 of the internal partition 24 comes to bear on the front face of the receiving chip 6.
    During this compression operation of the encapsulation cover 20, the bead of bonding material 34 extended on the front face 9 of the chip 6 penetrates at least partially into the accumulation and confinement groove 33 of the internal partition 24, preferably without flowing beyond the sides of this partition 24 towards the sensors 10 and 11.
    After the bonding material has hardened, the encapsulation cover 20 is fixed. The layer 35, the layers 36 and 37 and the bead 38 are formed.
    The optical elements 43 and 44 can be mounted on the encapsulation cover 20 before or after the assembly operation described above.
    Thanks to the existence of the accumulation and confinement groove 33, the quantity of bonding material 34 interposed between the internal partition 24 and the front face 9 of the receiving chip 6, can be increased, so as to constitute a bead 38 continuous and light-tight, without the bonding material 34 reaching the sensors 10 and 11 during the mounting operation and while ensuring correct assembly. For this, the amount of bonding material 34 interposed between the internal partition 24 and the front face 9 of the receiving chip 6 will be adjusted so that the section of the cord 38 is less than or close to the section of the groove. accumulation and containment 33.
    It is also possible, before mounting the encapsulation hood 20, to produce extended liquid or pasty beads of bonding material 34 of substantially constant sections, thanks to a machine whose operation is thus facilitated.
    According to an alternative embodiment illustrated in Figure 4, the recess 32 arranged in the end portion of the partition 24 adjacent to the front face 9 of the receiving chip 6 further comprises a plurality of secondary grooves for accumulation and confinement 45 parallel to the accumulation and containment groove 33 and situated on either side of the latter, the grooves 45 being for example less deep than the accumulation and containment groove 33. As shown, the grooves secondary accumulation and containment 45 are triangular sections.
    When the encapsulation cover 20 is put in place as described above, the bonding material 34 also fills, at least partially, the secondary accumulation and containment grooves 45, by forming secondary cords 46 also attached to the face front 9 of the receiving chip 6.
    According to an alternative embodiment illustrated in FIG. 5, the recess 32 arranged in the end portion of the partition 24 adjacent to the front face 9 of the receiving chip 6 comprises two parallel grooves 33, separated by a rib 33a, suitable forming parallel beads 38 and a plurality of secondary grooves 45 equivalent to those of the example described with reference to FIG. 4 and further arranged in the end of the rib 33a, capable of forming secondary parallel beads 46 .
    According to an alternative embodiment illustrated in FIG. 6, the end portion of the partition 24 adjacent to the front face 9 of the receiving chip 6 is provided with spaced orifices 47 crossing its flanks delimiting the accumulation and confinement groove 33, these orifices 47, of small section, constituting vents facilitating the penetration of the bonding material 34 into the groove 33 during the assembly operation of the encapsulation cover 20 described above.
    ίο
    According to an alternative embodiment illustrated in FIG. 7, the end portion of the partition 24 adjacent to the front face 9 of the receiving chip 6 is provided with spaced apart slots 48, of small thickness, crossing its flanks delimiting the groove of accumulation and confinement 33, these slots 48 also opening on the side of the front face 9 of the receiving chip 6. These slots 48 also constitute vents facilitating the penetration of the bonding material 34 into the groove 33 during the operation d assembly of the encapsulation cover 20 described above.
    In all the variant embodiments illustrated in FIGS. 1 to 7, the bonding material 34 is shown as completely filling the accumulation and confinement grooves 33. As explained above in connection with FIGS. 1 to 3, the bonding material collage 34 may only partially fill these grooves.
    The accumulation and confinement groove 33 can be of any cross section, for example of rectangular section as illustrated in FIGS. 1 to 6, or triangular, or of polygonal cross section with for example five facets as illustrated in FIG. 7.
    The encapsulation cover 20 can be made in a single part or in several parts. For example, the front wall 21, provided with the internal partition 24, can be added by an opaque bonding on the front end of the peripheral wall 22.
    权利要求:
    Claims (10)
    [1" id="c-fr-0001]
    1. Electronic unit comprising:
    a support plate (2) having a front mounting face (4), at least one electronic chip (4) having a rear face (8) fixed on the front mounting face of the support plate and a front face (9 ), a cover (20) for encapsulating said chip, comprising a peripheral wall (22), a front wall (21) and an interior partition (24) passing locally above said chip and delimiting two cavities (39, 40), a bonding material (34) interposed between on the one hand the support plate and the chip and on the other hand the peripheral wall (22) and the internal partition (24) of the cover;
    housing in which at least the end part of the internal partition (24) of the cover (20), adjacent to the front face (9) of the chip, has at least one accumulation and confinement recess (32) suitable to receive at least partially the bonding material.
    [2" id="c-fr-0002]
    2. Housing according to claim 1, wherein said inner partition (24) of the cover is supported on the front face (9) of the chip.
    [3" id="c-fr-0003]
    3. Housing according to one of claims 1 and 2, wherein said recess comprises at least one accumulation and containment groove (32) extending longitudinally to the interior partition (24).
    [4" id="c-fr-0004]
    4. Housing according to any one of the preceding claims, in which the peripheral wall (22) and the internal partition (24) of the cover have edges (23, 26, 27, 30, 31) which are located at a distance from the front face (4) of the support plate and the flanks (28, 29) of the chip, the bonding material comprising layers (35, 36, 37) between them.
    [5" id="c-fr-0005]
    5. Housing according to claim 3, wherein said accumulation and containment groove (33) extends at least above the front face of the chip and to the opposite edges of the latter.
    [6" id="c-fr-0006]
    6. Housing according to any one of the preceding claims, in which said recess comprises at least one main accumulation and containment groove (33) extending longitudinally to the partition and secondary accumulation and containment grooves (45 ) extending longitudinally to the interior partition and located on either side of the main groove.
    [7" id="c-fr-0007]
    7. Housing according to any one of the preceding claims, in which the end part of the cover partition, adjacent to the front face (9) of the chip, comprises at least one opening (47, 48) extending transversely to the interior partition and forming a vent.
    [8" id="c-fr-0008]
    8. Housing according to any one of the preceding claims, in which the cover (20) and the bonding material (34) are opaque.
    [9" id="c-fr-0009]
    9. Housing according to any one of the preceding claims, in which said chip (4) comprises light radiation sensors (10, 11) located on either side of said partition (24), in said cavities, the wall front (21) of the cover (24) comprising an opening (42) opposite the sensor located in one of the cavities and in which another electronic chip (12) is fixed on the support plate and is located in the other cavity, this other chip comprising a light radiation emitter (16), the front wall (21) of the cover (24) comprising another opening (41) opposite this emitter.
    [10" id="c-fr-0010]
    10. Housing according to claim 9, wherein elements (43, 44) allowing light to pass are mounted in said openings.
    1/4
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    引用文献:
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    EP3637466A1|2018-10-11|2020-04-15|STMicroelectronicsLimited|Electronic device comprising a chip having an optical sensor|
    法律状态:
    2017-07-19| PLFP| Fee payment|Year of fee payment: 2 |
    2018-03-02| PLSC| Search report ready|Effective date: 20180302 |
    2018-07-20| PLFP| Fee payment|Year of fee payment: 3 |
    2019-07-22| PLFP| Fee payment|Year of fee payment: 4 |
    2020-07-21| PLFP| Fee payment|Year of fee payment: 5 |
    2021-07-22| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1657951|2016-08-26|
    FR1657951A|FR3055509B1|2016-08-26|2016-08-26|ELECTRONIC HOUSING COMPRISING A GROOVE HOOD|FR1657951A| FR3055509B1|2016-08-26|2016-08-26|ELECTRONIC HOUSING COMPRISING A GROOVE HOOD|
    US15/611,266| US10480994B2|2016-08-26|2017-06-01|Electronic housing including a grooved cover|
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