• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a waveguide device (1) for guiding a radiofrequency signal at a determined frequency f, the device (I) comprising a core (3) comprising sidewalls with external (8) and internal (8) surfaces ( 7), the inner surfaces (7) delimiting a waveguide channel (2). A conductive layer (4) covers the inner surface (7) of the core (3), said conductive layer (4) being formed of a metal. having a skin depth 6 at the frequency f. Said conductive layer (4) has a thickness at least twenty times equal to said skin depth 6.
    公开号:FR3051924A1
    申请号:FR1600865
    申请日:2016-05-30
    公开日:2017-12-01
    发明作者:Rijk Emile De；Mirko Favre；Mathieu Billod；Alexandre Dimitriades
    申请人:Swissto12 SA；
    IPC主号:
    专利说明:

    Waveguide comprising a thick conductive layer
    Technical Field [0001] The present invention relates to a waveguide device, a method of manufacturing said waveguide and an information carrier for manufacturing said waveguide.
    STATE OF THE ART [0002] Radio frequency (RF) signals can propagate either in a free space or in waveguide devices. These waveguide devices are used to channel the RF signals or to manipulate them in the spatial or frequency domain.
    The present invention particularly relates to passive RF devices that allow to propagate and manipulate radio frequency signals without using active electronic components. Passive waveguides can be divided into three distinct categories: • Devices based on waveguiding inside hollow metal channels, commonly called waveguides. • Devices based on waveguiding inside dielectric substrates. • Devices based on waveguiding by means of surface waves on metal substrates such as PCB PCBs, microstrips, etc.
    The present invention relates in particular to the first category above, collectively referred to hereafter as waveguides. Examples of such devices include waveguides per se, filters, antennas, mode converters, and so on. They can be used for signal routing, frequency filtering, separation or recombination of signals, transmission or reception of signals in or from free space, etc.
    An example of a conventional waveguide is shown in Figure 1.11 is constituted by a hollow device, the shape and proportions determine the propagation characteristics for a given wavelength of the electromagnetic signal. Conventional waveguides used for radio frequency signals have internal openings of rectangular or circular section. They allow to propagate electromagnetic modes corresponding to different distributions of electromagnetic field along their section. In the example shown, the waveguide has a height b along the y axis and a width a along the z axis.
    [0006] FIG. 2 schematically illustrates the electric field lines E and magnetic lines H in such a waveguide. The dominant mode of propagation is in this case the electrical transverse mode called TE, o. The index i indicates the number of half-wavelengths across the width of the guide, and o the number of half-wavelengths along the height.
    Figures 3 and 4 illustrate a waveguide with circular section. Circular modes of transmission can propagate in such a waveguide. The arrows in FIG. 4 illustrate the TEii transmission mode; the substantially vertical arrows show the electric field, the arrows further horizontal the magnetic field. The orientation of the field changes across the section of the waveguide.
    Apart from these examples of rectangular or circular waveguide openings, other forms of opening have been imagined or can be imagined in the context of the invention and which maintain an electromagnetic mode to a given signal frequency for transmitting an electromagnetic signal. Examples of possible waveguide apertures are illustrated in FIG. 5. The illustrated surface corresponds to the section of the waveguide aperture delimited by electrically conductive surfaces. The shape and surface of the section may further vary along the main direction of the waveguide device.
    The manufacture of waveguides with complex sections is difficult and expensive. Recent work, however, has demonstrated the possibility of producing waveguide components, including antennas, waveguides, filters, converters, etc., using additive manufacturing methods, for example 3D printing. In particular, the additive manufacturing of waveguides comprising both non-conductive materials, such as polymers or ceramics, and conductive metals is known.
    Waveguides with ceramic or polymer walls manufactured by an additive method and then covered with a metal veneer have been suggested in particular. The inner surfaces of the waveguide must indeed be electrically conductive to operate. The use of a non-conductive core makes it possible on the one hand to reduce the weight and the cost of the device, on the other hand to implement 3D printing methods adapted to polymers or ceramics and making it possible to produce parts high precision with low roughness.
    An exemplary waveguide i produced by additive manufacturing is illustrated in FIG. 6. It comprises a non-conductive core 3, for example made of polymer or ceramic, which is manufactured for example by stereolithography or by another additive process. and which defines an internal aperture 2 for propagation of the RF signal. In this example, the window has a rectangular section of width a and height b. The inner walls of this core around the opening 2 are coated with an electrically conductive coating 4, for example a metal veneer. In this example, the outer walls of the waveguide are also coated with a metal plating which may be of the same metal and the same thickness. This outer coating strengthens the waveguide against external mechanical or chemical stresses.
    Figure 7 illustrates an alternative waveguide similar to that of Figure 6, but without the conductive coating on the outer faces.
    The waveguides are typically used outside, for example in the aerospace (plane, helicopter, drone) to equip a spacecraft in space, on a boat at sea or on a sub-gear. marine, on gear evolving in the desert or high mountain, each time in hostile or even extreme conditions. In these environments, the waveguides are notably exposed to: extreme pressures and temperatures that vary significantly, which induces repeated thermal shocks; a mechanical stress, the waveguide being integrated in a machine that undergoes shocks, vibrations and charges that impact the waveguide; hostile weather and environmental conditions in which gears equipped with waveguides operate (wind, frost, humidity, sand, salts, fungi / bacteria); To meet these constraints, we know waveguides formed by assembling previously machined metal plates, which allow to manufacture waveguides adapted to evolve in hostile environments. In contrast, the manufacture of these waveguides is often difficult, expensive and difficult to adapt to the manufacture of light waveguides and complex shapes.
    As regards the waveguides assembled by additive manufacturing, the existing techniques do not allow the manufacture of waveguides sufficiently resistant to evolve in hostile environments. The existing waveguides, manufactured by additive manufacturing of a polymer core whose inner surface is covered with metal, do not have mechanical and structural characteristics that allow satisfactory use in hostile environments where waveguides. Exposed to significant variations in pressure or temperature, the structure of these waveguides is unstable and tends to degrade which disrupts the transmission of the RF signal. In addition, the existing waveguides, manufactured by additive manufacturing of a conductive material, such as a metal material, have surface conditions of too low quality, including excessive roughness, which degrades the RF performance of the waveguide. wave and makes additive manufacturing difficult to use for this application.
    BRIEF SUMMARY OF THE INVENTION [0016] An object of the present invention is to provide a waveguide device free or minimizing the limitations of known devices.
    Another object of the invention is to provide a waveguide device by additive manufacturing that can be used in hostile conditions.
    According to the invention, these objects are achieved in particular by means of a waveguide device device for guiding a radiofrequency signal at a determined frequency f, the device comprising: a core manufactured by additive manufacturing in conductive or preferably non-conductive material, comprising side walls with external and internal surfaces, the inner surfaces delimiting a waveguide channel, a metal conductive layer covering the inner surface of the core, said conductive layer being formed of a metal characterized by a skin depth δ at the frequency f, the conductive layer having a thickness at least twenty times equal to said skin depth δ.
    The skin depth δ is defined as:
    where μ is the magnetic permeability of the plated metal, f is the radio frequency of the signal to be transmitted and σ is the electrical conductivity of the plated metal. Intuitively, it is the thickness of the area where the current in the conductor is concentrated at a given frequency.
    This solution has the advantage over the prior art to provide waveguides assembled by additive manufacturing which are more resistant to the constraints to which they are exposed (thermal, mechanical, meteorological and environmental constraints).
    In waveguides assembled by additive manufacturing according to existing methods, the structural, mechanical, thermal and chemical properties essentially depend on the properties of the core. Typically, waveguides are known in which the conductive layer deposited on the core is very thin, less than the skin depth of the metal constituting the conductive layer. Thus, it was generally accepted that to improve the structural and mechanical properties of the waveguides it was necessary to increase the thickness and / or rigidity of the core. It was also accepted that the thickness of the conductive film layer must be reduced in order to lighten the structure.
    The inventors have discovered that by increasing the thickness of the conductive layer so that it reaches a thickness at least twenty times equal to the skin depth δ of the metal of the conductive layer, the structural, mechanical, thermal properties and chemical waveguide depend mostly, if not almost exclusively, the conductive layer. This surprising behavior is observed although the thickness of the conductive layer remains significantly lower than the thickness of the core.
    In one embodiment, the resistance of the device selected from tensile strength, torsion, bending or a combination of these resistors is conferred mainly by the conductive layer. For example, one way to characterize the resistance of a device is to measure the Young's modulus. It is recognized that for a material, the higher the Young's modulus, the stiffer the material. For example, steel has a higher Young's modulus than rubber. According to one embodiment, the conductive layer is made of metal and is less thick than the core and yet it is the metal layer that provides the essential rigidity of the device.
    Thus, it is possible to reduce the thickness of the core, and thus its dimensions, while improving the tensile strength, torsion, bending of the device (see Figure 12). It is advantageous to be able to reduce the thickness of the walls, and thus the dimensions of the waveguide, while increasing the tensile strength (for example rigidity), torsion, bending of the waveguide, particularly for spacecraft or submarine or where the space available for each component is restricted.
    In one embodiment, the resistance of the device selected from tensile strength, torsion, bending or a combination of these resistors being conferred mainly by the conductive layer over the operating temperature range of the device. Operational temperatures mean temperatures between -50 ° C and + 150 ° C. This temperature range makes it possible to cover the majority of the temperatures where the device according to the invention is likely to evolve (space, desert, deep water, etc.).
    In one embodiment, the conductive layer has a thickness between twenty times and sixty times the skin depth δ. This embodiment mainly reduces or even eliminates the roughness of the conductive surface.
    This also makes it possible to reinforce the tensile strength, torsion, bending of the device, for example the rigidity of the waveguide.
    In one embodiment, the conductive layer has a thickness of between sixty and one thousand times the skin depth δ. Such a conductive layer thickness particularly makes it possible to reinforce tensile strength, torsion, bending of the device, for example the rigidity of the waveguide.
    In one embodiment, the device comprises a smoothing layer between the core and the conductive layer. At the end of the additive manufacturing of the core, it has been observed that the additive manufacturing process creates a high roughness (for example, hollows and bumps), especially on the edges and surface of the core, particularly on the edges at an angle. These hollows and bumps can take the form of steps, each step representing the addition of a layer of non-conductive material during additive manufacturing. It was observed that after covering the core with a thin conductive layer, the roughness of the core persisted so that the surface after metallization still had a roughness which disturbed the transmission of the RF signal. In this case, the addition of a smoothing layer between the core and the conductive layer makes it possible to reduce or even eliminate this roughness, which improves the transmission of the RF signal. The smoothing layer may be of conductive or non-conductive material.
    When the smoothing layer comprises a weakly conductive material, for example nickel, the transmission of the RF signal is provided essentially by the outer metal conductive layer, the influence of the smoothing layer is negligible, and in this case the outer conductive layer must have a thickness at least twenty times equal to said skin depth δ.
    In one embodiment, the resistance of the device selected from tensile strength, torsion, bending or a combination of these resistors is conferred mainly by the conductive layer comprising the smoothing layer.
    In one embodiment, the resistance of the device selected from tensile strength, torsion, bending or a combination of these resistors is conferred mainly by the conductive layer comprising the smoothing layer over the operating temperature range of device.
    The use of a conductive layer thicker than what would be required by the skin thickness also smooths the roughness of the soul due to the resolution of the 3D printer. Thus, the conductive layer also makes it possible to reduce or even eliminate the roughness of the core.
    This smoothing layer also improves the structural, mechanical, thermal and chemical properties of the waveguide device.
    In one embodiment, the device comprises a coupling layer (or priming) between the core and the conductive layer. Preferably, the attachment layer is on the inner surface of the core. The attachment layer may be of conductive or non-conductive material. The bonding layer makes it possible to improve the adhesion of the conductor on the core.
    In one embodiment, the device comprises successively a non-conductive core made in additive manufacturing, a bonding layer, a smoothing layer and a conductive layer. Thus, the bonding layer and the smoothing layer make it possible to reduce the roughness of the surface of the waveguide channel. The bonding layer makes it possible to improve the adhesion of the conductive or non-conductive core with the smoothing layer and the conductive layer.
    In one embodiment, the metal layer comprises a plurality of metal sub-layers. When the conductive layer comprises several successive layers of highly conductive metals, for example Cu, Au, Ag, the skin depth δ is determined by the properties of the materials of all the layers in which the film current is concentrated.
    When the conductive layer comprises several successive sub-layers of metals of which at least one is a weak conductor, for example Ni, the skin depth δ of the weakly conductive sub-layer is negligible in the calculation of the thickness of the conductive layer, most of the transmission of the RF signal being provided by the sub-layers of highly conductive metals deposited on top of the sub-layer of weakly conductive materials.
    In one embodiment, the conductive metal layer also covers the outer surface of the core. When the device is covered with a metal layer, the rigidity of the device is improved.
    According to one embodiment, the core comprises at least one layer of polymer and / or ceramic.
    In one embodiment, the core is formed of a metal or an alloy. For example, the metal or alloy is selected from Cu, Au, Ag, Ni, Al, stainless steel, brass or a combination of these choices. In one embodiment, the metal layer comprises a metal selected from Cu , Au, Ag, Ni, Al, stainless steel, brass.
    In one embodiment, the attachment layer optionally comprises a metal selected from Cu, Au, Ag, Ni, Al, stainless steel, brass, a non-conductive material, for example a polymer or a ceramic or a combination. of these choices.
    In one embodiment, the smoothing layer optionally comprises a metal selected from Cu, Au, Ag, Ni, Al, stainless steel, brass, a non-conductive material, for example a polymer or a ceramic or a combination. of these choices.
    In one embodiment, the device comprises successively a core, a bonding layer, a nickel smoothing layer, and said metal conductive layer.
    According to one embodiment, the device comprises successively a non-conductive core, a first copper layer, a nickel layer, a second copper layer. The attachment layer comprises the first copper layer. The smoothing layer comprises the Ni layer. The metal layer comprises the second Cu layer.
    The invention also relates to a method of manufacturing a waveguide device for guiding a radio frequency signal at a determined frequency f, the method comprising: fabricating a core of conductive or preferably non-conductive material comprising walls lateral surfaces with external and internal surfaces, the inner surfaces delimiting a waveguide channel, depositing a conductive layer on the inner surface of the core, said conductive layer being formed of a metal characterized by a skin depth δ to the frequency f, said conductive layer having a thickness equal to at least twenty times said skin depth δ.
    According to one embodiment, the deposition of the conductive layer on the core is carried out by electrolytic deposition or electroplating, chemical deposition, vacuum deposition, physical vapor deposition (PVD), deposition by printing, deposition by sintering. .
    In one embodiment of the method, the conductive layer comprises several layers of metals and / or non-metals deposited successively.
    In one embodiment, the manufacture of said core comprises an additive manufacturing step. Additive manufacturing means any process for manufacturing parts by adding material, according to computer data stored on a computer medium and defining a model of the part. In addition to stereolithography, the term also refers to other manufacturing methods such as curing or coagulation of liquid or powder including, but not limited to, binder jetting methods, DED (Direct Energy Deposition). , EBFF (Electron beam freeform fabrication), FDM (fused deposition modeling), plastic freeforming (PEE), aerosols, BPM (ballistic particle manufacturing), powder bed, SES (Selective Laser Sintering), ALM (additive Layer Manufacturing), polyjet, EBM (electron beam melting), photopolymerization, etc. [0049] The invention further relates to a manufacturing method comprising: i) introducing data representing the shape of a waveguide device core, core with sidewalls with external and internal surfaces; ii) the use of these data for additive manufacturing by means of a waveguide device core; iii) the deposition of a conductive layer on said core, the conductive layer being characterized by a skin depth δ at the frequency f, so as to cover the inner surfaces of the core to define a waveguide channel, iv) said data representing the shape of a core are determined by taking into account the thickness of the conductive layer so that the waveguide is optimized for RF signal transmission at the frequency f, the conductive layer having a thickness of at least twenty the skin depth δ.
    The dimensions of the waveguide channel are determined according to the frequency of the wave to be transmitted. It is necessary to know the thickness of the conductive layers and the thickness of the walls of the core to calculate the dimensions (width and height) of the waveguide channel. In the method according to the invention, the thickness of the core which is manufactured is calculated taking into account the unusual thickness of the conductive layer which will be deposited in a second time on the soul to obtain a waveguide channel at dimensions required.
    The invention also relates to a computer data medium containing data intended to be read by an additive manufacturing device for manufacturing an object, said data representing the shape of a core for a waveguide device, said core having sidewalls with outer and inner surfaces, the inner surfaces defining a waveguide channel.
    The computer data medium can be constituted for example by a hard disk, a flash memory, a virtual disk, a USD key, an optical disk, a storage medium in a network or cloud type, etc..
    The embodiments of the waveguide device apply mutatis mutandis to the manufacturing processes and the data carrier according to the invention and vice versa.
    In the context of the invention, the terms "conductive layer", "conductive coating", "metal conductive layer" and "metal layer" are synonymous and interchangeable.
    BRIEF DESCRIPTION OF THE FIGURES [0055] Examples of implementation of the invention are indicated in the description illustrated by the appended figures in which: FIG. 1 illustrates a truncated perspective view of a conventional waveguide device rectangular section. • Figure 2 illustrates the magnetic and electrical field lines in the device of Figure i. FIG. 3 illustrates a truncated perspective view of a conventional circular waveguide device. Figure 4 illustrates the magnetic and electrical field lines in the device of Figure 3. Figure 5 illustrates different possible sections of transmission channels in waveguide devices. FIG. 6 illustrates a truncated perspective view of a rectangular section waveguide produced by additive manufacturing and whose inner and outer walls are both covered with a conductive electrical material deposition. FIG. 7 illustrates a truncated perspective view of a rectangular section waveguide device produced by additive manufacturing and of which only the internal walls are covered with a deposition of conductive electrical material. FIGS. 8A and 8B illustrate a device according to a first embodiment in which the core is covered with a single conductive layer on the inner face and, respectively, on the inner and outer face. FIGS. 9A and 9B illustrate a device according to a second embodiment in which the core is covered with a smoothing layer and then a conductive layer on the inner face and, respectively, on the inner and outer face. Figures loA and loB illustrate a device according to a third embodiment in which the core is covered with a bonding layer, a smoothing layer and a conductive layer on the inner face and, respectively, on the inner and outer side. • Figure ii shows a longitudinal sectional view of a portion of the rough surface of the core of the smoothing and conductive layer on the core. FIG. 12 is a comparative table of the Young's moduli for a waveguide according to the prior art and a waveguide according to the present invention.
    Example (s) of Embodiment of the Invention [0056] FIGS. 8, 9 and 10 represent three embodiments of a waveguide device i according to the invention, with in each case two subvariants . The waveguide I comprises a core 3, for example a core of polymer, epoxy, ceramic, organic material, metal, etc. manufactured by additive manufacturing, for example by stereolithography. The core material may be non-conductive or conductive. The thickness of the walls of the core is for example between 0.5 and 3 mm, preferably between 0.8 and 1.5 mm.
    The shape of the soul can be determined by a computer file stored in a computer data carrier.
    The core may also consist of several parts formed by stereolithography and assembled together before plating, for example by gluing or thermal fusion or mechanical assembly.
    This core 3 defines an internal channel 2 for waveguiding, and whose section is determined according to the frequency of the electromagnetic signal to be transmitted. The dimensions of this internal channel a, b and its shape are determined as a function of the operating frequency of the device i, that is to say the frequency of the electromagnetic signal for which the device is manufactured and for which a stable transmission mode and optionally with a minimum of attenuation is obtained.
    The core 3 has an inner surface 7 and an outer surface 8, the inner surface 7 covering the walls of the opening of rectangular section 2.
    In a first embodiment illustrated in FIG. 8A, the internal surface 7 of the polymer core 3 is covered with a conductive metal layer 4, for example copper, silver, gold, nickel etc., plated by chemical deposition without electric current. The thickness of this layer is for example between 1 and 20 microns, for example between 4 and 10 microns.
    The thickness of this conductive coating 4 must be sufficient for the surface to be electrically conductive at the chosen radio frequency. This is typically obtained using a conductive layer whose thickness is greater than the skin depth δ.
    This thickness is substantially constant on all internal surfaces to obtain a finished part with dimensional tolerances for the precise channel. According to the invention, the thickness of this layer 4 is at least twenty times greater than the skin depth in order to improve the structural, mechanical, thermal and chemical properties of the device.
    In the embodiment of Figure 8A, the outer surface 8 of the core is bare. In order to protect it, in the embodiment of FIG. 8B, this external surface is also covered with a conductive layer 5, which also contributes to improving the structural, mechanical, thermal and chemical properties of the device.
    The conductive metal deposition 4,5 on the inner faces 7 and possibly outer 8 is done by immersing the core 3 in a series of successive baths, typically i to 15 baths. Each bath involves a fluid with one or more reagents. The deposition does not require applying a current on the core to be covered. Stirring and regular deposition are obtained by stirring the fluid, for example by pumping the fluid into the transmission channel and / or around the device or by vibrating the core 3 and / or the fluid tank, for example with a device vibrating ultrasound to create ultrasonic waves.
    In the embodiment illustrated in Figure 9A, the inner surface 7 of the polymer core 3 is covered with a smoothing layer 9, for example a layer of Ni. The thickness of the smoothing layer 9 is at least equal to the resolution of the 3D printing process used to make the core, the resolution of the 3D printing process determining the roughness of the surface. In one embodiment, the thickness of this layer is between 5 and 500 microns, preferably between 20 and 150 microns. This smoothing layer also determines the mechanical and thermal properties of the device i. The Ni layer 9 is then covered with the conductive layer 4, for example copper, silver, gold, etc.
    The smoothing layer makes it possible to smooth the surface of the core and thus to reduce the transmission losses due to the roughness of the internal surface.
    In this embodiment, the core 3 is covered with a metal layer 4 + 9 formed of a smoothing layer 9 and a conductive layer 4. The total thickness of this layer 4 + 9 is greater than or equal to twenty times the skin depth δ. The value of the Young's modulus of the device i is mainly conferred by this conductive layer 4 + 9. The thickness of the conductive layer 4 may also only be greater than or equal to twenty times the skin depth δ. The most conductive layer is preferably deposited last at the periphery.
    Similarly, in Figure 9B, the inner surface 7 of the non-conductive polymer core 3 is covered with a smoothing layer 9 of Ni deposited by chemical deposition. The Ni layer 9 is then covered by chemical deposition of a conductive layer 4 made of Cu, the thickness of which is at least equal to twenty skin thicknesses at the nominal transmission frequency of the waveguide. The outer surface 8 of the core 3 is also covered by chemical deposition of a nickel smoothing layer 6, which also serves as a structural support. A conductive layer 5, for example copper, may be deposited on top of this smoothing layer.
    In the embodiment illustrated in FIG. 10A, the waveguide i comprises an attachment layer ii, for example a Cu layer, over the inner surface 7 of the core 3; this attachment layer facilitates the subsequent deposition of the smoothing layer 9 if such a layer is provided, or the conductive layer 4. The thickness of this layer is preferably less than 30 microns.
    In the same way, in FIG. 1B, the waveguide i comprises an attachment layer 12, for example a Cu layer, over the outer surface 8 of the core 3; this attachment layer facilitates the subsequent deposition of the smoothing layer 6 if such a layer is provided, or of the outer conductive layer 5.
    FIG. Ii is a diagram showing a longitudinal section of a portion of the internal surface 7 of the core 3 of a waveguide device i comprising a waveguide channel 2. It can be seen that this inner surface is very irregular or rough due to the additive manufacturing process.
    Above the core 3, the waveguide i comprises an attachment layer ii, for example a Cu layer between 1 and 10 microns thick.
    A smoothing layer 9, for example a Ni layer, is deposited by chemical deposition and partially smooths the irregularities of the layer of the surface of the core 3. The thickness of this smoothing layer is as follows: less than the resolution of the additive printing system; in one embodiment, the thickness of the smoothing layer 9 is between 5 and 500 microns, preferably between 20 and 150 microns.
    A third conductive layer 4 of copper or silver is deposited by chemical deposition on the smoothing layer 9; its thickness is preferably greater than or equal to twenty times the skin thickness at the nominal frequency f of the waveguide, so that the surface currents concentrate mainly, or almost exclusively, in this layer. The relatively large thickness of this conductive layer 4 also makes it possible to reinforce the mechanical rigidity of the device. In one embodiment, the thickness of this layer is between 5 and 50 microns, preferably between 5 and 15 microns.
    These depositions can be applied mutatis mutandis to the external surface 8.
    The table of FIG. 12 compares the Young's modulus of a waveguide i entirely in Al with the Young's modulus of a waveguide device i according to the invention. The waveguide according to the prior art used for this comparison consists of a sheet of Al 500 micrometer thick having a Young's modulus of 72500 Nlrmn. The waveguide i according to the invention used in this example comprises a polymer core 3 imm imm thick, a cling layer ii of Cu of 5 micrometer, a smoothing layer 9 of Ni 90 micrometer and a 4 micron conductive layer 4 of Cu. The overall thickness of the coating is thus 100 micrometers for a Young's modulus of 214,000 N / mm 2. The influence of the bonding layers on the Young's modulus is negligible. Note that the flexural strength (flexural rigidity) of the waveguide according to the invention is greater than that of the waveguide made entirely of aluminum according to the prior art, for a reduced weight.
    Reference numbers used in the figures
    权利要求:
    Claims (14)
    [1" id="c-fr-0001]
    claims
    A waveguide device (i) for guiding a radiofrequency signal at a determined frequency f, the device (i) comprising: a core (3) manufactured by additive manufacturing and having sidewalls with outer surfaces (8) and internal (7), the inner surfaces (7) delimiting a waveguide channel (2), a metal conductive layer (4) covering the inner surface (7) of the core (3), said metallic conductive layer (4) being formed of a metal having a skin depth δ at the frequency f, characterized in that the metal conductive layer (4) has a thickness at least twenty times equal to said skin depth δ.
    [2" id="c-fr-0002]
    2. Waveguide device (i) according to claim 1, the resistance of the device (i) selected from tensile strength, torsion, bending or a combination of these resistors being conferred mainly by the conductive layer (4). ).
    [3" id="c-fr-0003]
    Waveguide device (i) according to one of claims 1 or 2, the metal conductive layer (4 + 9) comprising a smoothing layer (9) between the core (3) and the conductive layer ( 4).
    [4" id="c-fr-0004]
    4. Waveguide device (i) according to claim 3, the resistance of the device (i) selected from tensile strength, torsion, bending or a combination of these resistors being conferred mainly by the conductive layer (4). +9) comprising the smoothing layer (9).
    [5" id="c-fr-0005]
    5. waveguide device (i) according to one of claims i to 4, comprising a fastening layer (ii) on the inner surface of the core (3).
    [6" id="c-fr-0006]
    6. Waveguide device (i) according to one of claims 1 to 5, comprising a metal layer (5) covering the outer surface (8) of the core (3).
    [7" id="c-fr-0007]
    7. waveguide device (i) according to one of claims i to 6, the core being formed of a polymeric material and / or ceramic.
    [8" id="c-fr-0008]
    8. waveguide device (i) according to one of claims i to 6, the core being formed of a metal or an alloy.
    [0009]
    9 · Waveguide device (i) according to one of claims i to 8, the metal layer (4) optionally comprising a metal selected from Cu, Au, Ag, Ni, Al, stainless steel, brass or a combination of these choices.
    [10" id="c-fr-0010]
    10. Waveguide device (i) according to one of claims i to 9, the device (i) comprising successively a core (3), a layer of attachment (ii), a smoothing layer (9) nickel, and said metal conductive layer (4).
    [11" id="c-fr-0011]
    A method of manufacturing a waveguide device (i) for guiding a radio frequency signal at a determined frequency, the method comprising the steps of: fabricating a core (3) comprising sidewalls with external surfaces (8) and internal (7), the inner surfaces (7) delimiting a waveguide channel (2), depositing a conductive layer (4) on the inner surface (7) of the core (3), said conductive layer (4) being formed of a metal characterized by a skin depth δ at frequency f, the method being characterized in that said conductive layer (4) has a thickness at least twenty times equal to said skin depth δ .
    [12" id="c-fr-0012]
    12. The method of claim ii, the manufacture of the core comprising an additive manufacturing step.
    [13" id="c-fr-0013]
    13. Method according to one of claims ii to 12, the conductive layer (4) comprising several layers of metals and / or non-metals deposited successively.
    [14" id="c-fr-0014]
    A method of manufacture comprising: i) inputting data representing the shape of a waveguide device core (3) (i), the core having sidewalls with outer surfaces (8) and internal (7). ii) the use of these data to perform by additive manufacturing a core (3) waveguide device, iii) the deposition of a conductive layer (4,5) on said core (3), the conductive layer being characterized by a skin depth δ at the frequency f, so as to cover the internal surfaces of the core to define a waveguide channel, iv) characterized in that said data representing the shape of a core (3 ) are determined by taking into account the thickness of the conductive layer so that the waveguide is optimized for RF signal transmission at the frequency f, the conductive layer having a thickness of at least twenty times the skin depth δ.
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    FR2916580A1|2008-11-28|Electromagnetic wave i.e. hyper frequency wave, guiding structure for radiating plate slot antenna, has zone with element made of insulating material possessing dielectric characteristics, and dimensions and geometry equal to that of zone
    WO2014198688A1|2014-12-18|Cooled printed circuit with multi-layer structure and low dielectric losses
    FR3099000A1|2021-01-22|Waveguide filter suitable for an additive manufacturing process
    FR3055570A1|2018-03-09|MULTILAYER DEVICE WITH METAL MOLD SKIN AND METHOD OF MANUFACTURING SUCH MULTILAYER DEVICE
    FR2987545A1|2013-08-30|Multi-layer printed circuit structure for antenna of airborne radar, has layer whose metalized face is provided with electronic component, where metalized faces of layer are assembled with metalized faces of another layer
    同族专利:
    公开号 | 公开日
    EP3465815A1|2019-04-10|
    ES2881828T3|2021-11-30|
    FR3051924B1|2020-04-10|
    US10862186B2|2020-12-08|
    IL263297A|2021-10-31|
    CN109196715A|2019-01-11|
    WO2017208153A1|2017-12-07|
    EP3465815B1|2021-04-21|
    CN109196715B|2021-04-20|
    IL263297D0|2018-12-31|
    US20200127358A1|2020-04-23|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US3195079A|1963-10-07|1965-07-13|Burton Silverplating|Built up nonmetallic wave guide having metallic coating extending into corner joint and method of making same|
    US3769618A|1971-12-27|1973-10-30|Freedman J|Thin film low temperature conductors and transmission lines|
    US20120033931A1|2009-04-16|2012-02-09|Hideyuki Usui|Waveguide|
    US3982215A|1973-03-08|1976-09-21|Rca Corporation|Metal plated body composed of graphite fibre epoxy composite|
    EP2225794B1|2007-12-20|2014-03-19|Telefonaktiebolaget LM Ericsson |A waveguide transition arrangement|
    CN102623647A|2012-04-05|2012-08-01|四川虹视显示技术有限公司|Manufacturing method and substrate for organic electroluminescence device|
    JP2014037081A|2012-08-15|2014-02-27|Toppan Printing Co Ltd|Card|
    US9728768B2|2013-03-15|2017-08-08|Sion Power Corporation|Protected electrode structures and methods|
    DE102014112509B4|2014-08-29|2020-12-17|Dyemansion Gmbh|Use of an impregnating agent for impregnating molded parts produced in a 3D printing process|
    CN105420674A|2015-12-04|2016-03-23|济南晶正电子科技有限公司|Single-crystal film bonding body and manufacturing method thereof|FR3075482B1|2017-12-20|2020-09-18|Swissto12 Sa|PROCESS FOR MANUFACTURING A WAVEGUIDE DEVICE|
    FR3075483B1|2017-12-20|2019-12-27|Swissto12 Sa|PASSIVE RADIO FREQUENCY DEVICE, AND MANUFACTURING METHOD|
    US11128034B2|2018-03-02|2021-09-21|Optisys, LLC|Mass customization of antenna assemblies using metal additive manufacturing|
    US11211680B2|2018-11-14|2021-12-28|Optisys, LLC|Hollow metal waveguides having irregular hexagonal cross-sections formed by additive manufacturing|
    KR20210093316A|2018-11-19|2021-07-27|옵티시스, 엘엘씨|Irregular Hexagonal Cross Section Hollow Metal Waveguide Filter|
    FR3095081A1|2019-04-09|2020-10-16|Swissto12 Sa|Arrangement of a set of waveguides and its manufacturing process|
    FR3095082B1|2019-04-11|2021-10-08|Swissto12 Sa|Oval section waveguide device and method of manufacturing said device|
    FR3110030A1|2020-05-06|2021-11-12|Elliptika|Method of manufacturing a waveguide and waveguide manufactured by the process|
    法律状态:
    2017-05-23| PLFP| Fee payment|Year of fee payment: 2 |
    2017-12-01| PLSC| Publication of the preliminary search report|Effective date: 20171201 |
    2018-05-22| PLFP| Fee payment|Year of fee payment: 3 |
    2019-05-23| PLFP| Fee payment|Year of fee payment: 4 |
    2020-05-22| PLFP| Fee payment|Year of fee payment: 5 |
    2021-05-20| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1600865A|FR3051924B1|2016-05-30|2016-05-30|WAVEGUIDE INCLUDING A THICK CONDUCTIVE LAYER|
    FR1600865|2016-05-30|FR1600865A| FR3051924B1|2016-05-30|2016-05-30|WAVEGUIDE INCLUDING A THICK CONDUCTIVE LAYER|
    US16/304,760| US10862186B2|2016-05-30|2017-05-30|Waveguide device comprising a core having a waveguide channel, where a smoothing layer and a conductive layer of at least 5 skin depth are formed on an inner surface of the waveguide channel|
    PCT/IB2017/053178| WO2017208153A1|2016-05-30|2017-05-30|Waveguide comprising a thick conductive layer|
    CN201780033086.XA| CN109196715B|2016-05-30|2017-05-30|Waveguide comprising thick conductive layer|
    EP17728662.2A| EP3465815B1|2016-05-30|2017-05-30|Waveguide comprising a thick conductive layer|
    ES17728662T| ES2881828T3|2016-05-30|2017-05-30|Waveguide comprising a thick conductive layer|
    IL263297A| IL263297A|2016-05-30|2018-11-26|Waveguide comprising a thick conductive layer|
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