• 专利附录
  • 专利说明
  • 权利要求
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    • 专利摘要:
    A method of manufacturing a waveguide device (1) comprising the steps of: -making a core (2) of non-conductive material, said core having sidewalls with external (21) and internal (20) surfaces, the internal surfaces defining a waveguide channel (5); depositing a conductive metal layer (3) on the inner surfaces (20) by immersion in a reagent fluid; characterized in that said core (2) has at least one hole (7) between said external and internal surfaces, specifically intended to promote the evacuation of bubbles in said channel (5) and / or the circulation of the fluid during said immersion .
    公开号:FR3048556A1
    申请号:FR1600370
    申请日:2016-03-04
    公开日:2017-09-08
    发明作者:Rijk Emile De；Mirko Favre；Mathieu Billod；Alexandre Dimitriades；Alessandro Macor
    申请人:Swissto12 SA；
    IPC主号:
    专利说明:

    dans laquelle μ est la perméabilité magnétique du métal plaqué, f est la fréquence radio du signal à transmettre et σ est la conductivité électrique du métal plaqué.
    [0044] Cette épaisseur est sensiblement constante sur toutes les surfaces internes 20 afin d'obtenir une pièce finie avec des tolérances dimensionnelles pour le canal 5 précises. L'épaisseur est de préférence supérieure à 1 μηι.
    [0045] Les surfaces externes 21 autour de l'âme 2 peuvent aussi être recouvertes d'une déposition du même matériau, d'un autre matériau, ou être nues.
    [0046] La déposition de métal conducteur 3 sur les faces internes 20 et éventuellement externes 21 se fait en immergeant l'âme 5 dans une série de bains successifs, typiquement 5 à 15 bains. Chaque bain implique un fluide avec un ou plusieurs réactifs. La déposition ne nécessite pas d'appliquer un courant sur l'âme à recouvrir. Un brassage et une déposition régulière sont obtenus en brassant le fluide, par exemple en pompant le fluide dans le canal de transmission 5 et/ou autour du dispositif ou en vibrant l'âme 5 et/ou le bac de fluide, par exemple avec un dispositif vibrant à ultrasons pour créer des vagues ultrasoniques.
    [0047] Selon un aspect de l'invention, un ou plusieurs trous traversants 7 traversent l'âme 2 entre les surfaces internes et externes 21, de manière à permettre une communication fluidique entre le canal 5 et l'environnement autour du dispositif 1. Dans l'exemple illustré sur cette figure, plusieurs trous de section variable sont prévus sur la grande paroi de largeur interne b et plusieurs trous 7 de section variable sont également prévus sur la petite paroi de hauteur a. Il est cependant aussi possible de prévoir des trous seulement sur la grande paroi, ou seulement sur la petite paroi, ou sur un nombre quelconque des parois. Il est possible de prévoir, 0, 1 ou N trous sur chaque paroi. La section des trous traversants 7 et leur forme peut être identique ou variable.
    [0048] La figure 8 illustre une variante de dispositif à guide d'ondes 1 avec un canal de guidage interne 5 à section circulaire et muni de trous traversants 7 pour l'échange fluidique entre le canal 5 et 1'extérieur lors de 1'immersion.
    [0049] La figure 9 illustre une variante de dispositif à guide d'ondes 1 avec un canal de guidage interne 5 à section rectangulaire, le canal 5 étant cependant ondulé et non parallélépipédique. Il est également muni de trous traversants 7 pour l'échange fluidique entre le canal 5 et l'extérieur lors de l'immersion.
    [0050] Les trous s'étendent dans tous ces exemples perpendiculairement aux surfaces internes 20 et externes 21, et perpendiculairement à la direction principale selon laquelle s'étend le canal 5. Des trous orientés obliquement peuvent aussi être réalisés.
    [0051] La taille des trous 7, leur forme, leur orientation, leur espacement, leur distribution sur les surfaces internes et externes, leur nombre et leur densité affectent notamment les caractéristiques suivantes : • Efficacité de l'échange de fluide depuis et vers le canal 5 lors de la déposition des surfaces conductrices sur l'âme 2. • Efficacité de 1'évacuation des bulles hors du canal 5 lors de cette étape de déposition. • Performance du dispositif guide d'onde, par exemple atténuation du signal transmis ou autres perturbations du signal causées par les trous.
    [0052] La figure 11 illustre l'atténuation de signal RF en décibels produite par un seul trou de section circulaire 7 de 50mm de long, le trou étant prévu à travers une des grandes parois d'un dispositif à guide d'ondes à section rectangulaire, pour différentes fréquences de transmission. Les différentes courbes correspondent à différents diamètres de trous 1. Dans la figure 11, où on montre un exemple de guide d'ondes en bande Ka, on voit que l'atténuation est négligeable pour un trou de diamètre 0,6 et 0,7 mm, mais qu'elle augmente plus rapidement au-delà. Les valeurs absolues dépendent du type de dispositif à guide d'ondes et de ses dimensions. Le diagramme démontre cependant que l'usage de trous de dimensions suffisantes pour le but décrit peut être considéré sans affecter le fonctionnement du dispositif.
    [0053] La figure 12 illustre l'atténuation de signal RF en décibels produite par un seul trou 7 identique à celui de la figure 11, mais prévu à travers une des petites parois du même dispositif à guide d'ondes. Les différentes courbes correspondent à différents diamètres de trous 7. On voit que 1'atténuation augmente également avec le diamètre du trou, mais qu'elle reste moins importante que lorsque le trou est prévu dans une des grandes parois de largeur b. Cette simulation suggère qu'il est généralement préférable de prévoir des trous (possiblement traversants) sur les petites parois du dispositif à guide d'ondes, au moins dans le cas de dispositifs à section rectangulaire en mode de transmission TEn.
    [0054] La figure 13 illustre l'atténuation de signal RF en décibels produite par deux trous 7 dans un dispositif identique à celui de la figure 11, les trous étant prévus à travers une des grandes parois à guide d'ondes. Les différentes courbes correspondent à différents diamètres de trous 7. A nouveau, 1'atténuation du signal électromagnétique a généralement tendance à augmenter avec le diamètre du trou. Elle est cependant aussi fortement dépendante de la fréquence ce qui suggère une perturbation du mode de transmission à certaines fréquences.
    [0055] De manière générale, les dimensions des trous 7 entre les parois internes et externes 20, 21 affectent les performances radiofréquence du dispositif. Cette dégradation de performance est cependant acceptable si la dimension typique des trous Ts est inférieure au tiers de la longueur d'onde λ dans l'espace libre à la fréquence opérationnelle du dispositif :
    Ts < λ/ 3 [0056] Dans un mode de réalisation préférentiel, la dimension typique des trous Ts est inférieure au cinquième de Ts.
    [0057] Différentes sections possibles pour les trous traversants 1 sont illustrés sur la figure 10 qui montre aussi la dimension typique Ts à considérer pour chaque forme. Dans le cas d'un canal 5 à section rectangulaire, la dimension typique est la hauteur b (c'est-à-dire la dimension perpendiculaire à la direction principale du canal de la plus petite paroi). Dans le cas d'un canal 5 à section circulaire, la dimension typique Ts est constituée par le diamètre. D'autres dimensions typiques sont illustrées sur la figure 10.
    [0058] La figure 14 illustre schématiquement un exemple de dispositif guide d'onde 1 qui peut être fabriqué avec le procédé de l'invention. Il s'agit dans cet exemple non limitatif d'un réseau d'antennes comportant des pavillons 10 et des sections de transmission formant un réseau formeur de faisceau (beamforming network). Toutes les surfaces internes doivent être métallisées, c'est-à-dire recouvertes d'une déposition métallique. L'âme 5 est fabriquée par fabrication additive, par exemple par stéréolithographie, dans un polymère ou une céramique, ou une combinaison des deux. Le dispositif 1 comporte des trous 7 qui peuvent être soit obtenus directement par le processus de fabrication additives, soit, ou pour certains d'entre eux, percés après coup.
    [0059] L'invention au aussi pour objet un procédé de fabrication comportant : 1'introduction de données dans un ordinateur représentant la forme d'une âme 2 de dispositif à guide d'ondes, telle que décrite ci-dessus ; l'utilisation de ces données pour réaliser par fabrication additive une âme de dispositif à guide d'ondes.
    [0060] Par ailleurs, l'invention concerne aussi un support de données informatique contenant des données destinées à être lues par un dispositif de fabrication additive pour fabriquer un objet, lesdites données représentant la forme d'une âme pour dispositif 1 à guide d'ondes, ladite âme comportant des parois latérales avec des surfaces externes 21 et internes 20, les surfaces internes définissant un canal 5 de guide d'ondes ; ladite âme comportant au moins un trou 7 entre lesdites surfaces externes et internes.
    [0061] Le support de données informatique peut être constitué par exemple par un disque dur, une mémoire flash, un disque virtuel, une clé USD, un disque optique, un support de stockage dans un réseau ou de type cloud, etc.
    A process for the additive manufacture of a waveguide as well as waveguide devices manufactured by this method.
    TECHNICAL FIELD [0001] The present invention relates to an additive manufacturing method of waveguide device and a waveguide manufactured according to this method.
    STATE OF THE ART [0002] Radio frequency (RF) signals can propagate either in a space or in waveguide devices. These waveguide devices are used to channel the RF signals or to manipulate them in the spatial or frequency domain.
    The present invention particularly relates to passive RF devices that allow to propagate and manipulate radio frequency signals without using active electronic components. Passive waveguides can be divided into three distinct categories: • Devices based on waveguiding inside hollow metal channels, commonly called waveguides. • Devices based on waveguiding inside dielectric substrates. • Devices based on waveguiding by means of surface waves on metal substrates such as PCB PCBs, microstrips, etc.
    The present invention relates in particular to the first category above, collectively referred to hereafter as waveguides. Examples of such devices include waveguides per se, filters, antennas, mode converters, and so on. They may be used for signal routing, frequency filtering, signal separation or recombination, transmission or reception of signals in or from free space, etc. An example of a conventional waveguide is illustrated in Figure 1. It is constituted by a hollow device, the shape and proportions determine the propagation characteristics for a given wavelength of the electromagnetic signal. Conventional waveguides used for radio frequency signals have internal openings of rectangular or circular section. They allow to propagate electromagnetic modes corresponding to different distributions of electromagnetic field along their section. In the example shown, the waveguide has a height b along the y axis and a width a along the Z axis.
    [0006] FIG. 2 schematically illustrates the electric field lines E and magnetic lines H in such a waveguide. The dominant mode of propagation is in this case the electrical transverse mode called TEw- index 1 indicates the number of half-wavelengths across the width of the guide, and 0 the number of half-wavelength along the height.
    Figures 3 and 4 illustrate a waveguide with circular section. Circular modes of transmission can propagate in such a waveguide. The arrows in FIG. 4 illustrate the TEia transmission mode; the substantially vertical arrows show the electric field, the arrows further horizontal the magnetic field. The orientation of the field changes through the section of the waveguide.
    [0008] Apart from these examples of rectangular or circular waveguide openings, other forms of opening have been devised or can be devised in the context of the invention and which make it possible to maintain one or more modes. (s) electromagnetic (s) at a given signal frequency to transmit an electromagnetic signal. Examples of possible waveguide apertures are shown in FIG. 5. The illustrated surface corresponds to the section of the aperture of the waveguide delimited by electrically conductive surfaces. The shape and surface of the section may further vary along the main direction of the waveguide device.
    The manufacture of waveguides with complex sections is difficult and expensive. Recent work, however, has demonstrated the possibility of producing waveguide components, including antennas, waveguides, filters, converters, etc., using additive manufacturing methods, for example 3D printing. In particular, the additive manufacturing of waveguides comprising both non-conductive materials, such as polymers or ceramics, and conductive metals is known.
    Waveguides with ceramic or polymer walls manufactured by an additive method and then covered with a metal veneer have been suggested in particular. The inner surfaces of the waveguide must indeed be electrically conductive to operate. The use of a non-conductive core makes it possible on the one hand to reduce the weight and the cost of the device, on the other hand to implement 3D printing methods adapted to polymers or ceramics and making it possible to produce parts High precision with low wall roughness.
    An example of waveguide 1 made by additive manufacturing is illustrated in Figure 6. It comprises a non-conductive core 2, for example polymer or ceramic, which is manufactured for example by stereolithography or by another additive method and which defines an internal aperture 5 for propagating the RF signal. In this example, the window has a rectangular section of width a and height b. The inner walls of this core around the opening 5 are coated with an electrically conductive coating 3, for example a metal plating. In this example, the outer walls of the waveguide are also coated with a metal plating 4 which may be of the same metal and the same thickness. This outer coating strengthens the waveguide against external mechanical or chemical stresses.
    Figure 7 illustrates an alternative waveguide similar to that of Figure 6, but without the conductive coating on the outer faces.
    Various techniques can be implemented for the deposition of the metal coating on the inner and possibly outer faces of the core. However, the problem is complex because of the small size of the opening, the complex shapes which it is often necessary to cover, and the need to control with great precision the dimensions of the opening and therefore the thickness coating.
    Electrodeposition methods have for example been implemented, based on the use of an electric current between a cathode on the face to be covered and an anode immersed in a liquid filled with metal ions. Since the core 5 is non-conductive, this method requires the deposition of an intermediate conductive layer that can serve as a cathode. The deposition of this intermediate layer is difficult. The electrical connection of the portions of the cathode difficult to reach within the waveguide is also problematic.
    For this reason, chemical deposition methods, without electrical current, are often preferred. They implement the immersion of the part to be plated successively in one or more baths containing reagents which trigger chemical reactions resulting in the deposition of the chosen metallic material, for example copper, gold, silver, nickel, etc., on the surface to be covered.
    The efficiency and dynamics of the deposition depend on many factors, including the concentration of reagents and metal ions in the various baths near the surfaces to be covered.
    Tests carried out in the context of this invention, however, have shown that the chemical deposition, without electrical current, of conductive metal on the walls of waveguide channels of complex shape has, however, at least two difficulties: [0018] Firstly, the frequent presence of trapped air bubbles in the waveguide channel often causes insufficient plating, or even complete lack of plating, on some surfaces. The air bubbles prevent any contact between the reactive agents of the liquid and certain portions of the surface to be covered.
    Then, the liquid reactants tend to stagnate in the channels of the waveguide. The chemical deposition reaction then rapidly consumes all the reagents of the stagnant liquid in the channels. When all the reagents have been consumed, the deposition reaction stops by leaving the waveguide channels with plating defects or plating of insufficient and irregular thickness.
    BRIEF SUMMARY OF THE INVENTION [0020] An object of the present invention is to provide a waveguide device manufacturing method which is free from the above limitations.
    Another object of the invention is to provide a waveguide device manufactured according to this method and which is free from the limitations of waveguide devices above.
    According to the invention, these objects are achieved in particular by means of a waveguide device manufacturing method comprising the following steps: -making a core of conductive or non-conductive material, said core having sidewalls with external and internal surfaces, the inner surfaces defining a waveguide channel; depositing a conductive metal layer on the inner surfaces by immersion in a reagent fluid; said core having at least one hole between said external and internal surfaces, specifically intended to promote the evacuation of bubbles in said channel and the flow of the fluid during said immersion.
    By waveguide device is meant in the present application any device comprising a hollow channel defined by conductive walls and for guiding RF electromagnetic waves in the channel, for example for the transmission of a signal. remote electromagnetic, filtering, reception and emission in the ether (antennas), mode conversion, signal separation, signal recombination, etc.
    The invention relates in particular to devices capable of operating in the frequency bands L, S, C, X, Ku, K, Ka, Q, V, Ή, F, D or G.
    The hole or holes allow a more uniform conductive metal deposition by avoiding the accumulation of bubbles in the channel, and allowing improved fluid exchange between the inside and the outside of the waveguide during the deposition.
    The section of the channel is significantly larger than that of the hole or holes, which do not disturb the radio performance, for example the transmission efficiency of the waveguide.
    The hole or holes preferably extend perpendicular to the walls through which they pass.
    The hole or holes preferably extend perpendicularly to the main direction of the channel.
    The manufacture of the core may comprise an additive manufacturing step, for example a stereolithography manufacturing step.
    The term "additive manufacturing" describes any process for manufacturing parts by adding material, according to computer data stored on a computer medium and defining a model of the part. In addition to stereolithography, the term also refers to other manufacturing methods such as curing or coagulation of liquid or powder including, but not limited to, binder jetting methods, DED (Direct Energy Deposition). , EBFF (Electron Beam Freeform Manufacturing), FDM (Fused Deposition Modeling), PFF (Plastic Freeforming), Aerosol, BPM (Ballistic Particle Manufacturing), Powder Bed, SLS (Selective Laser Sintering), ALM (Additive Layer Manufacturing), polyjet, EBM (electron beam melting), photopolymerization, etc. [0031] The method may include a step of surface treatment of the core to promote the attachment of the conductive metal layer. The surface treatment may comprise an increase in the surface roughness, and / or the deposition of an intermediate bonding layer.
    The additive manufacturing step can generate a core that already includes the hole or holes. The shape and location of the holes are therefore defined by the computer file used for the additive printing of the soul.
    In a variant, the hole or holes are drilled after the additive manufacturing step. This variant, however, involves an additional step.
    The edges of the hole may be metallized during the deposition step.
    The holes can be filled after metallization, for example by inserting a pin or filling a conductive adhesive.
    The outer faces of the device may be metallized during the deposition step. The device is thus more mechanically rigid and protected from mechanical and chemical attack from the outside.
    The conductive metal deposition is preferably carried out by a chemical process without the use of electric current.
    The invention also relates to a waveguide device produced by this method and comprising: a core of non-conductive material, said core having sidewalls with external and internal surfaces, the inner surfaces defining a channel; waveguide / conductive metal layer on the inner surfaces; at least one hole between said external and internal surfaces.
    BRIEF DESCRIPTION OF THE FIGURES [0039] Examples of implementation of the invention are indicated in the description illustrated by the appended figures in which: • FIG. 1 illustrates a truncated perspective view of a conventional waveguide device at rectangular section. FIG. 2 illustrates the magnetic and electrical field lines in the device of FIG. 1. FIG. 3 illustrates a truncated perspective view of a conventional circular waveguide device. Figure 4 illustrates the magnetic and electrical field lines in the device of Figure 3. Figure 5 illustrates different possible sections of transmission channels in waveguide devices. FIG. 6 illustrates a truncated perspective view of a rectangular section waveguide produced by additive manufacturing and whose inner and outer walls are both covered with a conductive electrical material deposition. FIG. 1 illustrates a truncated perspective view of a rectangular section waveguide produced by additive manufacturing and of which only the internal walls are covered with a deposition of conductive electrical material. FIG. 8 illustrates a perspective view of a rectangular section waveguide produced by additive manufacturing and whose internal walls are pierced with holes for the evacuation of bubbles and the circulation of fluid during the deposition. FIG. 9 illustrates a perspective view of a circular section waveguide produced by additive manufacturing and whose internal walls are pierced with holes for the evacuation of bubbles and the flow of fluid during the deposition. • Figure 10 illustrates different possible sections of through holes in waveguide devices, showing the typical dimension Ts to be considered for each section. FIG. 11 is a diagram which illustrates the decibel attenuation produced by a single hole of variable diameter in a large wall of a rectangular section waveguide device, according to the transmission frequency and the hole diameter. Fig. 12 is a diagram illustrating the decibel attenuation produced by a single variable diameter hole in a small wall of a rectangular section waveguide device, depending on the transmission frequency and the hole diameter. FIG. 13 is a diagram which illustrates the decibel attenuation produced by two holes of variable diameter in a large wall of a rectangular section waveguide device, according to the transmission frequency and the diameter of the hole. Figure 14 schematically illustrates an exemplary waveguide device that can be manufactured with the method of the invention.
    EXAMPLE (S) OF EMBODIMENT OF THE INVENTION FIG. 7 illustrates a perspective view of a waveguide device 1 according to the invention, in this case a rectangular section waveguide device. It comprises a core 2 of non-conductive material, for example polymer such as epoxy, or ceramic, manufactured by additive manufacturing, for example by stereolithography. This core defines an internal channel 5 for waveguiding, and whose section is determined according to the frequency of the electromagnetic signal to be transmitted. The dimensions of this internal channel a, b and its shape are determined according to the operating frequency of the device 1, that is to say the frequency of the electromagnetic signal for which the device is manufactured and for which a stable transmission mode and optionally with a minimum of attenuation is obtained.
    The core 5 is manufactured monolithically, for example by stereolithography. It may also consist of several parts formed by stereolithography and assembled together before plating, for example by gluing or thermal fusion.
    The inner surfaces 20 of the core 2 delimit the channel 5. They are covered with a deposition of conductive material not shown, for example copper, silver, gold, nickel etc, plated by deposition chemical without electric current.
    The thickness of this conductive coating must be sufficient for the surface to be electrically conductive at the chosen radio frequency. This is typically obtained using a conductive layer deposited on the inner walls of the waveguide with a thickness at least equal to the skin depth δ;
    where μ is the magnetic permeability of the plated metal, f is the radio frequency of the signal to be transmitted and σ is the electrical conductivity of the plated metal.
    This thickness is substantially constant on all internal surfaces 20 to obtain a finished part with dimensional tolerances for the precise channel 5. The thickness is preferably greater than 1 μηι.
    The outer surfaces 21 around the core 2 may also be covered with a deposition of the same material, another material, or be bare.
    The conductive metal deposition 3 on the inner faces 20 and possibly outer 21 is done by immersing the core 5 in a series of successive baths, typically 5 to 15 baths. Each bath involves a fluid with one or more reagents. The deposition does not require applying a current on the core to be covered. Stirring and regular deposition are obtained by stirring the fluid, for example by pumping the fluid in the transmission channel 5 and / or around the device or by vibrating the core 5 and / or the fluid tank, for example with a ultrasonic vibrating device for creating ultrasonic waves.
    According to one aspect of the invention, one or more through holes 7 pass through the core 2 between the inner and outer surfaces 21, so as to allow fluid communication between the channel 5 and the environment around the device 1. In the example illustrated in this figure, several holes of variable section are provided on the large wall of internal width b and several holes 7 of variable section are also provided on the small wall height a. However, it is also possible to provide holes only on the large wall, or only on the small wall, or on any number of walls. It is possible to provide, 0, 1 or N holes on each wall. The cross-section of the through-holes 7 and their shape may be identical or variable.
    FIG. 8 illustrates an alternative waveguide device 1 with an internal guide channel 5 with a circular cross-section and provided with through-holes 7 for the fluidic exchange between the channel 5 and the outside during 1 '. immersion.
    FIG. 9 illustrates an alternative waveguide device 1 with an internal guide channel 5 with a rectangular section, the channel 5 being however corrugated and not parallelepipedal. It is also provided with through holes 7 for fluid exchange between the channel 5 and the outside during immersion.
    The holes extend in all these examples perpendicularly to the inner and outer surfaces 20 and 21, and perpendicular to the main direction along which the channel 5 extends. Slant-oriented holes may also be made.
    The size of the holes 7, their shape, their orientation, their spacing, their distribution on the internal and external surfaces, their number and their density affect in particular the following characteristics: • Efficiency of the fluid exchange from and to the channel 5 during the deposition of the conductive surfaces on the core 2. • Effectiveness of the evacuation of the bubbles out of the channel 5 during this deposition step. • Performance of the waveguide device, eg attenuation of the transmitted signal or other signal disturbances caused by the holes.
    FIG. 11 illustrates the attenuation of the RF signal in decibels produced by a single circular section hole 7 of 50mm in length, the hole being provided through one of the large walls of a sectional waveguide device. rectangular, for different transmission frequencies. The different curves correspond to different diameters of holes 1. In FIG. 11, where an example of a Ka-band waveguide is shown, it can be seen that the attenuation is negligible for a hole of diameter 0.6 and 0.7. mm, but it increases faster beyond that. Absolute values depend on the type of waveguide device and its dimensions. The diagram however demonstrates that the use of holes of sufficient size for the purpose described can be considered without affecting the operation of the device.
    FIG. 12 illustrates the attenuation of the RF signal in decibels produced by a single hole 7 identical to that of FIG. 11, but provided through one of the small walls of the same waveguide device. The different curves correspond to different diameters of holes 7. It can be seen that the attenuation also increases with the diameter of the hole, but that it remains less than when the hole is provided in one of the large walls of width b. This simulation suggests that it is generally preferable to provide holes (possibly through) on the small walls of the waveguide device, at least in the case of devices with a rectangular section in transmission mode TEn.
    FIG. 13 illustrates the attenuation of RF signal in decibels produced by two holes 7 in a device identical to that of FIG. 11, the holes being provided through one of the large waveguide walls. The different curves correspond to different diameters of holes 7. Again, the attenuation of the electromagnetic signal generally tends to increase with the diameter of the hole. However, it is also highly dependent on the frequency which suggests a disturbance of the transmission mode at certain frequencies.
    In general, the dimensions of the holes 7 between the inner and outer walls 20, 21 affect the radiofrequency performance of the device. This performance degradation is however acceptable if the typical dimension of the holes Ts is less than one third of the wavelength λ in the free space at the operating frequency of the device:
    Ts <λ / 3 [0056] In a preferred embodiment, the typical dimension of the holes Ts is less than one fifth of Ts.
    Different possible sections for the through holes 1 are illustrated in Figure 10 which also shows the typical dimension Ts to consider for each shape. In the case of a channel 5 of rectangular section, the typical dimension is the height b (that is to say the dimension perpendicular to the main direction of the channel of the smaller wall). In the case of a channel 5 of circular section, the typical dimension Ts is constituted by the diameter. Other typical dimensions are illustrated in FIG.
    FIG. 14 schematically illustrates an exemplary waveguide device 1 that can be manufactured with the method of the invention. In this nonlimiting example, there is an antenna array comprising horns 10 and transmission sections forming a beamforming network. All internal surfaces must be metallized, that is, covered with metal deposition. The core 5 is manufactured by additive manufacturing, for example by stereolithography, in a polymer or ceramic, or a combination of both. The device 1 comprises holes 7 which can be obtained directly by the additive manufacturing process, or, for some of them, drilled afterwards.
    The invention also relates to a manufacturing method comprising: the introduction of data into a computer representing the shape of a waveguide device core 2, as described above; the use of these data to achieve by additive manufacturing a waveguide device core.
    Furthermore, the invention also relates to a computer data medium containing data intended to be read by an additive manufacturing device for manufacturing an object, said data representing the shape of a core for a device 1 to guide a device. wave, said core having sidewalls with outer and inner surfaces 21, the inner surfaces defining a waveguide channel; said core having at least one hole 7 between said outer and inner surfaces.
    The computer data medium can be constituted for example by a hard disk, a flash memory, a virtual disk, a USD key, an optical disk, a storage medium in a network or cloud type, etc..
    权利要求:
    Claims (20)
    [1" id="c-fr-0001]
    claims
    A method of manufacturing a waveguide device (1) comprising the steps of: -making a core (2) having sidewalls with outer (21) and inner (20) surfaces, the inner surfaces defining a channel waveguide (5); depositing a conductive metal layer (3) on the inner surfaces (20) by immersion in a reagent fluid; characterized in that said core (2) comprises at least one hole (Ί) between said external and internal surfaces, specifically intended to promote the evacuation of bubbles in said channel (5) and / or the circulation of the fluid during said immersion ,
    [2" id="c-fr-0002]
    2. Method according to claim 1, said channel (5) having a larger section than said hole (7).
    [3" id="c-fr-0003]
    3. Method according to one of claims 1 to 2, the typical dimension (Ts) of the hole or holes (7) being less than one third of the wavelength (k) in the free space at the operating frequency of the device .
    [4" id="c-fr-0004]
    4. Method according to one of claims 1 to 3, the typical dimension (Ts) of the hole or holes (7) being less than 2 millimeters.
    [5" id="c-fr-0005]
    5. Method according to one of claims 1 to 4, the hole or holes (7) extending perpendicular to said walls (20, 21) and the main direction of the channel.
    [6" id="c-fr-0006]
    6. Method according to one of claims 1 to 5, the manufacture of said core (5) comprising an additive manufacturing step.
    [7" id="c-fr-0007]
    7. The method of claim 6, the manufacture of said core being performed by stereolithography.
    [8" id="c-fr-0008]
    8. Method according to one of claims 1 to 7, comprising a surface treatment step of said core (5) to promote the attachment of the conductive metal layer.
    [9" id="c-fr-0009]
    9. Method according to one of claims 1 to 8, the conductive metal deposition (3) being performed by a chemical process without the use of electric current.
    [10" id="c-fr-0010]
    10. Method according to one of claims 6 to 9, said additive manufacturing step producing a core which includes the hole or holes (7).
    [11" id="c-fr-0011]
    11. Method according to one of claims 6 to 9, said hole (7) being pierced after said additive manufacturing step.
    [12" id="c-fr-0012]
    12. Method according to one of claims 1 to 11, said core (5) having a plurality of said holes (7) between the inner and outer walls (20, 21), the diameter of each hole being less than 1mm.
    [13" id="c-fr-0013]
    13. Method according to one of claims 1 to 12, the deposition comprising a step of pumping fluid through said at least one hole (7).
    [14" id="c-fr-0014]
    A waveguide device (1) comprising: a core (5) having sidewalls with outer (21) and inner (20) surfaces, the inner surfaces defining a waveguide channel (5); a conductive metal layer (3) on the inner surfaces (20); at least one hole (7) between said external and internal surfaces.
    [15" id="c-fr-0015]
    15. Device according to claim 14, said channel (5) having a larger section than said hole (7).
    [16" id="c-fr-0016]
    16. Device according to one of claims 14 to 15, the typical dimension (Ts) of the hole or holes (7) being less than one third of the wavelength (λ) in the free space at the operating frequency of the device .
    [17" id="c-fr-0017]
    17. Device according to one of claims 14 to 16, the typical dimension (Ts) of the hole or holes (7) being less than 1.6 millimeters.
    [18" id="c-fr-0018]
    18. Device according to one of claims 14 to 17, said hole extending perpendicular to said walls and to the main direction of the channel.
    [19" id="c-fr-0019]
    19. A manufacturing method comprising: inputting data representing the shape of a waveguide device core (1), said core having sidewalls with outer (21) and inner (20) surfaces, the inner surfaces defining a waveguide channel (5); said core having at least one hole (7) between said outer and inner surfaces; the use of these data to achieve by additive manufacturing a waveguide device core.
    [20" id="c-fr-0020]
    20. A computer data medium containing data to be read by an additive manufacturing device for manufacturing an object, said data representing the shape of a waveguide device core (1), said core having walls lateral surfaces with outer (21) and inner (20) surfaces, the inner surfaces defining a waveguide channel (5) / said core having at least one hole (7) between said outer and inner surfaces.
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    同族专利:
    公开号 | 公开日
    US11031669B2|2021-06-08|
    CN109075418B|2021-07-20|
    IL261337D0|2018-10-31|
    CN109075418A|2018-12-21|
    WO2017149423A1|2017-09-08|
    EP3424103A1|2019-01-09|
    FR3048556B1|2018-03-02|
    US20200161738A1|2020-05-21|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US6265703B1|2000-06-02|2001-07-24|The Ferrite Company, Inc.|Arc suppression in waveguide using vent holes|
    US20120084968A1|2010-09-29|2012-04-12|Jayesh Nath|Systems and methods for manufacturing passive waveguide components|WO2019229515A1|2018-06-01|2019-12-05|Swissto12 Sa|Radiofrequency module|
    FR3087954A1|2018-10-31|2020-05-01|Thales|WAVE GUIDE OBTAINED BY ADDITIVE MANUFACTURING|
    WO2021224074A1|2020-05-06|2021-11-11|Elliptika|Process for manufacturing a waveguide and waveguide manufactured via the process|
    FR3110779A1|2020-05-20|2021-11-26|Elliptika|Additive manufacturing process of a waveguide and waveguide obtained by the process|US3982215A|1973-03-08|1976-09-21|Rca Corporation|Metal plated body composed of graphite fibre epoxy composite|
    CN104733825B|2015-04-16|2017-03-15|中国人民解放军国防科学技术大学|A kind of novel waveguide bonder based on wave transparent medium and the coat of metal|
    IL241951A|2015-10-07|2018-04-30|Israel Aerospace Ind Ltd|Waveguide elements, fabrication techniques and arrangements thereof|FR3075482B1|2017-12-20|2020-09-18|Swissto12 Sa|PROCESS FOR MANUFACTURING A WAVEGUIDE DEVICE|
    FR3075483B1|2017-12-20|2019-12-27|Swissto12 Sa|PASSIVE RADIO FREQUENCY DEVICE, AND MANUFACTURING METHOD|
    US11128034B2|2018-03-02|2021-09-21|Optisys, LLC|Mass customization of antenna assemblies using metal additive manufacturing|
    US20210191036A1|2018-05-14|2021-06-24|The Trustees Of Columbia University In The City Of New York|Micromachined waveguide and methods of making and using|
    CN109149038A|2018-08-30|2019-01-04|深圳大学|Waveguide filter and its manufacturing method|
    CN109103556A|2018-08-30|2018-12-28|深圳大学|Waveguide filter and its manufacturing method|
    US11211680B2|2018-11-14|2021-12-28|Optisys, LLC|Hollow metal waveguides having irregular hexagonal cross-sections formed by additive manufacturing|
    KR20210093316A|2018-11-19|2021-07-27|옵티시스, 엘엘씨|Irregular Hexagonal Cross Section Hollow Metal Waveguide Filter|
    EP3664216A1|2018-12-05|2020-06-10|Airbus Defence and Space|Asymmetric waveguide|
    FR3095082B1|2019-04-11|2021-10-08|Swissto12 Sa|Oval section waveguide device and method of manufacturing said device|
    FR3099000B1|2019-07-15|2021-10-29|Swissto12 Sa|Waveguide filter suitable for an additive manufacturing process|
    DE102020104038A1|2020-02-17|2021-08-19|Friedrich-Alexander Universität Erlangen-Nürnberg|Process for the production of high-frequency technical functional structures|
    法律状态:
    2017-03-22| PLFP| Fee payment|Year of fee payment: 2 |
    2017-09-08| PLSC| Publication of the preliminary search report|Effective date: 20170908 |
    2018-03-23| PLFP| Fee payment|Year of fee payment: 3 |
    2020-03-19| PLFP| Fee payment|Year of fee payment: 5 |
    2021-03-23| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1600370A|FR3048556B1|2016-03-04|2016-03-04|METHOD FOR THE ADDITIVE MANUFACTURE OF A WAVEGUIDE AND WAVEGUIDE DEVICES MADE THEREBY|
    FR1600370|2016-03-04|FR1600370A| FR3048556B1|2016-03-04|2016-03-04|METHOD FOR THE ADDITIVE MANUFACTURE OF A WAVEGUIDE AND WAVEGUIDE DEVICES MADE THEREBY|
    PCT/IB2017/051086| WO2017149423A1|2016-03-04|2017-02-24|Method for the additive manufacturing of a waveguide and waveguide devices produced according to said method|
    CN201780014717.3A| CN109075418B|2016-03-04|2017-02-24|Method for additive manufacturing of a waveguide and waveguide device manufactured according to said method|
    US16/082,060| US11031669B2|2016-03-04|2017-02-24|Method of additive manufacture of a waveguide as well as waveguide devices manufactured according to this method|
    EP17708589.1A| EP3424103A1|2016-03-04|2017-02-24|Method for the additive manufacturing of a waveguide and waveguide devices produced according to said method|
    IL261337A| IL261337D0|2016-03-04|2018-08-23|Method for the additive manufacturing of a waveguide and waveguide devices produced according to said method|
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