• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention proposes a light module comprising a flexible substrate integrated circuit of FPCB type. The mass recovery of the electronic circuit housed by the printed circuit is achieved without the addition of dedicated fasteners for this purpose. Compared with techniques known in the art, the invention makes it possible to produce a light module involving fewer component parts and occupying a smaller volume.
    公开号:FR3048153A1
    申请号:FR1651409
    申请日:2016-02-22
    公开日:2017-08-25
    发明作者:Olivier Badia
    申请人:Valeo Vision SA；
    IPC主号:
    专利说明:

    The invention relates to the field of lighting and light signaling, in particular for a motor vehicle.
    In the field of lighting and light signaling for motor vehicles, it is becoming more and more common to use light sources with electroluminescent semiconductor components, for example light-emitting diodes, LEDs. An LED component emits light rays when a voltage of a value at least equal to a threshold value called forward voltage is applied to these terminals.
    In known manner, one or more LEDs of a light module for a motor vehicle are powered through power control means, which include converter circuits. The power control means are configured to convert an electric current of a first intensity, for example provided by a current source of the motor vehicle, such as a battery, into a charging current having a second intensity, different from the first. The electronic circuits providing the power control means, as well as the circuits comprising the light sources themselves can in known manner be made on flexible printed circuit boards (FPCB). Compared to printed circuits with a rigid substrate, a FPCB has the advantage of being foldable, which facilitates its arrangement in the restricted volume available within a light device of a motor vehicle. The electronic circuits made on one side of a FPCB may nevertheless require a resumption of the zero potential, or of the mass. For this purpose, it is for example known to provide electrically conductive rivets which pierce the flexible substrate at predetermined locations, and contact a grounded element. The usable surface of the printed circuit is thus occupied in part by components whose sole function is mass recovery. The object of the invention is to propose a solution that overcomes at least one of the aforementioned disadvantages. More particularly, the invention provides a light module involving a flexible substrate printed circuit, FPCB, which allows a mass recovery by limiting the volume occupied by the elements that carry out mass recovery with respect to known solutions. The invention relates to a light module for a motor vehicle. The light module comprises a metal device representing the mass, and an assembly comprising a flexible substrate printed circuit, FPCB, housing an electronic circuit. The light module also comprises at least one support plate. The assembly is disposed on a surface of the metallic device. The flexible substrate comprises a first substrate portion which supports on a first face the electronic components of the electronic circuit, and which is in contact, by a second face opposite to the first face, with said support plate so that the first portion of the substrate is stiffened. The light module is remarkable in that the flexible substrate comprises a second substrate portion which comprises at least one electrically conductive trace on a first face, and which is delimited by a single fold of the substrate relative to the first substrate portion, the fold being such that the second substrate portion is in contact with said support plate and such that the electrically conductive trace performs a ground resumption.
    The first portion of the substrate may be in the form of a strip having a length and a width, the width being less than the length. The second part may be provided in the form of a tongue widening the width of the substrate over part of the length.
    Preferably, the support plate is more rigid than the flexible substrate.
    Preferably, the second substrate portion may be folded toward the second face of the first substrate portion.
    The support plate may preferably be wrapped by the first and second substrate portions.
    Preferably, the electrically conductive trace of the first face of the second substrate portion may be in electrical contact with the surface of the metallic device.
    Preferably, the support plate may be electrically conductive. The support plate may preferably comprise aluminum.
    The support plate may preferably comprise two parts which extend in planes generally parallel to the surface of the metallic device, and comprising a first part whose first face is in contact with the second face of the first substrate portion and whose a second face, opposite to the first, is in contact with the surface of the metallic device, and a second part in contact with the electrically conductive trace of the first face of the second substrate portion.
    The fold of the substrate may preferably be such that the first substrate portion and the second substrate portion extend next to each other in planes generally parallel to the surface of the metallic device.
    Preferably, the support plate may comprise an opening allowing passage of the flexible substrate at the fold. It can for example be a slot.
    The metal device may preferably be part of heat dissipation means of the module. It may for example be a radiator intended to dissipate the heat produced by the electronic components of the electronic circuit.
    Preferably, the contacts between the substrate and the support plate and / or the surface of the metallic device can be made using a thermally conductive adhesive. The contacts between the support plate and the substrate and / or the surface of the metallic device may preferably be made using a thermally conductive adhesive. The glue is advantageously electrically conductive.
    The flexible substrate or support plate may preferably be attached to the metal device with at least one rivet piercing the substrate or support plate. Fixing can be done by crimping by means of a piece.
    Preferably, the electronic circuit may comprise means for controlling the supply of at least one light source of the light module. The electronic circuit may preferably comprise at least one light source, for example a semiconductor element. It may for example be an LED or a laser diode.
    By using the measurements according to the present invention, it becomes possible to carry out a ground resumption for an electronic circuit implanted on one side of a printed circuit of the FPC6 type, by using the flexibility of the substrate of the printed circuit, and without having recourse to additional components dedicated for this purpose. As a result, the solution proposed by the invention makes it possible to achieve mass recovery by using fewer parts compared to existing solutions. Compared to known solutions, the invention avoids the manual installation of two rivets on the flexible and fragile printed circuit, and avoids the need to return the latter by two folds. This implies a lower cost of implementation and a gain in volume in the limited space available for the design of a light device for a motor vehicle. Other features and advantages of the present invention will be better understood from the description and the drawings in which: FIG. 1 shows a schematic illustration of a lateral section through a flexible substrate and a support plate in a preferred embodiment of a light module according to the invention; FIG. 2 shows a perspective illustration of a light module according to a preferred embodiment of the invention; - Figure 3 shows a section along the axis A-A of the module shown in Figure 2; FIGS. 4a and 4b show a detail, in particular a flexible substrate, according to a preferred embodiment of the invention; FIG. 5 shows a schematic illustration of a lateral section through a flexible substrate and a support plate in a preferred embodiment of a light module according to the invention; - Figure 6 shows a detail, including a support plate, according to a preferred embodiment of the invention; - Figure 7 shows a perspective illustration of a light module according to a preferred embodiment of the invention.
    In the following description, like reference numerals will be used to describe similar concepts through different embodiments of the invention. Thus, the reference numerals 100, 200, 300, 400 describe a light module in four different embodiments according to the invention.
    Unless specifically indicated otherwise, technical characteristics described in detail for a given embodiment may be combined with the technical characteristics described in the context of other embodiments described by way of example and not limitation.
    The elements shown in the drawings are not scaled and are simplified to increase the clarity of the presentation.
    Flexible FPCB printed circuit boards are known per se in the art. Their production will not be described in detail in the context of the present invention. Typically, the components of an electronic circuit implanted on a PCB FPCB are arranged on a first face of the substrate and connected by electrically conductive tracks provided on the surface of the substrate. In order to guarantee the durability of such an assembly, the flexible substrate is, in a locally known manner, stiffened by bonding a support plate to the second face of the flexible substrate, which is the face opposite to the face that supports the electronic circuit of the flexible substrate.
    FIG. 1 schematizes a light module 100 according to an embodiment according to the invention. A side cut is shown. Only the essential components for understanding the invention are shown. A light module may however include other components than those shown. The module comprises a metal device 110 representing the mass. Advantageously, it is a means of heat dissipation of the light module, for example a metal radiator, such as aluminum. The module comprises an assembly that includes a flexible substrate printed circuit board 120 and a support plate 160. The support plate is intended to stiffen the flexible substrate at the location corresponding to the location of the components of an electronic circuit. Ideally, the support plate is bonded to the substrate. The thickness of the flexible substrate 120 is exaggerated with respect to the thickness of the plate for the sake of clarity of the disclosure. The FPCB printed circuit houses an electronic circuit whose electronic components 133 are shown. These are, for example, light sources of LED type, LED. The assembly is disposed on a surface 112 of the metal device. The electronic components 133 are supported on a first face 132 of a first substrate portion 130. The second face 134 of the first substrate portion, opposite the first face 132, is in contact with the support plate 160. The substrate flexible means comprises a second substrate portion 140 having a first face 142 and a second face 144. In the flattened state of the substrate, the first faces 132 and 142 of the first and second substrate portions form a continuous surface in the same plane. In FIG. 1, the second substrate portion 140 is folded with respect to the first substrate portion 130. A single fold 150 delimits the two portions. The fold is such that the second substrate portion comes into contact, in particular by its second surface 144, with the support plate and by its first surface 142 with the metallic device. As this first surface 142 has an electrically conductive trace 143 connected to the electronic circuit, a ground resumption is thus achieved without using additional components.
    Figure 2 shows a perspective view of a variation of the embodiment shown in Figure 1. The module 200 includes a metallic device 210 representing the mass. The module includes an assembly that includes a flexible substrate printed circuit board 220 and a non-visible support plate. The FPCB printed circuit houses an electronic circuit whose electronic components 233 are shown. The assembly is disposed on a surface 212 of the metallic device. The electronic components 233 are supported on a first face 232 of a first substrate portion 230. A fold 250 connects the first substrate portion to a second portion not visible in Figure 2. A fastening rivet 214 is provided to secure the together on the metal device. It is not necessary that the rivet, or crimping pin, be electrically conductive.
    Figure 3 shows a section of the module 200 at the line A-A. There is seen the support plate 260, which is partially enveloped by the first substrate portion 230, the fold 250 and the second substrate portion 240. The second face 234 of the first substrate portion 230 is in contact with the plate 260. Ideally, a thermally conductive adhesive is provided at this interface. The second portion of substrate 240 is folded towards the second face 234 of the first portion 230, so as to envelop the support plate 260, which is contacted by the second face 244 of the second substrate portion 240. On the first 242 of the second portion of the substrate, which is in contact with the surface 212 of the metallic device 210, is provided an electrically conductive trace 243 connected to the electronic circuit housed on the substrate 220. This arrangement realizes the mass recovery without dedicated specific components for this purpose. Ideally, a thermally conductive adhesive is provided at the interface of the surfaces 212 and 242, to ensure a heat exchange between the substrate 220 and the metal element 210.
    When the module 200 is assembled, the electronic components 233 are first laid on the substrate, the first portion 230 of which is then bonded to the support plate 260, the dimensions (width, length) of which are advantageously substantially equal to those of the first portion of substrate 230. The second portion 240 of the substrate is then folded over the support plate and glued to it. The assembly is then fixed, by gluing and / or crimping the radiator 210.
    Figure 4a shows the flexible substrate 220 in an unfolded state as seen from above. Neither the support plate nor the metallic device are illustrated. The substrate 220 comprises a first portion 230 and a second portion 240. The first face of the substrate is also separated into a first portion 232 and a second portion 242. The first face of the second substrate portion 242 comprises the electrically conductive trace intended for contact the metal element representing the mass. Figure 4b shows the flexible substrate 220 seen from below, in a folded state. In particular, the tongue representing the second substrate portion 240 is folded towards the second face 234 of the first substrate portion.
    FIG. 5 schematizes a light module 300 according to another embodiment according to the invention. A side cut is shown. Only the essential components for understanding the invention are shown. The module comprises a metal device 310 representing the mass. Advantageously, it is a means of heat dissipation of the light module, for example a metal radiator, such as aluminum. The module includes an assembly that includes a flexible substrate printed circuit board 320 and an electrically conductive support plate 360. The support plate is intended to stiffen the flexible substrate at the location corresponding to the location of the components of an electronic circuit. Ideally, the support plate is bonded to the substrate. The thickness of the flexible substrate 320 is exaggerated with respect to the thickness of the plate for the sake of clarity of the disclosure. The FPCB printed circuit houses an electronic circuit whose electronic components 333 are shown. These are, for example, light sources of LED type, LED. The assembly is disposed on a surface 312 of the metallic device. The electronic components 333 are supported on a first face 332 of a first substrate portion 330. The second face 334 of the first substrate portion, opposite the first face 332, is in contact with the support plate 360. The substrate flexible comprises a second portion of substrate 340 having a first face 342 and a second face 344. In the flattened state of the substrate, the first faces 332 and 342 of the first and second substrate portions form a continuous surface in the same plane. In FIG. 5, the second substrate portion 340 is folded with respect to the first substrate portion 330. A single fold 350 delimits the two portions. The fold 350 is such that the first substrate portion 330 and the second substrate portion 340 extend next to each other in planes generally parallel to the surface of the metallic device 312. The plans are located at different heights relative to the surface 312. On the one hand, the second face 334 of the first substrate portion 330 is in contact with a first portion of the support plate 363, which is stored between the surface 312 and the substrate 320 The second face 334 of the first substrate portion is in contact with the first face 363 of the first portion 362 of the support plate. The second face 364 of the first substrate portion is in contact with the surface 312. The respective interfaces are ideally provided with a thermally conductive adhesive layer. On the other hand, the first face 342 of the second substrate portion 340 is in contact with a second portion of the support plate 366. The second substrate portion 340 is interposed between the surface 312 and the support plate. Ideally the respective interfaces are provided with a thermally and electrically conductive glue. The arrangement is such that the first face 342 comprises an electrically conductive trace 343 which contacts the support plate 360. The first portion 362 of the electrically conductive support plate is connected to ground by its contact with the surface 312. The mass recovery is therefore performed by the electrically conductive trace 343 which is in contact with the second portion 366 of the support plate.
    Figure 6 shows a top view of a support plate 360 comprising the two described parts 362 and 366 respectively. The support plate is preferably a metal plate, for example an aluminum plate. The two parts of the plate are preferably separated by an opening, such as a slot which allows passage of the flexible substrate, while the two parts are electrically connected.
    FIG. 7 shows a perspective view of a variant of the embodiment shown in FIG. 5. The module 400 comprises a metal device 410 representing the mass. The module includes an assembly that includes a flexible substrate printed circuit board 420 and a support plate 460 having two distinct portions 462, 466. The printed circuit FPCB type houses an electronic circuit 433 whose electronic components are shown. The assembly is disposed on a surface 412 of the metallic device. The electronic components 433 are supported on a first face 432 of a first substrate portion 430. The first substrate portion 430 is stiffened by the first portion 462 of the support plate 460. A fold 450 connects the first substrate portion to a second portion 440. In a right-to-left direction in FIG. 7, the fold passes the substrate 460 below the second portion 466 of the support plate 460. At least one fastening rivet 412 is provided to secure the together on the metal device. It is not necessary that the rivet, or crimping pin, be electrically conductive. The rivet (s) may be at the level of the substrate, or as illustrated on a portion of the support plate that connects the two parts thereof. The illustration shows that the two parts of the support plate extend in the same plane.
    When mounting the module 400, the electronic components 433 are first laid on the substrate. The substrate is then folded so that the first portion 430 can be adhered to the first portion 462 of the support plate 260. The second portion 440 of the substrate is then passed through the opening of the support plate to be glued in. below the second portion 266 of the support plate. The assembly is then fixed by bonding and / or crimping to the metal device 410.
    权利要求:
    Claims (12)
    [1" id="c-fr-0001]
    claims
    A light module (100, 200, 300, 400) for a motor vehicle comprising a metal device (110, 210 310, 410) representing the mass, and an assembly comprising a flexible substrate printed circuit (120, 220, 320, 420), FPCB, housing an electronic circuit, and at least one support plate (160, 260, 360, 460), the assembly being disposed on a surface (112, 212, 312, 412) of the metallic device (110, 210, 310, 410), wherein the flexible substrate comprises a first substrate portion (130, 230, 330, 430) which supports on a first face (132, 232, 332, 432) at least one electronic component (133, 233, 333, 433) of the electronic circuit, and which is in contact, by a second face (134, 234, 334, 434) opposite the first face, with said support plate (160, 260, 360, 460) of so that the first substrate portion is stiffened, characterized in that the flexible substrate comprises a second substrate portion (140, 240, 340, 440) which comprises at least one electrically conductive trace (143, 243, 343) on a first face (142, 242, 342), and which is delimited by a single fold (150, 250, 350, 450) with respect to the first substrate portion (130, 230, 330, 430), the fold being such that the second substrate portion is in contact with said support plate (160, 260, 360, 460) and such as the trace electrically conductive (143, 243, 343) performs a mass recovery.
    [2" id="c-fr-0002]
    2. Light module according to claim 1, characterized in that the second substrate portion (140, 240) is folded towards the second face (134, 234)) of the first substrate portion (130, 230).
    [3" id="c-fr-0003]
    3. Light module according to claim 2, characterized in that the support plate (160, 260) is enveloped by the first and the second substrate portion. 4. Light module according to one of claims 2 or 3, characterized in that the electrically conductive trace (143, 343) of the first face (142, 324) of the second substrate portion (140, 240) is in electrical contact. with the surface (112, 212) of the metallic device (110, 210).
    [4" id="c-fr-0004]
    5. Light module according to claim 1, characterized in that the support plate (110, 210, 310, 410) is electrically conductive.
    [5" id="c-fr-0005]
    Light module according to Claim 5, characterized in that the support plate (360, 460) comprises two parts which extend in planes generally parallel to the surface of the metallic device (312, 412), comprising a first part (362, 462) of which a first face (363) is in contact with the second face (334) of the first substrate portion (330) and a second face (364), opposite to the first, is in contact with the surface of the metallic device (312, 412), and a second portion (366, 466) in contact with the electrically conductive trace (343) of the first face (342) of the second substrate portion (340, 440).
    [6" id="c-fr-0006]
    7. Light module according to claim 6, characterized in that the fold (350, 450) of the substrate (320, 420) is such that the first substrate portion (330, 430) and the second substrate portion (340, 440 ) extend next to each other in planes generally parallel to the surface of the metallic device (312, 412).
    [7" id="c-fr-0007]
    8. Light module according to one of claims 5 to 7, characterized in that the support plate (360, 460) comprises an opening for the passage of the flexible substrate (320, 420) at the fold (350, 450).
    [8" id="c-fr-0008]
    9. Light module according to one of claims 1 to 8, characterized in that the metal device (110, 210, 310, 410) is part of the heat dissipation means of the module. 10. The light module according to one of claims 1 to 9, characterized in that the contacts between the substrate (120, 220, 320, 420) and the support plate (160, 260, 360, 460) and / or the surface metal device (112, 212, 312, 412) are made using a thermally conductive adhesive.
    [9" id="c-fr-0009]
    Light module according to one of claims 1 to 10, characterized in that the contacts between the support plate (160, 260, 360, 460) and the substrate (120, 220, 320, 420) and / or the surface of the metal device (112, 212, 312, 412) are made using a thermally conductive adhesive.
    [10" id="c-fr-0010]
    Light module according to one of claims 1 to 11, characterized in that the flexible substrate (120, 220, 320, 420) or the support plate (160, 260, 360, 460) are attached to the metal device at using at least one rivet piercing the substrate or the support plate.
    [11" id="c-fr-0011]
    13. Light module according to one of claims 1 to 12, characterized in that the electronic circuit comprises means for controlling the supply of at least one light source of the light module.
    [12" id="c-fr-0012]
    14. Light module according to one of claims 1 to 13, characterized in that the electronic circuit comprises at least one light source, for example semiconductor element.
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    同族专利:
    公开号 | 公开日
    US20170241624A1|2017-08-24|
    US10386045B2|2019-08-20|
    FR3048153B1|2019-11-29|
    EP3209098A1|2017-08-23|
    CN107101152B|2021-12-07|
    CN107101152A|2017-08-29|
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    法律状态:
    2017-02-28| PLFP| Fee payment|Year of fee payment: 2 |
    2017-08-25| PLSC| Publication of the preliminary search report|Effective date: 20170825 |
    2018-02-26| PLFP| Fee payment|Year of fee payment: 3 |
    2019-02-28| PLFP| Fee payment|Year of fee payment: 4 |
    2020-02-28| PLFP| Fee payment|Year of fee payment: 5 |
    2021-02-26| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1651409|2016-02-22|
    FR1651409A|FR3048153B1|2016-02-22|2016-02-22|LUMINOUS MODULE FOR A MOTOR VEHICLE WITH MASS RECOVERY|FR1651409A| FR3048153B1|2016-02-22|2016-02-22|LUMINOUS MODULE FOR A MOTOR VEHICLE WITH MASS RECOVERY|
    EP17155663.2A| EP3209098A1|2016-02-22|2017-02-10|Light module for a motor vehicle with ground socket|
    US15/437,921| US10386045B2|2016-02-22|2017-02-21|Luminous module for an automotive vehicle with connection to ground|
    CN201710094581.3A| CN107101152B|2016-02-22|2017-02-21|Light module for a motor vehicle with ground connection|
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