• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    This device (24) for supporting at least two electronic cards (22) is intended to be inserted into a chassis, each electronic card (22) having two faces (26, 28) and a peripheral edge (30). The support device (24) comprises a core (40) configured to be arranged between the electronic boards (22) and to hold the boards (22) in separate planes with one face (26, 28) of a board electronics (22) arranged facing a corresponding face (26, 28) of another electronic card (22).
    公开号:FR3047869A1
    申请号:FR1651111
    申请日:2016-02-11
    公开日:2017-08-18
    发明作者:Damien Blanchet；Adrien Zanetti
    申请人:Alstom Transport Technologies SAS；
    IPC主号:
    专利说明:

    Device for supporting at least two electronic boards, electronic module and associated electronic system
    The present invention relates to a device for supporting at least two electronic cards, the support device being intended to be inserted into a chassis. The invention also relates to an electronic module comprising at least two electronic cards and such a device for supporting the electronic cards. The invention also relates to an electronic system comprising a frame and at least one such electronic module, the electronic boards of said module being mounted in the frame by means of the support device and being carried by said support device. The invention thus relates to the field of electronic systems with a chassis and electronic cards intended to be inserted into the chassis, the chassis preferably being in the 3U or 6U format. The invention relates in particular to the field of on-board electronic systems, in particular on-board electronic systems, such as a railway vehicle. 1U is a unit of well known length and defined according to the Eurocard standard, or IEC-60297-3, or according to the IEEE 1101.1, IEEE 1101.10 and IEEE 1101.11 standards. 1U corresponds to a length equal to 44.45 mm, that is to say equal to 1.75 inches (English irich).
    The 3U format then corresponds to a frame height equal to 133.35 mm, or 5.25 inches, the electronic cards for the 3U format then having a height substantially equal to 100 mm. The 6U format corresponds to a frame height equal to 266.70 mm, or 10.5 inches, the electronic cards for the 6U format then having a height substantially equal to 233.35 mm.
    Document US 2006/0171119 A1 discloses a mechanical adapter making it possible to fix two electronic cards in the 3U format together to form an electronic assembly in the 6U format, the electronic cards being maintained in the same vertical plane by this adapter . The electronic assembly, comprising the two electronic cards and the adapter, is then insertable into a 6U format chassis. The person skilled in the art will observe that the sum of two card heights intended for the 3U format is substantially equal to 200 mm, ie 33.35 mm less than a card intended for the 6U format, which makes it possible then to such an adapter having a height substantially equal to 33.35 mm.
    The electronic cards are thus fixed one above the other, and the adapter further comprises a radiator for dissipating the thermal energy released by the electronic cards during their operation.
    However, such an electronic assembly is relatively fragile, and the electronic cards of this set are also not always well cooled despite the presence of the radiator on the mechanical adapter.
    The object of the invention is therefore to provide a device for supporting at least two electronic cards to have an assembly that is more robust when the electronic cards are maintained by the support device. For this purpose, the subject of the invention is a device for supporting at least two electronic cards, the support device being intended to be inserted into a chassis, each electronic card comprising two faces and a peripheral edge, the support device comprising a core configured to be arranged between the electronic boards and to hold the boards in separate planes, with one face of an electronic board disposed facing a corresponding face of another board.
    The support device according to the invention then makes it possible to improve the mechanical robustness by the presence of the core configured to be arranged between the electronic cards and to maintain the electronic cards in separate planes, with one side of a card electronics arranged opposite a corresponding face of another electronic card.
    According to other advantageous aspects of the invention, the support device comprises one or more of the following characteristics, taken separately or in any technically possible combination: the support device is configured to be mechanically supported against the frame, lack of contact between any of the electronic boards and the frame; - The core is made of a thermally conductive material, to convey by conduction the thermal energy dissipated by the electronic cards; the core comprises two bearing faces, each bearing face being provided with an attachment edge for a respective electronic card; - The support device is configured to be inserted by sliding in the frame, and comprises at least one groove adapted to cooperate with a complementary groove of the frame; the core is configured to maintain the electronic cards in substantially parallel planes; the core extends in a vertical plane, and the support device further comprises at least one flank, each flank extending substantially in a horizontal plane, being fixed to a respective vertical end of the core and overflowing by relative to the soul to protect an edge of the corresponding electronic card; - The support device further comprises at least one thermally conductive and electrically insulating buffer, each pad being fixed to the core and being configured to be facing at least one component of a respective electronic card; and - the support device further comprises at least one fixing flange made of a mechanical vibration absorbing material, each fixing flange being configured to maintain a corresponding electronic card in contact with the core.
    When the core comprises two bearing faces, each bearing face being provided with a fixing edge of a respective electronic card, the mechanical strength is further improved, each electronic card being then maintained on all of its peripheral edge in contact with the corresponding bearing face of the core.
    When the core is also made of a thermally conductive material, the support device then makes it possible to improve the cooling of the electronic boards during their operation, by conveying, by conduction towards the frame, the thermal energy dissipated by the e-cards. The invention also relates to an electronic module comprising at least two electronic cards and a device for supporting the electronic cards, wherein the support device is as defined above. The invention also relates to an electronic system comprising a chassis and at least one electronic module, wherein at least one electronic module is as defined above, the electronic boards of said module being mounted in the chassis via the support device and being carried by said support device.
    According to another advantageous aspect of the invention, the electronic system further comprises the following characteristic: the chassis is of a type chosen from the type 3U and the type 6U.
    These features and advantages of the invention will become apparent on reading the following description, given solely by way of nonlimiting example, and with reference to the appended drawings, in which: FIG. 1 is a diagrammatic representation of an electronic system comprising a frame and an electronic module, the electronic module comprising two electronic cards and a device for supporting the electronic cards, the cards of said module being mounted in the frame by means of the support device and being carried by said device FIG. 2 is a sectional view of the electronic module according to plane II of FIG. 1 according to a first embodiment of the invention; FIG. 3 is a side view of the electronic module of FIG. FIG. 4 is a view similar to that of FIG. 3 according to an alternative embodiment; FIG. 5 is a view similar to that of FIG. 2 is a view similar to that of FIG. 2 with a different arrangement of the electronic boards with respect to the support device, and FIG. support devices attached to each other.
    In the remainder of the description, the terms "front", "back", "right", "left", "up", "down", "longitudinal", "transverse" and "vertical" are understood by reference to the conventional orthogonal axis system, shown in certain figures and having: a longitudinal axis X directed from the rear to the front; - a transverse axis Y directed from right to left; and a vertical axis Z, directed from bottom to top.
    In FIG. 1, an electronic system 10 comprises a chassis 12 and an electronic module 14. The electronic system 10 is, for example, a system with a chassis 12 in the 3U format or in the 6U format according to the Eurocard standard, or IEC-60297-3, or according to IEEE 1101.1, IEEE 1101.10 and IEEE 1101.11.
    The electronic system 10 is preferably an on-board electronic system, in particular an onboard system on board a vehicle, such as a railway vehicle.
    The frame 12 comprises at the front an opening 16 for receiving the electronic module or modules 14, and at the rear a bottom board 18 (of the English backplane), also called backplane board, to connect electrically or the electronic modules 14, or to electrically interconnect the electronic modules 14 together. The opening 16 is preferably rectangular.
    The frame 12 has first grooves 20 for guiding each electronic module 14 from the opening 16 to the bottom floor card 18.
    The frame 12 is preferably made of a thermally conductive material, to facilitate the evacuation to the outside of the heat dissipated by the electronic module or modules 14. The frame 12 is for example made of aluminum.
    The frame 12 is for example in the form of a rectangular parallelepiped, with a height H along the vertical axis Z, a length L along the longitudinal axis X and a width W along the transverse axis Y.
    The height H is preferably compatible with the 3U or 6U format. The length L corresponds to the depth of the frame 12, and is slightly greater than the length of each module 14 along the longitudinal axis X. The width W is variable, and depends on the number of electronic modules 14 to be inserted into the frame 12.
    The height H is, for example, substantially equal to 133.35 mm in the case of a 3U format or substantially equal to 266.70 mm in the case of a 6U format. The length L is for example equal to 24 cm, and the width W is preferably between 15 cm and 45 cm.
    At least one electronic module 14 comprises at least two electronic cards 22 and a device 24 for supporting the electronic cards.
    Preferably, each electronic module 14 comprises at least two electronic cards 22 and a respective support device 24, the electronic cards 22 then being carried by said support device 24.
    In the example of FIG. 2, the electronic module 14 comprises exactly two electronic cards 22 carried by the support device 24.
    The electronic cards 22 of each electronic module 14 according to the invention are mounted in the frame 12 by means of a respective support device 24, and are carried by said support device 24. The skilled person will observe that an electronic card 22 is optional, the support device 24 is of course also able to support a single electronic card 22 when a single electronic card 22 is present.
    Each electronic card 22 is known per se, and is preferably compatible with the chassis 12 of a type chosen from the type 3U and the type 6U in the sense of the Eurocard standard, or IEC-60297-3, or according to the standards IEEE 1101.1, IEEE 1101.10, and IEEE 1101.11.
    Each electronic card 22 comprises a printed circuit 25 with a first face 26, a second face 28 and a peripheral edge 30 between the first and second faces 26, 28, and components 32 electrically connected to the printed circuit 25, for example via solders 34.
    In the example of Figures 1 and 2, each electronic card 22 extends substantially in a vertical plane having the longitudinal axis X and the vertical axis Z. Each face 26, 28 then extends in said vertical plane. Each face 26, 28 is substantially flat.
    Each electronic card 22 further comprises a rear connector 36, visible in FIGS. 3 and 4, for its electrical connection with the bottom floor card 18. FIGS. 3 and 4 are side views from the left to the right of the electronic module 14 along the transverse axis Y.
    The support device 24 is intended to be inserted into the frame 12, and comprises a core 40 configured to be arranged between the electronic cards 22 and to hold the electronic cards 22 in separate planes, with a face 26, 28 of a electronic card 22 arranged facing a corresponding face 26, 28 of another electronic card 22.
    The support device 24 is configured to be in mechanical support against the frame 12, in the absence of a contact between any of the electronic boards 22 and the frame 12.
    In addition optional, the support device 24 is configured to be inserted by sliding in the frame 12, and comprises at least one second groove 42 adapted to cooperate with a first groove 20 complementary to the frame 12.
    In optional complement, the support device 24 further comprises at least one flank 44, 46, each flank 44, 46 extending substantially perpendicularly to the core 40 and projecting with respect to the core 40 to protect an edge of the corresponding electronic card 22.
    In the example of FIG. 2, the support device 24 comprises an upper flank 44 and a lower flank 46, the upper flank 44 being attached to an upper end of the core 40 and the lower flank 46 being fixed at one end. lower of the soul 40.
    The support device 24 then has a cross section I-shaped, or in the shape of an inverted H, in a transverse plane having the transverse axis Y and the vertical axis Z.
    In addition optional, the support device 24 further comprises at least one thermally conductive and electrically insulating buffer 48, each pad 48 being fixed to the core 40 and being configured to be facing at least one component 32 of a respective electronic card 22.
    In the example of FIG. 2, the support device 24 comprises two buffers 48 fixed on either side of the core 40, each pad 48 being provided for a respective electronic card 22 and arranged facing the dissipating component 32 the most thermal energy, such as a processor-type component, for example with a BGA type (Bail Grid Arraÿ).
    In addition, the support device 24 further comprises at least one fastening flange 50, 52, made of a material that absorbs mechanical vibrations, each fastening flange 50, 52 being configured to maintain a corresponding electronic card 22 in contact with it. the soul 40.
    The support device 24 preferably comprises an upper fixing flange 50 and a lower fixing flange 52, configured to hold the corresponding electronic card 22 by its upper edge and its lower edge respectively in contact with the core 40. 50, 52 extends along the longitudinal axis X.
    In the example of FIG. 2, the support device 24 comprises two upper fixing flanges 50 and two lower fixing flanges 52, namely an upper fixing flange 50 and a lower fixing flange 52 for each of the two electronic cards. 22.
    In addition optional, the support device 24 further comprises at least one cover 54 for protecting the electronic card. In the example of FIG. 2, the support device 24 comprises two protective covers 54, namely a protective cover 54 for each electronic card 22.
    In addition optional, the support device 24 further comprises a front face 56 equipped with a handle 58 to facilitate the extraction of the electronic module 14 relative to the frame 12. The front face 56 is for example fixed to the upper sidewall 44 and bottom flank 46.
    In addition optional, as shown in Figure 4 illustrating an alternative embodiment, the support device 24 further comprises cooling grooves 60, formed for example in the upper flank 44 and / or in the lower flank 46, or partially in the core 40, to further improve the cooling of the electronic boards 22. The cooling grooves 60 are for example aligned vertically with the electronic components 32 dissipating the most heat energy.
    The printed circuit 25 is known per se, and is also called PCB (English Printed Circuit Board).
    The first face 26 is the face receiving mainly the components 32 of the card, and is also called component face. The components 32 fixed to the printed circuit 25 on the side of the first face 26 are in particular the components having the greatest height among the various components 32, and are generally so-called through components, in the sense that the connecting lugs, not shown, of these components pass through the printed circuit 25 to be soldered to the electrical tracks, not shown, of the printed circuit 25 on the side of its second face 28.
    The second face 28 is the face with essentially welds 34 for fixing the components 32 to the printed circuit 25, while connecting them electrically to the corresponding tracks of the printed circuit 25. The second face 28 is then also called seams face. Those skilled in the art will observe that components 32 of low height are also likely to be attached to the printed circuit 25 on the side of the second face 28, and are then components 32 mounted on the surface. The core 40 extends for example in the vertical plane, and each flank 44 then extends in a horizontal plane having the longitudinal axis X and the transverse axis Y. The core 40 is preferably made of a material thermally conductive, to convey conduction by thermal energy dissipated by the electronic cards 22. The core 40 is for example made of aluminum, copper, nickel-plated brass. The core 40 has two bearing faces 62, 64, namely a first bearing face 62 for a first electronic card 22 and a second bearing face 64 for a second electronic card 22, each bearing face 62 , 64 being provided with an edge 66 for fixing an electronic card 22 respectively. Each upper edge, respectively lower, of a respective electronic card 22 is then preferably sandwiched between said fixing edge 66 and a respective upper, respectively lower, fixing flange 50, 52.
    In the example of FIGS. 2, 5 and 6, the core 40 is configured to hold the electronic boards 22 in substantially parallel planes, in this case in vertical planes containing the longitudinal axis X and the vertical axis Z .
    In addition optional, as shown in Figure 5 illustrating an alternative embodiment, the core 40 further comprises a passage opening 68, configured to allow the passage of electrical connectors 70, and / or a flexible connection, and generally an electrical connection for electrically connecting the two electronic cards 22 carried by the corresponding support device 24. The passage opening 68 is an opening through the core 40 from one side, and each electrical connector 70 is associated with a respective electronic card 22.
    Each flank 44, 46 is attached to a respective vertical end of the core 40. Each flank 44, 46 preferably overflows on either side of the core 40 to protect the edge of each of the two electronic cards 22 carried. by the support device 24. Each sidewall 44, 46 then has, in the transverse plane having the transverse axis Y and the vertical axis Z, a generally symmetrical cross section with respect to a median plane of the core 40 comprising longitudinal axis X and the vertical axis Z.
    Each flank 44, 46 is made of a thermally conductive material, also for conveying by conduction the thermal energy dissipated by the electronic cards 22. Each flank 44, 46 is preferably made of the same material as the core 40. Each flank 44, 46 is for example made of aluminum, copper, nickel-plated brass.
    Each flank 44, 46 is preferably integral with the core 40.
    Each pad 48 is for example a thermal paste, such as a silicone paste. Each pad 48 is for example made of a material made of silicone and glass fibers.
    Each fixing flange 50, 52 is preferably electrically insulating, while being able to absorb mechanical vibrations.
    Each fixing flange 50, 52 is for example made of an elastomeric material. Alternatively, each attachment flange 50, 52 is made of aluminum or stainless steel.
    Each protective cover 54 is for example in the form of a plate intended to be fixed to the upper sidewall 44 and the lower sidewall 46, and to provide protection against the external environment, such as against water and dust .
    As a variant, each protective cover 54 is in the form of a shielding grid, in order to protect the electronic cards 22 against electromagnetic interference, in particular in order to protect them against electromagnetic radiation emitted by electronic map (s) nearby. Those skilled in the art will then understand that the electronic boards 22 may be arranged in different ways with respect to the support device 24. In the example of FIG. 2, the electronic boards 22 are carried by the support device 24 having their first face 26, said component face, facing outwards, and then having their second face 28, said face welds, facing inwards towards the core 40.
    In a variant, in the example of FIG. 6, the electronic boards 22 are carried by the support device 24 having their first face 26 facing inwards in the direction of the core 40, and then having their second face 28 facing outwards.
    Alternatively, not shown, the electronic cards 22 are arranged with respect to the support device 24 with an electronic card 22 having its first face 26 facing inward towards the core 40, while the other electronic card 22 has its first face 26 facing outwards and its second face 28 facing inward towards the core 40.
    When the face of the electronic card 22 which faces the core 40 is the second face 28, referred to as the solder face, the buffer 48 is then configured to be in contact with an area of the second face 28 which is the zone in question. view of the component 32 to be cooled and the other side of the card 22, the component to be cooled being located on the side of the first face 26, as shown in Figure 2.
    When the face of the electronic card 22 which is facing the core 40 is the first face 26, each pad 48 is then directly in contact between the core 40, on the one hand, and the component 32 to be cooled, d on the other hand, as shown in Figure 6. In other words, each buffer 48 is then sandwiched between the core 40 and the component 32 to be cooled. This makes it possible to further improve the cooling of said component 32.
    Thus, the support device 24 according to the invention offers a greater mechanical robustness by the presence of the core 40 arranged between the electronic boards 22 and now the electronic boards 22 in separate planes, with a face 26, 28 of an electronic card 22 arranged facing a corresponding face 26, 28 of another electronic card 22.
    When the core 40 is furthermore made of a thermally conductive material, the support device 24 then makes it possible to improve the cooling of the electronic boards 22 during their operation, by diffusing towards the frame 12 the thermal energy dissipated by the electronic cards 22.
    Where appropriate, the support device 24 according to the invention also allows a reduction of costs, the core 40 which plays the role of radiator then being common to two separate electronic cards 22.
    The support device 24 according to the invention also offers a greater modularity of the electronic modules 14 according to the invention, being able to be attached to another support device 24, preferably able to be fixed to this other device. support 24, as shown in FIG. 7. This then makes it possible to form a dual electronic module comprising at least three electronic cards 22.
    Where appropriate, the upper flank 44 of the first support device 24 is attached to, or even fixed laterally to, the upper flank 44 of the second support device 24, and in a similar manner the lower flank 46 of the first support device 24 is attached, or even attached laterally to the lower flank 46 of the second support device 24.
    In other words, each support device 24 is stackable to its right or left with another support device 24 to form a dual electronic module.
    The support device 24 according to the embodiment of Figure 5 with further passage opening 68 facilitates the electrical interconnection of the electronic boards 22, allowing to connect directly via connectors 70 internal to the electronic module 14 , without going through the bottom floor card 18.
    It is thus conceivable that the support device 24 according to the invention to have a greater mechanical strength when the electronic cards 22 are maintained by the support device 24, while reducing costs.
    权利要求:
    Claims (12)
    [1" id="c-fr-0001]
    1. Device (24) for supporting at least two electronic boards (22), the support device (24) being intended to be inserted into a frame (12), each electronic board (22) comprising two faces (26, 28) and a peripheral edge (30), the support device (24) comprising a core (40) configured to be arranged between the electronic boards (22) and to hold the boards (22) in separate planes, with a face (26, 28) of an electronic card (22) arranged facing a corresponding face (26, 28) of another electronic card (22).
    [2" id="c-fr-0002]
    2. Support device (24) according to claim 1, wherein the support device (24) is configured to be mechanically supported against the frame (12), in the absence of contact between any of electronic boards (22) and the frame (12).
    [3" id="c-fr-0003]
    3. Support device (24) according to claim 1 or 2, wherein the core (40) is made of a thermally conductive material for conductive conveyance thermal energy dissipated by the electronic cards (22).
    [4" id="c-fr-0004]
    4. Support device (24) according to any one of the preceding claims, wherein the core (40) comprises two bearing faces (62, 64), each bearing face (62, 64) being provided with a fixing edge (66) for a respective electronic card (22).
    [5" id="c-fr-0005]
    A support device (24) according to any one of the preceding claims, wherein the support device (24) is configured to be slidably inserted into the frame (12), and comprises at least one groove (42) adapted to to cooperate with a groove (20) complementary to the frame (12).
    [6" id="c-fr-0006]
    The support device (24) according to any one of the preceding claims, wherein the core (40) is configured to hold the electronic boards (22) in substantially parallel planes.
    [7" id="c-fr-0007]
    The support device (24) according to any one of the preceding claims, wherein the web (40) extends in a vertical plane, and the support device (24) further comprises at least one sidewall (44). , 46), each flank (44, 46) extending substantially in a horizontal plane, being attached to a respective vertical end of the web (40) and projecting from the web (40) to protect an edge of the corresponding electronic card (22).
    [8" id="c-fr-0008]
    The support device (24) according to any one of the preceding claims, wherein the support device (24) further comprises at least one thermally conductive and electrically insulating pad (48), each pad (48) being attached to the core (40) and being configured to face at least one component (32) of a respective electronic board (22).
    [9" id="c-fr-0009]
    The support device (24) according to any one of the preceding claims, wherein the support device (24) further comprises at least one attachment flange (50, 52) made of a mechanical vibration absorbing material, each fixing flange (50, 52) being configured to maintain a corresponding electronic card (22) in contact with the core (40).
    [10" id="c-fr-0010]
    An electronic module (14) comprising at least two electronic boards (22) and an electronic board support device (24) (22), wherein the support device (24) is in accordance with any one of the preceding claims. .
    [11" id="c-fr-0011]
    An electronic system (10) comprising a frame (12) and at least one electronic module (14), wherein at least one electronic module (14) is in accordance with the preceding claim, the electronic boards (22) of said module (14). ) being mounted in the frame (12) via the support device (24) and being carried by said support device (24).
    [12" id="c-fr-0012]
    The electronic system (10) of claim 11, wherein the frame (12) is of a type selected from type 3U and type 6U.
    类似技术:
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    同族专利:
    公开号 | 公开日
    EP3206469B1|2019-01-09|
    EP3206469A1|2017-08-16|
    FR3047869B1|2019-08-16|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    EP0075210A2|1981-09-22|1983-03-30|Siemens Aktiengesellschaft|Module to be inserted in a frame|
    US4916575A|1988-08-08|1990-04-10|Asten Francis C Van|Multiple circuit board module|
    FR2764473A1|1997-06-04|1998-12-11|Trt Lucent Technologies|ELECTRONIC DRAWER COMPRISING AN IMPROVED HEAT EXHAUST DEVICE|
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    US6510053B1|2000-09-15|2003-01-21|Lucent Technologies Inc.|Circuit board cooling system|
    US7254025B2|2005-02-02|2007-08-07|National Instruments Corporation|Cooling mechanisms associated with card adapter|DE102019215036A1|2019-09-30|2021-04-01|Mahle International Gmbh|System with a gear mechanism and a circuit board|
    US11140767B2|2020-03-05|2021-10-05|Hamilton Sundstrand Corporation|Conductive thermal management architecture for electronic modules in a two-card assembly|
    US11259445B2|2020-03-05|2022-02-22|Hamilton Sundstrand Corporation|Cooling mechanism for electrionic component mounted on a printed wiring board|
    法律状态:
    2017-02-17| PLFP| Fee payment|Year of fee payment: 2 |
    2017-08-18| PLSC| Search report ready|Effective date: 20170818 |
    2018-02-23| PLFP| Fee payment|Year of fee payment: 3 |
    2019-02-18| PLFP| Fee payment|Year of fee payment: 4 |
    2020-11-13| ST| Notification of lapse|Effective date: 20201006 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1651111A|FR3047869B1|2016-02-11|2016-02-11|DEVICE FOR SUPPORTING AT LEAST TWO ELECTRONIC CARDS, ELECTRONIC MODULE AND ELECTRONIC SYSTEM THEREOF|
    FR1651111|2016-02-11|FR1651111A| FR3047869B1|2016-02-11|2016-02-11|DEVICE FOR SUPPORTING AT LEAST TWO ELECTRONIC CARDS, ELECTRONIC MODULE AND ELECTRONIC SYSTEM THEREOF|
    EP17155730.9A| EP3206469B1|2016-02-11|2017-02-10|Device for supporting at least two electronic cards, associated electronic module and electronic system|
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