• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Integrated electronic device comprising a perforated substrate (6) comprising an interconnection network and connection means (61) intended to be fixed on a printed circuit board (8), an integrated photonic module (5) electrically connected to the perforated substrate (6), having a portion facing a portion of said hole (7) of the twisted substrate (6), an integrated electronic module (4) electrically connected to the photonic module (5) and extending at least partly in said hole (7), the electronic module (4) and the substrate (6) being electrically connected on the same face of the photonic module (5).
    公开号:FR3046697A1
    申请号:FR1650152
    申请日:2016-01-08
    公开日:2017-07-14
    发明作者:Jean-Francois Carpentier；Patrick Lemaitre；Mickael Fourel
    申请人:STMicroelectronics Crolles 2 SAS；
    IPC主号:
    专利说明:

    Three-dimensional integrated photonic structure with improved optical properties
    Embodiments of the invention relate to photonic circuits, and more particularly to the interconnection of photonic modules with other modules, especially in three-dimensional integrated structures.
    As illustrated in FIG. 1, an integrated three-dimensional photonic structure STR can conventionally comprise an electronic module 1 comprising a plurality of integrated electronic circuits 10 and first solder balls 11 located on one of its faces, an integrated photonic module 2, comprising a plurality of integrated photonic circuits made for example in a semiconductor substrate 21, an interconnection portion 22, the first contact pads 23 ("bonding pad" according to the English name) on its upper face and second solder balls 24 on its lower face, and - an input / output input component of an optical signal, not shown, for example a first optical fiber connected to the upper face of the photonic module 2 and optically coupled to the integrated photonic circuits made in the semiconductor substrate 21, and - a substrate "BGA" 3 ("Bail Grid Array" according to the Anglo-Saxon acronym well known to those skilled in the art) comprising third solder balls 30 on a first face and second contact pads 33 on a second face opposite to the first face.
    The substrate also comprises metal lines and vias forming an interconnection network 31 making it possible to provide an electrical connection between the second contact pads 33 and the solder balls 30.
    The electronic module 1 can be electrically connected to the photonic module 2 by means of the first solder balls 11 and the first contact pads 23.
    The photonic module 2 can be electrically connected to the BGA substrate 3 by means of the second solder balls 24 and the second contact pads 33 located on the upper face of the substrate.
    The photonic components of the photonic module are electrically connected to the BGA substrate by vias 20 ("TSV", Trough Silicon Via according to the Anglo-Saxon acronym well known to those skilled in the art) extending in the semiconductor substrate 21 of the photonic module, and by the second solder balls 24.
    The third solder balls 30 may for example be intended to be connected to a printed circuit board.
    In this type of integrated three-dimensional photonic structure, the input / output component of an optical signal being connected to the upper face of the photonic module 2, the electronic module 1 and the integrated photonic module 2 must be electrically connected to the BGA substrate 3 through vias 20 extending into the semiconductor substrate 21 of the photonic module 2. These through vias 20 generate mechanical stresses in the semiconductor substrate 21, which modify the refractive index of the medium for a certain distance around vias.
    For critical optical components such as, for example, ring resonators, the use of TSV involves either specifying guard distances between a TSV and a critical optical component, which complicates circuit design, ie using TSVs. small diameter, which complicates the manufacture of circuits.
    Thus, it is proposed a three-dimensional structure comprising a photonic module not including TSV.
    According to one aspect, there is provided an integrated device or structure comprising a perforated substrate comprising an interconnection network and connection means intended to be fixed on a printed circuit board, an integrated photonic module electrically connected to the substrate, comprising a part facing a portion of said hole of the substrate, an integrated electronic module electrically connected to the photonic module and extending at least partially in said hole, the electronic module and the substrate being electrically connected on the same face of the photonic module .
    In other words, by connecting the electronic module and the substrate on the same face of the photonic module, it avoids the realization of through vias while retaining a reduced size structure.
    This is possible in particular by the presence of a hole in the substrate in which the photonic module can be placed.
    According to one embodiment, the connection means are arranged on a first face of the substrate and the photonic module is connected to said first face of the substrate.
    The photonic module may furthermore comprise a semiconductor film incorporating photonic components which comprise at least a first optical coupler, for example a grating coupler, the semiconductor film being partly opposite said first face and said at least one an optical coupler facing a portion of the hole.
    According to another embodiment, the connection means are disposed on a first face of the perforated substrate and the photonic module is connected to the face opposite to said first face of the substrate.
    The photonic module may furthermore comprise a semiconductor film incorporating photonic components which comprise at least one first optical coupler, for example a grating coupler, the semiconductor film being partly facing said face opposite the first face. and said at least one first optical coupler is located opposite a lateral face of the photonic module.
    The device may further comprise a second optical coupler located facing a lateral face of the photonic module or facing said hole, and possibly a heat sink in contact with the electronic module, advantageously placed facing the hole of the substrate in such a way when the connection means are fixed on a printed circuit board, the dissipator is in contact with the printed circuit. Other advantages and characteristics of the invention will appear on examining the detailed description of embodiments, which are in no way limiting, and the appended drawings in which: FIG. 1, previously described, illustrates the prior art; Figures 2 to 4 show embodiments of the invention.
    FIGS. 2 and 3 show a three-dimensional integrated structure STR, comprising an electronic module 4 comprising a plurality of integrated electronic circuits, a photonic module 5 comprising a plurality of integrated photonic components, and a perforated substrate 6, for example a perforated substrate of the type BGA ("Bail Grid Array" according to the Anglo-Saxon acronym well known to those skilled in the art).
    The plurality of integrated electronic circuits may comprise, for example, modulators, digital analog converters, memory components, and control circuits ("drivers") of certain photonic components of the photonic module, etc.
    The electronic module further comprises first connection means 40 made on a first face F41, for example first copper pillars.
    The photonic module 5 here comprises a silicon-on-insulator substrate, ("SOI", Silicon On Insulator), comprising a carrier substrate 50 and a silicon film 51 disposed above a buried insulating layer 52 commonly designated by the skilled in the art under the acronym "BOX" ("Burried OXyde").
    The photonic module 5 further comprises an interconnection portion 53 (known to those skilled in the art under the acronym "BEOL", Back End Of Line). This interconnection portion comprises on its front face FS5 second connection means 54, for example second copper pillars located on the peripheral region of said upper face FS5, and third connection means 55, for example third pillars of brass 55 located within said peripheral region.
    The silicon film comprises a plurality of photonic components, such as, for example, waveguides 58, modulators 57 and photodetectors 56, and also optical couplers 580 and 581, for example network couplers adapted to receive / transmit an optical signal. from / to an input / output component such as an optical fiber.
    Optical connectors 590 and 591 make it possible to connect optical input / output components to the photonic module 5. These optical connectors 590 and 591 are, for example, secured to the photonic module 5 by gluing.
    The perforated substrate 6 is, for example, a ceramic substrate, comprising an interconnection network comprising metal lines 60 and vias 64, and one face of which comprises a matrix of solder balls 61, for example the lower surface FI6. The solder balls are intended for example to connect to a printed circuit board 8.
    The perforated substrate 6 has a hole 7, for example a rectangular through-hole extending from the lower face FI6 of the substrate to an upper face FS6 opposite to the lower face FI6. The upper face FS6 further comprises fourth connection means 62, for example fourth copper pillars located at the periphery of the hole 7.
    The photonic module 5 is secured to the lower surface FI6 of the substrate 6 via the second and fourth copper pillars 54 and 62, so that a portion of the photonic module 5 is opposite the hole 7.
    Thus, the silicon film 51 of the photonic module 5 is located partly opposite the lower face FI6 of the perforated substrate 6.
    The electronic module is secured to the upper face FS5 of the photonic module 5 via the first and third copper pillars 40 and 55, so that it is located partly in the hole 7.
    Some of the electronic circuits of the electronic module are thus electrically connected to the solder balls 61 and thus to the printed circuit board 8 by electrical connections each comprising first and third copper pillars 40 and 55, vias and metal tracks of the part of FIG. interconnection 53 of the photonic module, the second and fourth copper pillars 54 and 62 located at the periphery of the photonic module 5, and metal tracks 60 and vias 64 of the interconnection network of the perforated substrate 6.
    Similarly, first and third copper pillars 40 and 55 as well as vias and metal tracks of the interconnection portion 53 of the photonic module provide the electrical connection between certain electronic circuits of the electronic module, for example control circuits, and certain photonic components of the photonic module, such as modulators 55.
    Finally, photonic components can be connected to the solder balls 61, in particular the pillars 54 and 62 and the interconnection network of the substrate 6.
    In all these cases it is thus free from the realization of through vias ("TSV").
    The integrated structure STR furthermore comprises optical input / output components.
    Here, an input component 90, for example a first optical fiber, is connected to the upper face FS5 of the photonic module via a first optical connector 590. For example, the optical fiber 90 is thus optically coupled to an optical coupler 580 made in the semiconductor film 51 and located opposite said hole 7. This optical coupling is possible by the absence of metal levels in the region of the interconnection portion 53 located between the first optical connector 590 and the first optical coupler 580.
    It should be noted here that the connection of the optical fiber 90 on the upper face FS5 of the photonic module via the first optical connector 590 is greatly facilitated by the configuration of the photonic module 5 and the perforated substrate 6, leaving the part of the upper face FS5 of the photonic module which is opposite said hole accessible from the outside of the structure.
    An output component 91, for example a second optical fiber, is connected to the edge of the photonic module via a second optical connector 591. For example, the optical fiber 91 is thus optically coupled to a second optical coupler 581. substrate 51 located opposite said slice or side face.
    According to another embodiment illustrated in FIG. 4, the second face FS6 of the perforated substrate 6 comprises fifth connection means 63, for example fifth copper pillars situated at the periphery of the hole 7.
    The photonic module 5 is here connected to the second face FS6 of the perforated substrate 6, via the second copper pillars 54 and said fifth copper pillars 63, so that a portion of the photonic module 5 is facing of the hole 7.
    Thus, the silicon film 51 of the photonic module 5 is located partly opposite the second face FS6 of the perforated substrate 6.
    The electronic module 4 is connected to the photonic module 5 via the first copper pillars 40 and the third brass pillars 55.
    Thus, the electrical connections connecting some of the electronic circuits of the electronic module to the solder balls 60 here comprise each of the first and third copper pillars 40 and 55, vias and metal tracks of the interconnection portion 53 of the photonic module, second and fifth copper pillars 54 and 63, metal tracks 60 and vias 64 of the intersecting substrate network 6.
    A single input / output component, for example an optical fiber 92, is connected to a side face of the photonic module 5 via an optical connector 592. For example, the optical fiber 92 is thus optically coupled to a integrated optical coupler 582 made in the semiconductor film 51 opposite said lateral face.
    A heat sink DT is here connected to a second face F42 of the electronic module. Thus, the electronic module 4 and the dissipator DT are located partly in the hole 7.
    The dissipator DT here is also in contact with the printed circuit board 8.
    It is also possible to envisage that the photonic module further comprises at least one photonic component such as the network coupler 583 disposed opposite the hole 7 of the perforated substrate 6, adapted to be coupled optically to an input component. output such as the optical fiber 93 shown in broken lines, via an optical connector 593.
    In this case, it is necessary to use low-space input / output components adapted to be housed in the height defined between the interconnection portion 53 of the photonic module and the printed circuit board 8. for this reason, it is possible to use optical fibers that accept reduced radii of curvature, of the order of a millimeter, for example. One could of course consider having only one optical fiber input / output 93 optically coupled to the coupler 583. This type of assembly avoids the need for an optical connection by the wafer of the photonic module.
    Although there have been described here photonic modules associated with optical connectors adapted to receive input / output components such as optical fibers 90, 91, 92, and 93, it is quite possible to envisage a photonic module without at least one optical input connector and thus an input optical fiber, but in which the photonic module 5 comprises an integrated light source, such as a hybrid laser source.
    权利要求:
    Claims (8)
    [1" id="c-fr-0001]
    An integrated device comprising a perforated substrate (6) comprising an interconnection network and connection means (61) intended to be fixed on a printed circuit board (8), an integrated photonic module (5) electrically connected to the substrate hole (6), having a portion facing a portion of said hole (7) of the twisted substrate (6), an integrated electronic module (4) electrically connected to the photonic module (5) and extending at least partly in said hole (7), the electronic module (4) and the substrate (6) being electrically connected on the same face of the photonic module (5).
    [2" id="c-fr-0002]
    2. Device according to claim 1, wherein the connection means (61) are disposed on a first face (FI6) of the substrate (6) and the photonic module (5) is connected to said first face (FI6) of the substrate.
    [3" id="c-fr-0003]
    3. Device according to claim 2, wherein the photonic module (5) comprises a semiconductor film (51) incorporating photonic components (55, 56, 58) which comprise at least a first optical coupler (580), the film semiconductor being partially opposite said first face (FI6) and said at least one first optical coupler (580) is opposite a portion of the hole (7).
    [4" id="c-fr-0004]
    4. Device according to claim 1, wherein the connection means (61) are disposed on a first face (FI6) of the perforated substrate (6) and the photonic module (5) is connected on the opposite face (FS6) to said first face (FI6) of the substrate.
    [5" id="c-fr-0005]
    The device according to claim 4, wherein the photonic module (5) comprises a semiconductor film (51) incorporating photonic components (56, 57, 58) which comprise at least a first optical coupler (582), the film semiconductor (51) being partly opposite said opposite face (FS6) to the first face (FI6) and said at least one first optical coupler (582) is located opposite a lateral face of the photonic module.
    [6" id="c-fr-0006]
    6. Device according to any one of claims 3 or 5 further comprising a second optical coupler (581, 583) located opposite a side face of the photonic module or facing said hole (7).
    [7" id="c-fr-0007]
    7. Device according to any one of the preceding claims, wherein the integrated electronic module (4) is in contact with a heat sink (DT).
    [8" id="c-fr-0008]
    8. Device according to claim 7 taken in combination with claim 5, wherein the heat sink (DT) is configured such that, when the connection means (61) are fixed on a printed circuit board (8), the heat sink (DT) is in contact with the printed circuit (8).
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    同族专利:
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    引用文献:
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    法律状态:
    2016-12-20| PLFP| Fee payment|Year of fee payment: 2 |
    2017-07-14| PLSC| Publication of the preliminary search report|Effective date: 20170714 |
    2017-12-21| PLFP| Fee payment|Year of fee payment: 3 |
    2019-12-19| PLFP| Fee payment|Year of fee payment: 5 |
    2021-10-08| ST| Notification of lapse|Effective date: 20210905 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1650152A|FR3046697B1|2016-01-08|2016-01-08|THREE-DIMENSIONAL INTEGRATED PHOTONIC STRUCTURE WITH IMPROVED OPTICAL PROPERTIES|
    FR1650152|2016-01-08|FR1650152A| FR3046697B1|2016-01-08|2016-01-08|THREE-DIMENSIONAL INTEGRATED PHOTONIC STRUCTURE WITH IMPROVED OPTICAL PROPERTIES|
    US15/217,100| US10012792B2|2016-01-08|2016-07-22|Three-dimensional integrated photonic structure with improved optical properties|
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