• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The spatial power combiner (10) has a plurality of inputs (11a, 11b, 11c, ...) to which are connected respectively a set of transmission lines (a, b, c, ...), and an output (12). . The spatial power combiner further comprises a body (13) forming a cavity (14) and the set of transmission lines (a, b, c, ...) pass longitudinally through the cavity (14) and are arranged around an absorbent member (15) extending longitudinally in the cavity (14).
    公开号:FR3044171A1
    申请号:FR1561267
    申请日:2015-11-23
    公开日:2017-05-26
    发明作者:Hadrien Theveneau；Matthieu Werquin；Christophe Gaquiere
    申请人:Universite Lille 1 Sciences et Technologies；Commissariat a lEnergie Atomique CEA；Microwave Characterization Center；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
    IPC主号:
    专利说明:

    The present invention relates to a spatial power combiner having a plurality of inputs and an output.
    A power combiner is a device for combining the power of multiple inputs into a single output.
    The generation of high power is necessary in some applications, for example in radar systems to emit a high power signal or communication systems to deliver a high power signal to a communication channel.
    Since the output power level of a single power amplifier is often not sufficient, a power combiner is needed to add or combine power outputs from multiple power amplifiers.
    Thus, power combiners are frequently used with a set of power amplifiers, each power amplifier amplifying an input signal and providing an output signal. The power combiner combines the power of the output signals of the power amplifiers and generates a total output power.
    Many architectures of power combiners exist. A spatial power combiner is a type of power combiner consisting of a cavity powered by signals from a set of input transmission lines, respectively. The power from each line is combined and recovered in an output central transmission line.
    In current power space combiners, the power combiner inputs are not isolated from each other. Thus, each input of the combiner has an influence on the other inputs, a failure at an input or components connected to this input can be propagated at the other inputs.
    In addition, the failure of a single power amplifier can cause significant degradation in power combiner performance, which can cause a failure in the operation of a device in which the power combiner is used.
    The present invention aims to solve at least one of the aforementioned drawbacks and to provide a spatial power combiner in which the reliability is improved. For this purpose, the present invention proposes according to a first aspect a spatial power combiner comprising a plurality of inputs to which are connected respectively a set of transmission lines, and an output.
    The spatial power combiner further comprises a cavity forming body, the plurality of transmission lines longitudinally passing through said cavity and being disposed around an absorbing member extending longitudinally in said cavity. The absorbent element makes it possible to isolate the transmission lines from one another, the signals carried by the transmission lines thus having no influence between them.
    In addition, in case of failure at a transmission line, this transmission line has no effect on the other transmission lines of the assembly and the power combiner always delivers a proper output signal, in the worst case. cases, the power output can be reduced.
    In one embodiment, the length of the absorbent element is equivalent to the length of the transmission lines in the spatial power combiner.
    Thus, the absorbent element extends longitudinally over the entire length of the transmission lines, which improves the isolation of the inputs to each other and can facilitate the assembly of the power combiner during its manufacture.
    In another embodiment, the length of the absorbent element is less than the length of the transmission lines in the spatial power combiner.
    By reducing the length of the absorbent element relative to the length of the transmission lines, the magnetic and dielectric losses due to the absorbent are reduced.
    In a particular case, the absorbent element extends starting from the input of said spatial power combiner.
    Thanks to this arrangement of the absorbent element, the dissipation of the energy dissipated in the form of heat in the power combiner is improved because the heat travels a reduced distance.
    In another particular case, the absorbent element extends from the output of said spatial power combiner.
    In one embodiment, the spatial power combiner further comprises heat dissipation means extending longitudinally in the cavity, the absorbent element surrounding the dissipation means.
    According to one characteristic, the heat dissipation means comprise a metal rod.
    In particular, in the case where the absorbent element extends from the inlet and the length of the absorbent element is less than the length of the transmission lines, the distance traveled by the heat along the rod metal is reduced.
    According to one characteristic, the transmission lines are microstrip transmission lines.
    Thus, the connection of the input transmission lines to electronic circuits is facilitated.
    In addition, no transition to another type of transmission line is necessary, avoiding losses due to transitions between different types of transmission lines.
    According to another characteristic, the inputs of the spatial power combiner have a low impedance.
    The connection of the combiner inputs to electronic circuits or components having low impedance outputs is thus facilitated. Indeed, when the impedance values are close, the implementation of the impedance adaptation is simplified.
    According to another characteristic, the spatial power combiner comprises a thermal evacuation module.
    This thermal evacuation module assists in the heat dissipation of the spatial power combiner.
    According to one embodiment, the spatial power combiner comprises an impedance pre-adaptation module arranged at the input of the spatial power combiner, the impedance pre-adaptation module comprising first portions of the transmission lines of the set of transmission lines. transmission.
    In one embodiment, each first portion of the transmission lines comprises a set of layers, the set of layers comprising: at least one first conducting layer carrying a signal and having a decreasing width along said first portion of the line; transmission, and - at least one second conductive layer serving as a potential reference and having an opening having a width increasing along the first portion of said transmission line.
    Thus, due to variations in the width of the first conductive layer and the opening of the second conductive layer, the value of the impedance of the transmission line varies along the transmission line.
    In particular, the impedance increases along the transmission line.
    Consequently, the value of the impedance of a transmission line at the input of the spatial power combiner is less than the value of the impedance of the transmission line at the output of the combiner.
    In a variant of this embodiment, the set of layers comprises a third conductive layer serving as a potential reference.
    In another variant of this embodiment, the impedance pre-adaptation module comprises a support on which the first parts of the transmission lines are arranged, the support comprising a set of recesses, each first part of the transmission lines of the transmission line. set of transmission lines being respectively disposed on a hollow of the set of recesses.
    Thus, the second conductive layer of each set of layers of each transmission line is in contact with each hollow of the support.
    According to a second aspect, the present invention relates to a power amplification assembly formed by a spatial power combiner according to the invention and an amplification structure arranged at the input of said spatial power combiner, the amplification structure. comprising a set of inputs and a set of outputs, the outputs being respectively connected to the inputs of the spatial power combiner.
    Therefore, the transmission lines of the spatial power combiner are connected to the outputs of the amplification structure.
    Thus, the spatial power combiner combines the powers present respectively at the outputs of the amplification structure.
    In addition, the input transmission lines of the spatial power combiner correspond respectively to transmission lines at the output of said amplification structure.
    According to one characteristic, the amplification structure comprises a set of power amplifiers, each power amplifier being connected to each output of the amplification structure.
    Thus, the input signals of the power combination set are first amplified and then their power is combined by the spatial power combiner into a single output.
    According to one characteristic, the outputs of the power amplifiers have a low impedance.
    Thus, the impedance matching between the amplification structure and the power combiner is easily implemented. The power amplification assembly has characteristics and advantages similar to those previously described in connection with the spatial power combiner. Other features and advantages of the invention will become apparent in the description below.
    In the accompanying drawings, given by way of non-limiting examples: FIG. 1a shows a perspective view partially broken away of a power amplification assembly according to an embodiment of the invention comprising a spatial power combiner according to a first embodiment of the invention; - Figure 1b shows an exploded perspective view of the power amplification assembly of Figure 1a. FIG. 2 represents a partial cutaway perspective view of the power combiner according to a second embodiment of the invention; - Figure 3 shows a perspective view partially broken away of the power combiner according to a third embodiment of the invention; and - Figures 4a and 4b show an exploded view of a first part of a transmission line of the power combiner shown in Figures 2 and 3 according to two embodiments.
    A power amplification assembly according to the invention will be described with reference to Figures 1a and 1b.
    FIG. 1a shows a power amplification assembly 100 comprising a spatial power combiner 10 and an amplification structure 20.
    An exploded view of the power amplification assembly is shown in Figure 1b.
    The spatial power combiner 10 is arranged at the output of the amplification structure 20.
    The amplification structure 20 comprises a set of inputs 21a, 21b, 21c, ... and a set of outputs 22a, 22b, 22c, ..., the number of inputs and outputs of the sets being identical.
    Note that in the remainder of this document, the inputs of the amplification structure 20 are referenced 21 and the outputs 22.
    The amplification structure 20 further comprises a set of power amplifiers 23, each power amplifier 23 being connected to an input 21 of the amplification structure 20 and to an output 22 of the amplification structure 20.
    Input transmission lines a ^, bi, Ci ... respectively connect the inputs 21 of the amplification structure 20 and the power amplifiers 23. Output transmission lines a2, b2, c2 ... respectively connect the power amplifiers 23 and the outputs 22 of the amplification structure 20.
    Thus, the power amplifiers 23 respectively amplify the signals at the inputs 21 of the amplification structure 20 and generate amplified signals at the outputs 22.
    The amplification structure 20 comprises a body 24 enclosing the power amplifiers 23 and the input transmission lines a-i, b-ι, Ci ... and output a2, b2, c2 ...
    In the embodiment shown in FIGS. 1a and 1b, the body 24 has an octagonal shape, the amplification structures comprise eight inputs 21, eight outputs 22, as well as eight power amplifiers 23. Each set formed by an amplifier of power 23, an input transmission line a ^, bi, Ci ... and an output transmission line a2, b2, c2 ... is disposed on a face of the body 24 in octagonal form.
    Of course, the body of the amplification structure may have different geometric shapes, and the number of inputs, power amplification outputs and transmission lines may be different.
    Note that in this partial view with partial tearing shown in Figure 1a, only three of the aforementioned sets are visible.
    The power amplifiers 23 are known to those skilled in the art, will not be described in more detail in this document.
    In the embodiment shown, the amplification structure 20 comprises cooling means 25 disposed around the periphery of the body 24 in order to dissipate the heat produced by the power components, in particular by the power amplifiers 23.
    The spatial power combiner 10 is arranged at the output of the amplification structure 20.
    The outputs 22 of the amplification structure 20 are connected to inputs 11a, 11b, 11c, ... (referred to hereinafter as the document) of the spatial power combiner 10. The powers of the signals at the output of the structure of FIG. amplification 20 are thus combined by the spatial power combiner 10 into a single power output of the spatial power combiner 10.
    Thus, in the power space combiner 10 transmission lines a, b, c, ... are respectively connected to the inputs 11a, 11b, 11c, ... of the spatial power combiner 10.
    It will be noted that the transmission lines a, b, c, ... of the spatial power combiner 10 are a continuity of the output transmission lines a2, b2, c2 ... of the amplification structure 20.
    The spatial power combiner 10 further includes an output 12 on which a combined power is generated.
    On this output 12, it is thus generated a combined output signal having a power corresponding to the combined powers of the input signals 11 of the spatial power combiner 10. Therefore, on the output 12, a combined output signal is generated. a power corresponding to the combined powers of the signals at the output of the amplification structure 20.
    Electronic equipment can be connected to the output 12 of the spatial power combiner 10 to use this combined power.
    Note that in the embodiment described, the output 12 is high impedance, presenting by way of non-limiting example 50 Ohms.
    The signal at the output 12 of the spatial power combiner 10 can thus be used, for example in an antenna or as input to a device serving as a transition from a waveguide to a coaxial line, without the need for impedance transformation. , or with an impedance transformation easy to perform.
    The spatial power combiner 10 comprises a cylindrical body 3 forming a cavity 14.
    The transmission lines a, b, c,... Comprise a first portion corresponding to the portion of line between the input 11 and the cavity 14 of the spatial power combiner 10.
    In the remainder of the document, the portion of the spatial power combiner at the cavity 14 will be called the heart of the combiner 101. The first part of a transmission line a, b, c, ... is also called a line of acces aa, ba, ca, ...
    Each input line a, b, c, ... further comprises a second part ab, bb, cb, ... corresponding to the portion of line between the access line aa, ba, ca ... and the output 12 of the combiner. The second portions of the transmission lines ab, bb, cb, ... pass longitudinally through the cavity 14 from the input 11 of the power space combiner 10 and up to the output 12 of the power space combiner 10.
    In the embodiment described, the input transmission lines a, b, c ... are microstrip transmission lines.
    Thus, since the power amplifiers 23 output signals on microstrip lines, the connection between the amplification structure 20 and the spatial power combiner 10 can be realized directly and without requiring necessary conversions between different types of power. lines.
    Losses due to the transformation of signals between lines of different types are thus avoided.
    The spatial power combiner 10 comprises an absorbent element 15 extending longitudinally in the cavity 14. The absorbent element 15 is placed between the input transmission lines a, b, c, ... especially between the second parts transmission lines ab, bb, cb, ... in the heart of the combiner 101.
    More particularly, the second portions of input transmission lines ab, bb, cb, ... are arranged around the absorbent element 15.
    In the embodiment shown in FIG. 1, the absorbent element 15 extends over the entire length of the second portions of the transmission lines ab, bb, cb, ... that is to say that it is extends over the entire cavity 14 between the input 11 and the output 12 of the spatial power combiner 10, more particularly over the entire core of the power spatial combiner 101.
    Therefore, in this embodiment, the length of the absorbent element 15 is equivalent to the length of the second portions of the transmission lines ab, bb, cb, ... in the power spatial combiner 10.
    In other embodiments, such as the embodiment shown in Figures 2 and 3, the length of the absorbent member 15 is less than the length of the second portions of the transmission lines ab, bb, cb, .. in the spatial power combiner 10.
    FIG. 2 represents a spatial power combiner 10 'according to a second embodiment of the invention. Note that the cavity is not shown in this figure.
    In this embodiment, the transmission lines a ', b', c ', ... and in particular the second parts of the transmission lines ab', bb ', cb', ... are arranged around the absorbent member 15 ', the absorbent member 15' extending longitudinally in a portion of the cavity (not shown in the figure).
    In this embodiment, the absorbent element 15 'extends from the output 12' of the spatial power combiner 10 'over a predetermined length. By way of non-limiting example, the predetermined length may be 50 mm.
    Naturally, the value of this predetermined length may be different, this value varying for example depending on the nature of the absorbent element 15 'used.
    In one embodiment, the absorbent member 15 comprises an absorbent material, such as an epoxy resin loaded with particles of a magnetic absorbent, for example ferrite particles.
    In this embodiment, the spatial power combiner 10 'further includes a plastic member 16' extending longitudinally in the cavity, in extension of the absorbent member 15 '. The plastic element 16 'has a mechanical function, making it possible to keep in place the transmission lines a', b ', c', ....
    In this embodiment, the absorbent member 15 'and the plastic member 16' are secured to each other by means of a threaded rod disposed in a recess 18 'formed in the absorbent member 15' and the plastic member 16 .
    Thus, the absorbent element 15 'and the plastic element 16' are fixed together by screwing.
    In particular, a first recess portion 18a ', corresponding to the recess made in the plastic element 16', is a threaded longitudinal recess, the walls of the recess 18 'thus forming a thread. A second recess portion 18b ', corresponding to the recess made in the absorbent member 15', is a recess whose walls are smooth.
    Of course, the attachment of the absorbent member 15 'and the plastic member 16' can be achieved by different means.
    FIG. 3 represents a third embodiment of the spatial power combiner 10 ".
    In this embodiment, the absorbent element 15 "extends longitudinally in the cavity (not shown in this figure) starting from the input 11" of the spatial power combiner 10 ", over a predetermined length. By no means limiting example, the spatial power combiner may have a length of 300 mm, and the absorbent element of 50 mm.
    According to another example, for a low loss power spatial combiner, the length of the absorbent element may be 20 mm.
    Of course, the length values of the power space combiner and the absorbing element may be different.
    In this embodiment, the spatial power combiner 10 "comprises heat dissipation means 17" extend longitudinally in the cavity.
    The heat dissipation means 17 "comprise in one embodiment a metal rod.
    This embodiment is particularly advantageous when the metal rod allows efficient dissipation of the thermal energy in the form of heat produced in the spatial power combiner 10 ".
    In this embodiment, the absorbent element 15 "is disposed so that it surrounds the dissipation means 17" over the predetermined length.
    Thus, the heat dissipation means 17 "extend longitudinally throughout the cavity The absorbent element 15" extends over a predetermined length starting from the input 11 "of the spatial power combiner 10". The heat dissipation means 17 "are thus surrounded by the absorbent element 15" over the predetermined length.
    In one embodiment, the spatial power combiner 10 (see FIG. 1) further comprises a thermal evacuation module 18.
    This thermal evacuation module 18 may be used with different spatial combiner structures of power 10, 10 ', 10 ", in particular with the structures shown in FIGS. 2 and 3.
    This thermal evacuation module 18 makes it possible to dissipate more the heat produced in the spatial power combiner 10.
    The thermal evacuation module 18 is a conventional module known to those skilled in the art and does not need to be described in detail here.
    In the embodiments described, the outputs of the power amplifiers 23 (or outputs 21 of the amplification structure 20) have a low impedance.
    In addition, the inputs 11 of the spatial power combiner 10 also have a low impedance.
    In addition, although the inputs of the spatial power combiner have a low impedance, the combiner output has a high impedance.
    In an embodiment such as that represented in FIGS. 1a and 1b, the spatial power combiner 10 furthermore comprises an impedance pre-adaptation module 102. This impedance pre-adaptation module 102 modifies the value of the impedance present in FIG. input 11 of the power space combiner 10.
    The impedance pre-adaptation module comprises the first parts of the transmission lines aa, ba, ca ... or access lines. Each access line aa, ba, ca ... comprises a printed circuit comprising at least two conductive layers, a conductive layer carrying a signal and a conductive layer serving as potential reference.
    Two embodiments of a printed circuit forming the access lines aa, ba, ca ... are represented by FIGS. 4a and 4b.
    FIG. 4a is a simplified illustration of an exploded view of a printed circuit forming the first part of a transmission line or access line aa of the spatial power combiner 10 according to one embodiment.
    Each access line aa, ba, ca, ... comprises a set of layers superimposed between them.
    In the embodiment shown in FIG. 4a, the set of layers comprises a first conductive layer 200, a second conductive layer 400 and a third conductive layer 700.
    In this embodiment, the first conductive layer 200 carries a signal, and the second 400 and third 700 conductive layers serve as a potential reference. The set of layers further comprises a first insulation layer 300, a second insulation layer 600 and an adhesive layer 500.
    In one embodiment, one of the conductive layers, here being the third conductive layer 700, has pads 800 arranged on the edges along the layer.
    In this embodiment, each of the other layers (200-600) has openings 900 disposed on the edge along the layer, an opening having a shape complementary to a pad 800 of the third conductive layer 700 and being located so a pad 800 can be inserted into an opening 900 of each layer of all the layers forming the access line aa. The assembly formed by the studs 800 and the openings 900 form means for holding or fixing the layers of all the layers together.
    Of course, other modes of attachment or retention may be employed in other embodiments.
    In addition, the number of layers may be different.
    The first conductive layer 200 has a central portion 201 and two lateral portions 202.
    The central portion 201 of the first conductive layer 200 carries the signal carried by a transmission line a, the power of which will be combined with that of the other signals carried by the other transmission lines b, c, ....
    The side portions 202 of the first conductive layer 200, the second conductive layer 400 and the third conductive layer 700 serve as a reference potential. The lateral portions 202 of the first conductive layer 200, the second 400 and third 700 conductive layers are interconnected by the pads 800, these pads being for example metallic.
    A first insulating layer 300 is disposed between the first 200 and the second 400 conductive layer in order to isolate the latter two.
    Similarly, the second insulating layer 600 is disposed between the second layer 400 and the third 700 conductive layers.
    In this embodiment, an adhesive layer 500 is disposed between the second conductive layer 400 and the second insulating layer 600.
    Note that in the example described, the first conductive layer 200, the second conductive layer 400 and the first insulating layer 300 form a first set, and the third conductive layer 700 and the second insulating layer 600 form a second together, the first and the second assembly being held together by means of the adhesive layer 500.
    Of course, other conductive, insulating and adhesive layers may be added and the order of the layers may be different.
    The impedance variation is implemented by the first conductive layer 200 and the second conductive layer 400.
    In the example shown, the width of the first conductive layer 200 decreases along the first portion of the transmission line aa. The width of the first conductive layer 200 thus has a lower value at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the the input of this module 102, 102 '(or at the input of the power space combiner 10).
    The second conductive layer 400 has an opening 401. This opening 401, or the width of the opening 401, increases along the first portion of the transmission line aa. The opening 401 of the second conducting layer 400 is thus greater at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the the input of this module 102, 102 '(or the input of the power space combiner 10).
    FIG. 4b is a simplified illustration of an exploded view of a printed circuit forming the first part of a transmission line or access line aa 'of the spatial power combiner 10 according to a second embodiment.
    In this embodiment, the set of layers forming the access line aa 'comprises a first conductive layer 200', a second conductive layer 400 'and an insulating layer 300'. The set formed by these three layers forms the access line aa. This access line aa 'is disposed on a support or soleplate 1000', the second conductive layer 200 'being in contact with the hollow 1001'.
    In particular, the support 1000 'comprises a set of recesses 1001', each recess 1001 'having a shape suitable for receiving the printed circuit forming the access line aa'.
    Thus, in the embodiment described, the number of hollows is equal to the number of access lines aa ', ba', ca ', ...
    Of course, the support 1000 'may be in one piece or be formed by a set of supports, each support being associated with an access line aa', ba ', ca', ...
    In this embodiment, the support 1000 'further comprises a second recess 1002' made in the first recess 1001 ', the second recess 1002' receiving a second insulation layer 600 '.
    The second insulation layer 600 'and the second cavity 1002' thus have complementary shapes.
    The second insulating layer 600 'disposed in the second recess 1002' of the support 1000 'assists in maintaining the printed circuit forming the access line aa' disposed in the first recess 1001 'of the support 1000'.
    In the embodiment described, the support 1000 'is made of metal.
    The first conductive layer 200 'transports the signal carried by a transmission line a', the power of which will be combined with that of the other signals carried by the other transmission lines b ', c' ...
    The second conductive layer 400 'and the metal support 1000' serve as a reference potential.
    It will be noted that when the printed circuit is inserted into the first hollow 1001 'of the support 1000', the second conducting layer 400 'is in contact with the support 1000'.
    The insulating layer 300 'is disposed between the first conductive layer 200' and the second conductive layer 400 'in order to isolate them from each other.
    As for Figure 4a, other layers of metallization and insulation can be added in all layers.
    In addition, the width of the first conductive layer 200 'decreases along the first portion of the transmission line aa'. The width of the first conductive layer 200 thus has a lower value at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the the input of this module 102, 102 '(or at the input of the power spatial combiner 10').
    The second conductive layer 400 'has an opening 401'. This opening 401 ', or the width of the opening 400', increases along the first portion of the transmission line aa '. The opening 401 'of the second conductive layer 400' is thus greater at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the the level of the input of this module 102, 102 '(or the input of the spatial power combiner 10').
    In embodiments in which the spatial power combiner does not include an impedance pre-adaptation module 101, 101 ', the impedance variation between the input and the output of the spatial power combiner is implemented only by the coaxial structure of the core of the combiner 101, 101 '.
    In all embodiments, the common mode impedance of the transmission lines of the coaxial structure of the power combiner increases along the coaxial structure of the combiner core 101, 101 '. This increase is implemented by a reduction in the ratio between the diameter formed by the set of transmission lines located inside the cylindrical body 13 and the inside diameter of the cylindrical body 13 of the core of the spatial power combiner 10.
    It will be noted that the arrangement of the lines inside the cylindrical body 13 and the own cylindrical body 13 form a coaxial structure.
    权利要求:
    Claims (17)
    [1" id="c-fr-0001]
    1. Spatial power combiner (10; 10 '; 10 ") having a plurality of inputs (11a, 11b, 11c, ...; 11a', 11b ', 11c', ...; 11a", 11b ", 11c" , ...) to which are connected respectively a set of transmission lines (a, b, c, ...; a ', b', c ', ... a ", b", c ", ... ), and an output (12; 12 '; 12 "), the spatial power combiner (10, 10', 10") further comprising a body (13; 13 '; 13 ") forming a cavity (14) and characterized in that the set of transmission lines (a, b, c, ...; a ', b', c ', ... a ", b", c ", ...) traverse longitudinally said cavity (14) and are arranged around an absorbent element (15; 15 '; 15 ") extending longitudinally in said cavity (14).
    [2" id="c-fr-0002]
    Spacecraft combiner according to claim 1, characterized in that the length of the absorbent element (15) is equivalent to the length of the transmission lines (a, b, c, ...) in the space combiner. power (10).
    [3" id="c-fr-0003]
    3. Spacecraft combiner according to claim 1, characterized in that the length of the absorbent element (15 ', 15 ") is less than the length of the transmission lines (a', b ', c',. ..; a ", b", c ", ...) in the spatial power combiner (10 '; 10").
    [4" id="c-fr-0004]
    Spatial power combiner according to claim 3, characterized in that the absorbing element (15 ") extends from the input of said spatial power combiner (10").
    [5" id="c-fr-0005]
    A power space combiner according to claim 3, characterized in that the absorbing element (15 ') extends from the output of said spatial power combiner (10').
    [6" id="c-fr-0006]
    6. spatial power combiner according to one of claims 1 to 5, characterized in that it further comprises heat dissipation means (17 ") extending longitudinally in said cavity, said absorbent element (15") surrounding the dissipation means (17 ").
    [7" id="c-fr-0007]
    7. spatial power combiner according to claim 6, characterized in that the heat dissipation means (17 ") comprise a metal rod.
    [8" id="c-fr-0008]
    Spacecraft combiner according to one of Claims 1 to 7, characterized in that the transmission lines (a, b, c,..., A ', b', c ',... ", B", c ", ...) are microstrip transmission lines.
    [9" id="c-fr-0009]
    Spacecraft combiner according to one of Claims 1 to 8, characterized in that the inputs (11a, 11b, 11c, ...; 11a ', 11b', 11c ', ...; 11a ", 11b ", 11c", ...) of the spatial power combiner (10; 10 '; 10 ") have a low impedance.
    [10" id="c-fr-0010]
    10. Space power combiner according to one of claims 1 to 9, characterized in that it further comprises a thermal evacuator module (18).
    [11" id="c-fr-0011]
    11. Spacecraft combiner according to one of claims 1 to 10, characterized in that it comprises an impedance pre-adaptation module (102; 102 ') arranged at the input of the spatial power combiner (10; 10'). 10 "), said impedance pre-adaptation module (102; 102 ') having first portions of said transmission lines (aa, ba, ca aa', ba ', ca' ...) of the set of lines of transmission.
    [12" id="c-fr-0012]
    12. Spacecombine power combiner according to claim 11, characterized in that each first part of said transmission lines (aa, ba, ca, ...; aa ', ba', ca ', ...) comprises a set plurality of layers, said plurality of layers having - at least a first conductive layer (200; 200 ') carrying a signal and having a decreasing width along said first portion of the transmission line (aa, ba, ca, ... aa ', ba', ca ', ...), and - at least one second conductive layer (400; 400') serving as a potential reference and having an opening (401; 401 ') having a width increasing along the first part of said transmission line (aa, ba, ca, ...; aa ', ba', ca ', ...).
    [13" id="c-fr-0013]
    13. Spacecraft combiner according to claim 12, characterized in that the set of layers comprises a third conductive layer (700) serving as a reference potential.
    [14" id="c-fr-0014]
    14. Spacecraft combiner according to one of claims 11 to 13, characterized in that said impedance pre-adaptation module comprises a support (1000 ') on which are arranged the first parts of the transmission lines (aa', ab ', ac', ...), said support (1000 ') having a set of recesses (1001'), each first part of the transmission lines of the set of transmission lines being respectively disposed on a recess (1001 ') of the hollow assembly (1001').
    [15" id="c-fr-0015]
    15. A power amplification assembly characterized in that it is formed by a spatial power combiner (10; 10 '; 10 ") according to one of the preceding claims and an amplification structure (20) arranged at the input (11; 11 '; 11 ") of said spatial power combiner (10; 10'; 10"), said amplification structure comprising a set of inputs (21a, 21b, 21c, ...) and a set of outputs (22a, 22b, 22c, ...), the outputs (22a, 22b, 22c, ...) being respectively connected to the inputs (11a, 11b, 11c, ...; 11a ', 11b' , 11c ', ...; 11a ", 11b", 11c ", ...) of said space power combiner (10; 10'; 10").
    [16" id="c-fr-0016]
    Power amplifier assembly according to claim 15, characterized in that the amplification structure (20) comprises a set of power amplifiers (23), each power amplifier (23) being connected to each output (22a, 22b, 22c, ...) of the amplification structure (20).
    [17" id="c-fr-0017]
    Power amplifier assembly according to claim 16, characterized in that the outputs (22a, 22b, 22c, ...) of the power amplifiers (23) have a low impedance.
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    同族专利:
    公开号 | 公开日
    US20170149113A1|2017-05-25|
    US10326191B2|2019-06-18|
    EP3171451A1|2017-05-24|
    FR3044171B1|2018-07-06|
    EP3171451B1|2021-11-10|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US4129839A|1977-03-09|1978-12-12|Raytheon Company|Radio frequency energy combiner or divider|
    US4371845A|1980-05-23|1983-02-01|Hughes Aircraft Company|Modular microwave power divider-amplifier-combiner|
    US4424496A|1981-10-13|1984-01-03|Raytheon Company|Divider/combiner amplifier|
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    US10003118B2|2015-12-22|2018-06-19|Qorvo Us, Inc.|Spatial coupler and antenna for splitting and combining electromagnetic signals|
    US10454433B2|2017-06-29|2019-10-22|Qorvo Us, Inc.|Amplifier assembly and spatial power combining device|
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    US10587027B2|2017-08-22|2020-03-10|Qorvo Us, Inc.|Spatial combining devices for high-frequency operation|
    US10749276B2|2017-08-22|2020-08-18|Qorvo Us, Inc.|Spatial power-combining devices and antenna assemblies|
    US10707819B2|2017-08-22|2020-07-07|Qorvo Us, Inc.|Phase tuning for monolithic microwave integrated circuits|
    US10340574B2|2017-08-22|2019-07-02|Qorvo Us, Inc.|Spatial combining device and antenna|
    US10651527B2|2017-08-22|2020-05-12|Qorvo Us, Inc.|Spatial power-combining devices with segmented waveguides and antennas|
    US10720711B2|2017-08-22|2020-07-21|Qorvo Us, Inc.|Antenna structures for spatial power-combining devices|
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    US11162734B2|2018-08-06|2021-11-02|Qorvo Us, Inc.|Heat exchanger assemblies for electronic devices and related methods|
    US11255608B2|2018-08-06|2022-02-22|Qorvo Us, Inc.|Heat exchanger assemblies for electronic devices|
    US10855240B2|2018-11-15|2020-12-01|Qorvo Us, Inc.|Structures for spatial power-combining devices|
    US10804588B2|2018-12-10|2020-10-13|Qorvo Us, Inc.|Antenna structures for spatial power-combining devices|
    US11005437B2|2019-02-25|2021-05-11|Qorvo Us, Inc.|Spatial power-combining devices with thin film resistors|
    法律状态:
    2016-11-30| PLFP| Fee payment|Year of fee payment: 2 |
    2017-05-26| PLSC| Publication of the preliminary search report|Effective date: 20170526 |
    2017-11-30| PLFP| Fee payment|Year of fee payment: 3 |
    2019-11-29| PLFP| Fee payment|Year of fee payment: 5 |
    2020-11-30| PLFP| Fee payment|Year of fee payment: 6 |
    2021-11-30| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1561267|2015-11-23|
    FR1561267A|FR3044171B1|2015-11-23|2015-11-23|SPACE COMBINER OF POWER|FR1561267A| FR3044171B1|2015-11-23|2015-11-23|SPACE COMBINER OF POWER|
    US15/357,441| US10326191B2|2015-11-23|2016-11-21|Spatial power combiner|
    EP16200051.7A| EP3171451B1|2015-11-23|2016-11-22|Spatial power combiner|
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