• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Electronic and / or computer equipment (1), of the type of computer servers comprising electronic cards (5), a power supply unit (2), which supplies power supplies to different entities of the electronic equipment (1), the power supply unit having a sealed envelope (20) filled with dielectric fluid (6), able to capture calories on various components of the power supply unit to diffuse them to a heat exchange wall (3), the electrical power supply being extractable, a diphasic thermal transfer circuit (4) with capillary pumping with an evaporator (7) thermally coupled to the heat exchange wall of the power supply unit, and a condenser (8), located remote from the power supply unit, and thermally coupled to a general calorie collector (9,9 '), such as in the service position, the heat exchange zone (3) is pressed against the evaporator (7).
    公开号:FR3042886A1
    申请号:FR1560205
    申请日:2015-10-26
    公开日:2017-04-28
    发明作者:Vincent Dupont；Nicolas Depret
    申请人:CALYOS SA；
    IPC主号:
    专利说明:

    Computer equipment with cooled power supply
    The present invention relates to computer and / or electronic equipment; in particular, we are interested in different types of modules or sets of computer servers that are usually used in 'data centers' (would say in French 'data center / calculation').
    The development of data exchanges over the Internet has led to a huge need for computing power and storage in servers to meet the needs of users and in particular these servers are often grouped in centers called 'data centers'.
    The cooling needs of the electronic / computer equipment forming the server sets in these data centers are constantly growing due to the ever increasing density of the processors in these cards.
    It has already been proposed to take heat from the processors which are the most important sources of heat dissipation by means of a phase change heat transfer system, as for example in the document US7770630.
    Furthermore, it is known, for example from document US2011132579, a so-called "pool boiling" solution in which all the components of an electronic card, including consequently the most dissipative components are immersed in a dielectric liquid which forms the calorie evacuation vector. However, this solution involves a significant amount of dielectric liquid and induces multiple risks of leakage; which makes the local and particular treatment of the most dissipative components preferable. Moreover, in the so-called "pool boiling" solution, the cold source of the system must necessarily be located above the level of the liquid.
    It turns out that a computer and / or electronic equipment is electrically powered by a power supply unit, in order to generate one or more stabilized power supplies from the AC mains voltage, which also contains many dissipative components. , such as rectifying diodes and coils / self-smoothing. The increase in the density and computing power leads to provide efficient cooling of the power supply unit, which is conventionally provided by a fan (or natural convection) to the detriment of compactness.
    Moreover, it is customary to provide that the power supply unit is a replaceable element, indeed some of these components may fail because the technology is chosen according to its cost and availability on the market. The extra cost that would guarantee a service life comparable to that of the calculation part is not acceptable at the data center scale. It is also possible that the power supply is damaged by a surge on the power supply that feeds it.
    It turns out that the known solutions, including fan-based, do not respond correctly to this need. It therefore appeared a need to propose new solutions to ensure efficient cooling of the power supply while allowing its replacement, and in passing improving the compactness. For this purpose, the invention proposes electronic and / or computer equipment, comprising: one or more electronic boards and, if appropriate, auxiliary elements, a power supply unit, which supplies electrical power supplies to various entities of the equipment, the power supply unit having a fluid-tight envelope defining an interior space filled with dielectric fluid, able to capture calories on various components of the power supply unit to distribute them to a heat exchange zone, the block power supply being removable and replaceable, - a two-phase thermal transfer circuit with capillary pumping with an exchanger-absorber thermally coupled to the heat exchange zone of the power supply unit, and a heat exchanger-rejector, located at a distance from the power supply unit, and thermally coupled to a general calorie collector, characterized in that in the service position, the heat exchange zone is pressed against the exchanger-absorber.
    Thus, it ensures good thermal contact between the power supply unit and the two-phase thermal transfer circuit; it is thus possible to evacuate the calories generated by the power supply unit at a distance from the latter in a very efficient and passive manner. It is understood that the exchanger-absorber takes calories on the power supply unit and that the exchanger-rejector rejects these calories at a distance. It is also noted that according to one of the possible configurations, the exchanger-absorber will be formed by an evaporator and the exchanger-absorber will be formed by a condenser (with or without undercooling 'sub-cooling').
    Thanks to these arrangements, an advantageous configuration is obtained with a replaceable and efficiently cooled power supply unit. In addition, the removal of a fan makes it possible to improve the compactness of the power supply unit; moreover, the proposed solution makes it possible to increase the service life and the reliability because the risk of fouling is eliminated even in difficult environment for decentralized systems (atmosphere not clean, dusty).
    In embodiments of the system according to the invention, one or more of the following arrangements may also be used.
    According to an advantageous aspect, the two-phase thermal transfer circuit comprises a pair of two flexible pipes connecting the exchanger-absorber and the exchanger-rejector. With this, thanks to the flexibility of said pipes, the exchanger-absorber can be easily moved, away from the heat exchange zone of the power supply unit, to release the movement of the power supply unit during a maintenance or replacement operation.
    The pair of two pipes may comprise a steam pipe and a liquid pipe. In particular, a vaporization phenomenon is used in the absorber exchanger, which makes it possible to very efficiently collect the calories on the power supply unit.
    The heat exchange zone is typically formed by one or more heat exchange walls, forming part of the sealed envelope; so that it suffices to press the exchanger-absorber on the heat exchange wall to take the calories emitted by the power supply unit.
    Advantageously, a thermal interface material promoting thermal conduction between the heat exchange wall and the absorber exchanger is provided. It is thus possible to reduce the contact thermal resistance and to further improve the transfer of calories from the power supply unit to the absorber exchanger. The exchanger-absorber may be an evaporator in which a two-phase working fluid is vaporized by the heat supplied by the heat exchange zone. The phase change allows to take a large amount of calories on a limited surface. The evaporator may comprise a porous mass providing the capillary pumping function ("capillary wick"). So that we have a local means providing the pumping function, independently of the circulation means of the two-phase fluid elsewhere. The exchanger-exchanger-absorber may be located above the exchanger-rejector, the driving force of pumping being provided by the capillary pressure against the gravity. Due to the performance of the capillary wick, the two-phase fluid in the liquid phase can be pumped against the gravity from the exchanger-rejector (condenser) passively. This feature allows easy integration of the system and its cold source in the rack unlike thermosiphon type systems for which the exchanger-rejector must be located above the vaporization zone.
    The heat exchange zone may comprise, on the side directed towards the inside of the interior space, an improved heat exchange surface, preferably in the form of projections or extensions of the solid wall, for example of heat exchange; this maximizes the available area for a good heat exchange between the dielectric fluid and the heat exchange zone.
    According to a configuration, the electronic and / or computer equipment is in the form of a computer server card module for data center / calculation, the power supply block having a generally parallelepipedal shape, received in a slide at the inside an envelope of the module, the heat exchange zone being formed by at least one heat exchange wall.
    The power supply can be moved between a service position and an extracted position for replacement or maintenance.
    The heat exchange wall extends in an XY plane and there is provided a movement in the Z direction at the end of the insertion stroke along X near the service position, the slide being generally perpendicular to Z; it is thus possible to make automatic the coupling between the heat exchange wall and the exchanger-absorber at the end of the insertion stroke of the power supply unit.
    The general calorie collector may be a common cold liquid circuit, which circuit is advantageously common to several adjacent computer assemblies.
    It is possible to provide a clamping of the direct clamping type with fast screws to fix the exchanger-absorber against the heat exchange wall.
    Optionally, a detachable interface (IF2) can be provided between the exchanger-rejector and the general calorie collector. Other features and advantages of the invention will become apparent from the following description of one of its embodiments, given by way of non-limiting example, with reference to the accompanying drawings. FIG. 1 is a general schematic view of an electronic or computer equipment with a cooling system comprising a power supply unit cooled in pool boiling mode and cascaded by a two-phase loop, FIG. 2 is a general view of perspective of the rear area of a server board module, according to another configuration, with an extractable power supply unit, Figure 3 shows in cross section a server board module, Figure 4 is another general perspective view. FIG. 5 is similar to FIG. 1 and illustrates three variants, FIG. 6 shows in more detail the sectional capillary evaporator; FIG. 7 is similar to FIG. 8 shows in section the power supply block according to a variant, Figure 9 shows a view of a computer server cabinet.
    In the different figures, the same references designate identical or similar elements.
    Figure 1 shows schematically an example of an electronic or computer equipment 1 with an extractable power supply unit 2. A typical example of such computer equipment is a rack (a 'cabinet') of computer server (s) responding to requests on the Internet.
    This type of electronic or computer equipment usually includes one or more electronic cards received in slides. The arrangement of these electronic boards can be horizontal (Fig. 1) or vertical (Fig. 5). In some cases, these electronic cards can be relatively simple, without a protective envelope; in other cases, these electronic cards may be more elaborate with a protective envelope and a combination of motherboard and daughter card (s), without excluding the presence of hard disks or memory storage entities, modules for coupling to the Internet, etc. With regard to the power supplies necessary for the operation of these electronic cards, a dedicated entity, called the 'power supply unit', is usually provided, which provides different stabilized power supplies. According to one configuration, there is provided a power supply unit 2 common to a plurality of electronic cards (Figs 1 and 5). According to another configuration, in the case of complex electronic cards, the power supply unit can be embedded with the electronic card itself (Figs.2, 3, 4 and 7).
    As stated in the introduction, due to the increase in computing power, the power supply must be cooled more and more efficiently, which is done conventionally by means of air convection by fan. The solution of the fan has the disadvantage of a minimum space requirement for an efficient airflow. Furthermore, it is known that finned radiators can trap dust which decreases the efficiency of the fan solution over time. In addition, the fan noise and the latter tends to increase over time, moreover the life of the fan is necessarily limited.
    Advantageously according to the present invention, an essentially liquid cooling technique is used to cool the substrate 21 and the various components 22 that are included in the power supply unit. To do this, the power supply unit 2 comprises a fluid-tight envelope 20 defining an interior space El filled with a dielectric fluid 6. To prevent any risk of excessive rise in pressure, provision is made to integrate an anti-condensation device. -surpression, in the form of a safety valve and / or a controlled loss of wall thickness ("burst disk"). In this way the risk of explosion during a fire can be controlled. Preferably the antisurpression device will be placed on the upper part of the sealed envelope 20 so as to avoid a liquid evacuation.
    This dielectric fluid 6 can be chosen from the Novec ™ range of 3M®, for example for its fireproof qualities.
    The dielectric fluid 6 has a vaporization temperature at atmospheric pressure in the range [45 ° C - 70 ° C]. In contact with the hot components, vapor bubbles 61 are formed (this process is commonly referred to as 'pool boiling') and upwardly upward Archimedes towards the upper wall of the power supply unit; at this point, in contact with the colder wall, they undergo condensation and fall back into droplets 62 or by runoff into the main mass of the dielectric fluid 6.
    According to the example illustrated in FIG. 1, the power supply unit 2 has a parallelepipedal shape, with in particular an upper face which forms a heat exchange wall 3.
    For the purposes of the present invention, the heat exchange wall 3 is more generally designated by the term "heat exchange zone", this zone being not necessarily flat or continuous.
    The heat exchange wall 3 comprises, on the side directed towards the interior of the interior space, heat exchange fins 36, which increase the effective exchange surface between the vapor phase of the dielectric fluid and the wall of the heat exchange.
    Instead of the fins shown, it should be noted that any type of improved heat exchange surface may be chosen as a solution tending to increase the effective exchange surface between the vapor phase of the dielectric fluid and the heat exchange wall. Advantageously, the structuring of the fins will allow the effective evacuation of the condensate film.
    In addition, there is provided a two-phase thermal transfer circuit 4 with capillary pumping, configured to collect calories at the power supply block and to reject them remotely, by means of a two-phase fluid 14.
    More specifically, the two-phase thermal transfer circuit 4 comprises an exchanger-absorber 7 thermally coupled to the heat exchange zone 3 of the power supply unit, and a heat exchanger-emitter 8, located at a distance from the power supply unit, and thermally coupled to a general calorie collector 9.
    Furthermore, the exchanger-absorber 7 and the exchanger-re-caster 8 are interconnected by pipes (or pipes), a first pipe (ref 47) carrying the working fluid from the exchanger-absorber 7 to 1 exchanger-rejector 8 and the other (ref 48) carrying the working fluid from the exchanger-rejeuse 8 to the exchanger-absorber 7.
    According to the example of FIG. 1, the exchanger-absorber 7 is formed by an evaporator and the exchanger-absorber 8 is formed by a condenser (with or without subcooling 'sub-cooling'), in which case the first The pipe carries essentially 14V steam, and the second pipe essentially carries 14L liquid.
    Advantageously, these two lines 47,48 are flexible, which makes it possible to mechanically move the exchanger-absorber 7, in particular to carry out the extraction of the power supply unit as has been discussed in the introduction of this document.
    In the normal service configuration (operational use), the heat exchange zone 3 is pressed against the exchanger-absorber 7, at the location of a first interface marked IF1. According to the 'flat' configuration shown in FIG. 1, the lower face of the exchanger-absorber 7 interfaces the upper face of the heat exchange zone 3 with the (optional) interposition of a thermal interface material 31 favoring the thermal conduction between the heat exchange wall 3 and the exchanger-absorber 7. The thermal interface material 31 is a grease or a graphite compound. The exchanger-rejector 8 makes it possible to evacuate calories from the two-phase working fluid 14 to another heat transfer fluid, here a cold liquid 9 based on water.
    According to another configuration shown in FIG. 2, the electronic equipment 1 is a server card module delimited by a protective envelope 10. The power supply unit 2 is normally housed inside the envelope 10, but is represented here in an extracted position, useful for a maintenance operation and / or for its replacement.
    More specifically, the power supply unit is movable between a service position and an extraction position as will be seen later.
    The heat exchange wall 3 extends in an XY plane. The Z direction corresponds to the main normal of the server board module. The exchanger-absorber 7 is found, in the service position of the power supply unit, above said heat exchange wall. In the example illustrated, the exchanger-rejector 8 is pressed against one of the faces of the casing 10 of the module (FIG 2). In this configuration, the entire envelope 10 is used as the radiative element of the calories, and which forms the general collector of calories within the meaning of the present invention.
    Figure 3 illustrates two possible solutions, among others, for thermally coupling the exchanger-absorber 7 with the heat exchange wall of the power supply unit.
    According to a first solution, the insertion movement of the power supply unit is rectilinear and parallel to the axis X, and the exchanger-absorber is mounted with a degree of freedom of translation along the Z axis. a rocker 60 rotatably mounted about an axis Y1. When the bottom of the power supply unit approaches the end position, it presses a spring 63 which in turn pushes on a first lever arm 64 of the rocker which pivots in the direction of the needles of a watch; a second lever arm 65 of the rocker pushes the heat exchanger-absorber 7 against the heat exchange wall 3. When the electric power supply unit is extracted, a return spring 66 moves the heat exchanger-absorber 7 away from the the coupling position.
    According to a second solution, the slide 68 which guides the power supply unit is not rectilinear but bends upwards at the end of the race, with a ramp zone 69. In this case, the exchanger-absorber can be mounted in almost fixed position. Near the end of the race, the power supply unit approaches the exchanger-absorber according to Z until its contact, with effective veneer at the end of the stroke.
    An electrical connection coupler (not shown in the figures) then allows the power supply unit 2 to deliver stabilized power supplies to the other entities of the server module 1.
    FIG. 4 illustrates another configuration of the server card module in which the two-phase thermal transfer circuit 4 collects calories from a plurality of dissipative components present on the electronic card, in particular the main processors ('CPU' or 'GPU'). Each of these processors is thermally coupled to an evaporator 51 connected to a main heat-collecting circuit 40. The main heat-collecting circuit 40 is in the form of a closed loop, for example an annular loop, with working fluid circulating from passive way (without mobile mechanical elements and external energy consumption) inside, either in two-phase form (liquid + vapor), or in essentially liquid form. According to a possible configuration, the movement of the working fluid in the main collection circuit may result from a vapor ejection phenomenon at the outlet of each of the evaporators placed on the main processors; under these conditions, the presence of a capillary wick in the exchanger-absorber 7 is not strictly necessary.
    This main heat collection circuit 40 also supplies the exchanger-absorber 7 with working fluid.
    It is noted that certain secondary equipment such as memory strips 16 are connected to the main collection circuit 40 by a conductive thermal bridge 15.
    An electrical connection coupler 11 makes it possible to connect the electronic card to the chassis (connection 'bottom of rack' or 'backplane'). With regard to the exchanger-absorber 7, there may be several possibilities. According to a first possibility, it is an evaporator without a capillary medium, the circulation being provided by capillary wicks present in the CPU evaporators 51 as mentioned above.
    According to a second possibility, it may also be an evaporator with a capillary medium as illustrated in FIG. 6, in which case there is a local pumping means.
    According to a third possibility, it may be a heat capture exchanger using the working fluid in the essentially liquid state, the fluid being used mainly to cool the CPUs by vaporization and used in an annexed manner to cool equipment. auxiliaries such as the power supply unit, the memory modules, etc.
    FIG. 5 illustrates a configuration with the electronic cards 5 arranged vertically, and the general calorie collector 9 'being formed by a forced air exchanger by a fan 90.
    Another variant visible in FIG. 5 illustrates the different relative positions for, on the one hand, the power supply block 2 and, on the other hand, the exchanger-rejector 8. In this case, the exchanger-absorber 7 is an evaporator Capillary capillary wick providing passive pumping pressure against gravity.
    Note also that the heat exchange wall of the power supply unit is on one side and not on the top.
    This illustrates the extremely important flexibility for the implementation of the different elements in a computer equipment.
    In Figure 6, the capillary wick 71 is in contact with the hot plate 70. The latter has teeth 72 which define grooves 73 for evacuation of steam.
    Fast fixing screws 76 are provided to secure the structure of the evaporator 78 to the heat exchange wall 3 of the evaporator power supply.
    FIG. 7 illustrates a configuration similar to that already shown in FIG. 3, in which the two-phase thermal transfer circuit connects the exchanger-absorber 7 in contact with the power supply unit with the exchanger-rejector 8 which is on the opposite face, for example beside the electrical connection coupler 11.
    It is noted here that the length of the lines 47,48 is not constrained, their course is not necessarily straight and can make detours. Thus, there is advantageously a great freedom of positioning for both the power supply unit and the cold source for cooling.
    FIG. 8 illustrates a variant concerning the use of the dielectric fluid 6 without phase change, for example a dielectric oil. Natural convection is generally not efficient enough because of the high viscosity of the oil. In this case, the convection is forced by a device for moving the fluid, such as a helix 24.
    In this case, the system loses its totally passive character for the internal part of the power supply unit.
    Figure 9 illustrates a configuration of server module cabinets 55 arranged vertically, with two rows one above the other. In the lower part we find blocks of servitude as the power supply block (s) 2 and the coupler (s) to the Internet network.
    It will be noted that in FIG. 1, there is provided an interface labeled IF2 by which the exchanger-rejector 8 and the general calorie collector 9 can be uncoupled.
    In a variant not shown in the figures, this second interface IF2 is used and it is planned to form a macro power supply module that integrates not only the power supply unit 2 as described above, but also its own circuit ( 'private') two-phase thermal transfer 4 with its pipes (optionally flexible) and its heat exchanger. In this case the exchanger-absorber 7 can be mounted in a non-removable manner on the heat exchange wall 3 of the power supply unit.
    权利要求:
    Claims (12)
    [1" id="c-fr-0001]
    1. Electronic and / or computer equipment (1), comprising: - one or more electronic boards (5) and if necessary auxiliary elements, - a power supply unit (2), which supplies power supplies to different entities the electronic equipment (1), the power supply unit having a sealed fluid envelope (20) defining an interior space (E1) filled with dielectric fluid (6), able to capture calories on various components of the d-block; power supply for distributing them to a heat exchange zone (3), the power supply unit being removable and replaceable, a diphasic thermal transfer circuit (4) with capillary pumping with a heat-exchanger-absorber (7) thermally coupled to the heat exchange zone of the power supply unit, and a heat exchanger-rejector (8), located remote from the power supply unit, and thermally coupled to a collector gen ral calories (9,9 '), characterized in that in the operating position, the heat exchange zone (3) is pressed against 1'échangeur-absorber (7).
    [2" id="c-fr-0002]
    2. Equipment according to claim 1, wherein the two-phase thermal transfer circuit (4) comprises a pair of two flexible lines (47,48) connecting the exchanger-absorber (7) and the exchanger-rejecter (8).
    [3" id="c-fr-0003]
    Equipment according to claim 2, wherein the pair of two pipes comprises a vapor pipe (47) and a liquid pipe (48).
    [4" id="c-fr-0004]
    4. Equipment according to one of claims 1 to 3, wherein the heat exchange zone is formed by one or more heat exchange walls forming part of the sealed envelope (20).
    [5" id="c-fr-0005]
    5. Equipment according to claim 4, wherein there is provided a thermal interface material (31) promoting thermal conduction between the heat exchange wall (3) and the exchanger-absorber (7).
    [6" id="c-fr-0006]
    6. Equipment according to one of claims 1 to 5, wherein the exchanger-absorber is an evaporator in which a two-phase working fluid is vaporized by the heat provided by the heat exchange zone (3).
    [7" id="c-fr-0007]
    7. Equipment according to claim 6, wherein the evaporator (7) comprises a porous mass (71) providing the capillary pumping function.
    [8" id="c-fr-0008]
    8. Equipment according to claim 7, wherein the evaporator (7) is located above the exchanger-rejector (8), the driving force of pumping being provided by the capillary pressure against the gravity.
    [9" id="c-fr-0009]
    9. Equipment according to one of claims 1 to 8, wherein the heat exchange zone (3) comprises, on the side facing the interior of the interior space, an improved heat exchange surface, preferably under form of projections of fins type (36) of heat exchange.
    [10" id="c-fr-0010]
    10. Electronic and / or computer equipment according to one of claims 1-9, in the form of a computing server card module for data center / calculation, the power supply block having a generally parallelepipedal shape, received in a slideway inside an envelope (10) of the module, the heat exchange zone being formed by at least one heat exchange wall (3).
    [11" id="c-fr-0011]
    11. Equipment according to claim 10, wherein the heat exchange wall (3) extends in an XY plane and is provided a movement in the Z direction at the end of the insertion stroke along X, close to the position. of service, the slide being generally perpendicular to Z.
    [12" id="c-fr-0012]
    12. Equipment according to one of claims 1 to 11, wherein there is provided a detachable interface (IF2) between the exchanger-rejector (8) and the general collector of calories (9).
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    GB201804875D0|2018-03-27|2018-05-09|Sec Dep For Foreign And Commonwealth Affairs|A power distribution assembly|
    JP2019179893A|2018-03-30|2019-10-17|株式会社ケーヒン|Cooler|
    CN111669935A|2019-03-08|2020-09-15|鸿富锦精密电子有限公司|Cooling device and electronic device cooling system using same|
    CA3042519C|2019-05-07|2020-12-22|Stephane Gauthier|Cooling a computer processing unit|
    US10782751B1|2019-05-07|2020-09-22|Stephane Gauthier|Cooling a computer processing unit|
    CN110345791A|2019-06-20|2019-10-18|上海交通大学|Phase-change accumulation energy can system and data center platform suitable for data center|
    US10955883B1|2019-10-15|2021-03-23|Hewlett Packard Enterprise Development Lp|Power supply dry disconnect liquid cooling|
    法律状态:
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    优先权:
    申请号 | 申请日 | 专利标题
    FR1560205|2015-10-26|
    FR1560205A|FR3042886B1|2015-10-26|2015-10-26|COMPUTER EQUIPMENT WITH ELECTRICAL POWER SUPPLY UNIT|FR1560205A| FR3042886B1|2015-10-26|2015-10-26|COMPUTER EQUIPMENT WITH ELECTRICAL POWER SUPPLY UNIT|
    US15/771,048| US10416736B2|2015-10-26|2016-10-25|Computer system with cooled electric power supply unit|
    JP2018521272A| JP2019501439A|2015-10-26|2016-10-25|Computer apparatus comprising a cooled power supply unit|
    PCT/EP2016/075612| WO2017072095A1|2015-10-26|2016-10-25|Computer system with cooled electric power supply unit|
    CN201680066434.9A| CN108431723A|2015-10-26|2016-10-25|Computer installation with cooling power supply unit|
    EP16787801.6A| EP3368959B1|2015-10-26|2016-10-25|Computer system with cooled electric power supply unit|
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