• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    An electronic device and method for manufacturing such an electronic device, comprising: a support plate (2) having a mounting face (5) and including an electrical connection network (3), at least one integrated circuit chip (4) ), mounted on said mounting face of the support plate and connected to said electrical connection network, an encapsulation block (6) in which the chip is embedded, this encapsulation block extending over the chip and around the latter on said mounting face of the support plate, and at least one additional element (7) of an electrically conductive material, at least partially embedded in said encapsulation block (6), this additional conductive element having at least one main portion (8) extending parallel to said support plate and having at least one secondary portion (9) electrically connected to said chip.
    公开号:FR3040535A1
    申请号:FR1557999
    申请日:2015-08-28
    公开日:2017-03-03
    发明作者:David Auchere；Laurent Marechal；Yvon Imbs；Laurent Schwarz
    申请人:STMicroelectronics Grenoble 2 SAS；STMicroelectronics Alps SAS；
    IPC主号:
    专利说明:

    Electronic device with integrated conductive element and method of manufacture
    The present invention relates to the field of electronic devices.
    Known electronic devices, generally of parallelepipedal shape, comprise a support plate, including an electrical connection network, an integrated circuit chip mounted on one of the faces of the support plate and an encapsulation block in which is embedded the chip. The chip is connected to the network of the support plate by electrical connection elements such as balls, interposed between the support plate and the chip, or by electrical connection wires embedded in the encapsulation block.
    Such electronic devices are mounted on printed circuit boards, generally via electrical connection elements such as balls, connecting the electrical connection network of the support plates and the electrical connection network of the printed circuit boards. .
    When the chips generate radio signals to be transmitted or process received radio signals, the transmitting or receiving antennas are realized on the printed circuit boards. The electrical signals follow very long resistive paths which consist of lines of the electrical connection network of the printed circuit boards, the electrical connection elements between the printed circuit boards and the support plates, lines of the electrical connection network. support plates and the electrical connection elements between the support plates. Such paths also depend on the quality of the interconnections resulting from the manufacture.
    The above provisions constitute a handicap in particular when the necessary size of the antennas, for the transmission of radio signals at frequencies of the order of 1 Giga Hertz or greater or even much higher, at the giga Hertz, becomes reduced.
    According to one embodiment, there is provided an electronic device which comprises a support plate having a mounting face and including an electrical connection network, at least one integrated circuit chip, mounted on said mounting surface of the support plate. and connected to said electrical connection network, an encapsulation block in which the chip is embedded, this encapsulation block extending over and around the chip on said mounting face of the support plate, and at least one additional element of an electrically conductive material, at least partially embedded in said encapsulation block, said conductive additional element having at least one main portion extending parallel to said support plate and having at least one a secondary portion electrically connected to said chip.
    Said secondary portion of the additional conductive element may be connected to at least one electrical contact arranged on said mounting face of said support plate at a distance from the periphery of the chip.
    Said secondary portion of the additional conductive element can be connected to at least one electrical contact arranged on a front face of said chip.
    Said secondary portion of said additional conductive element can be folded towards the support plate relative to its main portion.
    A welding material may be interposed between said secondary portion of said conductive additional element and said electrical contact of the support plate.
    Said encapsulation block may have a cavity at least partially revealing said main portion of said additional conductive element.
    Said main portion of said additional conductive element may extend above and away from the chip.
    Said additional conductive element may constitute a radio antenna.
    Said encapsulation block may comprise two superposed parts between which said additional conductive element extends.
    It is also proposed a method of manufacturing an electronic device, wherein there is a primary electronic device comprising a support plate, an integrated circuit chip mounted on a mounting surface of the support plate and a primary block encapsulation device extending above the chip and around the chip on said mounting face of the support plate, the encapsulation block having a front face parallel to the support plate; and an additional element of an electrically conductive material, shaped to have at least one main portion and at least one secondary portion.
    The method comprises: making a hole through said primary encapsulating block of the primary electronic device from its front face until at least partially discovering an electrical contact with said mounting face of said support plate or chip; installing said additional conductive element in a position such that its main portion extends on said front face of the primary encapsulation block and its secondary portion is connected to said electrical contact in said hole; and providing an additional encapsulation block on said primary encapsulation block of said primary electronic device, the primary encapsulation block and the additional block constituting a final encapsulation block in which said additional conductive element is at least partially embedded.
    The method may comprise: providing a conductive additional element having a secondary portion folded relative to its main portion and installing the additional conductive element in a position such that this secondary portion is engaged in said hole of the encapsulation block of the device primary electronics.
    The method may comprise: connecting the secondary portion of said additional conductive element to said electrical contact with solder material.
    The method may comprise: providing a groove in the front face of the primary encapsulating block of the primary electronic device and installing at least said main portion of said additional conductive element in said groove.
    The method may comprise: at least partially adhering said additional conductive element on the front face of the primary encapsulation block of the primary electronic device.
    The method may include: providing a recess in the additional encapsulation block so as to partially discover said main portion of said additional conductive element.
    The method may comprise: before installing said additional conductive element, making a recess in said primary encapsulation block of the primary electronic device and installing said additional conductive element in a position such that said main portion of this additional conductive element completely covers and close this recess.
    Electronic devices and their manufacturing methods will now be described as examples of embodiments, illustrated by the drawing in which: - Figure 1 shows a section of an electronic device according to the invention; FIG. 2 represents a view from above of the electronic device of FIG. 1; FIG. 3 represents a manufacturing step, in section, of the electronic device of FIG. 1; FIG. 4 represents another manufacturing step, in section, of the electronic device of FIG. 1; FIG. 5 represents another manufacturing step, in section, of the electronic device of FIG. 1; FIG. 6 represents another manufacturing step, in section, of the electronic device of FIG. 1; FIG. 7 represents a section of another electronic device according to the invention; - Figure 8 shows a section of another electronic device according to the invention; FIG. 9 represents a section of another electronic device according to the invention; and FIG. 10 represents a view from above of the electronic device of FIG. 9.
    As illustrated in FIGS. 1 and 2, according to an exemplary embodiment, a final electronic device 1 comprises a support plate 2, including an integrated electrical connection network 3, an integrated circuit chip 4 mounted on a front mounting face 5 of the support plate 2 and a final encapsulation block 6 in which the chip 4 is embedded and which extends on the chip 4 and around the latter, on the mounting surface 5 of the support plate 2, such that the electronic device 1 is in the form of a parallelepiped.
    According to an embodiment variant shown, the integrated circuit chip 4 is mounted on the mounting face 5 of the support plate 2 by means of electrical connection elements 7, such as balls, which selectively connect the chip 4 and the electrical connection network 3. According to another embodiment, the chip 4 could be glued to the mounting face 5 of the support plate 2 and be connected to the electrical connection network 3 by electrical connection wires embedded in the encapsulation block 6.
    The electronic device 1 further comprises an integrated additional element 7 made of an electrically conductive material, preferably rigid, embedded in the encapsulation block 6. The additional conductive element 7 comprises a main portion 8 which extends in parallel at the mounting face 5 of the support plate 2 and a secondary portion 9 which connects the main portion 8 to an electrical contact 10 of the electrical connection network 3 via a solder material 11, this electrical contact 10 being arranged on the mounting face 5 of the support plate 2 and being located at a distance and outside the periphery of the chip 4 and at a distance and inside the periphery of the encapsulation block 6.
    According to an alternative embodiment shown, the main portion 8 of the additional conductive element 7 extends above and away from the chip 4 and the secondary portion 9 is folded towards the support plate 2 relative to the main portion 8. The additional conductive element 7, for example, may be formed by stamping an elongate metal sheet whose main portion 8 is flat above and away from the support plate 2 and the chip 4, the secondary portion 9 can be reduced to a folded tab. The additional conductive element 7 can be obtained by cutting a metal plate and forming simultaneously or after cutting.
    The electronic device 1 may be provided with external electrical connection elements 12, such as balls, arranged on electrical contacts 13 of the electrical connection network 3 arranged on a face 14 of the support plate 2, opposite the face of the 5, these electrical contacts 13 being selectively connected to the electrical connection network 3 of the support plate 2.
    The electronic device 1 can be implemented in the following manner.
    As illustrated in FIG. 3, there is a prefabricated primary electronic device 15 which comprises the support plate 2, the chip 4 assembled as previously described and a primary encapsulation block 16 in which the chip 4 is embedded and which extends around the chip 4, on the mounting face 5 of the support plate 2. The primary encapsulation block 16 has a front face 17 which is parallel to the support plate 2 and which extends above and away from the chip 4.
    As illustrated in FIG. 4, a hole 18 is locally made through the primary encapsulation block 16, from its end face 17, at a location between the periphery of the chip 4 and the periphery of the primary encapsulation block 16. , so as to discover the electrical contact 10. Then, a drop of a solder material 11 is deposited at the bottom of the hole 18 on the electrical contact 10.
    Then, as illustrated in FIG. 5, the additional conductive element 7, prefabricated by forming and cutting, is installed on the primary encapsulation block 16, in a position such that its main portion 8 extends over the front face 17 and its secondary portion 9 is engaged in the hole 18, the end of the secondary portion coming into contact with the welding material 11.
    Then, optionally, at least the portion of the main portion 8 furthest from the secondary portion 9 is bonded to the front face 17 by virtue of a glue point 19. According to an alternative embodiment, optionally illustrated in FIG. 2 , a positioning groove 16a opening into the hole 18 could be made in the end face 17 of the primary encapsulation block 16, the main portion 8 of the additional conductive element 7 can be inserted into this groove 16a and thus put in position and kept in place.
    Then, the electrical device 15 is passed through an oven to produce the solder of the secondary portion 9 of the additional conductive element 7 on the electrical contact 10 via the solder material 11, the additional conductive element 7 being maintained thanks to the glue point 19.
    Then, as illustrated in FIG. 6, an additional encapsulation block 20 is produced on the primary encapsulation block 16 so as to cover the additional conductive element 7, so that the primary encapsulation block 16 and the additional encapsulation block 20 constitute the final encapsulation block 6 and that the final electronic device 1 is obtained as described previously with reference to FIGS. 1 and 2.
    As illustrated in FIG. 7, according to another exemplary embodiment, the final electronic device 1 can be considered as a new primary electronic device 21, on which steps equivalent to the steps described above with reference to FIGS. 4 to 6 are carried out, for example, as follows.
    A hole 22 is made in or through the encapsulation block 6 from its front face 6a, at a different location from that of the front hole 18, so as to discover another electrical contact 23 of the electrical connection network 3, this other electrical contact 23 being arranged on the mounting face 5 of the support plate 2.
    Then, a drop of solder material 24 is deposited on this electrical contact 23 at the bottom of the hole 22.
    Then, another additional conductive element 25 is installed equivalent to the additional conductive element 7, a main portion of which is placed on the front face 6a of the encapsulation block 6 and a secondary part is engaged in the hole 22 to be placed on the drop 24. Then, we weld.
    Finally, another additional encapsulation block 26 is produced on the encapsulation block 6 by covering the other additional conductive element 25, so as to form another final encapsulation block 27 consisting of the encapsulation block 6 and the encapsulation block 6. additional encapsulation block 26.
    We then obtain a final electronic device 28 equipped with two additional conductive elements 7 and 25, embedded in this final encapsulation block 27.
    As illustrated in FIG. 8, according to another exemplary embodiment, a final electronic device 28 differs from the electronic device 1 previously described in that it comprises an additional conductive element 29 whose secondary portion 30 is, this time, directly connected to a specific electrical contact 31 provided on the front face 32 of the chip 4. The specific electrical contact 31 can result from the formation of an electrical connection passing through the substrate of the integrated circuit chip 4, known as TSV. (from the Anglo-Saxon "Through Silicon Via").
    In this exemplary embodiment, the manufacturing step, equivalent to that described with reference to FIG. 4, consists in making a hole 33 through the primary encapsulation block 16, at a location above the chip 4 , in order to discover the electrical contact 31. The following steps of installation of an additional conductive element 7 and realization of an additional encapsulation block 20 are equivalent to those described with reference to Figures 5 and 6.
    As illustrated in Figures 9 and 10, according to another embodiment, a final electronic device 34 differs from the electronic device 1 described above in that it comprises a fitting of a cavity 35 in a final encapsulation block 6, open towards the outside and partially revealing the main portion 8 of the additional conductive element 7.
    The cavity 35 comprises an opening 36 arranged through the additional encapsulation block 20, to the main portion 8 of the additional conductive element 7. This opening 36 is made after the step of producing the additional encapsulation block 20.
    The cavity 35 further comprises a recess 37 arranged below the main portion 8 of the additional conductive element 7, for example between the end face 38 of the chip 4 opposite to the support plate 2 and this main portion 8 The recess 37 is made during the step described with reference to FIG. 4, before the introduction of the additional conductive element 7. The main portion 8 of the additional conductive element 7 completely covers the recess 37 so that, during the step of producing the additional encapsulation block 20, the material constituting this block 26 does not penetrate into this recess 37.
    Moreover, the front face 38 of the chip 4 may be covered with a metal layer 39. The main portion 8 of the additional conductive element 7 may serve to form a radio frequency antenna and the metal layer 39 may in this case serve as a ground plane for said antenna.
    According to an alternative embodiment, the main portion 8 of the additional conductive element 7 could be perforated.
    A cavity equivalent to the cavity 35 could be made in the electronic devices described with reference to FIGS. 7 and 8.
    In the case where the main portion 8 of the additional conductive element 7 forms a radio frequency antenna, the cavity 35 and the recess 37 formed below the main portion 8 of the additional conductive element 7 have advantage of allowing access to main portion 8 to deform and / or perforate, to adjust the electromagnetic characteristics of the antenna. This adjustment operation can be performed after the manufacture of the final device 34 is complete and that it has been mounted and tested in the desired application.
    The electronic devices that have just been described may be from collective manufacturing on a common support wafer, as is known in the field of microelectronics. Additional encapsulation blocks and encapsulation blocks may be obtained by spreading a liquid material, for example an epoxy resin, and then curing the material.
    Of course, the additional conductive elements of the electronic devices may have any desired topographic shape.
    The additional conductive elements of the electronic devices which have just been described, included in the final encapsulation block, can advantageously constitute electromagnetic antennas for the transmission / reception of very high frequency radio signals (up to gigahertz or higher at gigabyte Hertz, or even several hundred gigabytes Hertz), connected to the chip 4 by short paths of electrical connection, via the electrical connection network of the support plate 2 (Figure 1) or directly (Figure 8).
    权利要求:
    Claims (16)
    [1" id="c-fr-0001]
    An electronic device comprising: a support plate (2) having a mounting face (5) and including an electrical connection network (3), at least one integrated circuit chip (4), mounted on said mounting face of the support plate and connected to said electrical connection network, an encapsulation block (6) in which the chip is embedded, this encapsulation block extending over the chip and around the chip on said face of mounting the support plate, and at least one additional element (7) of an electrically conductive material, at least partially embedded in said encapsulation block (6), said additional conductive element having at least one main portion (8) extending parallel to said support plate and having at least one secondary portion (9) electrically connected to said chip.
    [2" id="c-fr-0002]
    2. Device according to claim 1, wherein said secondary portion (9) of the conductive additional element is connected to at least one electrical contact (10) provided on said mounting face of said support plate at a distance from the periphery of the chip.
    [3" id="c-fr-0003]
    3. Device according to claim 1, wherein said secondary portion (30) of the additional conductive element (29) is connected to at least one electrical contact (31) arranged on a front face of said chip.
    [4" id="c-fr-0004]
    4. Device according to any one of the preceding claims, wherein said secondary portion (9) of said additional conductive element is folded towards the support plate relative to its main portion (8).
    [5" id="c-fr-0005]
    5. Device according to any one of the preceding claims, wherein a welding material (11) is interposed between said secondary portion of said additional conductive element and said electrical contact of the support plate.
    [6" id="c-fr-0006]
    6. Device according to any one of the preceding claims, wherein the encapsulation block (6) has a cavity (35) at least partially exposing said main portion (8) of said additional conductive element.
    [7" id="c-fr-0007]
    7. Device according to any one of the preceding claims, wherein said main portion (8) of said additional conductive element extends above and at a distance from the chip.
    [8" id="c-fr-0008]
    8. Device according to any one of the preceding claims, wherein said additional conductive element constitutes a radio antenna.
    [9" id="c-fr-0009]
    9. Device according to any one of the preceding claims, wherein said encapsulation block comprises two superposed parts (16, 20) between which said additional conductive element (7) extends.
    [10" id="c-fr-0010]
    A method of manufacturing an electronic device comprising: providing: - a primary electronic device (15) comprising a support plate (2), an integrated circuit chip (4) mounted on a mounting face (5) of the support plate and a primary encapsulation block (16) extending over the chip and around the chip on said mounting face of the support plate, the encapsulation block having a front face ( 17) parallel to the support plate; and an additional element (7) of an electrically conductive material, shaped to have at least one main portion (8) and at least one secondary portion (9); and method comprising: making a hole (18) through said primary encapsulation block (16) of the primary electronic device from its front face (17) until at least partially discovering an electrical contact (10, 31) of said mounting face of said support plate or chip; installing said additional conductive element (7) in a position such that its main portion (8) extends on said front face (17) of the primary encapsulation block and its secondary portion (9) is connected to said electrical contact in said hole ; and providing an additional encapsulation block (20) on said primary encapsulation block (16) of said primary electronic device, the primary encapsulation block and the additional block constituting a final encapsulation block (6) in which said encapsulation block additional conductor (7) is at least partially embedded.
    [11" id="c-fr-0011]
    11. The method of claim 10, comprising: having an additional conductive element (7) having a secondary portion (9) folded relative to its main portion (8) and install the additional conductive element in a position such that this secondary portion (9) is engaged in said hole (18) of the encapsulation block (16) of the primary electronic device.
    [12" id="c-fr-0012]
    12. Method according to one of claims 10 and 11, comprising: connecting the secondary portion (9) of said additional conductive element to said electrical contact by welding material (11).
    [13" id="c-fr-0013]
    The method according to any of claims 10 to 12, comprising: providing a groove (16a) in the end face (17) of the primary encapsulation block (16) of the primary electronic device and installing at least said main portion ( 8) of said additional conductive element (7) in this groove.
    [14" id="c-fr-0014]
    14. A method according to any one of claims 10 to 13, comprising: at least partially glue said additional conductive element (7) on the front face of the primary encapsulation block (16) of the primary electronic device.
    [15" id="c-fr-0015]
    The method of any one of claims 10 to 14, comprising: providing a recess (36) in the additional encapsulation block (20) so as to partially expose said main portion (8) of said additional conductive member (7). ).
    [16" id="c-fr-0016]
    A method according to any one of claims 10 to 15, comprising: before installing said additional conductive element (7), making a recess (37) in said primary encapsulation block (20) of the primary electronic device and install said additional conductive element (7) in a position such that said main portion of said conductive additional element totally covers and closes said recess (37).
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    法律状态:
    2016-07-20| PLFP| Fee payment|Year of fee payment: 2 |
    2017-03-03| PLSC| Search report ready|Effective date: 20170303 |
    2017-07-20| PLFP| Fee payment|Year of fee payment: 3 |
    2018-07-20| PLFP| Fee payment|Year of fee payment: 4 |
    2019-07-22| PLFP| Fee payment|Year of fee payment: 5 |
    2020-07-21| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
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