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    • 专利摘要:
    Cell (2) gas for an atomic sensor (1) comprising an optical cavity (11) provided with at least one optical window (9) and adapted to be filled with a gas. The cell further includes a sealing cup (13) having a cavity mouth (14), a channel mouth (15), and a seal port (16), and a membrane (18) sealing sealing access of the sealing bowl. The membrane (18) can be plastically deformed by heating to hermetically seal the cavity mouth and / or the channel mouth so as to hermetically separate the optical cavity (11) from the gas inlet channel (17) .
    公开号:FR3038892A1
    申请号:FR1556729
    申请日:2015-07-16
    公开日:2017-01-20
    发明作者:Vincent Maurice；Nicolas Passilly；Christophe Gorecki
    申请人:Centre National de la Recherche Scientifique CNRS；Universite de Franche-Comte；
    IPC主号:
    专利说明:

    Gas cell for an atomic sensor and method of filling a gas cell. The invention relates to the field of gas cells and atomic sensors comprising gas cells. The term "gas" may mean any gas, vapor, or alkaline vapor or a mixture of a gas and a vapor.
    Atomic sensors comprise, for example, atomic clocks, micro-magnetometers or even micro-gyrometers. Such atomic sensors may for example be intended for telecommunications, navigation and defense systems.
    Such gas optical cells are sometimes referred to as "cells" or "microcells" and associated sensors "micro-atomic clocks", "micro-magnetometers" and "micro-gyrometers". Throughout the text, the term "micro" must be understood in the context and with the meaning indicated.
    A typical application is a chip-scale atomic clock, known by the acronym CSAC (for Chip-Scale Atomic Clock).
    The operation of the atomic sensors is based on optical spectroscopy of the atoms of a gas filling the cavity of a cell provided with at least one optical window. This cavity is thus called an "optical cavity". The gas is usually an alkaline vapor, such as cesium or rubidium. This spectroscopy makes it possible to measure one or more spectral quantities associated with the physical quantity or quantities that the sensor seeks to observe, for example a frequency, a magnetic field or an acceleration.
    For example, in the case of an atomic micro-clock, the operation of the sensor may be based on the measurement of the frequency of a particular microwave transition of the atoms of the gas, called the clock transition. In this application, the atomic micro-clock then typically implements the principle of atomic resonance by coherent entrapment of population known by the acronym CPT (for Coherent Population Trapping).
    Moreover, the width of the line observed by spectroscopy, and therefore the frequency stability in the case of an atomic clock, is determined by the relaxation time of the alkaline atoms from the coherent state in which they have been pumped. to their ground state, a time which is in particular a function of the collisions of atoms with the walls of the cell, which lead to the loss of their coherence.
    To improve the quality of gas spectroscopy, and therefore the accuracy and stability of the atomic sensor, it is thus known to add to the alkaline vapor a gas, said buffer gas or buffer atmosphere, to slow the diffusion of alkaline atoms to the walls of the cell and to confine said alkaline atoms.
    Such atomic sensors offer the advantage of being small in size, energy saving and having a very good accuracy and stability of measurement.
    An example of such an atomic sensor is known from the work of the MAC-TFC consortium, the FEMTO-ST Institute (acronym for Franche-Comté Electronique Mécanique Thermique et Optique - Sciences et Technologies) which conceived and realized a steam cell of cesium very compact (a few mm3) for an atomic clock, with micro-machining MEMS (acronym for MicroElectroMechanical Systems) silicon and anodic solder (see for example "New approach of manufacturing and dispensing of micromachined cesium vapor cell" by L. Nieradko, C. Gorecki, A. Douahi, V. Giordano, JC Beugnot, J. Dziuban and M. Moraja published in JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS of August 2008).
    The realization of gas optical cells and such atomic sensors is usually used to microfabrication methods of stacks of silicon and glass substrates, fixed together by anodic welds.
    A usual method of microfabrication of a cell thus begins with the etching of cavities in a silicon substrate. A first glass substrate is then welded, usually by anodic welding, on one side of this substrate. Finally, a second glass substrate is welded on the opposite side after incorporation of the buffer atmosphere and the alkali metal, which can take various forms depending on the filling method employed.
    In order to introduce the alkali metal into the optical cavity, it is possible to manufacture, and in particular the anodic welding step, in an atmosphere containing cesium and a buffer gas or by depositing a certain amount of alkali metal in liquid or solid form in a cavity of the cell.
    However sealing in the presence of pure cesium brings complications. The anodic welding must indeed begin at low temperature, to avoid evaporation of metal deposited in the cavity, and continue while the temperature is increased. This can lead to pressure discrepancies of the buffer gas as described in US2012 / 0298295A1.
    To simplify the manufacture of the atomic sensor and to allow the implementation of standard anodic welding equipment under optimal conditions, it is known to use a solid compound called a dispenser which is introduced into the cell during the sealing step. . Such a compound is for example made of a Zr-Al alloy and cesium chromate, suitable to remain stable at the temperature of the anode weld. The dispenser is then heated locally, for example using a power laser to release pure cesium and establish saturated vapor in the cell. After activation, most of the cesium atoms are in the liquid phase or in the solid phase, depending on the temperature. Such a method is for example detailed in the document "From the Implementation to the Characterization and Assembly of Microfabricated Optical Alkali Vapor Cell for MEMS Atomic Clocks. By Nieradko, Lukasz, et al., Published in 2007 in the journal Solid-State Sensors, pages 45-48.
    If it simplifies the manufacture of the sensor, the presence of a dispenser in each cell is however also restrictive. On the one hand, it limits the density of cells achievable on a wafer, which increases the cost of production per cell. On the other hand, it increases the size of the cell, and therefore that of the atomic sensor that integrates it. The cell also suffers from a greater heat dissipation (larger radiant surface). Moreover, the use of a per-cell dispenser imposes a significant fixed cost for each cell. The amount of cesium released during activation by heating is also difficult to control. The amount of alkali metal can thus vary significantly between cells from the same batch. The cesium condensation may then be excessive and obstruct the optical window, or conversely, the amount of cesium may be insufficient to ensure a satisfactory life. In addition, one study indicated that the dispenser could cause variations in the atmosphere and compromise the performance of the clock that integrates it ("Aging Study on Micro-Fabricated Cs Buffer-Gas Cell for Atomic Clock Applications." Abdullah, Salman et al., published in 2014 in the European Frequency and Time Forum). Finally, since the dispenser is not usually fixed in the cavity, it can hit the walls if the cell is subjected to shocks or vibrations. The particles that make up the dispenser can then disintegrate and obstruct the optical window. One of the objectives of the invention is thus to avoid the presence of a dispenser in the final cell or to prevent interactions between the dispenser and the atmosphere of the optical cavity.
    The buffer buffer in the cell may be one or more atomic or molecular species.
    However, the presence of a buffer atmosphere has the disadvantage of introducing a dependence of the spectroscopic measurement as a function of the temperature of the cell (for example a quadratic dependence of the frequency of the clock transition with the temperature).
    Thus, variations in the temperature of the cell result in variations in the measured spectral quantities and therefore in the measurement of the atomic sensor.
    It is therefore necessary to use a buffer atmosphere for which the thermal dependence induced on the spectral quantities has a point of inversion around the operating temperature of the cell.
    In particular, it is known from the document "Quadratic Dependence on Temperature of Cs 0-0 Hyperfine Resonance Frequency in Single Buffer Gas Microfabricated Vapor Cell. "From Miletic, Danijela et al., Published in 2010 in the journal Electronics Letters vol. 46 a buffer atmosphere composed solely of neon which makes it possible to cancel the thermal dependence of the frequency of the clock transition around 80 ° C.
    Such a buffer atmosphere makes it possible to operate the atomic sensor in a temperature range limited to a few degrees below the operating temperature of the cell, for example up to 70 or 75 ° C for a pure neon buffer atmosphere because the energy constraints usually only allow the cell to be heated without being able to cool it and the associated electronics also dissipate energy in the form of heat.
    To meet current industry standards, however, these systems must be able to operate in a range of -40 ° C to +85 ° C, see beyond for certain applications.
    Buffer atmospheres composed of nitrogen and argon are also known which make it possible, by adjusting the partial pressures of the mixture, to obtain a variable inversion point up to 120 ° C. as described in the document "RF- Interrogated End-State Chip-Scale Atomic Clock. Braun, Alan M et al., Published in 2007 in the 39th Annual Specified Time and Time Interval Meeting. The use of dinitrogen with a dispenser, however, has disadvantages because the dinitrogen is absorbed by the dispenser. Other buffer atmospheres composed of rare gases, which do not react with the dispenser, have also been studied but have drawbacks. Thus, these blends are difficult to stably contain, impose unfavorable spectral broadening and are generally less favorable than dinitrogen to mitigate the effect of "radiation trapping" which reduces signal quality and sensor performance.
    Another object of the invention is thus notably to allow the use, in a steam cell, of a buffer gas diversity without the operation or manufacture of the steam cell having the drawbacks detailed above.
    Finally, during the anodic welding process, molecules composed of oxygen can be generated. Existing processes therefore do not achieve vacuum levels below 1 CT4 mbar, which are necessary for applications such as magneto-optical trapping of atoms or ion trapping.
    Yet another object of the invention is in particular to improve the quality of the vacuum compared to what is usually obtained during anodic welding. The invention thus has as its first object a gas cell, intended in particular to be included in an atomic sensor such as an atomic clock, an atomic magnetometer or an atomic gyrometer, being associated on the one hand with at least one laser for transmitting an incoming external laser beam impacting the cell and, secondly, for a photodetector for receiving an external laser beam leaving the cell, the laser beam having penetrated the cell, the cell comprising a cavity provided with at least one optical window and adapted to be filled with a gas.
    The cell is characterized in that it further comprises: a sealing bowl comprising a cavity mouth adapted to allow a passage of gas between the sealing bowl and the optical cavity; a channel mouth designed to allow an inlet. gas in the sealing bowl through a gas supply channel, and o a sealing port, and - a membrane sealingly sealing the sealing port of the sealing bowl, and in that the membrane is adapted to be plastically deformed by heating to hermetically seal at least one of the cavity mouth and the channel mouth so as to hermetically separate the optical cavity from the gas inlet channel.
    According to one embodiment, the cell further comprises a heating device in contact with the membrane, in particular a resistive element able to be traversed by an electric current or a layer of an absorbent material for at least one light wavelength which is not substantially absorbed by the membrane.
    According to one embodiment, the cell comprises a multilayer assembly comprising, on the one hand, a wafer or conformable wafer shaped hollow to present a recess opening into at least one opening, said recess being able to be filled with a gas, and, on the other hand, at least one glass wafer or wafer sealingly closing said opening of the recess to form the optical cavity provided with at least one optical window, wafer or glass wafer and the wafer. - or wafer - shaped recessed being arranged opposite one another and sealed to one another, in particular by anodic welding.
    In one embodiment, the membrane is a portion of the glass wafer, and in particular the optical window and the membrane are formed by two portions spaced apart from one another by wafer - glass.
    In one embodiment, the wafer - or wafer --conformable is recessed to present a second recess, forming the sealing bowl, and opening into at least a second opening, forming the sealing port.
    According to one embodiment, the sealing bowl and the membrane are formed in the glass wafer, in particular the glass wafer or wafer comprises at least a first glass underlayer and a second underlayer made of glass. glass superimposed and secured, the sealing cup being formed in the first underlayer of glass, the membrane being formed in the second underlayer of glass.
    According to one embodiment, the gas inlet channel is formed in at least one of the wafer - or wafer --conformable and the wafer - or wafer - glass, so as to pass through substantially all of a thickness of said wafer, or wafer, substantially perpendicular to an extension plane of said wafer or wafer.
    In one embodiment, the membrane is glass, and in particular is a thin portion of a wafer - or wafer - glass.
    According to one embodiment, the sealing bowl comprises a sealing zone surrounding the channel mouth, substantially flat and parallel to the undeformed membrane, and designed to form a hermetic contact with the membrane deformed plastically by heating so as to separate tightly. the optical cavity of the gas inlet channel.
    In one embodiment, a distance between the plastically undeformed membrane and the sealing zone - measured perpendicularly to said plastically undeformed membrane and said sealing zone - is less than one hundred microns.
    In one embodiment, a diameter of the sealing area of the sealing bowl is greater than three times the distance between the plastically undeformed membrane and the sealing area.
    In one embodiment, a thickness of the membrane is less than 500 microns, preferably less than 100 microns.
    According to one embodiment, the cell comprises a source of a gas connected to the gas supply channel and adapted to fill the optical cavity with a gas via the gas inlet channel and the sealing bowl, at the means of the mouth of the cavity and the mouth of the canal.
    In one embodiment, the source comprises a source cavity connected to the gas supply channel and an alkali metal dispenser received in the source cavity and adapted to generate an alkaline vapor by heating.
    According to one embodiment, the cell comprises, in addition to the optical cavity, an additional cavity filled with an additional gas, adjacent to and separated from the optical cavity by a wall designed to be pierced and allowing a mixing of said additional gas with a gas contained in the optical cavity.
    According to one embodiment, the wall of the additional cavity is able to be pierced by an action without exogenous contact with the cell 2, in particular by interaction with the wall of a pulsed laser beam, a continuous laser beam or a laser beam. shock.
    In one embodiment, the optical cavity is filled with a gas, and the membrane is in a plastically deformed state in which the membrane hermetically closes at least one of the cavity mouth and the channel mouth, by hermetically separating the optical cavity of the gas inlet channel. The subject of the invention is also a set of cells comprising a plurality of cells as described above, the gas supply channels of which are connected to a single source of gas, in particular in which said plurality of cells forms a integral and rigid assembly adapted to be cut so as to separate the cells from each other. The subject of the invention is also a process for filling gas with a cell, in which: a cell as described above or a set of cells as described above is available; there is a source of a gas connected to the gas inlet channel of the cell or of the set of cells, the optical cavity is filled with the gas from the source via the arrival channel. of gas and the sealing bowl, by means of the mouth of the cavity and the mouth of the channel, and the plastic is deformed by heating the membrane to seal at least one of the mouth of the cavity and the channel mouth, so as to hermetically separate the optical cavity of the gas inlet channel.
    In one embodiment, the membrane is deformed by heating by means of a laser directed on the membrane.
    In one embodiment, the membrane is plastically deformed by heating by circulating an electric current in a resistive element in contact with the membrane.
    In one embodiment, the source is an alkali metal dispenser received in a source cavity connected to the gas inlet channel of the cell or set of cells, and the optical cavity is filled by heating said dispenser.
    In one embodiment, after plastically deforming the membrane to hermetically separate the optical cavity from the gas inlet channel, the cell is separated from the gas source.
    According to one embodiment, after having plastically deformed the membrane to hermetically separate the optical cavity from the gas inlet channel, a wall separating from the optical cavity is pierced by an additional cavity filled with an additional gas, so as to mix said additional gas. with a gas contained in the optical cavity. The subject of the invention is also a method of placing a cell under vacuum, in which: a cell as described above or a set of cells as described above is available; has a pumping station connected to the gas supply channel of the cell or of the set of cells, - the pumping station is actuated to suck a gas contained in the optical cavity via the channel of gas inlet and sealing bowl, by means of the cavity mouth and the mouth of the channel, and - plastically deformed by heating the membrane to seal at least one of the cavity mouth and the channel mouth, so as to hermetically separate the optical cavity from the gas inlet channel. The subject of the invention is also a process for the manufacture of a cell as described above, in which - a wafer - or wafer --conformable and at least one wafer - or wafer - is available in glass, - the wafer - or wafer -conformable recessed, in particular it is engraved, to form a recess opening into at least one opening, - conforms at least one of the wafer or wafer - conformable and the glass wafer or wafer, in particular it is engraved, so as to form a gas supply channel and a sealing bowl comprising a cavity mouth adapted to allow a passage of gas between the sealing bowl and the optical cavity, o a channel mouth designed to allow a gas inlet into the sealing bowl through the gas inlet channel, and o a sealing access, - a multilayer assembly comprising the wafer - or wafer - conformable and said at least at least s a plate - or wafer - made of glass so that the opening of the recess is closed hermetically to form an optical cavity provided with at least one optical window and able to be filled with a gas, and where it is closed hermetically sealing the sealing port with a plastically deformable membrane to seal at least one of the cavity mouth and the channel mouth so as to hermetically separate the optical cavity from the channel; arrival of gas. Finally, the subject of the invention is an atomic sensor comprising a cell as described above, associated, in a compact manner, on the one hand with a laser emitting an incoming external laser beam impacting the cell and, d on the other hand, to a photodetector receiving an external laser beam coming out of the cell.
    In the drawings: FIG. 1 is a perspective and sectional diagram of an atomic sensor according to an embodiment of the invention, comprising a gas cell according to one embodiment of the invention, to which a laser for emitting an incoming laser beam impacting the cell and a photodetector for receiving an external laser beam leaving the cell, FIGS. 2A to 2F illustrate the successive steps of a method for producing a cell such that that shown in Figure 1 in cross-section for Figures 2A to 2E and a top view for Figure 2F; FIGS. 2A to 2C illustrate more particularly the conformation of a wafer - or wafer --conformable, FIG. 2D, the assembly of the wafer - wafer - conformable wafer - or glass wafer - wafer to form a multilayer assembly and the cell itself, FIG. 2E the sealing of the cell after gas filling by deformation of the membrane and FIG. 2F illustrates a top view of the cell of FIG. 2E, FIGS. 3A to 3C illustrate the successive stages of FIG. a method of filling gas with a cell such as that shown in Figures 1 and 2A to 2E; FIG. 3A illustrates more particularly the filling of gas of the optical cavity, FIG. 3B the sealing of the cell after filling by deformation of the membrane and FIG. 3C the separation of the cell from the source of alkali metal, FIG. 3D illustrates a top view of the cell of Figure 3B, Figure 3E shows a top view of a set of cells having a plurality of cells such as that of Figures 3A to 3D, Figures 4A to 41 illustrate the steps successive embodiments of a method for producing a cell according to a second embodiment of the invention in which the sealing bowl and the membrane are defined in the wafer - or wafer - of glass, in a cross-section for FIGS. 4A at 4H and a view from above for Figure 41; FIGS. 4A to 4F more specifically illustrate the definition of the sealing bowl and the membrane in the first glass underlayer and second glass underlayer of a wafer - or wafer - in glass, FIG. 4G, FIG. assembly of a wafer - or wafer - conformable and wafer - or wafer - glass to form a multilayer assembly and make the actual cell, Figure 4H the sealing of the cell after filling gas by deformation of the membrane and FIG. 41 illustrates a view from above of the cell of FIG. 4H, FIG. 5A illustrates a sectional view of an alternative embodiment of a cell according to the embodiment of FIGS. 4A to 41, in which the cavity 5B illustrates a top view of a set of cells comprising a plurality of cells such as that of FIG. 5A, FIG. 6 illustrates a sectional view of a variant of embodiment of FIG. n of a cell according to the embodiment of Figures 1 and 2A to 2E, wherein the membrane is a thinned portion of a wafer - or wafer - glass,
    FIGS. 7A to 7C illustrate the successive steps of a gas filling process of a cell according to an alternative embodiment of a cell such as that of FIGS. 1 and 2A to 2E, in which the cell comprises an additional cavity filled with additional gas, Figure 7A illustrates more particularly the filling of gas of the optical cavity, Figure 7B the sealing of the cell after filling by deformation of the membrane and Figure 7C the drilling of the wall separating the additional cavity of the optical cavity for mixing the additional gas and the gas of the optical cavity, FIG. 7D illustrates a top view of a set of cells comprising a plurality of cells such as that of FIGS. 7A to 7C,
    FIGS. 8A to 8C illustrate the successive steps of a method of vacuuming a cell according to one embodiment of the invention; FIG. 8A illustrates more particularly the operation of a pumping station for sucking up a gas; contained in the optical cavity, Figure 8B the sealing of the cell after evacuation by deformation of the membrane and Figure 8C the separation of the cell from the pumping station.
    In the different figures, the same references designate identical or similar elements.
    FIG. 1 illustrates an example of an atomic sensor 1 according to the invention incorporating a cell 2.
    The atomic sensor 1 is, for example, a chip-scale atomic clock (CSAC for Chip-Scale Atomic Clock) based on the principle of coherent population trapping atomic resonance (CPT for Coherent Population Trapping). The atomic sensor 1 comprises an alkaline vapor (cesium) cell 2 to which are associated, on the one hand, a laser 3 for emitting an incoming external laser beam impacting the cell 2, for example a vertical cavity laser ( VCSEL for Vertical Cavity Surface Emitting Laser) and, on the other hand, a photodetector 4 for receiving an external laser beam coming out of the cell 2. The laser beam is referred to as 5.
    The cell 2 firstly comprises an optical cavity 11 which is provided with at least one optical window 9 and is capable of being filled with a gas.
    The gas comprises, for example, an alkaline vapor such as cesium or rubidium and, where appropriate, a buffer gas. To this end, the cell 2 comprises on the one hand a multilayer assembly 6 which takes for example the form of a housing 6. This multilayer assembly 6 includes, firstly, a wafer - or wafer - 7, called "wafer - or wafer - 7 conformable "or" wafer - or wafer - 7 recessed ", depending on whether it is considered to be in the original unconformed state or in the conformed state, since it is ultimately shaped into hollow as it is exposed.
    The plate - or wafer - 7 extends along an extension plane H between a first face 7a and a second face 7b, opposite to each other and substantially parallel to the extension plane H.
    As illustrated by FIGS. 2A to 2C, the plate - or wafer - 7 is recessed to have a recess 25 on at least one of its faces 7a, 7b, opening into at least one opening 25a, on at least one side. one of its faces 7a, 7b. The recess 25 is understood relative to a front base plane S the wafer - or wafer - 7, on which is applied the wafer - or wafer - glass 8, for example to the first face 7a.
    To form the recess 25, the wafer - or wafer - 7 conformable may be etched, in particular etched by the opening 25a of the recess 25. The recess 25 may for example be formed by deep reactive ion etching or by humic etching anisotropic KOH. The recess 25 is adapted to be filled with a gas to form a portion of the optical cavity 11. The multilayer assembly 6 includes, secondly, at least one plate - or wafer - made of glass 8 which is formed of a single wafer or several superimposed wafers as will be detailed later.
    The wafer - or wafer - 8 glass is arranged to seal the opening 25a of the recess 25 so as to form, with said recess 25, the optical cavity 11 provided with at least one optical window. For this purpose, the plate - or wafer - shaped recessed 7 and the wafer - or wafer - glass 8 are arranged opposite one another, against each other.
    The wafer or glass wafer 8 extends for example also according to an extension plane H between a first face 8a and a second face 8b, opposite to one another and substantially parallel to the extension plane H .
    A face 8a, 8b of the plate - or wafer - made of glass 8 is thus disposed facing and in contact with a face 7a, 7b of the wafer - or wafer - 7.
    The plates 7, 8 are sealed to each other in a fixed and sealed manner, in particular by anodic welding between their facing faces. The multilayer assembly 6 (and therefore by extension the cell 2) may have a parallelepipedal or cylindrical outer shape or another shape. It is generally flattened and compact with a volume that can be a few mm3 or a few tens of mm3. It has an extension plane H, and two perpendicular transverse planes, namely a first transverse plane which is the plane of Figures 2A to 2E (and the median plane of the optical cavity 11) and a second perpendicular transverse median plane.
    The cell 2 thus comprises at least one optical window 9 formed by a portion of the wafer - or wafer - made of glass 8.
    The cell 2 may also comprise a second optical window 10 which may be arranged on the same side of the cell 2 as the optical window 9, the two optical windows being for example formed by two portions spaced from each other of the wafer - or wafer - in glass 8.
    Alternatively, the second optical window 10 may be arranged on one side of the cell 2 opposite to the side of the optical window 9, the two optical windows being formed by two separate wafer-wafers 8 placed on faces 7a. , 7b respectively opposed to the wafer - or wafer - shaped recessed 7.
    The cell 2 further comprises a sealing bowl 13.
    The sealing bowl 13 is provided with a cavity mouth 14, a channel mouth 15 and a sealing port 16. The cavity mouth 14 is adapted to allow a passage of gas between the sealing bowl. 13 and the optical cavity 11. The channel mouth 15 is designed to allow gas to enter the sealing bowl 13 via a gas inlet channel 17.
    Finally, the sealing port 16 is sealed by a membrane 18 shown in FIG. 2D.
    The membrane 18 is adapted to be plastically deformed by heating to seal at least one of the cavity mouth 14 and the channel mouth 15, so as to hermetically separate the optical cavity 11 from the inlet channel of the gas 17.
    The membrane 18 may in particular be made of glass so that it can be plastically deformed in an easy manner and to seal gas to at least one of the cavity mouth 14 and the channel mouth 15.
    Specifically, the membrane 18 is adapted to be placed, in the first place, in an initial state - or non-deformed - illustrated in Figures 2D, 3A, 4G, 7A and 8A.
    In this initial state, the membrane 18 is substantially flat and does not obstruct the cavity mouth 14 or the channel mouth 15. In this state of the membrane 18, there is therefore a communication between the optical cavity 11 and the gas supply channel 17 via the sealing bowl 13.
    It is thus possible to fill the optical cavity 11 with a gas supplied through the gas inlet channel 17 and the sealing bowl, by means of the cavity mouth and the channel mouth.
    For example, a source cavity 19 can be connected to the gas supply channel 17.
    Such a source cavity 19 may receive an alkali metal source, such as cesium or rubidium, in various forms.
    The alkali metal source may be pure alkali metal in solid or liquid state.
    The alkali metal source may be a chemical compound comprising alkaline atoms, subsequently released by a thermal or radiative post-treatment.
    The alkali metal source may be an alkali metal distributor 19a, such as cesium or rubidium, the alkaline vapor being generated by heating the dispenser 19a, in particular after sealing the cell 2 and before plastic deformation of the membrane 18.
    The source cavity 19 may be formed in the wafer - or wafer - conformable 7, for example by recess forming the wafer - or wafer - conformable 7 to present a recess in a manner similar to that described above concerning the cavity 11. The wafer - or wafer - 7 conformable can thus be etched by ion etching and / or chemical.
    The source cavity 19 can thus be adjacent to the optical cavity 11, and connected to said optical cavity 11 by the gas inlet channel 17 and the sealing bowl 13.
    Such a source cavity 19 can also be filled with gas, and connected to the gas supply channel 17.
    Such a source cavity 19 can also be connected to an exogenous source of gas or alkali metal in cell 2 or in the multilayer assembly 6.
    As illustrated in FIGS. 3E, 5B, 7D, a plurality of cells 2 can be arranged so that the gas inlet channels 17 of the cells 2 are connected to a single source cavity 19.
    Such a plurality of cells 2 can then form a set of cells.
    Such a set of cells may in particular be a single and rigid set. The gas inlet channels 17 of the cells 2 can be connected to a common gas inlet channel 21 of the assembly 20. The common gas inlet channel 21 can be connected to a source cavity 19 as detailed above for a single cell 2.
    For example, the cells 2 of the assembly 20 may be manufactured from a single multilayer assembly 6. The assembly 20 may thus comprise a wafer - or wafer - 7 conformable and at least one wafer - or wafer - in 8 such that the vapor optic cells 2 of the assembly 20 share said conformable wafer - wafer - 7 and said at least one wafer - or glass wafer 8. The cell assembly may also include cutting portions 22 between the cells 2 of the assembly 20, capable of being cut to allow the cells 2 to be separated from the assembly 20 after manufacture and filling of gas.
    The cells 2 of the assembly 20 can thus be sealed individually and the amount of cesium in each cell 2 can be controlled. This reduces the size and cost of manufacturing cells and can improve the performance of the clock or sensor.
    Furthermore, the membrane 18 is adapted to be placed, secondly, in a deformed state, more particularly a plastically deformed state by heating. This deformed state of the membrane 18 is illustrated in FIGS. 1, 2E, 3B, 3C, 4H, 5A, 6, 7B, 7C, 8B and 8C.
    In this deformed state, the membrane 18 hermetically closes at least one of the cavity mouth 14 and the channel mouth 15. In this way, the membrane 18 hermetically separates the optical cavity 11 from the inlet channel of the gas 17.
    In this deformed state of the membrane 18, the optical cavity 11 is isolated from the gas inlet channel 17 and more particularly isolated from the outside of the cell 2.
    Thus, during a gas filling process according to the invention, once the optical cavity 11 is filled with gas via the gas inlet channel 17, the membrane 18 is plastically deformed by heating. hermetically sealing at least one of the cavity mouth 14 and the channel mouth 15 so as to hermetically separate the optical cavity 11 from the gas inlet channel 17.
    In one embodiment of the invention, the membrane 18 can be plastically deformed by heating by means of a laser directed on the membrane 18.
    For this, the material of the membrane 18 may be such that it absorbs at least one wavelength of the light to be heated by said laser directed on the membrane 18.
    Alternatively, the membrane 18 may be provided with a heating device 23 for heating and plastically deforming the membrane 18.
    The heating device 23 may be disposed on an outer face 18a of the membrane 18, opposite to an inner face 18b of the membrane 18 obstructing the sealing access 16 of the sealing bowl 13.
    In one embodiment, the heating device 23 may be a layer 23 of an absorbent material for at least one light wavelength that is not substantially absorbed by the membrane 18 so as to locally concentrate energy in order to local warming of the membrane.
    By "not substantially absorbed by the membrane", it is meant that the absorption of light at said light wavelength, by the membrane 18, is not sufficient to plastically deform the membrane 18 by heating without the need for a laser. a crippling power to do this.
    In this way, a laser directed on the membrane 18 can plastically deform the membrane 18 by heating.
    In another embodiment of the invention, the membrane 18 can be plastically deformed by Joule heating.
    For this, the heating device 23 in contact with the membrane 18 may be a resistive element 23 adapted to be traversed by an electric current to heat the membrane 18 by Joules effect.
    Said resistive element 23 may for example be a layer of a resistive material.
    The deformation of the membrane 18 may also involve a pressure difference between the outside and the inside of the sealing bowl.
    Thus, the membrane 18 can be deformed under the joint action of a heating and a pressure difference between the outside and the inside of the sealing bowl, that is to say between the outer face 18a and the inner face 18b of the membrane 18.
    In this way, it is possible to ensure a deformation of the membrane 18 towards the inside of the sealing bowl 13.
    The sealing cup 13 and the diaphragm 18 can be made in different ways which will now be further detailed.
    Referring to FIGS. 2A to 2E, 3A to 3C, 6, 7A to 7C and 8A to 8C, the sealing cup 13 may be formed in the wafer - or wafer - conformable 7.
    More specifically, the wafer - or wafer --conformable 7 may be recessed to present a second recess 26 opening on at least a second opening 26a. The second recess 26 can then form the sealing bowl 13, and the second opening 26a form the sealing port 16 of the sealing bowl 13.
    To form the second recess 26, the wafer - or wafer - 7 conformable can be etched, for example by ion etching and / or chemical etching, in particular by etching by the second opening 26a of the second recess 26.
    In one embodiment of the invention, the recess 25 forming a portion of the optical cavity 11 and the second recess 26 are etched on the same face of the wafer - or wafer - 7 conformable, for example the first face 7a .
    In this embodiment, the cavity mouth 14 may be formed by covering the recess 25 and the second recess 26 on the first face 7a of the wafer - or wafer - 7 conformable.
    In another embodiment, the recess 25 forming a portion of the optical cavity 11 and the second recess 26 may be respectively etched on opposite sides of the wafer - or wafer - 7 conformable respectively on the first face 7a and on the second side 7b.
    In this embodiment, the cavity mouth 14 may be formed by a connecting channel, defined in the wafer - or wafer - 7 conformable, and connecting the recess 25 forming a portion of the optical cavity 11 and the second recess 26. Said connecting channel may in particular be defined by hollow conformation, for example by etching.
    In a last embodiment, the recess 25 forming a portion of the optical cavity 11 may be through and open on the two opposite faces 7a, 7b opposite the wafer - or wafer - 7 conformable.
    In this embodiment, the cavity mouth 14 may then be formed by covering the recess 25 and the second recess 26 on one of the faces 7a, 7b of the wafer - or wafer - 7 conformable.
    Furthermore, the gas inlet channel 17 can also be defined in the wafer - or wafer - 7 conformable, in particular by etching from the sealing bowl 13.
    The gas inlet channel 17 can lead on the one hand to the location of the channel mouth 15 of the sealing bowl 13 and on the other hand to at least one second channel mouth 24, for example located at near the source cavity 19.
    In one embodiment of the invention illustrated in FIGS. 1, 2A to 2E, 3A to 3C, 6, 7A to 7C and 8A to 8C, the gas inlet channel 17 is formed in the wafer - or wafer - conformable 7 so as to pass through substantially the entire thickness of said wafer - or wafer --conformable 7, substantially perpendicular to the extension plane H of said wafer - or wafer - conformable 7.
    The gas inlet channel 17 formed in the wafer - or wafer - conformable 7 may also have bends or conformations appropriate to reach the source 19.
    The sealing bowl 13 is illustrated in particular in FIGS. 2D, 2E and 2F and may comprise a sealing zone 28 substantially flat and parallel to the membrane 18 in the undeformed state.
    The sealing zone 28 surrounds the channel mouth 15 and is adapted to form a gastight contact with the membrane 18 in the deformed state.
    In a particular embodiment of the invention, the channel mouth 15 and the sealing zone 28 are substantially circular or coronal and concentric and form a bottom of the sealing bowl 13 shaped recessed in the wafer - or wafer - 7 conformable.
    A distance between the membrane 18, in the plastically undeformed state and the sealing zone 28 - taken perpendicularly to said membrane 18 in the non-deformed state and said sealing zone 28 - may in particular be less than a hundred percent. microns, preferably less than a few tens of microns.
    In this way, the diaphragm 18 in the deformed state can easily seal the channel mouth 15 so as to hermetically separate the optical cavity 11 from the gas inlet channel 17.
    More specifically, the sealing bowl 13 may be of substantially cylindrical shape and may for example have a diameter of a few tens of microns or a few hundred microns and preferably greater than three times said distance between the membrane 18, in the non-state. - plastically deformed and the sealing zone 28.
    A diameter of the sealing zone 28 may thus be greater than a few tens of microns, for example greater than a hundred microns.
    In an embodiment illustrated in FIGS. 4A to 41, 5A to 5B, the membrane 18 may consist of a portion of the wafer - or wafer - made of glass 8.
    In particular, in this embodiment, the optical window 9 and the membrane 18 may be formed by two portions spaced from one another of a single wafer - or wafer - made of glass 8.
    Alternatively, the membrane 18 may be constituted by a portion of a second wafer - or wafer - glass 8. The two wafers - or wafer - 8 separate glass can then be respectively respectively placed on the faces 7a, 7b respectively opposite of the plate - or wafer - shaped hollow 7.
    In the variant embodiment of the invention, illustrated in particular in FIGS. 4A to 41, 5A and 5B, the sealing bowl 13 and the membrane 18 may both be formed in the wafer - or wafer - of glass 8.
    In this way, the sealing bowl 13 and the membrane 18 may in particular be placed above the optical cavity 11, that is to say at the location of the opening 25a of the recess 25, as illustrated. in Figure 5A.
    This makes it possible to further reduce the size of the cell 2.
    Specifically, the wafer - or wafer - glass 8 may then comprise at least a first glass sub-layer 27a and a second glass sub-layer 27b.
    The first glass sub-layer 27a and the second glass sub-layer 27b can be superimposed and joined so as to be sealed to one another in a fixed and sealed manner, in particular by direct welding between their faces. opposite. For the welding of the two glass substrates, it is thus possible to apply a large force while heating, and it is not necessary to implement an electric discharge. The sealing cup 13 may then be formed in the first glass underlayer 27a in a manner similar to that described above with respect to the wafer - or wafer - 7 conformable.
    Thus, the first glass sub-layer 27a may be recessed to present the second recess 26 opening at at least a second opening 26a. The second recess 26 can then form the sealing bowl 13, and the second opening 26a form the sealing port 16 of the sealing bowl 13.
    In this embodiment, the cavity mouth 14 may be a channel passing through the first glass sub-layer 27a, to open opposite the optical cavity 11 and in particular at the location of the opening 25a of the recess. 25 forming a portion of the optical cavity 11.
    The gas inlet channel 17 may further be defined, at least in part, in the first glass underlayer 27a in a manner similar to that described above with respect to the wafer - or wafer - 7 conformable.
    The sealing cup 13 and / or the gas inlet channel 17 defined in the first glass sub-layer 27a may furthermore have the same characteristics and dimensions as the sealing cup 13 and / or the inlet channel of the gas 17 defined in the wafer - or wafer - 7 conformable described above.
    To form the second recess 26, the first glass sub-layer 27a can thus be etched, for example by ion etching and / or chemical etching, in particular by etching by the second opening 26a of the second recess 26.
    The membrane 18 can then be formed in the second glass sub-layer 27b in a manner similar to that described above in relation to the wafer or wafer 8.
    Thus, the membrane 18 may then be constituted by a portion of the second glass sub-layer 27b.
    In this embodiment, the plastically deformed membrane 18 can hermetically close the cavity mouth 14 to hermetically separate the optical cavity 11 from the gas inlet channel 17.
    To facilitate the deformation of the membrane 18, the membrane 18 may in particular be a thinned portion of a wafer - or wafer - glass 8, as shown in Figure 6.
    By "a thinned portion of a wafer - or glass wafer" means a thinned portion of a wafer - or wafer - made entirely of glass 8 or a thinned portion of the second glass sub-layer 27b of a wafer - or wafer - made of glass 8.
    For example, a thickness of the membrane 18 may be less than a few hundred microns, for example 500 microns, or even less than a hundred microns.
    As is illustrated in Figures 7A to 7D, the cell 2 may further comprise an additional cavity 29 adapted to be filled with an additional gas.
    The additional gas filling the additional cavity 29 may in particular be a buffer gas or a component of the buffer gas as described above. The additional gas may thus be such as to slow the diffusion of the alkaline atoms towards the walls of the cell 2 and to confine said alkaline atoms. The additional gas may also be such that the dependence of the spectral quantities on the temperature induced by the buffer gas has a point of inversion around the operating temperature of the cell 2.
    The additional gas may for example comprise dinitrogen and / or argon.
    The additional cavity 29 is adjacent to the optical cavity 11. More specifically, the additional cavity 29 is separated from the optical cavity 11 by a wall 30 designed to be pierced and allow a mixture of the additional gas with a gas contained in the optical cavity 11 .
    In this way, it is possible to fill the optical cavity 11 with an alkaline gas by means of a dispenser 19a, to hermetically separate the optical cavity 11 of the dispenser 19a by deformation of the membrane 18, and finally to pierce the wall 30 separating the additional cavity 29 from the optical cavity 11 so as to mix said additional gas with a gas contained in the optical cavity 11.
    In this way, it avoids any interaction between the additional gas and the dispenser 19a.
    On the other hand, if an alkali metal source is used in place of a dispenser 19a, for example a barium-based chemical compound such as a mixture of cesium chloride and barium azide, the reabsorption of the the optical cavity 11 by the barium is also prevented.
    If the alkali metal source is cesium azide, the undesirable production of additional dinitrogen in the optical cavity 11 due to the involuntary decomposition of cesium azide is also prevented.
    In this way, it thus avoids more generally any interaction between the additional gas or the gas contained in the optical cavity 11 and the source of alkali metal from the source cavity 19.
    In an exemplary embodiment of the invention, a movable element is housed in the additional cavity 29. The movable element is adapted to be displaced by an external action, for example by a magnetic force, to pierce the wall 30 of the additional cavity 29.
    In another embodiment of the invention, the wall 30 of the additional cavity 29 is able to be pierced by an action without exogenous contact with the cell 2, in particular by an interaction with the wall 29 of a pulsed laser beam, of a continuous laser beam or an electric discharge.
    The wall 30 may be angularly structured and / or include indentations so as to promote piercing or breaking.
    Moreover, during the drilling of the wall, the volume occupied by the additional gas and the gas of the optical cavity 11 increases and their respective partial pressures decrease.
    For a given target pressure, the additional gas pressure to be established in the additional cavity 29 is therefore greater than this target pressure and depends on the volume of the cavities 29 and 11. This offers the possibility of carrying out the anodic welding between the platelets - or wafer - of the multilayer assembly 6 at a pressure greater than the target pressure (typically 10 kPa), which advantageously increases the applicable voltage without creating an electric discharge through the gas.
    By varying the volume of the additional cavity 29 between different cells 2, it is possible to obtain cells 2 of different pressures on the same substrate, especially in the same set of cells.
    This is useful for correcting pressure inhomogeneity due, for example, to temperature gradients during anodic bonding and increasing production efficiency. It is also possible to quickly perform optimization tests.
    Furthermore, by sealing the additional cavities 29 with an additional gas different from the source gas supplied by the source 19, a mixture of the two gases is obtained after drilling the wall 30. By varying the ratios of the volumes of the cavities 29, 11 between cells 2 of the same substrate, especially the same set of cells, buffer atmospheres having different partial pressure ratios can be produced at one time. In the case where variations in the ratio of the partial pressures of the additional gas and the source gas are observed on the same substrate, it is thus possible to compensate for them to increase the production yield.
    This solution is also of interest for determining the optimum composition of a buffer atmosphere.
    Moreover, the walls of the optical cavity 11 may be covered with an anti-relaxing coating. Such an anti-relaxing coating is designed to limit the loss of coherence induced by the collisions of the atoms with the walls of the optical cavity 11.
    Some anti-relaxant coatings do not withstand the high temperature of the anodic solder.
    According to the present invention, such an anti-relaxing coating can then be introduced into the cell 2 by the gas inlet channel 17 and the sealing bowl 13, and in particular after the anodic welding steps. The membrane 18 is then plastically deformed after the introduction of the anti-relaxing coating to seal the cell 2 without damaging the anti-relaxing coating.
    Finally, in an alternative embodiment of the invention, the gas inlet channel 17 of the cell 2 can be connected to a pumping station 31 able to suck a gas contained in the optical cavity 11.
    A method of evacuating a cell 2 may thus comprise the operation of the pumping station 31 for sucking up a gas contained in the optical cavity 11.
    After the operation of said pumping station 31 has made it possible to reach, in the optical cavity 11, a vacuum deemed sufficient, the gas inlet channel 17 can then be separated from the optical cavity 11 by deformation of the membrane. 18.
    "Vacuum" means a pressure lower than atmospheric pressure and advantageously less than 1 CT4 mbar.
    The pumping station 31 may in particular be actuated after the anodic welding steps.
    In this way, it is possible to achieve the necessary conditions for the magneto-optical trapping of atoms or the trapping of ions.
    权利要求:
    Claims (27)
    [1" id="c-fr-0001]
    A gas cell (2) intended in particular to be included in an atomic sensor (1) such as an atomic clock, an atomic magnetometer or an atomic gyrometer, being associated on the one hand with at least one laser ( 3) of emission of an incoming external laser beam (5) impacting the cell and, on the other hand, to a reception photodetector (4) of an external laser beam coming out of the cell, the laser beam having penetrated the cell, the cell comprising an optical cavity (11) provided with at least one optical window (9) and adapted to be filled with a gas, the cell being characterized in that it further comprises - a sealing bowl ( 13) comprising a cavity mouth (14) adapted to allow a passage of gas between the sealing bowl (13) and the optical cavity (11), o a channel mouth (15) designed to allow a gas inlet to the sealing bowl (13) by a gas inlet channel (17), and o access of cell (16), and - a membrane (18) sealing the sealing port of the sealing bowl, and in that the membrane (18) is plastically deformable by heating to seal at least the one of the cavity mouth (14) and the channel mouth (15), so as to hermetically separate the optical cavity (11) from the gas inlet channel (17).
    [2" id="c-fr-0002]
    2. Cell according to claim 1, further comprising a heating device (23) in contact with the membrane (18), in particular a resistive element capable of being traversed by an electric current or a layer of an absorbent material for at least a light wavelength that is not substantially absorbed by the membrane.
    [3" id="c-fr-0003]
    3. Cell according to any one of claims 1 and 2, comprising a multilayer assembly (6) comprising, on the one hand, a wafer - or wafer - conformable (7) shaped recessed to have a recess (25) opening into at least one opening (25a), said recess being adapted to be filled with a gas, and, secondly, at least one wafer - or wafer - made of glass (8) hermetically sealing said opening (25a) of the recess (25) for forming the optical cavity (11) provided with at least one optical window (9), the wafer - or wafer - of glass (8) and the wafer - or wafer - shaped (7) recessed being arranged facing each other and sealed to each other, in particular by anodic welding.
    [4" id="c-fr-0004]
    4. Cell according to claim 3, wherein the membrane (18) is a portion of the wafer - or wafer - glass (8), and in particular in which the optical window (9) and the membrane (18) are formed by two portions apart from one another of a single plate - or wafer - glass (8).
    [5" id="c-fr-0005]
    5. Cell according to any one of claims 3 and 4, wherein the wafer - or wafer - conformable (7) is recessed to present a second recess (26), forming the sealing bowl (13), and opening in at least a second opening (26a) forming the sealing port (16).
    [6" id="c-fr-0006]
    6. Cell according to any one of claims 3 and 4, wherein the sealing bowl (13) and the membrane (18) are formed in the wafer - or wafer - glass (8), in particular in which the wafer - or wafer - glass comprises at least a first glass sub-layer (27a) and a second glass sublayer (27b) superimposed and secured, the sealing cup (13) being formed in the first underlayer in glass, the membrane (18) being formed in the second glass sub-layer.
    [7" id="c-fr-0007]
    7. Cell according to any one of claims 3 to 6, wherein the gas inlet channel (17) is formed in at least one of the wafer - or wafer - conformable (7) and the wafer - or glass wafer (8), so as to pass substantially through a whole thickness of said wafer or wafer, substantially perpendicular to an extension plane of said wafer.
    [8" id="c-fr-0008]
    8. Cell according to any one of claims 1 to 7, wherein the membrane (18) is glass, and in particular is a thin portion of a wafer - or wafer - glass (8).
    [9" id="c-fr-0009]
    9. Cell according to any one of claims 1 to 8, wherein the sealing bowl (13) comprises a sealing zone (28) surrounding the channel mouth (15), substantially flat and parallel to the undistorted membrane. , and adapted to form a sealed contact with the plastically deformed membrane by heating so as to hermetically separate the optical cavity (11) from the gas inlet channel (17).
    [10" id="c-fr-0010]
    The cell of claim 9, wherein a distance between the plastically undeformed membrane (18) and the sealing zone (28) - measured perpendicularly to said plastically undeformed membrane and said sealing zone - is less than one hundred percent. microns.
    [11" id="c-fr-0011]
    A cell according to any of claims 9 and 10, wherein a diameter of the sealing area (28) of the sealing pan (13) is greater than three times said distance between the plastically undeformed membrane (18). and the sealing zone (28).
    [12" id="c-fr-0012]
    12. Cell according to any one of claims 1 to 11, wherein a thickness of the membrane (18) is less than 500 microns, preferably less than 100 microns.
    [13" id="c-fr-0013]
    Cell according to any one of claims 1 to 12, which comprises a source of a gas (19, 19a) connected to the gas inlet channel (17) and adapted to fill the optical cavity (11) with a gas through the gas supply channel (17) and the sealing pan (13) by means of the cavity mouth (14) and the channel mouth (15).
    [14" id="c-fr-0014]
    14. The cell of claim 13, wherein the source comprises a source cavity (19) connected to the gas inlet channel (17) and an alkali metal distributor (19a) received in the source cavity and adapted to generate a vapor alkaline by heating.
    [15" id="c-fr-0015]
    A cell according to any one of claims 1 to 14, which comprises, in addition to the optical cavity (11), an additional cavity (29) filled with an additional gas, adjacent to and separated from the optical cavity (11) by a wall (30) adapted to be pierced and permitting mixing of said additional gas with a gas contained in the optical cavity.
    [16" id="c-fr-0016]
    16. The cell of claim 15, wherein the wall (30) of the additional cavity (29) is able to be pierced by an exogenous non-contact action to the cell (2), in particular by an interaction with the wall of a cell. pulsed laser beam, continuous laser beam or electric shock.
    [17" id="c-fr-0017]
    The cell according to any one of claims 1 to 16, wherein the optical cavity (11) is filled with a gas, and wherein the membrane (18) is in a plastically deformed state in which the membrane (18) hermetically closes at least one of the cavity mouth (14) and the channel mouth (15), hermetically separating the optical cavity (11) from the gas inlet channel (17).
    [18" id="c-fr-0018]
    An array of cells having a plurality of cells according to any one of claims 1 to 17, wherein the gas supply channels (17) are connected to a single gas source (19), particularly wherein said plurality of cells (2) form a set (20) integral and rigid adapted to be cut so as to separate the cells (2) from each other.
    [19" id="c-fr-0019]
    19. A method of filling gas of a cell (2), wherein: - a cell (2) according to one of claims 1 to 17 or of a set of cells (20) according to the claim 18, there is a source (19, 19a) of a gas connected to the gas inlet channel (17) of the cell or the set of cells, the optical cavity (11) is filled in with the gas from the source via the gas supply channel (17) and the sealing pan (13), by means of the cavity mouth (14) and the channel mouth (15). ), and the membrane (18) is plastically deformed by heating to hermetically seal at least one of the cavity mouth (14) and the channel mouth (15) so as to hermetically separate the optical cavity (11) the gas supply channel (17).
    [20" id="c-fr-0020]
    20. The method of filling gas according to claim 19, wherein the membrane (18) is plastically deformed by heating by means of a laser directed on the membrane.
    [21" id="c-fr-0021]
    21. The method of filling gas according to claim 19, wherein the membrane (18) is plastically deformed by heating by circulating an electric current in a resistive element (23) in contact with the membrane.
    [22" id="c-fr-0022]
    22. The method of filling gas according to any one of claims 19 to 21, wherein the source is an alkali metal distributor (19a) received in a source cavity (19) connected to the gas supply channel (17). ) of the cell or set of cells, and wherein the optical cavity (11) is filled by heating said dispenser.
    [23" id="c-fr-0023]
    23. A method of filling gas according to any one of claims 19 to 22, wherein, after plastically deforming the membrane (18) to hermetically separate the optical cavity of the gas inlet channel, the cell is separated ( 2) of the gas source.
    [24" id="c-fr-0024]
    24. The method of filling gas according to any one of claims 19 to 23, wherein, after plastically deforming the membrane (18) to hermetically separate the optical cavity (11) from the gas inlet channel (17). a wall (30) separating from the optical cavity (11) is pierced by an additional cavity (29) filled with an additional gas, so as to mix said additional gas with a gas contained in the optical cavity.
    [25" id="c-fr-0025]
    25. A method of vacuuming a cell, wherein: - a cell (2) according to one of claims 1 to 17 or a set of cells (20) according to claim 18, - there is a pumping station (31) connected to the gas supply channel (17) of the cell or of the set of cells, - the pumping station (31) is actuated to suck a gas contained in the optical cavity (11) via the gas supply channel (17) and the sealing pan (13) by means of the cavity mouth (14) and the channel mouth (15) and plastically deforming the membrane (18) by heating to hermetically seal at least one of the cavity mouth (14) and the channel mouth (15) so as to hermetically separate the optical cavity ( 11) of the gas supply channel (17).
    [26" id="c-fr-0026]
    26. A method of manufacturing a cell according to one of claims 1 to 17 wherein - one has a wafer - or wafer -conformable (7) and at least one wafer - or wafer - glass (8), - the wafer - wafer -conformable, in particular it is engraved in the hollow, to form a recess (25) opening into at least one opening (25a), - conforming at least one of the wafer - or wafer - conformable (7) and wafer - wafer - glass (8), in particular it is engraved, so as to form a gas inlet channel (17) and a sealing bowl (13) having a cavity mouth (14) adapted to allow a passage of gas between the sealing bowl (13) and the optical cavity (11), o a channel mouth (15) adapted to allow gas to enter the bowl sealing means (13) through the gas supply channel (17), and o a sealing port (16), - forming a multilayer assembly (6) comprising the plate head or wafer - conformable (7) and said at least one wafer - or wafer - glass (8) so that the opening (25a) of the recess (25) is sealed to form a cavity optical system (11) provided with at least one optical window (9) and adapted to be filled with a gas, and where the sealing port (16) is sealed with a membrane (18) which can be plastically deformed by heating to hermetically seal at least one of the cavity mouth (14) and the channel mouth (15) so as to hermetically separate the optical cavity (11) from the gas inlet channel (17) .
    [27" id="c-fr-0027]
    27.A atomic sensor (1) comprising a cell (2) according to any one of claims 1 to 17, associated in a compact manner, on the one hand, with a laser (3) for emitting a laser beam ( 5) external entering the cell and on the other hand, a photodetector (4) receiving an external laser beam leaving the cell.
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    同族专利:
    公开号 | 公开日
    FR3038892B1|2017-08-11|
    US10775747B2|2020-09-15|
    US20180210403A1|2018-07-26|
    CN107850870A|2018-03-27|
    CN107850870B|2020-11-17|
    WO2017009582A1|2017-01-19|
    EP3323023A1|2018-05-23|
    JP2018528605A|2018-09-27|
    JP6910340B2|2021-07-28|
    EP3323023B1|2021-11-10|
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    法律状态:
    2016-06-22| PLFP| Fee payment|Year of fee payment: 2 |
    2017-01-20| PLSC| Publication of the preliminary search report|Effective date: 20170120 |
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    申请号 | 申请日 | 专利标题
    FR1556729A|FR3038892B1|2015-07-16|2015-07-16|GAS CELL FOR ATOMIC SENSOR AND METHOD FOR FILLING A GAS CELL|FR1556729A| FR3038892B1|2015-07-16|2015-07-16|GAS CELL FOR ATOMIC SENSOR AND METHOD FOR FILLING A GAS CELL|
    PCT/FR2016/051816| WO2017009582A1|2015-07-16|2016-07-13|Gas cell for an atomic sensor and method for filling a gas cell|
    US15/745,377| US10775747B2|2015-07-16|2016-07-13|Gas cell for an atomic sensor and method for filling a gas cell|
    CN201680046702.0A| CN107850870B|2015-07-16|2016-07-13|Gas cell for atomic sensor and method for filling gas cell|
    JP2018501882A| JP6910340B2|2015-07-16|2016-07-13|Gas cell for atomic sensor and filling method of gas cell|
    EP16750961.1A| EP3323023B1|2015-07-16|2016-07-13|Gas cell for an atomic sensor and method for filling a gas cell|
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