• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The component comprises at least one support (11) on which is fixed at least one electronic circuit (2), for example a circuit of the MMIC type, one or more layers of organic materials (13, 14, 15, 16, 17) stacked on said support (11) according to a printed circuit type technique and forming a pre-existing cavity containing said electronic circuit (2), said cavity being filled with a material of low permeability to water vapor such as LCP (1).
    公开号:FR3035739A1
    申请号:FR1500912
    申请日:2015-04-30
    公开日:2016-11-04
    发明作者:Philippe Kertesz
    申请人:Thales SA；
    IPC主号:
    专利说明:

    [0001] TECHNICAL FIELD The present invention relates to a microwave component that is resistant to moisture. BACKGROUND OF THE INVENTION It also relates to a method of packaging a circuit, especially microwave. The invention is particularly in the field of microwave microelectronic packaging, particularly for producing microwave packages with integrated shielding and resistant to moisture. These boxes are for example used in complex microwave equipment such as airborne radar electronic scanning. More generally, the field of application is that of narrowband or broadband microwave equipment, the boxes being usable in all high frequency applications, even those with high signal integrity specifications. The only moisture-resistant microwave packaging technologies rely on the use of inorganic materials or on the encapsulation of components by injected organic resins. Inorganic solutions include metal hermetic glass bead cases for input / output or ceramics. Solutions using inorganic materials have several disadvantages. We obtain in particular: - expensive and heavy housings, because of the materials used, metal or ceramic; Bulky solutions, in particular using housings with internal cavities, very often with peripheral interconnections; - Solutions whose reliability of report, in the concerned equipment, is generally problematic, because of differences of coefficient of expansion with the printed circuits on which they are assembled.
    [0002] In the case of injected organic packaging, it results in objects which are intrinsically unshielded electrically and which therefore can not be used as such in complex equipment where crosstalk is a critical parameter. The housing usually encountered is the so-called QFN 5 ("Q u ad Flat No-Lead") which has generally peripheral inputs and outputs. There is a need for compact housings meeting the following constraints: Protecting the encapsulated functions from moisture, especially to take into account all MMIC (Microwave Monolithic Integrated Circuit) technologies; Obtain good reliability of the reports; - Maintain the possibility of changing the boxes on the map; - Being able to dissipate calories; 15 - Have a capacity to be able to do 3D, that is to say according to the architectures, even with ultra compact housings, stack microwave functions according to the integration density of the chips used. Microwave applications require the use of III-V semiconductors with high charge mobility. These components operate in analog mode and are therefore very sensitive to the quality of the interconnections they use and the interference they may encounter. In addition, since these operate at significant voltages and currents, the electronic constituents (transistors, capacitors, resistors, etc.) can undergo corrosion phenomena when they are in operation, for example electrochemical corrosion due to a difference in Nernst potential. To avoid any problem of reliability the manufacturers first developed hermetic packages using inorganic materials (metals or ceramics as indicated above) which are heavy and bulky. In order to reduce the mass, volume and cost of manufacturing microwave packagings, plastic cases have begun to be developed with a significant loss of electromagnetic performance but acceptable for narrowband applications such as mobile telephony.
    [0003] 3035739 3 The field of electronic packaging has been the subject of many developments. The BIC (Bail Grid Array) type box has been developed in response to the QFP (Quad Flat Pack) technology with peripheral interconnects to increase the interconnection density. This type of BGA package has experienced a great boom for digital applications based on silicon semiconductors. In the field of organic microwave packaging, many solutions have also been developed. These solutions include Chip Scale Package (CSP) technology for narrowband applications with an operating frequency of less than 2.17 GHz. Plastic housings capable of handling heat dissipation in the range of 60 W to 100 W have also been developed for applications up to 2.17 GHz. There are plastic housings for high frequency applications, up to 35 GHz, in QFN narrow band. Thin Small Outline Package (QFN or TSOP) type plastic housings operate up to 12 GHz. A cavity housing using a thermoplastic material called LCP (Liquid Crystal Polymer) was developed in the late 2000s for high frequency applications. During the same period, the concept of packaging for microwave applications, in LTCC technology (Low Temperature Cofired Ceramic) and in LCP organic materials, was born. The box-type QFP (Quad Flat Pack), cavity, has encapsulation with satisfactory performance, a broadband function. Furthermore, patent applications FR 2 849 346 and FR 2877537 describe a BGA organic packaging cavity technology. As mentioned above, the only moisture-resistant microwave-compatible packaging technologies of all MMICs are based on the use of inorganic materials (glass beakers for ceramic inlets and outlets or ceramic housings), or on Encapsulation of the components by injected organic resins. Solutions based on inorganic materials lead to the use of expensive and heavy housings, and are bulky, in particular due to internal cavities and peripheral interconnections. Solutions based on organic materials have the major disadvantage of not being electrically shielded, and therefore can not be used in complex equipment where crosstalk is a critical parameter without additional partitioning. An object of the invention is in particular to overcome the aforementioned drawbacks, in particular by making it possible to produce housings of electronic components that are compact, economical and able to be shielded. For this purpose, the subject of the invention is an electronic component, comprising at least one support on which at least one electronic circuit is fixed, one or more organic material layers stacked on said support according to a printed circuit type technique and forming a pre-existing cavity containing said electronic circuit, said cavity being filled with a material of low permeability to water vapor, said low vapor permeability material being for example LCP type. In a possible embodiment, the support being metallic and the upper organic layer of the stack being covered with a metal layer, an array of metal elements each connected to said support and to said metal layer is disposed at the periphery of said component to form a Faraday cage including said electronic circuit, said metal elements being for example metallized holes.
    [0004] Said component comprises, for example, a flexible interconnection layer of the TAB type, stacked with said organic material layers, said interconnection layer connecting the connection points of said electronic circuit to interconnection points. Said component being of the BGA type, a network of balls is for example disposed on said metal layer. It comprises for example at least one layer of LCP thermoplastic material. The support forms, for example, a heat sink. It comprises for example at least one rigid layer. Said electronic circuit is for example a microwave circuit type MMIC.
    [0005] The subject of the invention is also a method of packaging at least one electronic circuit, said method comprising at least: a first phase in which said electronic circuit is fixed on a support and several layers of organic materials, interspersed with with layers of LCP thermoplastic material, are stacked on said support to form a cavity in which said electronic circuit is enclosed, said cavity being filled by creep of a LCP thermoplastic material; a second phase in which the said layers are pressed on the melting point support of the LCP material so as not to stick all the layers together. A TAB type interconnection layer is for example stacked with said layers, said interconnection layer being previously connected to the electronic circuit. The upper layer covering the cavity is for example covered with a metal layer. Said support being metallic, in a third phase, a network of metallized holes is for example made on the periphery of the stack of said layers, said holes electrically connecting said support and said metal layer so as to form a Faraday cage. In the third phase, a network of balls is for example fixed on said conductive layer, balls being electrically connected to said electronic circuit. Other features and advantages of the invention will become apparent with the aid of the description which follows, given with reference to the appended drawings which represent: FIG. 1, an exemplary embodiment of a microwave component 25 according to the invention; FIG. 2, an example of an electrical connection used in a component according to the invention; FIG. 3, an example of electrical shielding of a component according to the invention; FIG. 4 is an illustration of possible embodiments of a device according to the invention.
    [0006] FIG. 1 illustrates, in sectional view, an exemplary embodiment of a microwave component 10 according to the invention. The principle of the invention is based on the use of a thermoplastic material 1, for example of LCP (Liquid Crystal Polymer) type, a moisture-proof material with low water vapor permeability, filling a cavity pre-existing in which is placed at least one microwave circuit 2. Thereafter, by way of example, there is described a microwave component 10 having a single microwave circuit 2. A component according to the invention can of course comprise several electronic chips as well as passive components.
    [0007] The housing of a component according to the invention therefore has no cavity. The microwave circuit 2, for example a chip of the MMIC type, and encapsulated is covered with a moisture-proof material, preferably LCP material, inherently not very hydrophilic. The deformation of this material 1 allows the filling of the cavity and provides homogeneous stacks 15 and resistant to the penetration of water. Likewise at its melting temperature, the LCP becomes quasi-liquid and no longer exerts mechanical stress. This property allows the preservation of the integrity of fragile microwave structures such as the "air bridges" found on many MMICs.
    [0008] Advantageously, the invention uses for example inside the housing a layer of interconnections 3 having a certain flexibility, of the TAB type, for interconnecting the microwave circuit 2 to the external connections 4, of the BGA type. In a TAB ("Tape Automated Bonding") type of connection, the interconnection links are conductive tracks 25 placed on a dielectric film 15, for example polyimide. This type of connection makes it possible to control the electrical quality of the connections made and thus to operate in high frequency and in a wide band. The microwave component 10 of FIG. 1 may comprise a metal plate 11 forming a heat sink. The microwave circuit 2 is fixed on this plate 11 by bonding or brazing 12, the adhesive or solder also forming thermal coupling. The microwave circuit 2 is placed in a pre-existing cavity delimited laterally by a first layer 13 made of rigid thermosetting material. This first layer 13 is for example surmounted by one or more layers 14, 15 made of LCP thermoplastic material. The thermoplastic layers 14, 15 support the layer 3 of the TAB type, more precisely the dielectric films equipped with conductive tracks. This layer 3 makes it possible to interconnect the microwave circuit 2 with other possible circuits arranged inside the housing or with the input and output connections, in particular to solder balls 4, the housing being of the BGA type. . These layers of organic material 13, 14, 15 are covered with an upper layer 17, also of organic material.
    [0009] The cavity delimited by these layers 13, 14, 15, 17 encloses the microwave circuit. It is filled by the creep of the LCP thermoplastic material 1 so as to encapsulate the microwave circuit as previously described.
    [0010] The film 3 of the TAB type interconnection is for example covered with a layer 16 made of LCP thermoplastic material. Finally, the assembly is covered with an outer layer composed of a layer 17, for example made of LCP thermoplastic material or thermosetting material, covered with a metal layer 18, made of copper for example. The thermoplastic layers 16, 17 surmounting the interconnection 3 of the TAB type are pierced in several places, for example by a laser beam, so as to obtain depressions 19 facing perforations made on the interconnection 3.
    [0011] FIG. 2 illustrates a TAB type connection layer as used in the component of FIG. 1. This connection layer is composed of a plastic film 3 on which conductive tracks 21 connecting connection points 202 are placed. of the microwave circuit 2, as shown in Figure 1, at interconnection points 22 located on the plastic film. These interconnection points 22 are themselves connected by a network of tracks or vias to other active or passive circuits, or to the inputs and outputs of the component. The film 3 also comprises perforations 23 in which the depressions 19 are positioned. Advantageously, the connection layer 3 has a curvature which makes it possible to compensate for the double mechanical stress arising on the one hand from the depression 19 and on the other hand. the other side of the rear face 201 of the chip 2 constituting the microwave circuit. Return to FIG. 1. Metallic holes 9 pass through the periphery of the component to electrically connect the conductive plane 11 forming the drain with the conductive plane 18 supporting the external connection balls 4. These holes are disposed over the entire periphery of the component , for example in a regular manner, to form a Faraday cage delimited by the conductive planes 11, 18 and by the network of metallized holes 9. FIG. 3 illustrates, in a view from above of the component 10, an example of an arrangement of these holes 9 at the periphery. The holes could be replaced by metal studs. An intrinsically shielded packaging is thus obtained by producing an internal Faraday cage coupled to an interconnection mode in quasi-coaxial mode.
    [0012] FIG. 4 illustrates an example of a packaging method according to the invention that makes it possible in particular to obtain a microwave component as described above. The principle of packaging a component according to the invention is based on the use of layers of LCP thermoplastic material. By its thermoplastic nature, the LCP material deforms, flue, during its implementation to 280 ° C to conform and fill the pre-existing cavity. In a first phase of embodiment 41, the constituent parts of the component 10 are assembled. The rigid layer 13 is fixed on the metallic support plane 11. The metal plane may also be formed of a layer of copper thermosetting material. The chip 2 is bonded by its rear face on this plane 11 by means of a layer 12, thermal glue or solder alloy of the AuSn type, for example. Other constituent active or passive elements of the component 10 may be glued or brazed. In the present embodiment, the microwave component comprises a single chip 2. One or more layers 3, 14, 15, 16 are stacked on the rigid layer 13 to form a cavity intended to be filled by the thermoplastic material LCP 1 encapsulating the 2. The area occupied by the cavity contains the circuit (s) / element (s) constituting the electronic function of the component, these circuits and / or elements being intended to be encapsulated by the LCP material during the filling of the cavity. Among these stacked layers, there are thermoplastic material bonding layers and functional layers, for example the interconnection layer 3. Before the cavity is filled, the interconnection layer 3, of the TAB type, is in fact positioned. . It is connected beforehand to the connection points 202 of the chip 2, the chip being fixed on the support 11 once this connection operation is performed. All these layers, including the filled cavity, are covered with the outer layer composed of a thermoplastic layer 17 covered with a conductive layer 18, for example copper. If necessary, vertical interconnections can be made in this stack by laser or mechanical drilling, and by chemical or electrolytic metallization, at different stages of the stacking.
    [0013] In a second phase 42, the melting temperature of the LCP material is carried out in order to bond all the layers together and to fill all the interstices and flatness defects of the stack. Advantageously, the rigid layer 13 forms a mechanical stop during the pressing which protects the chip, preserving its integrity. In a third phase, the completion of the component is finalized. In particular, the through holes 9 are drilled to create the Faraday cage protecting the internal circuit (s) from interference. If the component is not subjected to such interference, it can be provided not to make the network of holes 9, that is to say not to make a Faraday cage. The casing of the casing is also carried out according to a standard process, such as the serigraphy of solder paste, positioning of the balls 4 and re-melting in the furnace. The connections of the balls 4 with the internal circuits, and in particular with the interconnection layer 3 can be achieved by conductive tracks obtained by screen printing on the intermediate layers or on the upper layer 17 as well as by a vias network traversing these layers. towards the balls. The balls 4 can also be electrically connected to a ground potential.
    [0014] A microwave component 10 as described above can be manufactured in series. For this purpose, there are provided stackings of layers of given length forming a row of patterns, each pattern corresponding to a component. The obtained pattern band is then cut to obtain the individual components. FIG. 4 illustrates the principle of producing a component according to the invention. The solution according to the invention is based on the implementation of a surface organic packaging technology, type BGA, without cavity 10 made by a method of manufacture. The deletion of the cavity, originally defined for the placement of chips or semiconductor 2 or passive elements, advantageously makes it possible to prevent the penetration of moisture in the form of liquid or vapor) at the level of these, and therefore to eliminate any problem of corrosion by electrochemical effect, at the level of the metal stacks of the electronic chips in the presence of a water electrolyte. The use of the LCP thermoplastic material makes it possible to obtain a housing that is much more resistant to moisture than all the polymers used in the prior art. The removal of the internal cavity of the housing makes it possible to compact it significantly, in particular by eliminating cavity walls defining the implantation surface of the electronic functions. It is thus possible to obtain a very compact component. The structure of the printed circuit type allows the production of a "Faraday cage" -type structure, either by metallized piercing 9, or by the production of studs or metallized slices connecting two metal planes 11, 18 positioned on the screen. one below and the other above the electronic function 2. This function is thus electrically isolated, which eliminates the crosstalk problems between the component and other possible components.
    [0015] The printed circuit technique also makes it possible to stack the electronic functions in the thickness of the housing structure. Finally, the printed circuit type technique makes it possible to achieve maximum integration densities, making it possible to stack functional and non-functional layers one above the other. The stack of at least one rigid thermosetting layer 13 guarantees the mechanical maintenance of the entire structure constituting the component. The surface interconnect mode, of BGA type, allows the design of the inputs and outputs of the component in such a way that they can convey high frequency signals that are shielded and insensitive to external disturbances, in particular thanks to the quasi-coaxial structure with a peripheral shield 9, consisting of ground connections. The invention has been described for the realization of a microwave component, but it can be applied more generally for an electronic component comprising one or more semiconductor electronic circuits, accompanied for example by passive circuits. The electronic function consisting of these elements is then encapsulated in a packaging as described above. 15
    权利要求:
    Claims (16)
    [0001]
    REVENDICATIONS1. Electronic component, characterized in that it comprises at least one support (11) on which is fixed at least one electronic circuit (2), one or more layers of organic materials (13, 14, 15, 16, 17) stacked on said support (11) according to a printed circuit technique and forming a pre-existing cavity containing said electronic circuit (2), said cavity being filled with a material (1) of low permeability to water vapor.
    [0002]
    2. Electronic component according to claim 1, characterized in that said material (1) of low permeability to water vapor is LCP type.
    [0003]
    3. Electronic component according to any one of the preceding claims, characterized in that the support (11) being metallic and the upper organic layer (17) of the stack being covered with a metal layer (18), a network of metal elements (9) each connected to said support (11) and to said metal layer (18) is disposed at the periphery of said component so as to form a Faraday cage including said electronic circuit (2).
    [0004]
    4. Electronic component according to claim 3, characterized in that said metal elements are metallized holes (9).
    [0005]
    5. Electronic component according to any one of the preceding claims, characterized in that it comprises a layer (3) of TAB type of flexible interconnections, stacked with said layers of organic materials, said interconnecting layer (3) connecting the connection points (202) of said electronic circuit (2) at interconnection points (22).
    [0006]
    6. Electronic component according to any one of the preceding claims, characterized in that said component being of the BGA type, a network of balls (4) is disposed on said metal layer (18). 3035739 13
    [0007]
    7. Electronic component according to any one of the preceding claims, characterized in that it comprises at least one layer (14, 15, 16, 17) of LCP thermoplastic material.
    [0008]
    8. Electronic component according to any one of the preceding claims, characterized in that the support (11) forms a heat sink.
    [0009]
    9. Electronic component according to any one of the preceding claims, characterized in that it comprises at least one rigid layer (13).
    [0010]
    10. Electronic component according to any one of the preceding claims, characterized in that said electronic circuit is a microwave circuit type MMIC.
    [0011]
    11. A method of packaging at least one electronic circuit, said method comprising at least: a first phase (41) in which said electronic circuit is fixed on a support (11) and several layers of organic materials, interposed with layers of LCP thermoplastic material, are stacked on said support (11) to form a cavity in which said electronic circuit is enclosed, said cavity being filled by creep of a LCP thermoplastic material (1); A second phase (42) in which the said layers are pressed on the melting point support of the LCP material (1) to bond all the layers together.
    [0012]
    12. Packaging method according to claim 11, characterized in that a TAB-type interconnect layer (3) is stacked with said layers, said interconnection layer (3) being previously connected to the electronic circuit (2). .
    [0013]
    13. The packaging method according to any one of claims 11 or 12, characterized in that the upper layer (17) covering the cavity is covered with a metal layer (18). 3035739 14
    [0014]
    14. A packaging method according to claim 13, characterized in that said support (11) being metallic, in a third phase (43), a network of metallized holes (9) is formed on the periphery of the stack of said layers, said holes (9) electrically connecting said support (11) and said metal layer (18) to form a Faraday cage.
    [0015]
    15. The packaging method according to claim 14, characterized in that in the third phase (43), a network of beads is fixed on said conductive layer, balls being electrically connected to said electronic circuit.
    [0016]
    16. Packaging method according to any one of claims 10 to 15, characterized in that said electronic circuit is a microwave circuit. 15 20
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    引用文献:
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    法律状态:
    2016-03-23| PLFP| Fee payment|Year of fee payment: 2 |
    2016-10-31| PLFP| Fee payment|Year of fee payment: 3 |
    2016-11-04| PLSC| Publication of the preliminary search report|Effective date: 20161104 |
    2017-03-27| PLFP| Fee payment|Year of fee payment: 3 |
    2018-03-27| PLFP| Fee payment|Year of fee payment: 4 |
    2020-03-26| PLFP| Fee payment|Year of fee payment: 6 |
    2021-03-25| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1500912|2015-04-30|
    FR1500912A|FR3035739B1|2015-04-30|2015-04-30|ELECTRONIC COMPONENT, IN PARTICULAR HYPERFREQUENCY, RESISTANT TO MOISTURE, AND METHOD OF PACKAGING SUCH COMPONENT|FR1500912A| FR3035739B1|2015-04-30|2015-04-30|ELECTRONIC COMPONENT, IN PARTICULAR HYPERFREQUENCY, RESISTANT TO MOISTURE, AND METHOD OF PACKAGING SUCH COMPONENT|
    EP16166445.3A| EP3089211A1|2015-04-30|2016-04-21|Moisture-resistant electronic component and method for packaging an electronic circuit for manufacturing such a component|
    US15/141,442| US9818706B2|2015-04-30|2016-04-28|Moisture-resistant electronic component, notably microwave, and method for packaging such a component|
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