• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a housing for a laser diode, comprising a heat conducting plate electrically insulated with an electronic circuit thereon; a laser diode chip mounted on the electronic circuit of the electrically insulated heat conductive platen and having an anode and a cathode, respectively connected to an external solder pad for external electrical connections; and a heat conducting support installed on a surface of the electrically insulated heat conducting platen to conduct the heat generated by the laser diode chip to the heat conducting support through the electrically insulated heat conductive platen, wherein the chip laser diode emits light from an edge of the electrically insulated heat conductive platen and the surface of a contact plane between the electrically insulated heat conductive platen and the heat conducting support is adjusted according to the power requirements of the laser diode, and the surface of the contact plane is between 6 and 5,000 mm2.
    公开号:FR3034579A3
    申请号:FR1651202
    申请日:2016-02-15
    公开日:2016-10-07
    发明作者:Hsun-Fu Lee；Hou-Chieh Lee
    申请人:Hou-Chieh Lee；
    IPC主号:
    专利说明:

    [0001] FIELD OF THE INVENTION The present invention relates to a housing for a laser diode, specifically a housing which is a heat conducting component capable of creating a heat conduction surface larger than a contact plane between a base for the laser diode chip and a heat conducting support, so as to allow the heat generated by the laser diode to be rapidly and efficiently conducted and dissipated. BACKGROUND OF THE INVENTION [0002] As shown in FIG. 1, a conventional diode laser box 10 comprises: a laser diode chip 110, an optical axis 101 of a light beam generator capable of emitting a laser beam conical 100, a base 120, and a heat conducting support 130, wherein the base 120 and the heat conducting support 130 are made of copper alloys, the laser diode chip 110 is a semiconductor chip, the two being often bonded by an adhesive 118. The base 120 receives the laser diode chip 110 and conducts the heat to the heat conducting support 130, which heat conducting support 130 is not large. As a result, the air contacting surface is not large enough to dissipate heat to the air by itself and the heat must be dissipated by a main surface of the heat conducting support 192 which is in contact with a body. larger external heat dissipation 191 (for example, a hull made of aluminum or a specialized heat dissipating fin). To improve the efficiency of the heat dissipation, the main surface of the heat conducting support 192 should be large and even, and it is common for the main surface of the heat conducting support 192 to be parallel to a glass window 105 (the two being vertical to the optical axis 101) for the installation of the glass window mounting mechanism 105 and the main surface of the heat conducting support 192, so as to allow the contact surface between the surface main of the heat conducting support 192 and the external heat dissipating body 191 to be enlarged in order to improve the efficiency of the heat conduction. The aforementioned mechanisms are common in the boxes for 15 low or medium power laser diodes. However, the aforementioned box is difficult to implement for high power laser diodes because the high power laser diodes generate a much greater amount of heat. In addition, there are two or three pins next to the base to connect the laser chip 20 by bonding gold wire. Because the pins need to be as close as possible to the laser chip, there is no room for the base to expand; therefore the base must be as small as possible, resulting in the formation of a bottleneck affecting the entire heat conduction pathway. As shown in FIG. 1, the contact plane 3034579 (section A-A) between the base 120 and the heat conducting support 130 is too small and the heat conducting surface can not be enlarged. FIG. 2, including FIGS. 2A and 2B, in which the unit used is mm, shows a box 5 for laser diode 20. FIG. 2A shows a conventional TO-5 box for a laser diode 20 comprising: laser diode 210 capable of emitting a laser beam 200 having an optical axis 201, a base 220, a heat conducting support 230 and pins 227, wherein the maximum surface of the contact plane 290 (section AA) between the base 220 and the heat conducting support 230 is approximately 1.3 mm × 3.3 mm = 4.29 = 2, without exceeding 6 mm 2. Because the surface of the contact plane 290 (section AA) between the base and the heat conducting support is so small that it constitutes a bottleneck in the heat conduction, it is difficult to conduct the heat of the heat. the laser diode chip 210 to the heat dissipating body, i.e., the heat is conducted by the heat conducting support 230, through a main surface of the heat conducting support 292 to a heat dissipating body external. FIG. 2B shows another conventional C-mount case for a laser diode 20 ', which typically includes the same major components as those shown in FIG. 2A (modifying only 2xx lxx numbering), and the surface of the contact plane 290 (section AA) for the conduction of heat is 1.8 mm x 2.0 mm = 3.6 mm 2, without exceeding 6 mm 2. [0004] According to the physics, a person skilled in the art should know that the heat transfer rate is proportional to the heat conducting surface, and because the heat conducting surface of the base provided by the diode housing conventional laser (the aforementioned surface of the contact plane) is too small, much of the heat generated by the laser diode chip is difficult to dissipate through the base towards the heat conducting support; in addition, because the base is installed in a small space, the heat conducting surface can not be enlarged as needed to improve the efficiency of the heat conduction. The small heat conduction surface of the base constitutes a bottleneck of the heat conduction of the laser diode housings. In addition, as shown in FIGS. 1 and 2, the conventional laser diodes are mounted in cylindrical housings and individually, as previously mentioned, the heat conduction surface of the base only can be enlarged inside the housing, and there is no place to house another laser diode chip, nor for other electronic components. Apparently, the conventional case is not suitable for a device that requires more than a laser diode, and there is no room to install other electronic components to improve performance. FIGS. 1 and 2 also show conventional boxes for laser diodes 10 and 20, in which an optical axis 101, 201 of the laser beam 100, 200 is emitted vertically with respect to the main surface of the heat-conducting support. 5 192, 292, rather than being issued in parallel thereto. In addition, current laser diode conditioning methods can not provide additional space within the current housing to improve the performance of the laser diode, for example to accommodate an additional photodiode for power sensing. optical laser diodes, a diode protection against electric shocks, and / or a diode protection against reverse bias. Moreover, one skilled in the art also knows that the LED chip emits light from the top surface instead of the edge and that it is easy to mount the LED on a large plate to have a large area for dissipation. heat. However, most laser diode chips emit light from the edge rather than the top surface, making it difficult to mount them on a large plate. Therefore, conventional laser diode chips that emit light from the edge are not mounted on large plates and can not be provided with large heat conduction components. There is therefore a great demand for a box that can solve the problems of conventional boxes for 25 laser diodes, especially the heat conduction problems 3034579 6 associated with the boxes for medium or high power laser diode chips that emit light from the edge and generate large amounts of heat. DESCRIPTION OF THE INVENTION [0008] The present invention provides an electrically insulated heat conductive stage which, when used as a housing component, is similar to the base (a component used to secure and install the diode chips laser) of a conventional case for a laser diode, but which is totally different from a base in its configuration, its shape and the dimensions of the surface. [0009] An object of the present invention is to propose a case for a chip with a laser diode, especially a housing used for a medium or high power laser diode, the housing 15 has a larger contact plane between an electrically insulated heat conducting plate and a heat conducting support, and the size of the surface of the The contact plane can be adjusted according to the power of the laser diodes, they can be of rectangular, square or irregular shape, allowing to drive and dissipate the heat generated. laser diodes efficiently and quickly to extend the life of laser diodes. In addition, the optical output power of the laser diodes can be increased to the same operational current since the heat dissipation has been improved. Another object of the present invention is to provide a housing for a laser diode, wherein the optical axis of the laser diodes is generally parallel to the surface of the electrically insulated heat conducting plate, and the method of assembly is simpler and the cost of assembly is decreased. Another object of the present invention is to propose a housing for a laser diode, in which there is room for additional devices such as a photodiode for measuring the optical power of the laser diode, a protection diode against reverse bias, and / or a protection against electric shock diode to improve performance and extend the life of the laser diode. Another object of the present invention is to provide a housing for a laser diode, in which the electrically insulated heat conductive platen and the heat conducting support are united in a single electrically insulated heat conducting component capable of driving and dissipate heat quickly and efficiently and reduce the cost of the case. A laser diode package according to the present invention comprises: a heat conducting plate electrically insulated with an electronic circuit thereon; a laser diode chip mounted on the electronic circuit of the electrically insulated heat conducting platen and having an anode and a cathode which are respectively connected to an outer solder pad for external electrical connections; and a heat conducting support installed on a surface of the electrically insulated heat conductive platen, which serves to dissipate the heat generated by the laser diode chip through the electrically insulated heat conductive platen to the heat conducting support, in wherein the laser diode chip emits light from the edge of the electrically insulated heat conducting platen and the surface of the contact plane between the electrically insulated heat conductive platen, the heat conductive support is preferably from 6 to 5,000. mm2 and can be adjusted according to the power requirements of the laser diodes. The present invention also relates to a housing for a laser diode, comprising: a heat conducting plate electrically insulated with an electronic circuit thereon; a laser diode chip 15 mounted on the electronic circuit and having an anode and a cathode which are respectively connected to an external solder pad for external electrical connections and a heat conducting support installed on a surface substantially parallel to the conductive plate of electrically insulated heat which serves to dissipate the heat generated by the laser diode chip through the electrically insulated heat conductive platen to the heat conducting support, wherein the laser diode chip emits light from the edge of the platen electrically insulated heat conductor, and the optical axis of the laser diode chip is generally parallel to the surface of the electrically insulated heat conductive platen. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIG. 1 is a lateral block diagram of the entire structure of a conventional laser diode box 10. [0015] FIGS. 2A and 2B are respectively a schematic diagram of the entire structure of FIG. a conventional TO-5 box for a laser diode 20 and a conventional type C mounting box for a laser diode 20 '. Figure 3A is a lateral block diagram of the entire structure of an embodiment of the laser diode housing 30 according to the present invention. FIG. 3B is a lateral block diagram of the entire structure of another embodiment of the laser diode housing 30 'according to the present invention. Figure 4A is a physical structure type diagram seen from above of the laser diode box 40 shown in Figure 3A. Figure 4B is a side structural diagram of an appearance of the laser diode housing 40 shown in Figure 4A. Figure 4C is a lateral structural diagram of another aspect of the laser diode housing 40 'shown in Figure 4A.
    [0002] DESCRIPTION OF THE DRAWINGS The present invention may be embodied in many different forms and should not be construed as limited to the embodiments described herein; The following detailed description is intended to serve to represent the various embodiments and features of the present invention, and therefore will not be construed as a limitation of the claims. In order to overcome the problem of the throttling neck of the heat conduction associated with conventional boxes, that is to say the fact that the surface of the contact plane between a base and a heat conductive support is Too small and can not be adjusted according to the power requirements of the laser diode, the present invention provides a housing for a laser diode 30 as shown in Fig. 3A, comprising: an electrically insulated heat conductive platen 320 with an electronic circuit 321 on this one; a laser diode chip 310 mounted on the electronic circuit 321 of the electrically insulated heat conductive plate 320 and having a solder point 411 of the anode and a solder point 412 of the cathode (as illustrated in FIG. 4A) connected respectively via the electronic circuit 321 to an external solder pad 313, 314 for external electrical connections and a heat conducting support 330 installed on a surface 25 parallel to the electrically insulated heat conducting plate 320, said surface for conducting the heat generated by the laser diode chip 310 to the heat conducting support 330 through the electrically insulated heat conducting plate 320 for dissipation, said laser diode chip 310 emitting a conical laser beam 300 to from the edge of the electrically insulated heat conducting plate 320. The center of the light beam is an optical axis 301 which is generally parallel to the surface 322 of the electrically insulated heat conducting plate 320 and / or generally parallel to the main surface of the heat conducting support 392. The electrically insulated heat conducting plate 320, used as a component for the housing, is similar to the base of a conventional case for laser diode, but different in its structure. The size of the electrically insulated heat conducting platen can be significantly enlarged according to the power dissipation requirements; for example, its length and width can be freely extended up to 2.4 mm x 2.4 mm, respectively, creating a heat conduction surface of 5.76 mm 2; or expanded to 2 mm x 3 mm or 3 mm x 2 mm, creating a heat conducting surface of 6 mm 2; or expanded to 6mm x 6mm, creating a heat conduction area of 36mm2; or extended to 70 mm x 70 mm, creating a heat conduction surface of about 5,000 mm 2 (which represents the contact plane as described below, section A'-A '). Therefore, the surface of the contact plane of the present invention can be freely adjusted from 6 to 5,000 mm 2, which means that the heat conduction surface of the contact plane 390 (section A'-A ') Between the electrically insulated heat conducting plate 320 and the heat conducting support 330 is large enough that the contact plane 390 is no longer a bottleneck in the heat conduction. In addition, current printed circuit board manufacturing technologies can be used on the electrically insulated heat conducting plate 320 to provide it with an electronic circuit 321 and solder pads 311, 312 for connecting the anode. and the cathode of the laser diode chip to the electronic circuit, so that the electrically insulated heat conductive platen 320 is no longer limited by the pins and can be freely extended. For example, for a single 1W laser diode, it is sufficient that the length and width of the electrically insulated heat conducting plate in a preferred embodiment be 10 mm respectively, and that the main surface size of the heat conductive support 392 that is 100 mm2. In addition, the electrically insulated heat conducting plate 320 of the present invention can be significantly extended, which not only improves the efficiency of heat conduction, but also has the following advantages: In the present invention, the electrically insulated heat conductive platen is large enough to be provided with a plurality of threaded holes allowing the electrically insulated heat conductive platen 3034579 to be attached to the heat conductive support by means of screws. rather than welding, thus increasing the flexibility of the mechanism design and reducing the cost of assembly. In addition, the present invention does not require the conventional heat conducting support, the electrically insulated heat conductive stage, on which the laser diode chip is already mounted, can be attached directly to the external aluminum heat dissipating body ; 2. since the surface of the base of the conventional laser diode is too small to accommodate other components (for example, the maximum area of a TO-18 case is 1.3 mm x 1.85 mm = 2.4 mm 2) leaving little room for other electronic components than the laser diode chip itself. The structure of the present invention allows the electrically insulated heat conducting plate 15 to easily accommodate other components, for example a protective diode which protects the diode laser chip against electrostatic discharge or reverse bias, and a photodiode for measuring the optical power of the laser diode, both of which can be mounted on the electrically insulated conductive platen by the same method, thereby extending the life of the laser diode, reducing cost and minimizing volume. Fig. 3B is a block diagram of another embodiment of the laser diode housing as shown in Fig. 3. In Fig. 3B, the components are the same as those shown in Fig. 3B. FIG. 3A, except that the electrically insulated heat conducting plate 320 is not necessarily parallel to the main surface of the heat conducting support 392 as shown in FIG. 3A, and according to the application requirements of FIG. 301, the heat conducting support 330 may be designed together with the external heat dissipating body 391 to have a trapezoidal shape or other shape, creating an included angle between the electrically insulated heat conducting plate 320 and the main surface of the heat conducting support 392, that is to say, the angle included between the optical axis 301 and the main surface of the heat conducting support 392, varies accordingly In addition, depending on the power requirements of the laser diode, the present invention provides sufficient heat conduction area to improve heat conduction efficiency, and the angle of the axis. Optical can be adjusted as needed. As mentioned above, the optical axis of the conventional housing is generally vertical with respect to the main surface of the heat conducting support, which does not allow adjustments. [0024] Embodiment: FIG. 4A is a physical structure type diagram of an embodiment of the laser diode box according to the present invention, which is also shown in the block diagram of FIG. 3A. As the embodiment is shown in FIG. 4A, a laser diode housing 40 provided by the present invention, which is used to emit a beam 400 having an optical axis 401, comprises an electrically insulated heat conducting plate 420 (FIG. as mentioned above, which is analogous to a base in a conventional laser diode housing) with an electronic circuit 421 thereon; a laser diode chip 410 mounted on the electronic circuit 421 and having a solder point 411 of the anode and a solder point 412 of the cathode, respectively connected via the electronic circuit 421 to an external solder pad 413, 414 for external electrical connections; and a heat conducting support 430 installed on a surface of the electrically insulated heat conductive plate 420, said surface serving to conduct heat generated by the laser diode chip 410 to the heat conducting medium 430 through the conductive plate of the electrically isolated heat 420 for dissemination, wherein the laser diode chip 410 emits light from an edge of the electrically insulated heat conducting plate 420, and a contact plane 490 (section A'-A ') between the electrically insulated heat conducting plate 420 and the heat conducting support 430 may be adjusted according to the power requirements of the laser diode and the surface of the contact plane may be between 6 and 5,000 = 2. As mentioned above, the surface of the contact plane (section A'-A ') between the electrically insulated heat conducting plate 420 and the heat conducting support 430 may be substantially larger than the surface of the plane. contact (section AA) between the conventional base of a laser diode 120, 220 and the heat conducting support 130, 230 and the shape and size of the contact plane of the present invention can be adjusted to solve the problem the heat conduction bottleneck associated with the conventional housing - the narrowest heat conduction surface of the heat conduction pathway. In the present invention, in the form of the laser diode housing 40 shown in FIG. 4B, the heat conducting support 430 and the laser diode chip 410 are respectively installed on opposite surfaces of the heat conducting plate. electrically isolated; in the form of the laser diode housing 40 'shown in FIG. 4B, the heat conducting support 430 and the laser diode chip 410 are both installed on the same surface of the electrically insulated heat conducting plate 420, said Heat conducting support 430 having a plurality of voids 480 for receiving the laser diode chip 410 and exposing the external solder pads for external electrical connections. In the present invention, the surface of the heat conducting support can be adjusted according to the power requirements of the laser diode, and the surface of the contact plane (section A'-A ') for the conduction of heat is between 6 and 5,000 mm2, and of course, the maximum area can be further enlarged or reduced depending on the power requirements of the laser diode. In a case for a laser diode 30 'as shown in FIG. 3B, an electrically insulated heat conducting plate 320 and a heat conducting support 330 5 are united in a single body. In one embodiment of the invention, an angle is formed between the contact plane 390, which is located between the electrically insulated heat conducting plate 320 and the heat conducting support 330, and the main surface of the heat conducting support 392, said angle being from 0 ° to 180 °. The main surface of the heat conducting support 392 is the contact plane between the heat conducting support 330 and an external heat dissipating body 391. According to the present invention, the electrically insulated heat conducting plate 320, 420 and the heat conducting support 330, 430 may be rectangular, square or irregular. In a laser diode box 40 as shown in FIG. 4A, there may be a plurality of laser diode chips 410, mounted on the electronic circuit, and each of the laser diode chips has an anode and a cathode respectively connected via the electronic circuit 421 to an external welding range for external electrical connections. [0030] Other than a plurality of laser diode chips, a laser diode package 40 provided by the present invention may also include a photodiode 440, behind the opposite edge of the leading edge emitting the laser, to measure the optical power of the laser diode. The photodiode 440 is connected to a feedback circuit (not shown in the figures) to control the optical power of the laser diode. The present invention includes a reverse bias protection diode 450 which is connected in parallel with and installed in the opposite direction of the laser diode to conduct electrical current to protect the laser diode when the reverse voltage passes through the diode electrodes. laser exceeds a predetermined value. The present invention also includes an electric shock protection diode 460 which is connected in parallel with the laser diode to conduct electric current to protect the laser diode when the voltage across the electrodes of the laser diode exceeds a predetermined value. The photodiode 440 has an anode and a cathode which are respectively connected to an external solder pad 441, 442 installed on the electronic circuit for external electrical connections. In addition, in a laser diode housing according to the present invention, the heat conducting support 430 also comprises a plurality of voids 480 for receiving additional electronic components, wherein the additional electronic components are a photodiode 440, A reverse-bias protection diode 450, and / or an electric-shock protection diode 460. In a laser diode package according to the present invention, the electrically-insulated heat conductive stage 420 may be a ceramic board, an electrically insulated heat conductive graphite board, or an aluminum circuit board. The heat conducting support may be a copper alloy plate, an aluminum alloy plate, an iron alloy plate or heat conductive graphite plate, wherein the ceramic board is a nitride platinum aluminum or platinum aluminum oxide. In the present invention, the same symbols used in Figures 4A, 4B and 4C represent the same components. In summary of FIGS. 3A, 3B and 4A, the present invention proposes a housing for laser diode 30 or 40, comprising: an electrically insulated heat conducting plate 320 or 420 with an electronic circuit 321 or 421 on it ; a laser diode chip 310 or 410 mounted on the electronic circuit 321 or 421 of the electrically insulated heat conducting plate 320 or 420 having a solder point 411 of the anode and a solder point 412 of the cathode, respectively connected via the electronic circuit 421 to an external solder pad 313, 314, 413 or 414 for external electrical connections; and a heat conducting support 330 or 430 installed on a surface 322 or 422 (as shown in FIG. 4C) of the electrically insulated heat conducting plate 320 or 420 to conduct the heat generated by the diode chip laser 310 or 410 to the heat conducting support 330 or 430 through the electrically insulated heat conducting plate 320 or 420 for dissipation, wherein the laser diode chip 310 or 410 emits a laser from the edge of the platen electrically insulated heat conductor 320 or 420, and the optical axis 301 or 401 of the laser diode chips are generally parallel to the surface 322 or 422 of the electrically insulated heat conducting plate 320 or 420. In a housing for a laser diode as shown in FIGS. 4A and 4B, the heat conducting support 430 and the laser diode chip 410 are respectively installed on different surfaces of the flat surface. Electrically insulated heat conductor 420. As shown in FIG. 4C, the heat conducting support 430 and the laser diode chip 410 can also be installed respectively on the same surface 422 of the electrically insulated heat conducting plate 420, wherein the heat conducting support 430 has a plurality of voids 480 for receiving the laser diode chip 410 and / or other electronic components, and for exposing the solder pads for external electrical connections. In addition, in the laser diode box according to the present invention, there are a plurality of laser diode chips 3034579 21 mounted on the electronic circuit and an anode and a cathode of each laser diode chip are respectively connected via the electronic circuit to the soldering range for external electrical connections. In addition, the laser diode housing of the present invention may also include a photodiode 440 having solder points 441, 442, said photodiode for measuring the optical power of the laser diode being installed behind the edge. opposite to the main edge emitting the laser of the laser diode chip 410, and is connected to a feedback circuit (not shown in the figures) to control the optical power of the laser diode. The present invention also includes a reverse bias protection diode 450 which is connected in parallel with and installed in the reverse direction of the laser diode to conduct electrical current to protect the laser diode when the reverse voltage passes through the electrodes of the laser diode. laser diode exceeds a predetermined value. The present invention also includes an electric shock protection diode 460 which is connected in parallel with the laser diode to conduct electrical current to protect the laser diode when the voltage across the electrodes of the laser diode exceeds a predetermined value.
    权利要求:
    Claims (10)
    [0001]
    REVENDICATIONS1. A laser diode housing, comprising: a heat conducting platen electrically insulated with an electronic circuit thereon; a laser diode chip mounted on the electronic circuit of the electrically insulated heat conducting plate and having a solder range of an anode and a solder range of a cathode, respectively connected, via the electronic circuit, to a range of external weld for external electrical connections, and a heat conducting support installed on a surface of the electrically insulated heat conducting plate, the surface for conducting the heat generated by the laser diode chip to the heat conducting support through the electrically insulated heat conducting platen 15 for dissipation, wherein the laser diode chip emits light from an edge of the electrically insulated heat conducting platen and in which a contact plane between the insulated heat conducting platen electrically and the heat conducting support 20 is adjusted according to the power requirements of the di laser ode and the surface of the contact plane is between 6 and 5,000 mm2.
    [0002]
    The laser diode housing of claim 1, wherein the heat conducting support and the laser diode chip 3034579 23 are respectively installed on different surfaces of the electrically insulated heat conducting plate.
    [0003]
    The laser diode housing of claim 1, wherein the heat conductive support and the diode chip are installed on the same surface of the electrically insulated heat conducting plate, and wherein the heat conducting support has a plurality of voids for receiving the laser diode chip and exposing the external solder pads for external electrical connections. 10
    [0004]
    The laser diode housing of claim 1, wherein the electrically insulated heat conducting platen and the heat conducting support are joined together in a single body.
    [0005]
    The laser diode housing of claim 1, wherein the electrically insulated heat conductive platen and the heat conducting support are rectangular, square or irregular in shape.
    [0006]
    The laser diode package of claim 1, wherein there are a plurality of laser diode chips mounted on the electronic circuit, and each of the plurality of laser diode chips has an anode and a cathode respectively connected via the electronic circuit has an external welding range for external electrical connections.
    [0007]
    The laser diode housing of claim 1, further comprising a photodiode which is mounted on the electrically insulated heat conducting platen and installed behind an edge opposite a laser leading edge for measuring the optical power of the laser. laser diode.
    [0008]
    The laser diode housing of claim 1, wherein the electrically insulated heat conductive platen 5 also includes a reverse bias protection diode which is connected in parallel with the laser diode and is installed in a reverse direction of the diode. laser for conducting electric current to protect the laser diode when a reverse voltage across the electrodes of the laser diode exceeds a predetermined value.
    [0009]
    The laser diode housing of claim 1, wherein the electrically insulated heat conductive platen comprises an electrical discharge protection diode which is connected in parallel with the laser diode to conduct electrical current to protect the laser diode. when a voltage crossing the electrodes of the laser diode exceeds a predetermined value.
    [0010]
    The laser diode housing of claim 7, wherein the photodiode has an anode and a cathode respectively connected to an external solder pad that is installed on the electronic circuit for external electrical connections.
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    引用文献:
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    TW200735494A|2004-06-29|2007-09-16|Tdk Corp|Heat-conducting member, laser diode attachment auxiliary member, optical head using the same, and optical recording/reproducing apparatus using the same|
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    TWI536512B|2012-12-26|2016-06-01|鴻海精密工業股份有限公司|Projection laser chip package structure|TWI580139B|2015-03-31|2017-04-21|Hou Chieh Lee|A packaging structure for a laser diode|
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    法律状态:
    2017-02-20| PLFP| Fee payment|Year of fee payment: 2 |
    2018-02-23| PLFP| Fee payment|Year of fee payment: 3 |
    2020-02-20| PLFP| Fee payment|Year of fee payment: 5 |
    2021-02-17| PLFP| Fee payment|Year of fee payment: 6 |
    2022-02-21| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    TW104204856U|TWM517941U|2015-03-31|2015-03-31|A packaging structure for a laser diode|
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