• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The manufacturing method makes it possible to manufacture a printed circuit (2) comprising an electrically insulating substrate (4) and electrically conductive elements (6, 6 ', 6 ") carried by the substrate (4). insulating substrate (4) and conductive elements (6) together, by means of addition of materials.
    公开号:FR3033977A1
    申请号:FR1500551
    申请日:2015-03-20
    公开日:2016-09-23
    发明作者:David Costes
    申请人:Thales SA；
    IPC主号:
    专利说明:

    [0001] The present invention relates to the field of printed circuits, and in particular to the manufacture of printed circuits.
    [0002] A printed circuit has a multilayer structure formed of an alternation of electrically insulating layers and conductive layers, conductive tracks being formed in the conductive layers. Via, in the form of metallized holes formed in at least one insulating layer, electrically connect conductive tracks of two conductive layers separated by at least one insulating layer. It is possible to manufacture a printed circuit board with one or two conductive layers by providing a plate comprising an insulating support layer covered on one face or on each face of a conductive layer, for example made of copper, and then etching tracks in each conductive layer, for example by etching.
    [0003] It is possible to manufacture printed circuits with at least three conductive layers by stacking printed circuits with one or two conductive layers, possibly with the interposition of insulating plates, for example between two printed circuits with two conductive layers. A multilayer printed circuit comprises conductive layers (at least two in number) alternating with insulating layers.
    [0004] In the same multilayer printed circuit, it is possible to provide thin conductive layers dedicated to the transmission of low energy signals, and thick conductive layers dedicated to the transmission of high energy signals. Due to the fabrication of the printed circuits with at least three conductive layers by stacking printed circuits with one or two conductive layers, each conductive layer has a uniform thickness, and the conductive tracks of each conductive layer have the same thickness. It follows that a conductive layer is generally dedicated to the transmission of high energy signals or the transmission of low energy signals, and that high energy tracks and low energy tracks are not formed in a same conductive layer.
    [0005] One of the aims of the invention is to propose a method of manufacturing printed circuits allowing more freedom in the manufacture of the printed circuit. For this purpose, the invention proposes a method for manufacturing a printed circuit comprising an electrically insulating substrate and electrically conductive elements carried by the substrate, the method comprising the manufacture of the insulating substrate and conductive elements jointly, by manufacture by adding of materials.
    [0006] According to particular embodiments, the manufacturing method comprises one or more of the following characteristics, taken separately or in any technically possible combination: it comprises the production of at least one zone in which a first element conductor and a second conductive element are sandwiched between two substrate parts, the first conductive element having a thickness, taken between the two substrate parts, strictly smaller than that of the second conductive element; it comprises the manufacture of a first zone and a second distinct zone, each comprising an alternating stack of substrate portions and conductive elements, the first zone and the second zone having a number of conductive elements that are strictly inferior the number of conductive elements of the second zone; it comprises the production of at least one zone comprising at least one buried conductor via (36) connecting two conductive elements separated by at least one portion of substrate; it comprises the manufacture of at least one electronic component and / or at least one magnetic component in the thickness of the printed circuit; it comprises the manufacture of at least one heat sink made in a through-hole from one end of the printed circuit in the direction of the thickness, the heat sink comprising at least one solid metal block of complementary section to that of the hole; ; the printed circuit is formed with a stable non-planar three-dimensional shape; the printed circuit is manufactured by adding material together with an electronic device shell.
    [0007] The invention also relates to a printed circuit obtained by a manufacturing method as defined above. The invention particularly relates to a printed circuit comprising an electrically insulating substrate and electrically conductive elements carried by the substrate, the printed circuit comprising at least one zone in which a first conductive element and a second conductive element are sandwiched between two parts. the first conductive element having a thickness, taken between the two substrate parts, strictly smaller than that of the second conductive element. The invention also relates to a printed circuit comprising an electrically insulating substrate and electrically conductive elements formed on the substrate, the printed circuit comprising a first zone and a second distinct zone, each comprising an alternating stack of substrate parts and elements. The first zone and the second zone have a number of conductive elements strictly smaller than the number of conductive elements of the second zone. The invention also relates to a printed circuit comprising an electrically insulating substrate and electrically conductive elements carried on the insulating substrate, the printed circuit comprising at least one electronic component and / or at least one magnetic component formed in the thickness of the printed circuit. The invention also relates to a printed circuit comprising an electrically insulating substrate and electrically conductive elements carried by the insulating substrate, the printed circuit comprising a heat sink made in a through hole from one end of the printed circuit in the direction of the thickness, the heat sink comprising at least one solid metal block of complementary section to that of the hole. The invention also relates to a printed circuit comprising an electrically insulating substrate and electrically conductive elements carried by the insulating substrate, the printed circuit being formed with a stable non-planar three-dimensional shape. The invention further relates to a printed circuit comprising an electrically insulating substrate and electrically conductive elements carried by the insulating substrate, the printed circuit being manufactured by adding material together with an electronic device shell. The invention and its advantages will be better understood on studying the following description, given solely by way of example and with reference to the appended drawings, in which: FIG. 1 illustrates the fabrication of a printed circuit by addition of materials, by successive layers; - Figures 2 to 5 illustrate successive steps of manufacturing the printed circuit of Figure 1; - Figure 6 illustrates a manufacturing system of the printed circuit by adding materials, using two manufacturing machines by adding material; Figures 7 to 9 illustrate printed circuits made by adding materials, having particular arrangements of the substrate and conductive layers; - Figure 10 illustrates a printed circuit manufactured by adding materials, including a heat sink; 11 illustrates a printed circuit comprising a heat sink, obtained according to a conventional manufacturing method, according to the state of the art; FIG. 12 illustrates a printed circuit manufactured by adding materials, comprising a heat sink with integrated electrical insulation; Figures 13 and 14 illustrate printed circuits made by adding materials, respectively comprising electrical components and a magnetic circuit integrated in the thickness of the printed circuit; - Figure 15 illustrates a printed circuit made by adding materials, having a three-dimensional shape; and - Figure 16 illustrates a printed circuit made by adding materials to a shell of a housing of electronic equipment.
    [0008] The printed circuit 2 of FIG. 1 comprises an electrically insulating substrate 4 and electrically conductive elements 6, 12 carried by the insulating substrate 4. The printed circuit 2 here comprises a multilayer structure formed of a stack of superposed structural layers 10 a stacking direction E.
    [0009] In Figure 1, some structural layers 10 contain both insulating substrate portions 8 and conductive elements 6 or portions of conductive elements 6. Certain areas of printed circuit 2 (right and left in FIG. 1 ) comprise a stack of conductive elements 6 and insulating substrate spacer portions 8 alternated in the stacking direction E. The printed circuit 2 comprises (in the center in FIG. 1) a conductive element forming a via 12 passing through the circuit 2 printed in the thickness direction and making an electrical connection between at least two conductive elements 6 located in two separate structural layers 10 and separated by an interposed insulating substrate portion 8 interposed between the two conductive elements 6. As illustrated by FIG. dotted parallel lines, the printed circuit 2 is manufactured by adding materials, by successive layers of material. During this manufacturing, layers of material are successively added to form the printed circuit 2. The layer of material between each pair of adjacent dashed lines (hereinafter fabrication layer 14) represents a layer of materials added during a step of manufacturing by adding materials. The printed circuit board 2 comprises two different materials, namely the insulating material of the substrate 4 and the conductive material of the conductive elements 6. At least some manufacturing layers 14 contain at least two different materials, in this case conductive material and insulating material.
    [0010] FIGS. 2 to 5 illustrate steps of deposition of production layers for the manufacture by adding material of the printed circuit 2. FIGS. 2 and 3 illustrate the fabrication of a structural layer 10 comprising two conductive elements 6 located on the part of and further a first section of the via 12, being separated and electrically isolated from the via 12 by a portion of the separation substrate 15, which is here annular and surrounds the via 12. The structural layer 10 is formed by several stacked manufacturing layers 14, and Figures 2 and 3 illustrate the manufacture of the first production layer 14.
    [0011] According to one embodiment, a material M1 is successively added, then the other M2. In the example shown, first remove the insulating material M1 (Figure 2), then the conductive material M2 (Figure 3). In a variant, the order of adding the materials is reversed. The operations of Figures 2 and 3 are repeated until forming the structural layer 10 (Figure 4).
    [0012] Figures 4 and 5 illustrate the fabrication of the next structural layer 10 formed above the previous structural layer. This next structural layer 10 comprises a second section of the via 12 extending that of the preceding structural layer 10, between two parts of the intermediate substrate 8. A manufacturing layer 14 is made, for example, by first adding the insulating material M1 (FIG. 4) and then the conductive material M2 (FIG. 5) or vice versa. Alternatively, if it is possible according to the three-dimensional geometry (3D) of the printed circuit 2, it is possible to add several layers of a material before proceeding to the addition of several layers of manufacture of the other material. The material addition operations are carried out by manufacturing layer until the printed circuit of FIG. 1 is obtained. The via 12 is thus formed by an electrically conductive solid block 16 extending through a hole 17 passing through the insulating substrate 4, the block 16 having a section complementary to that of the holes 17. Thus, the via 12 has a low electrical resistance compared to its diameter.
    [0013] As shown in FIG. 1, a section 18 of the via 12, here the upper section, is surrounded by a tubular substrate portion 19. This tubular substrate portion 19 makes it possible to electrically isolate the via 12 from conductive elements 6 which are not electrically connected to this via 12. The tubular substrate portion 19 connects intermediate substrate portions 8 separated by conductive elements 6.
    [0014] The substrate 4 comprises connecting substrate portions 21 interconnecting interlayer portions 8 interspersed with a conductive element 6. The tubular substrate portion 19 here includes a portion 21 of substrate connection. The material addition manufacturing thus makes it possible to manufacture in the substrate connecting portions connecting portions of substrate or portions of substrate separated by a conductive element. Manufacturing machines by adding material capable of using different materials exist on the market, and are for example marketed by PHENIX SYSTEMS company based in RIOM in France, under the names PXL, PXM and PXS.
    [0015] These machines are capable of using insulating ceramics or metals, which makes it possible to manufacture a printed circuit comprising an insulating ceramic substrate and metallic conductive elements. In one embodiment, such a machine is used by changing the material used by the machine whenever necessary during the manufacture of the printed circuit by adding material. Alternatively, as shown in FIG. 6, it is possible to use a material addition manufacturing system comprising two separate material adding machines 22, 24, each using a respective material, and transferring the circuit 2 is printed from one machine to another, at each change of material added during manufacture by adding materials of the printed circuit 2, by means of a transfer device 26. A machine 22 uses the insulating material and the other machine 24 uses the conductive material. The transfer device 26 is synchronized with the machines 22, 24 to transfer the printed circuit 2 in synchronism with the operation of the machines 22, 24. The material addition system 20 comprises an electronic control unit 28 controlling the machines 22, 24 and the transfer device 26 synchronously. The printed circuit 2 of Figure 1 has a relatively conventional printed circuit structure, which is multilayer. However, the manufacture of the printed circuit by adding material, by producing both the conductive elements and the substrate together by adding material, makes it possible to obtain particular shapes. The printed circuit portion 2 illustrated in Figure 7 comprises an alternating stack of conductive elements 6, 6 ', 6 "and interspersed substrate portions 8, 8', comprising a first thin conductive element 6 'and a second element 6 "thick conductor sandwiched between two substrate portions 8, 8 ', located at the same level of the stack being. The first conductive element 6 'has a first thickness strictly less than that of the second conductive element 6. The first conductive element 6' and the second conductive element 6 "are electrically connected. The first thin conducting element 6 'and the second thick conducting element 6' can be used respectively for the transmission of low energy signals and the transmission of high energy signals With at least one of the two substrate parts 8, 8 'taking the first and second sandwich conductor elements 6 ', 6 "have a recess at the junction between the first thin conductive member 6' and the second thick conductive member 6" to account for the thickness variation between the first and second elements 10 conductors 6 ', 6 ". Here, one of the substrate portions 8 is flat and the other 8 'has a recess. The printed circuit board 2 of FIG. 8 has the form of a plate, and comprises a first zone 34 and a second zone 35 each formed of an alternating stack of conductive elements 6, 6 'and stacked intermediate substrate portions 8 15 in a stacking direction E. The first zone 34 has a number of conductive element strictly smaller than that of the second zone 35. The conductive elements 6 'of the first zone 35 have a thickness strictly less than that of the conductive elements 6 of the second zone 34. The first zone 34 and the second zone 35 here have the same thickness. Indeed, with the process of manufacturing by adding material, it is no longer necessary to provide thick conductive layers for the transmission of high energy signals and thin conductive layers for the transmission of low energy signals.
    [0016] It becomes possible to have conductive elements for transmitting low energy signals and high energy signal transmission conductive elements located at the same level, sandwiched between two substrate parts as in FIG. or to provide an area dedicated to high energy signals and another area dedicated to low energy signals as in Figure 8.
    [0017] The printed circuit 2 of FIG. 9 is in the form of a multilayer plate formed of an alternating stack of conductive elements 6 and of intermediate substrate parts 8, and has buried via 36 formed between conductive elements 6 separated by interposed substrate portions 8 of the printed circuit arranged in superposed layers. These buried via 36 are made much easier, without positioning stress and can be combined with each other much more easily. With the traditional method, it would have been necessary to drill a hole 30339778 throughout the circuit board and then metallize it to electrically bond the appropriate layers. This method causes the metallized hole to be at the potential of the signal to be passed between different layers. The conductive layers in which the potential does not have to be brought must be cut around the via. The material addition method of fabrication makes it possible to connect two conductive layers without having to make a metallized hole through the entire printed circuit. Thanks to the invention, the conductive elements that are not placed between the conductive layers to be connected are spared, which increases their usable area. A printed circuit may also have a heat sink function.
    [0018] Thus, the printed circuit 70 of FIG. 11, according to the state of the art, makes it possible to thermally bond a cold plate 72 and a hot electronic component 74 in order to cool the latter. The printed circuit 70 comprises a heat sink 76 formed by holes 78 (here four in number) passing through the printed circuit 70 and whose inner surface 80 is metallized to provide a favorable thermal path. Optionally, the holes 78 are filled with resin slightly promoting heat transfer. Nevertheless, over the entire heat sink 76, the quantity of thermally conductive material is largely in the minority in respect of the elements having poor thermal conduction properties which are the air or the resin used to fill the metallized hole and the material used as substrate .
    [0019] The heat sink 76 must optionally provide an electrical insulation function because the electrical potential of the electronic component 74 is not necessarily the same as that of the cold plate 72. This electrical insulation can be provided by an electrically insulating element 82 placed between the printed circuit 70 and the cold plate 72. However, the electrically insulating element 82 is generally also thermally insulating and the thickness of this electrically insulating element may be relatively important because it must take into account the tolerances of the electrically insulating element 82. assembly of the mechanical chain to ensure electrical insulation in all circumstances. The addition of this electrically insulating element further degrades the performance of the thermal drainage 76.
    [0020] The printed circuit 2 of FIG. 10 comprises a heat sink 38 passing through the printed circuit 2, between an electronic component 40 fixed on a first face 2 'of the printed circuit 2 and a heat sink 42 disposed on the second opposite face 2 "of the 2. The heat sink 38 is made of a block of solid material made by adding material, The heat sink 38 is made, for example, of the same material as the conductive elements 6.
    [0021] The heat sink passes through an orifice 44 extending through the printed circuit 2 between the first face 2 'and the second face 2 ".The orifice is tubular and delimited by a tubular substrate portion 46 formed in the substrate 4. The heat sink 38 is of complementary section to that of the orifice 44, so that it fills the orifice 44.
    [0022] Optionally, as illustrated in FIG. 10, the printed circuit 2 comprises an electrical insulation layer 48 covering between the heat sink and the dissipator, or, as in FIG. 10, between two parts 38A, 38B of the heat sink 38 The electrical insulation layer 48 electrically isolates the electronic component 40 from the dissipator. The electrical insulation layer 48 is formed by adding material manufacturing together with the heat sink 38 and the printed circuit as a whole. The printed circuit 2 of FIG. 12 here has an alternating stack of conductive elements 6 and intermediate substrate parts 8. The heat sink 38 passes through this stack from side to side, in the direction of the stacking direction. The printed circuit of FIG. 12 differs from that of FIG. 10 in that the interface between the two parts 38A, 38B of the heat sink 38 separated by the electrical insulation layer 48 is not flat, but has complementary overlapping reliefs. It follows that the electrical insulation layer 48 has a three-dimensional shape with hollows and bumps, here in section, a sawtooth shape. Other shapes are possible, for example a crenellated form. Such a geometry makes it possible to increase the exchange surface between the two parts of the heat sink 38, and to increase the efficiency of the heat removal despite the presence of the electrical insulation layer 48. The heat sink 38, the electrical insulation layer 48, and possibly the heat sink 42, are each formed by material addition manufacturing, during the fabrication of the printed circuit 2 by adding material. In one embodiment, the electrical insulation layer 48 is made of the same material as the substrate 4. In another embodiment, the electrical insulation layer 48 is made of a material different from that of the substrate 4. In this case, at least three materials are used for the manufacture of the printed circuit by adding materials. To do this, use is made of a machine for manufacturing by adding material suitable for using these materials, or, similarly to FIG. 6, a system comprising at least three material-making machines each using a respective material, and an automatic transfer device for transferring the printed circuit from one machine to another during manufacture.
    [0023] FIG. 13 illustrates a printed circuit 2 comprising a magnetic component, here a magnetic circuit 50 provided in the thickness of the printed circuit 2. The magnetic circuit 50 comprises a magnetic core 52 comprising three parallel branches, including a central branch 54 and two lateral branches 56, the integrated circuit 5 further comprising a coil 59 around the central branch. The printed circuit 2 has a general form of multilayer plate and comprises, around the magnetic circuit 50, an alternating stack of intermediate substrate portions 8 and conductive elements 6. The magnetic circuit 50 is formed in the volume of the printed circuit 2.
    [0024] The printed circuit 2 including the magnetic circuit 50 is formed by manufacturing by adding material. The coil 58 is formed of an alternating stack of substrate portions 8 and conductor element 6 formed during manufacture by adding material. The coil 58 is encapsulated in an envelope 59 formed by the substrate 4 and separating the conductive elements 6 from the coil 58 of the magnetic circuit 50.
    [0025] FIG. 14 illustrates a printed circuit 2 made by adding material, and including electronic components 60 buried in the printed circuit 2. The electronic components 60 are embedded inside the printed circuit 2, at distances of external faces 2 ' 2 "opposite of the printed circuit 2. They are here comprised in an inner layer sandwiched between two substrate portions 8, with conductive elements 6 also sandwiched between these two substrate portions 8. The electronic components 60 are For example, resistances and / or capacitors are obtained by manufacturing by adding material by adapting the material used and / or the arrangement of the different materials used.These buried electronic components are protected and make it possible to preserve the compactness of the printed circuit 2 by avoiding making metallized holes between the inner layer and one of the outer faces, where the component is The printed circuit 2 of Figure 15 has a non-planar, three-dimensional non-planar shape. The printed circuit 2 is self-supporting. Here, it has the shape of a plate with a boss 62. The printed circuit 2 is manufactured directly with this 3D shape by manufacturing by adding material. Thus, it is possible to give the printed circuit 2 any shape, depending for example on the space available in a housing of an electronic device in which the printed circuit must be integrated. Figure 16 illustrates an assembly comprising a printed circuit board 2 and a shell 64 of a housing of an electronic device, the printed circuit board 2 and the shell being made jointly by manufacturing by adding materials. The printed circuit 2 is thus integrated with the shell 64 of the housing of the electronic device. This allows easy manufacturing, a compact arrangement, and a rugged assembly. The housing is for example a housing of a telecommunication or geolocation user terminal, or an onboard avionic computer. This joint fabrication of the printed circuit and the case makes it possible to link them thermally and to dissipate the thermal energy generated by the components affixed to the printed circuit towards the box. The manufacture of the substrate and of the conductive elements of a printed circuit by material addition manufacturing makes it possible to realize configurations which are not possible with the manufacture of a printed circuit by stacking of elementary printed circuits comprising an insulating plate covered with one or two conductive layers. It is possible to realize the printed circuit with a multilayer structure comprising an alternating stack of conductive elements and interleaved substrate parts, but making it possible to form buried vias more easily, without additional manufacturing costs and between any layers of the printed circuit. . It is also possible to produce the printed circuit with a multilayer structure by placing conductive elements of different thicknesses between two substrate parts, to give a three-dimensional shape to a substrate portion separating conductive elements, and / or to provide connecting substrate portion interconnecting intercalated substrate portions for better insulation of the conductive elements. It is also possible to form a solid heat sink electrically conductive material, properly removing heat, which reduces the thermal drain section relative to a conventional heat sink. This makes it possible to improve the cooling of the components and to improve the compactness of the printed circuit. It is possible to integrate in the printed circuit electronic components (resistance, capacity ..) and / or magnetic components (magnetic circuit, magnetic coil ...), in the thickness of the printed circuit, see in internal layers of the printed circuit. The printed circuit can be obtained with a particular three-dimensional shape and / or integrated in a shell of an electronic device. All this allows to have much more freedom of design. It remains possible to organize the circuit board in alternating layers, but it also becomes possible to depart from this design mode, since there is no longer a geometric constraint.
    [0026] 3033977 12 The existing material-making machines make it possible to manufacture an integrated circuit with different materials, insulating or conductive, magnetic or nonmagnetic.
    权利要求:
    Claims (9)
    [0001]
    CLAIMS 1. A method of manufacturing a printed circuit (2) comprising an electrically insulating substrate (4) and electrically conductive elements (6, 6 ', 6 ") carried by the substrate (4), the method comprising the manufacture of the insulating substrate (4) and conductive elements (6) together, by manufacture by adding materials.
    [0002]
    2. A manufacturing method according to claim 1, comprising the manufacture of at least one zone in which a first conductive element (6 ') and a second conductive element (6 ") are sandwiched between two substrate parts (8). ), the first conductive element (6 ') having a thickness, taken between the two substrate portions (8), strictly smaller than that of the second conductive element (6 ").
    [0003]
    3. A manufacturing method according to claim 1 or 2, comprising manufacturing a first and a second distinct zone, each comprising an alternating stack of substrate portions and conductive elements, the first zone and the second zone. second zone having a number of conductive elements strictly less than the number of conducting elements of the second zone.
    [0004]
    4. A manufacturing method according to any one of the preceding claims, comprising the manufacture of at least one zone comprising at least one buried conductor via (36) connecting two conductive elements (6) separated by at least one substrate portion (8).
    [0005]
    5. A manufacturing method according to any one of the preceding claims, comprising the manufacture of at least one electronic component and / or at least one magnetic component formed in the thickness of the printed circuit.
    [0006]
    6. A manufacturing method according to any one of the preceding claims, comprising the manufacture of at least one heat sink (38) made in a hole (44) passing right through the printed circuit (2) in the direction of the thickness, the heat sink (38) comprising at least one solid metal block of complementary section to that of the hole.
    [0007]
    7. A manufacturing method according to any one of the preceding claims, wherein the printed circuit is formed with a non-planar stable three-dimensional form.
    [0008]
    The method of manufacture as claimed in any one of the preceding claims, wherein the printed circuit is fabricated by adding material together with an electronic device shell (64). 35
    [0009]
    9. Printed circuit obtained by a manufacturing method according to any one of the preceding claims.
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    同族专利:
    公开号 | 公开日
    FR3033977B1|2018-08-17|
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    引用文献:
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    EP3468312A1|2017-10-06|2019-04-10|AT & S Austria Technologie & Systemtechnik Aktiengesellschaft|Component carrier having a three dimensionally printed wiring structure|
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    法律状态:
    2016-03-31| PLFP| Fee payment|Year of fee payment: 2 |
    2016-09-23| PLSC| Publication of the preliminary search report|Effective date: 20160923 |
    2017-03-31| PLFP| Fee payment|Year of fee payment: 3 |
    2018-03-30| PLFP| Fee payment|Year of fee payment: 4 |
    2020-03-31| PLFP| Fee payment|Year of fee payment: 6 |
    2021-03-30| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1500551A|FR3033977B1|2015-03-20|2015-03-20|METHOD FOR MANUFACTURING A PRINTED CIRCUIT AND CORRESPONDING PRINTED CIRCUITS|
    FR1500551|2015-03-20|FR1500551A| FR3033977B1|2015-03-20|2015-03-20|METHOD FOR MANUFACTURING A PRINTED CIRCUIT AND CORRESPONDING PRINTED CIRCUITS|
    US15/074,503| US20160278200A1|2015-03-20|2016-03-18|Method of manufacturing a printed circuit and the corresponding printed circuit|
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