• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A light source module (100) includes a light source (100) that includes a light emitting element, a rod configured to support the light emitting element, and a terminal having an end electrically connected to the light emitting element a wiring board (200) to which the other end of the terminal is electrically connected and which is configured to electrically connect the terminal to an external power supply terminal, and a thermal diffusion element (300) which is disposed between the rod and the wiring board (200) and which is thermally connected to the light emitting element.
    公开号:FR3033623A1
    申请号:FR1652018
    申请日:2016-03-10
    公开日:2016-09-16
    发明作者:Toshiaki Tsuda
    申请人:Koito Manufacturing Co Ltd；
    IPC主号:
    专利说明:

    [0001] TECHNICAL FIELD [0001] The present invention relates to a light source module and more particularly to a light source module used in a vehicle lamp, for example an automobile lamp. PRIOR ART [0002] A light source module of the prior art has a structure in which a laser light source including a laser element and a metal rod on which the laser element is mounted and the structure is mounted on a card. circuit (see for example the patent document 1). In the light source module, the laser light source is connected to the circuit board in a state where it is press fit into a hole of a heat sink plate from the side surface of the rod. [0003] Patent Documents 1: Japanese Patent Laid-open Publication No. 2006-278361. [0004] The present inventor has extensively studied the prior art light source module described above and discovered accordingly that there is room for improvement in the heat dissipation of the light source in the light source module of the prior art. SUMMARY [0005] Exemplary embodiments of the invention provide a light source module capable of improving the heat dissipation of a light source. [0006] One aspect of the present invention is a light source module. The light source module comprises: a light source that includes a light emitting element, a rod configured to support the light emitting element, and a terminal having an end electrically connected to the light emitting element; A wiring board to which the other end of the terminal is electrically connected and which is configured to electrically connect the terminal to an external power terminal; and a thermal diffusion member which is disposed between the rod and the wiring board and which is thermally connected to the light emitting element. According to this aspect, it is possible to improve the heat dissipation of the light source. [0007] The thermal diffusion element may comprise a first surface facing the wiring board, a second surface facing the wiring board and located in a position spaced from the wiring board with respect to the first surface and a through hole extending from the second surface to a surface of the light source side. The wiring board may be arranged so that an end region of the wiring board is superimposed with the second surface, viewed in the superposition direction of the light source, the thermal diffusion member, and the wiring board. The terminal may be inserted through the through hole and is electrically connected to the wiring board at the end region.
    [0002] According to this aspect, it is possible to improve the reliability of the connection between the light source and the wiring board. The light source module may further comprise a flexible insulation element disposed between the second surface and the end region.
    [0003] According to this aspect, it is possible to guarantee the electrical insulation between the wiring board and the thermal diffusion element. The wiring board and the terminal can be fixed to one another by means of a connection element. The terminal may have a curved portion which is deformed depending on the change in size of at least one of the thermal diffusion element, the terminal, the wiring board and the connection element. In this aspect, it is possible to further improve the decrease in the reliability of the connection between the light source and the wiring board. The thermal diffusion member may include a connection surface that is connected to a heat sink and the connection surface may be located at a position spaced from the light source with respect to the wiring board.
    [0004] According to this aspect, it is possible to improve the degree of freedom of the arrangement of the heat sink. [0009] According to the present invention, it is possible to provide a technology for improving the heat dissipation of a light source. BRIEF DESCRIPTION OF THE DRAWINGS The invention will be better understood and its advantages will be better understood on reading the detailed description which follows. The description refers to the following drawings, which are given by way of example. [0010] Figure 1 is a sectional view showing a schematic structure of a light source module according to a first embodiment.
    [0005] Fig. 2 is a perspective view showing a schematic structure of a light source module according to the first embodiment. Fig. 3 is a sectional view showing a schematic structure of a light source.
    [0006] Fig. 4 is an enlarged sectional view showing the vicinity of the connection portion of the light source module according to the first embodiment. Fig. 5 is an enlarged sectional view showing the vicinity of the connection portion of the light source module according to a second embodiment.
    [0007] Figure 6 is a sectional view showing the vicinity of the connection portion of the light source module according to a third embodiment. FIG. 7 is a schematic view for explaining the deformation of curved portions as a function of the change in dimensions of at least one of a thermal diffusion element, a terminal, a wiring board and a connection element. DETAILED DESCRIPTION [0011] Examples of embodiments of the present invention will be described hereinafter with reference to the drawings. Identical or similar elements, components and processes shown in each of the drawings are represented by like or similar reference numerals and the repetition of their description will be omitted. In addition, each embodiment is explanatory and is not intended to limit the present invention. It will be appreciated that all the features and combinations thereof described in each embodiment are not necessarily considered an essential part of the present invention. [0012] (First Embodiment) Fig. 1 is a sectional view showing a schematic structure of a light source module according to a first embodiment. In Fig. 1, the internal structures of a light source 100 and an external power supply terminal 600 are not shown. In addition, the portion of a wiring pattern excluding a bearing portion 206 is not shown. Fig. 2 is a perspective view showing a schematic structure of the light source module according to the first embodiment. Fig. 3 is a sectional view showing a schematic structure of the light source. A light source module 1 according to the present embodiment is used for example in a vehicle lamp. As shown in FIGS. 1 and 2, the light source module 1 comprises the light source 100, a wiring board 200 and a thermal diffusion element 300. As shown in FIGS. 1 to 3, the The light source 100 comprises, as a main configuration, a cover 102, a light emitting element 104, a rod 106 and at least two terminals 108, 110. The light source 100 has, for example, a box-type package. of the prior art. That is, the light source 100 has a structure such that the terminals 108, 110 extend outwardly through the rod 106 from a space for receiving the transmitting element. As a result, the terminals 108, 110 protrude from the main surface 10 of the rod 106 which is a main heat dissipating surface of the light source 100. The light source 100 excites a phosphor by means of a laser, thus producing white light. Specifically, the light source 100 has an internal space 103 formed by the cover 102 and the rod 106. The light emitting element 104 is received in the internal space 103. The internal space 103 is hermetically closed. The light emitting element 104 is a laser element of the prior art and the wavelength of its laser light is, for example, in the range of 380 to 470 nm. The rod 106 is a plate-like metal member and supports the light-emitting element 104. Specifically, a heat dissipation block 112 is attached to the surface of the rod 106, which is in contact with the light-emitting element 106. In addition, a secondary mount 114 is attached to the heat dissipating block 112 and the light emitting element 104 is mounted to the secondary mount 114. Accordingly, the stem 106 supports the light emitting element. 104 through heat dissipation block 112 and secondary mount 114. [0015] An electrode of light emitting element 104 is electrically connected to one end of one terminal 108. The other electrode of FIG. the light emitting element 104 is electrically connected to one end of the other terminal 110. The terminals 108, 110, are fixed to the rod 106 in a state where they are electrically isolated from the rod 106. A window 1 02a to outwardly extract the light from the light emitting element 104 is provided on the upper surface of the cover 102. The window 102a is provided with a wavelength converting portion 116 to convert the wavelength of at least a portion of the light of the light emitting element 104. As the wavelength converting portion 116, those obtained by dispersing a powder phosphor in transparent resin or glass, or a ceramic obtained by sintering the powdered phosphor, or the like, are given as an example. A lens 118 is provided on the optical path of the emission light from the light emitting element 104 between the light emitting element 104 and the wavelength converting portion 116. The lens 118 is, for example a collimator lens for converting the light emitted by the light emitting element 104 into parallel light. [0016] The wiring board 200 is an element for electrically connecting the terminals 108, 110 of the light source 100 at the external power supply terminal 600. The wiring board 200 is for example a printed wiring board of the prior art. The wiring board 200 includes a resin board 202 such as an epoxy glass board and a conductive wiring pattern (not shown) formed on the surface of the board 202. Accordingly, the wiring board 200 may be deformed. elastically to a certain extent. The card 202 has through-holes 202a in a region on which the light source 100 is mounted. The wiring pattern includes the support portion 206 in a region on which the light source 100 is mounted. In one embodiment, the bearing portion 206 includes a through-hole electrode structure extending from the major surface of the card 202 to the other major surface of the card 202 through the inner wall surface of the through-holes. 202a. In this way, it is possible to increase the area where the terminals 108, 110 and the bearing portion 206 are connected to each other by means of a connection element 204a. The other ends of the terminals 108, 110 are inserted into the through holes 202a of the card 202. The other ends of the terminals 108, 110, and the support portion 206 of the wiring pattern are electrically connected to each other. the others being fixed to each other by means of the connecting element 204a, for example a weld. In this manner, a connection portion 204 is formed between the wiring board 200 and the terminals 108, 110. [0018] The power supply terminal 600 is provided in a predetermined region, for example, at the the peripheral edge portion of the card 202. In the present embodiment, the bearing portion 206 is disposed in an end region 208 of the wiring board 200, and the external power terminal 600 is disposed in an end region opposite the end region 208. The direction in which the support portion 206 and the external power supply terminal 600 are arranged, i.e. the direction of extension of the wiring board 200 is a direction that intersects the superposition direction of the light source 100, the thermal diffusion member 300 and the wiring board 200. In addition, in the present embodiment, the terminal 15 600 external power supply is presented It is shaped like a connector. An external power supply is connected to the external power supply terminal 600. In addition, wiring (not shown) is electrically connected to the external power supply terminal 600 and the support portion 206. Accordingly, when the external power supply is connected to the external power supply terminal 600, power is supplied to the light emitting element 104 via the external power supply terminal 600, the wiring pattern, the connection portion 204 and terminals 108, 110. In addition, a control circuit (not shown) for controlling the output of light emitting element 104 or a thermistor (not shown) for detecting the temperature of the source of light. light 100 or the like is provided on the board 202. [0020] The thermal diffusion member 300 is made of a material having a high thermal conductivity, such as a metal. As the metal used for the thermal diffusion element 300, aluminum or the like can be exemplified. At least a portion of the thermal diffusion member 300 is disposed between the rod 106 of the light source 100 and the wiring board 200. The thermal diffusion member 300 is thermally connected to the light emitting element 104 The thermal diffusion member 300 is attached to the wiring board 200 by means of a fastener (not shown) such as for example a screw. The thermal diffusion member 300 has through holes 300a in positions corresponding to the through holes 202a of the card 202. The terminals 108, 110 are inserted through the through holes 300a and the through holes 202a and their forward ends are electrically connected to the bearing portion 206 at the connection portion 204. The heat generated in the light emitting element 104 may be diffused by the thermal diffusion element 300. light emitting element 104 is transferred to the thermal diffusion member 300 via the secondary mount 114, the heat sink block 112 and the rod 106. The thermal diffusion member 300 is in contact with the main surface of the rod 106. Accordingly, it is possible to increase the contact area between the rod 106 and the thermal diffusion member 300, as compared to the case wherein the thermal diffusion member 300 is in contact only with the side surface of the rod 106. Accordingly, it is possible to increase the heat dissipation of the light source 100. The diffusion element thermal 300 comprises a connection surface 302 connected to a heat sink 400. The thermal diffusion element 300 and the heat sink 400 are fixed to each other by means of fasteners 500 such as screws in the housing. a state in which the heat sink 400 is in contact with the connection surface 302. The heat transferred to the thermal diffusion element 300 is mainly dissipated through the heat sink 400. The connection surface 302 is arranged in a position spaced from the light source 100 relative to the wiring board 200. In this way, by shifting the position of the connection surface 302 with respect to the position of the wiring board 200 in the stacked direction of the light source 100, the thermal diffusion member 300 and the wiring board 200, the heat sink 400 and the wiring board 200 can be prevented from interfering with each other. As a result, the degree of freedom of the arrangement of the heat sink 400 is improved and the dimensions of the heat sink 400 can be increased. The shape of the thermal diffusion member 300 and the arrangement of the wiring board 200 are hereinafter described in more detail. As described above, the thermal diffusion member 300 is sandwiched between the wiring board 200 and the rod 106. When the thermal diffusion member 300 is disposed in this manner between the wiring board 200 and the 106, it is possible to improve the heat dissipation of the light source 100. However, at the moment when the temperature increases due to the heat of the light source 100 and the temperature decreases due to heat dissipation, the thermal diffusion member 300 expands or contracts and thus its dimensions change. In the structure described above, for example, as the thermal diffusion member 300 expands and as its dimensions increase, a force A (force in the direction indicated by the arrow A in FIG. the space between the light source 100 and the connection portion 204 appears in the light source module 1. Similarly, the terminals 108, 110, the wiring board 200 and the connecting member 204a expand. or contract with the temperature variation due to absorption and heat dissipation and thus, their dimensions change. The force A can also appear according to this variation of the dimensions. When the force A appears, a stress is applied to the connecting portion 204. As a result, a crack or the like appears in the connecting portion 204 and thus it is possible that the reliability of the connection between the light source 100 and the wiring board 200 decreases. On the other hand, the light source module 1 of the present embodiment comprises a structure described below. Fig. 4 is an enlarged sectional view showing the vicinity of the connection portion of the light source module according to the first embodiment. In Fig. 4, the internal structure of the light source 100 and the portion of the wiring pattern excluding the bearing portion 206 are not shown. As shown in FIG. 4, the thermal diffusion element 300 has a first surface 304 facing the wiring board 200 and a second surface 306 facing the wiring board 200 and disposed in a spaced apart position. the wiring board 200 relative to the first surface 304. In the present embodiment, the first surface 304 is in direct contact with the wiring cradle 200. However, another member may be interposed between the first surface 304 and the first surface 304. The wiring board 200. That is, as shown in Figures 2 and 4, the thermal diffusion member 300 has a substantially flat base portion 308 having a cut-away portion 308a and a covering portion 310 protruding towards the light source 100 from the base portion 308 and covering the cut portion 308a. The base portion 308 includes the connecting surface 302. The light source 100 is mounted on the major surface of the cover portion 310. An insertion portion for the wiring board 200 is formed by the inner surface of the cut portion 308a and the other major surface of the cover portion 310. A concave portion 312 is provided in the other major surface of the cover portion 310. The lower surface of the concave portion 312 constitutes the second surface 306. In addition, the region of the other major surface of the overlap portion 310 different from the region where the concave portion 312 is provided is the first surface 304. The through hole 300a is provided in the cover portion 310 and extends from the second surface 306 to the surface of the cover portion 310 on the side of the light source 100. The side of the end region 208 of the wiring board 200 on which is disposed the bearing portion 206 is inserted into the insertion portion. Accordingly, the wiring board 200 is arranged so that the end region 208 overlaps with the second surface 306, viewed in the superimposition direction B (direction indicated by the arrow B in FIG. 4) of the source. 100, the thermal diffusion member 300 and the wiring board 200. In addition, the terminals 108, 110, are inserted through the through hole 300a and through hole 202a and are electrically connected to the bearing portion 206 of the wiring board 200 at the end region 208. The wiring board 200 is attached to the first surface 304 of the thermal diffusion member 300 by fasteners (not shown) such as that screws, for example. The end region 208 is for example a region from the end (outermost end) of the card 202 to the support portion 206. The second surface 306 is spaced from the wiring card 200. Relative to the first surface 304. Accordingly, in the state in which the wiring board 200 is attached to the thermal diffusion element 300, a space corresponding at least to the depth of the concave portion 312 appears between the end region 208 and second surface 306. In addition, end region 208 is not attached to the insertion portion but is configured as a free end. As a result, the end region 208 of the wiring board 200 can be displaced by its own elasticity as a function of the change in dimensions of at least one of the thermal diffusion elements 300, the terminals 108, 110, of the wiring board. 200 and the connection portion 204. Specifically, when the force A appears due to the variation of the dimensions at least in one of the thermal diffusion element 300, terminals 108, 110 of the wiring board 200 and the connecting member 204a, a moving force in a direction in which the light source 100 is arranged and the wiring board 200 is applied to the connection portion 204. When the force is applied to the connection portion 204, the wiring board 200 is elastically deformed with the portion in contact with the first surface 304 as a pivot point and the end region 208 is moved. In this way, the connection portion 204 is allowed to move according to the change in dimensions of at least one of the thermal diffusion element 300, the terminals 108, 110, the wiring board 200 and the connection element 204a. As a result, the stress applied to the connection portion 204 is attenuated. That is, the wiring board 200 serves as a strain relief mechanism to attenuate the stress applied to the connection portion 204 as a function of the change in dimensions of at least one of the diffusion element 300, terminals 108, 110, of the wiring board 200 and the connection element 204a. Further, since a gap 5 appears between the end region 208 and the second surface 306, it is possible to ensure electrical isolation between the backing portion 206 and the thermal diffusion member 300. [0031] As described above, the light source module 1 according to the present embodiment comprises the thermal diffusion element 300 which is disposed between the rod 106 and the wiring board 200 and which is thermally connected to the transmitting element. In this way, it is possible to increase the area of contact between the rod and the thermal diffusion element, with respect to the case where the thermal diffusion element is in contact with the side of the rod. as in the prior art. As a result, it is possible to improve the heat dissipation of the light source 100. In addition, the thermal diffusion element 300 has the first surface 304 facing the wiring board 200 and the second surface 306 facing the wiring board 200 and disposed in a position spaced from the wiring board 200 relative to the first surface 304. The wiring board 200 is arranged so that the surface of the end region 208 facing the Thermal diffusion element 300 is facing the second surface 306. In addition, terminals 108, 110, are electrically connected to wiring board 200 at end region 208. Thus, the end region 208 may be displaced depending on the change in size of at least one of the thermal diffusion member 300, the terminals 108, 110, the wiring board 200, and the connection member 204a. As a result, it is possible to increase the reliability of the connection between the light source 100 and the wiring board 200. As a result, it is possible to obtain both an improvement in the heat dissipation of the source of light. light 100 and improve the reliability of the connection between the light source 100 and the wiring board 200. [0033] Second embodiment A light source module 1 according to a second embodiment has the same configuration that the light source module 1 according to the first embodiment, except that a flexible member 700 is also provided. The light source module 1 according to the second embodiment will be described hereinafter focusing on the different configurations of those of the first embodiment, and the common configurations will be briefly described or omitted. Figure 5 is an enlarged sectional view showing the vicinity of a connecting portion of the light source module according to the second embodiment. In Fig. 5, the internal structure of the light source 100 and the portion of the wiring pattern excluding the support portion 206 are not shown. As shown in FIG. 5, the light source module 1 according to the present embodiment comprises the flexible element 700, adding to the configurations described in the first embodiment. The flexible member 700 is made of an insulating material such as rubber and is disposed between the second surface 306 and the end region 208. It is thus possible to more reliably secure the electrical insulation between the bearing portion 206 and the thermal diffusion member 300. In addition, in the present embodiment, the flexible member 700 also extends between the inner wall surface of the through hole 300a and terminals 108, 110. It is thus possible to more reliably secure the electrical insulation between the terminals 108, 110, and the thermal diffusion element 300. In the portion of the flexible element 700 which is interposed between the end region 208 and the second surface 306, at least a portion of the surface facing the end region 208 is substantially level with the first surface 304. That is, the surface of the flexible element 700 turned towards the end region 208 and first surface 304 are in the same plane. Accordingly, in the state in which the wiring board 200 is attached to the first surface 304 of the thermal diffusion member 300, the wiring board 200 is in contact with the flexible member 700. In this way , the posture of the wiring board 200 can be stabilized. The flexible member 700 may be sufficiently elastically deformed to absorb the displacement of the end region 208 as a function of the change in size of the thermal diffusion member 300 or the like. Accordingly, the end region 208 can be displaced depending on the change in the dimensions of the thermal diffusion member 300 or the like, even when the flexible member 700 is in contact with the end region 208. for example, the flexible member 700 can absorb the stress applied to the connection portion 204 when the light source module 1 vibrates due to a force from the outside. In addition, since the flexible member 700 is in contact with the end region 208, the first surface 304 may be further spaced from the connection portion 204. extension of the second surface 306 can be increased. In this way, a support point when the wiring board 200 is elastically deformed can be spaced from the end region 208. As a result, the wiring board 200 is more easily elastically deformed. Accordingly, it is possible to more reliably mitigate the stress applied to the connecting portion 204. The flexible member 700 is configured such that the portion 25 extending between the second surface 306 and the region End plate 208 includes a larger dimension in the extension direction of wiring board 200 than the portion extending through through hole 300a. In this way, the area where the flexible member 700 is in contact with the wiring board 200 can be increased and it is thus possible to further stabilize the posture of the wiring board 200. [0039] (Third embodiment A light source module 1 according to a third embodiment has the same configuration as the light source module 1 according to the first embodiment, except that the terminals 108, 110, further comprise portions curved 108a, 3033623 and 110a. The light source module 1 according to the third embodiment will be described below by focusing on the different configurations of those of the first embodiment and the description of the common configurations will be omitted. Fig. 6 is a sectional view showing a schematic structure of a light source which is included in the light source module according to the third embodiment. Fig. 7 is a schematic view for explaining the deformation of the curved portions as a function of the change in size of at least one of the thermal diffusion member, terminals, wiring board and connecting member. . The left view of FIG. 7 shows the state of the curved portions before deformation and the right view of FIG. 7 shows the state of the curved portions after deformation. As shown in FIG. 6, the light source 100 included in the light source module 1 according to the present embodiment is configured so that the curved portions 108a, 110a are provided in the terminals 108, 110. The curved portions 108a, 110a are provided on the other end side (on the side opposite the side connected to an electrode of the light emitting element 104) of the terminals 108, 110 with respect to the rod 106. curved portions 108a, 110a have a structure which is bent so as to project in a direction intersecting the direction in which the light source 100 and the wiring board 200 are arranged. That is, the curved portions 108a, 110a have a spring structure and serve as a stress attenuation mechanism for attenuating the stress applied to the connection portion 204 as a function of the change in dimensions of at least one of the diffusion element. 300, terminals 108, 110, wiring board 200 and connection member 204a. As shown in FIG. 7, the curved portions 108a, 110a are deformed as a function of the change in dimensions of at least one of the thermal diffusion element 300, terminals 108, 110, of the wiring board. 200 and the connection member 204a. Specifically, when the force A appears due to the variation of the dimensions of the thermal diffusion member 300 or the like, the terminals 108, 110 are stretched in its extension direction and thus the curved portions 108a, 110a are deformed into a shape closer to a straight line.
    [0008] In this way, the distance between the two end portions of the terminals 108, 110 increases and the distance between the light source 100 and the connection portion 204 can change depending on the change in the dimensions of the diffusion element. thermal 300 or the like. As a result, the stress applied to the connection portion 204 is attenuated. As a result, it is possible to increase the reliability of the connection between the light source 100 and the wiring board 200. On the other hand, the curved portions 108a, 110a may have a curved shape. Alternatively, the bent portions 108a, 110a may be bellows shaped. In addition, curved portions 108a, 110a may be formed by a bend which is obtained by crushing and bending a predetermined region of the terminals 108, 110, or may be formed by means of a conductive strip. Further, the curved portions 108a, 110a may be formed such that the leading ends of the terminals 108, 110 protruding from the through hole 202a are folded toward the card 202. That is, the parts Curved portions 108a, 110a may be formed by clip portions disposed at the front end portions of terminals 108, 110. [0044] The present invention is not limited to the respective embodiments described above or their modifications. The respective embodiments and their modifications may be combined or other modification such as various design variations may be added to the respective embodiments, based on the knowledge of those skilled in the art. New embodiments that are achieved by such combinations or additional modifications are also included within the scope of the present invention. These new embodiments have the effects of the respective embodiments that are combined and their modifications. In the light source module 1 according to the first embodiment, both the flexible member 700 and the curved portions 108a, 110a may be provided or only one of these may be provided. In addition, in the respective embodiments, the light source 100 may be a laser light source having a different package than a can package. In addition, the light emitting element 104 may be an LED or the like. Furthermore, in the respective embodiments, the posture of the light source 100 with respect to the position of the external power supply terminal 600, for example the terminal arrangement direction 108, 110, is not limited to those represented.
    权利要求:
    Claims (5)
    [0001]
    REVENDICATIONS1. A light source module (1) comprising: a light source (100) which comprises a light emitting element (104), a rod (106) configured to support the light emitting element (104) and a terminal (108, 110) having an end electrically connected to the light emitting element (104); characterized in that it comprises a wiring board (200) to which the other end of the terminal (108, 110) is electrically connected and which is configured to electrically connect the terminal (108, 110) to a terminal of external power supply (600); and a thermal diffusion member (300) which is disposed between the rod (106) and the wiring board (200) and is thermally connected to the light emitting element (104).
    [0002]
    The light source module according to claim 1, wherein the thermal diffusion member (300) has a first surface (304) facing the wiring board (200), a second surface (306) facing the board. cabling (200) and located in a position spaced from the wiring board (200) relative to the first surface (304) and a through hole (300a) extending from the second surface (306) to a surface of the side a light source, wherein the wiring board (200) is arranged such that an end region (208) of the wiring board (200) is superimposed with the second surface (306), viewed in the direction for superimposing the light source (100), the thermal diffusion member (300) and the wiring board (200), and wherein the terminal (108, 110) is inserted through the through hole (300a). ) and is electrically connected to the wiring board (200) at the end region (20). 8).
    [0003]
    The light source module (100) of claim 2, further comprising: a flexible insulation member (700) disposed between the second surface (306) and the end region (208). 35
    [0004]
    The light source module (100) according to claim 2 or 3, wherein the wiring board (200) and the terminal (108, 110) are attached to each other by means of an element connection piece (204a), and wherein the terminal (108, 110) has a curved portion (108a, 110a) which is deformed depending on the change in size of at least one of the thermal diffusion member (300) , the terminal, the wiring board (200) and the connecting element (204a).
    [0005]
    The light source module (100) according to any one of claims 1 to 4, wherein the thermal diffusion member (300) has a connection surface (302) which is connected to a heat sink (400). and wherein the connection surface (302) is located at a position spaced from the light source (100) with respect to the wiring board (200).
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    2018-04-20| PLSC| Search report ready|Effective date: 20180420 |
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    优先权:
    申请号 | 申请日 | 专利标题
    JP2015048588A|JP6553901B2|2015-03-11|2015-03-11|Light source module|
    JP2015048588|2015-03-11|
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