• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a composite structure comprising an organic resin and carbon fibers, characterized in that it further comprises nanosheets of planar structure of graphene embedded in said resin. This structure combining good properties in terms of mechanical strength, thermal conductivity and electrical conductivity can advantageously be used for heat dissipation devices, as a solar generator substrate or even as a package of electronic components, embedded in satellites.
    公开号:FR3028515A1
    申请号:FR1402561
    申请日:2014-11-14
    公开日:2016-05-20
    发明作者:Martine Lutz；Dima Tanzilli；Nicolas Burger；Abdelghani Laachachi
    申请人:Thales SA；Centre De Rech Public Henri Tudor；Centre de Recherche Public Henri Tudor；
    IPC主号:
    专利说明:

    [0001] The field of the invention is that of composite mechanical structures having good properties in terms of mechanical strength, thermal conductivity and thermal conductivity. The composite structure comprises a resin filled with flat sheets of graphene with enhanced thermal conductivity and electrical conductivity, in particular for satellite. electrical conductivity especially for applications in the field of space, and can be integrated into telecommunications satellites, scientific observation.
    [0002] In general, devices for space applications must meet increasingly stringent performance. As far as telecommunications satellites are concerned, they are carrying an ever-increasing number of increasingly complex equipment that consumes more energy, producing more heat.
    [0003] In addition, future telecommunications satellite platforms must meet increasingly stringent performance requirements (pointing accuracy of antennas, mass ....). Thus, telecommunications satellites must be able to dissipate the heat produced by the onboard equipment in a high performance manner, in order to guarantee the durability of their performance. At the same time, the increasing multiplicity of on-board equipment, as well as economic reasons, impose on embedded components ever more severe mass constraints. Telecommunication satellites usually use heat sinks in the form of dissipative panels, commonly referred to as "North-South panels" or "North-South walls", because of their special arrangement on the surface of the satellites. North-South walls are typically comprised of heat conduction panels and devices, the latter commonly referred to as heat pipes, and usually consisting of networked tubular structures and within which a coolant circulates. For most satellite systems, the structure of the North - South walls is typically made of aluminum. In the same way, the heat pipes are typically made of aluminum. Aluminum 35 is preferred because it offers good characteristics of thermal conductivity, as well as physical properties facilitating extrusion, a process particularly suitable for obtaining tubular structural parts. In addition, aluminum offers known characteristics of lightness. Telecommunications satellites can also use shelving, supporting the equipment and heat transfer means allowing a transfer of the heat released by the equipment towards dissipative panels of North-South panel type, for example. In a similar manner, the components forming the shelves are in a preferred manner made of aluminum.
    [0004] As regards the observation and scientific satellites, particular missions requiring both rigid structures and heat-controlled panels by heat pipes are possible, particularly for the exploration of hot planets and the sun. In order to best satisfy the aforementioned constraints, and in particular the constraints related to the mass of the systems, it is envisaged to use alternative structures to the known aluminum structures. In particular, it is envisaged to use composite materials having smaller masses. In particular, composite structures based on carbon are envisaged. Indeed, recent developments allow the realization of composite structures containing carbon fibers enriched in graphite, or "graphitized". Such fibers offer very satisfactory characteristics in terms of thermal conduction. Composite structures incorporating graphitized carbon fibers are thus envisaged, in particular for producing the structure forming the plane of North - South satellite panels, for which good thermal conductivity characteristics are sought. According to techniques known from the state of the art, the use of highly graphitized carbon fibers can be matched with the use of a second carbon fiber, of the "high-strength" type, overcoming the insufficient mechanical strength of the first. Typically, the first conductive fiber may be disposed substantially perpendicular to the main axis of the heat pipes, and the second fiber, of high strength, substantially in the direction of the main axis of the heat pipes. Thus, a succession of layers comprising highly graphitized carbon fibers embedded in a resin, and 3 layers comprising high strength carbon fibers substantially aligned perpendicular to the fibers of the neighboring layers, can be realized. It is also possible to alternate layers in which carbon fibers are arranged in alignment at a certain angle, for example 45 °, with the fibers arranged in the adjacent layers; such a configuration, formed by a superposition of layers comprising fibers of heterogeneous nature, makes it possible to confer composite structures whose isotropic properties are improved. In this context, the Applicant has filed a patent application published under the reference 2 960 218, describing a solution based on organic resin and carbon fibers, the resin being loaded with carbon nanotubes. In order to achieve a heat sink, the composite material is coupled to the use of heat pipes, however this solution does not ensure that imperfectly a current return structure. According to this solution, the doped resin has become slightly electrically conductive, which already simplifies the implementation of the metallization (no scratching operation necessary in contrast to standard composites), but not enough to overcome metallization tracks to ensure the current return.
    [0005] Therefore, the object of the present invention is a new composite mechanical structure with enhanced mechanical strength and whose thermal conductivity and electrical conductivity are also improved. The originality of this structure lies in the use of graphene nanosheets as a filler of the resin, of planar structure, which may have specific surface areas greater than the charges currently proposed in the solutions of the known art, and in particular that based on carbon nanotubes. The solution proposed in the present invention consists of a structure whose very good properties in terms of mechanical strength, very good thermal conductivity and very good electrical conductivity thus makes it possible to envisage various applications in embedded structures on board a satellite, such as heat sinks, boxes for electronic components or even as a substrate for solar generators.
    [0006] More specifically, the subject of the present invention is a composite structure comprising an organic resin and carbon fibers, characterized in that it furthermore comprises nanosheets of planar graphene structure embedded in said resin.
    [0007] The advantage of using graphene nanosheets lies particularly in the very good properties of thermal conductivity, due to their large specific surface area, their sheet morphology, their large form factor and their length, and in the very good properties of electrical conductivity increased compared to that of carbon nanotubes. In fact, the dimensions of the nanosheets of planar structure are of the order of a few tens of microns, making it possible to increase in a consequent manner, their specific surface area with respect to those of carbon nanotubes, which can comprise a length of nanotube of the same order of magnitude but with a much smaller diameter.
    [0008] According to a variant of the invention, said composite structure comprises stacks of some graphene nanosheets of planar structure embedded in said resin. According to one variant of the invention, the nanosheight mass loading rate in the resin is between 5% and 20%.
    [0009] According to a variant of the invention, the specific surface area of the graphene nanosheets is greater than or equal to 500 m 2 / g, advantageously it may be greater than 750 m 2 / g. According to a variant of the invention, the structure comprises an alternating succession of layers comprising a first plurality of carbon fibers arranged in a determined alignment, and layers comprising a second plurality of carbon fibers disposed in an alignment substantially perpendicular to the aligning said first plurality of carbon fibers. According to a variant of the invention, the composite structure is formed by a fabric made by entangling a first plurality of carbon fibers arranged in a predetermined alignment, and a second plurality of carbon fibers arranged in alignment. substantially perpendicular to the alignment of said first plurality of carbon fibers.
    [0010] The invention also relates to a heat dissipation device, in particular for spatial application, comprising at least one dissipative panel, the dissipative panel comprising at least one skin made in the composite structure according to the invention.
    [0011] The invention also relates to a heat dissipation device comprising at least one skin made in the composite structure of the invention. According to a variant of the invention, the skin is assembled to a network of heat pipes. According to a variant of the invention, the dissipative panel comprises an inner skin and an outer skin of planar shape arranged parallel to one another and secured via structural elements. According to a variant of the invention, the heat dissipating device comprises an inner skin and an outer skin of planar shape arranged parallel to one another and secured via structural elements. According to a variant of the invention, the structural elements are formed by a honeycomb configuration of aluminum tubes. According to a variant of the invention, the structural elements are formed by a conductive foam. According to a variant of the invention, the heat pipe network is disposed externally to the dissipative panel on the surface of the inner skin. According to a variant of the invention, the network of heat pipes is disposed internally to the dissipative panel, between the inner and outer skins. According to a variant of the invention, the heat pipe network comprises one or a plurality of substantially tubular heat pipes, made of aluminum.
    [0012] According to a variant of the invention, the heat pipe network comprises one or a plurality of substantially tubular heat pipes, made of an aluminum alloy incorporating elements of low coefficient of thermal expansion.
    [0013] According to a variant of the invention, the assembly of the heat pipes to the skins is carried out by means of organic resin enriched with nanosheets of planar structure of graphene. The invention also relates to a fixed dissipative panel for 5 satellites, characterized in that it is formed by at least one heat dissipation device according to the invention. The invention also relates to a deployable dissipative panel for satellite, characterized in that it is formed by at least one heat dissipation device according to the invention. The subject of the invention is also a box of electronic equipment, in particular for spatial application, comprising electronic components positioned in a container, characterized in that said container comprises the composite structure according to the invention. Typically, the thickness of said composite structure is greater than or equal to a few millimeters, making it possible to stiffen said structure. The invention also relates to a solar generator substrate characterized in that it comprises a composite structure according to the invention. Typically the thickness of said composite structure is of the order of one-tenth of a millimeter, said structure being flexible. The invention also relates to a solar panel comprising a solar generator substrate according to the invention and a set of photovoltaic cells.
    [0014] The present invention will be better understood and other advantages will become apparent on reading the following description given by way of non-limiting example and with reference to the appended figures in which: FIG. 1 illustrates a graphene nanosheet used in a composite structure according to FIG. invention; Figure 2 provides a theoretical representation of the heat diffusion mechanisms in the composite samples as a function of the form factor of the charges dispersed in a resin; FIG. 3 illustrates the evolution of the performances in terms of thermal conductivity expressed in W / mK as a function of the mass load rate 3028515 in the case of resin loaded with carbon nanotubes and in the case of resin loaded with planar structure nanosheets. graphene; FIG. 4 illustrates the evolution of the performances in terms of electrical conductivity expressed in Log [S 1m] as a function of the mass loading rate in the case of resin loaded with carbon nanotubes and in the case of resin loaded with structural nanosheets. plane of graphene; FIG. 5 illustrates a perspective view illustrating a known structure 10 of a heat dissipation device for a telecommunication satellite; FIGS. 6 and 7 illustrate sectional views of a heat dissipation device comprising a dissipative panel with the composite structure of the invention and a heat pipe network, in a first exemplary embodiment; 8 illustrates a sectional view of a heat dissipation device comprising a dissipative panel with the composite structure of the invention and a heat pipe network, in a second embodiment; Figure 9 illustrates an example of a solar panel comprising as a substrate a composite structure of the invention. In general, the composite structure of the present invention comprises a resin filled with nanosheets of planar graphene structure and carbon fibers. In a recognized manner, a planar graphene nanofill is defined as being a single sheet of pure carbon, crystallized into a honeycomb structure, of a thickness the size of a carbon atom, such as the sheet illustrated in FIG. Figure 1. Its structure makes graphene an exceptional material, combining excellent mechanical, thermal and electrical properties. However, it is difficult to obtain experimentally a single sheet of 100% pure graphene, generally having oxygen functions at these ends and / or some re-aggregation of the sheets leading to a form closer to graphite.
    [0015] The composite structure of the present invention can thus typically comprise a stack of a few graphene nanosheets of planar structure that can typically have a thickness of between 1 nm and 10 nm and a length of more than ten nanometers that can typically reach a length of about a few tens of microns, which may for example be of the order of 25 μm in length, with a width of the same order of magnitude, and leading for example to a specific surface area of 750 m 2 / g. The Applicant has highlighted the comparative results obtained with: a resin loaded with carbon nanofibers (referenced Nanofibers Carbon); a resin loaded with nanosheets of planar structure of graphene, used in the present invention (referenced Graphene). Table 1 below summarizes the thermal conductivities obtained at 10% mass loading and according to their respective parameters. Specific Surface Form Factor Length of Conductivity. Theoretical Observed thermal energy _ Theoretical _: Observed (m2 / g) 0-irn IOM (W / mK) Nanofibres 100 300 10-20 30 <1 0.35 Carbon Graphene 750 2500 50-200 25 <100 2.42 20 The Applicant has thus been able to show the very good results obtained in terms of thermal conductivity with a resin loaded with nanosheets of planar structure of graphene. Increasing the specific surface area, shape factor, and size of the fillers helps increase performance. Planar graphene nanosheets have the best combination of parameters, with a large surface area and a large form factor, as well as a load size that can be considered relatively large. The thermal conductivity obtained from 2.42 W / m.K is evidence of this, resulting from a certain synergy of these parameters. The graphene charge rate in the composite structure also plays a role in the performance obtained. The Applicant has thus studied resins having respective mass loading rates of 5% and 10%. The increase in thermal conductivity is markedly greater for a 10% graphene loaded resin than for the 5% charged one. The nanosheets are interconnected at 10% with relatively small inter-particle distances, while at 5%, the nanosheets are well dispersed and relatively isolated from each other (with greater inter-particle mean distance). This average inter-particle distance naturally depends on the charge rate, as mentioned above, but also on the charge form factor.
    [0016] This postulate can notably be illustrated by FIG. 2, which provides a theoretical representation of the heat diffusion mechanisms within a resin R comprising charges, in the composite samples as a function of the charge form factor, comparing theoretically the heat diffusion in two composites with very different form factor charges. It is found that the beneficial effect of high form factor charges on thermal conductivity can mainly be explained by their distribution and the structural aspect of the material. Geometrically speaking, fillers with a larger form factor make it possible to fill in much more space in the resin, ie lower inter-particle average distances, than in the case of fillers with a lower form factor. Thus, by decreasing these inter-particle mean distances, a certain network of interconnected nanosheets is then obtained, which thus allows a much faster heat diffusion of charged charge. Table 2 below illustrates the performances in terms of thermal conductivity and the electrical conductivity, in the case of uncharged resin, in the case of resin loaded with a charge ratio of 5% of nanosheets of planar structure of graphene and with a charge rate of 10% of nanosheets of planar structure of graphene.
    [0017] 3028515 10 Conductivity Electrical Conductivity (S / m) Thermal (W / mK) Uncharged resin 1.49. 10-8 0.23 Resin loaded at 5 ° A 3.24 1 Resin loaded at 10% 9.30. The associated curves represented in FIGS. 3 and 4 further illustrate the evolution of the performances that can be expected respectively in terms of thermal conductivity expressed in W / mK and in terms of electrical conductivity expressed in Log [1]. S / m] as a function of the mass loading rate in the case of resin loaded with carbon nanotubes and in the case of resins loaded with nanosheets of planar structure of graphene. It is very clearly apparent from the set of two curves C3a and C48 (resin loaded with nanotubes) and curves C3b and C4b (resin loaded with graphene nanosheets) that the performances are better with the filled resin used in the present invention with nanosheets of planar structure of graphene. The evolution of electrical conductivity curves demonstrates the achievement of an asymptote from a mass loading rate of about 8 to 10%. EXAMPLE OF STRUCTURE FOR APPLYING Heatsink 20 intended in particular for being able to be embedded in a satellite To produce a skin with a high heat dissipation property, nanosheets of planar structure of graphene are mixed with resin intended for the composite structure.
    [0018] The filled resin is filmed so as to be able to produce a prepreg based on a carbon reinforcement (carbon fabric made up of high modulus long carbon fibers, typically a fiber modulus of greater than 400 GPa). This prepreg is then draped (stack of quasi-isotropic layers) and then polymerized in the form of skins. The polymerization can be carried out under pressure and temperature, the operation can typically be carried out in press or in an autoclave. It is thus possible to produce composite structures according to the invention which may have variable thicknesses, depending on the stack of prepreg layers prior to the polymerization and hardening operation of said composite structure, which may especially be intended for dissipator applications. thermal. FIG. 5 presents for this purpose a perspective view illustrating a known structure of heat dissipation device for a telecommunication satellite.
    [0019] Typically, a communication satellite comprises in particular a communication module 10. The communication module 10 comprises a plurality of highly dissipative electronic equipment 13. The electronic equipment 13 is installed on heat pipe networks not shown in this figure, but described in detail hereinafter with reference to FIGS. 2a, 2b and 3. The electronic equipment 13 is arranged inside the communication satellite. . The heat pipes are disposed on the inner surface of dissipative panels 11, 12, or inside the dissipative panels 11, 12. The heat pipe networks allow the transport and distribution of the thermal power over the total surface of the dissipative panels 11, 12. The outer surface of the dissipative panels 11, 12 then radiate this power to the surrounding space. For a better radiation of the thermal power, the outer surfaces of the dissipative panels 11, 12 are for example covered with optical solar reflectors, commonly referred to as the OSR acronym corresponding to the English terminology "Optical Solar Reflectors". The structure of the North-South panels is described in detail below with reference to FIGS. 6, 7 and 8. FIGS. 6 and 7 show sectional views illustrating the structure of a heat dissipating device comprising a dissipative panel. and a heat pipe network, in a first exemplary embodiment. In the first exemplary embodiment, an array of heat pipes comprising at least one heat pipe 21 may be disposed inside a dissipative panel 11. The inner and outer surfaces of the North-South panel 11 may be formed by two surface structures or "skins", respectively an inner skin 211 and an outer skin 212, 3028515 12 defining substantially parallel planes of each other. The skins 211, 212 may be secured via structural elements 22. The structural elements 22 may for example, typically form a so-called "honeycomb" structure. The electronic equipment 13 is arranged on the network of heat pipes 21. In the example illustrated in FIG. 6, a heat pipe of substantially tubular shape is shown in a cross-section. In the example illustrated in FIG. 7, several sections of the same heat pipe or of several heat pipes are shown in a cross-sectional view. A coolant circulates in the heat pipes 21. Typically in telecommunication satellite applications, the coolant used is ammonia. In typical structures known from the state of the art, the heat pipes 21, as well as the skins 211, 212 and the structural elements 15 forming the dissipative panels 11 may be made of aluminum. Figure 8 is a schematic representation of the composition of a dissipative panel according to an alternative embodiment. FIG. 8 shows a dissipative panel structure 11 in itself known from the state of the art, within which are integrated the heat pipe networks 21, appearing in a cross-section in the figure. In such a structure, the electronic equipment 13 can be arranged directly on a skin 211, 212, substantially above the heat pipe networks 21, the heat pipe networks 21 being disposed between the two skins 211, 212 of the dissipative panel 11. D similar to the structures described above with reference to FIGS. 6 and 7, structural elements 22 forming, for example, a honeycomb structure, can secure the assembly. According to the present invention, it also becomes possible to make structural current since the charge in graphene nanosheets also makes it possible to have good electrical conductivity in addition to the good thermal conductivity, without having recourse, for example, to the use of metallization tracks on the surface of the panels so as to recover the current, the structure of the present invention being sufficiently good electrical conductor to directly obtain this current return structure.
    [0020] An example of structure for solar panel application intended in particular to be embedded in a satellite The composite structure of the invention can also advantageously be used for solar panel substrates. It is indeed possible to make very thin films, with great flexibility because of their small thickness (typically may be of the order of a few tenths of a millimeter) and can thus in a variant be wound to be deployed. FIG. 9 illustrates for this purpose an example of a solar panel 31 comprising the following stack: a substrate 311 corresponding to the composite structure of the invention; a set of insulating layers 312 between which is made an electrical network 313; - at the stacking surface 312/313 corresponding to an electrical cover, a set of photovoltaic cells 314 a glass anti-radiation cover 315; It should be noted that according to another variant of the invention, the solar panel can also be a rigid solar panel. EXAMPLE OF STRUCTURE FOR ELECTRONIC ENCLOSURE INTENDED IN PARTICULAR TO BE ABLE TO BE INTO A SATELLITE The composite structure of the invention may also be designed to have a sufficient thickness, typically of a few millimeters, and to be shaped to serve as an electronic box for components. for example, to provide an alternative to metal alloys used in the packaging of on-board electronic equipment including satellites. Such parts may be made by molding or injection with suitable molds from the prepregs described above, to be shaped, the resin being polymerized to cure in the terminal phase.
    权利要求:
    Claims (21)
    [0001]
    REVENDICATIONS1. Composite structure comprising an organic resin and carbon fibers, characterized in that it further comprises nanosheets of planar structure of graphene embedded in said resin.
    [0002]
    2. Composite structure according to claim 1, characterized in that it comprises stacks of some graphene nanosheets 10 of planar structure embedded in said resin.
    [0003]
    3. Composite structure according to one of claims 1 or 2, characterized in that the mass density of nanosheets in the resin is between 5% and 20%. 15
    [0004]
    4. Composite structure according to one of claims 1 to 3, characterized in that the specific surface of the graphene nanosheets is greater than or equal to 500 m2 / g. 20
    [0005]
    5. Composite structure according to one of claims 1 to 4, characterized in that it comprises an alternating succession of layers comprising a first plurality of carbon fibers (41) arranged in a predetermined alignment, and layers comprising a second plurality carbon fibers (42) disposed in an alignment substantially perpendicular to the alignment of said first plurality of carbon fibers (41).
    [0006]
    6. Composite structure according to one of claims 1 to 4, characterized in that the composite structure is formed by a fabric made by entangling a first plurality of carbon fibers (41) arranged in a predetermined alignment, and a second plurality of carbon fibers (42) disposed in an array substantially perpendicular to the alignment of said first plurality of carbon fibers (41). 35
    [0007]
    7. Heat dissipation device, especially for spatial application, comprising at least one dissipative panel (11, 12), the dissipative panel (11, 12) comprising at least one skin (211, 212) made in the composite structure according to one of claims 1 to 6.
    [0008]
    8. Heat dissipation device according to claim 7, characterized in that the skin (211, 212) is connected to a heat pipe network (21).
    [0009]
    9. Heat dissipation device according to one of claims 7 or 8, characterized in that the dissipative panel (11, 12) comprises an inner skin (211) and an outer skin (212) of planar shape arranged parallel to the one of the other and secured via structural elements (22). 15
    [0010]
    10. Heat dissipation device according to claim 9, characterized in that the structural elements (22) are formed by a honeycomb configuration of aluminum tubes.
    [0011]
    11. Heat dissipation device according to claim 9, characterized in that the structural elements (22) are formed by a conductive foam.
    [0012]
    12. Heat dissipation device according to any one of claims 8 to 11, characterized in that the heat pipe network (21) is disposed externally to the dissipative panel (11, 12) on the surface of the inner skin (211). .
    [0013]
    13. Heat dissipation device according to any one of claims 8 to 11, characterized in that the heat pipe network (21) is disposed internally to the dissipative panel (11, 12) between the inner skin (211) and outer skin (212).
    [0014]
    14. Heat dissipation device according to any one of claims 8 to 13, characterized in that the heat pipe network (21) 35 comprises one or a plurality of substantially tubular heat pipes, made of aluminum. 3028515 16
    [0015]
    15. Heat dissipation device according to any one of claims 8 to 13, characterized in that the heat pipe network (21) comprises one or a plurality of substantially tubular heat pipes, made of an aluminum alloy incorporating elements. low coefficient of thermal expansion.
    [0016]
    16. A heat dissipation device according to any one of claims 8 to 15, characterized in that the assembly of the heat pipes (21) to the skins (211, 212) is produced by means of organic resin enriched with 10 nanometers of graphene graphene. flat structure.
    [0017]
    17. A box of electronic equipment, especially for space application, comprising electronic components positioned in a container, characterized in that said container comprises the composite structure according to one of claims 1 to 6.
    [0018]
    18. Electronic equipment case according to claim 17, characterized in that the thickness of said composite structure is greater than or equal to a few millimeters.
    [0019]
    19. Solar generator substrate characterized in that it comprises a composite structure according to one of claims 1 to 6. 25
    [0020]
    20. solar generator substrate according to claim 19, characterized in that the thickness of said composite structure is of the order of one-tenth of a millimeter, said structure being flexible.
    [0021]
    21. Solar panel comprising a solar generator substrate 30 according to one of claims 19 or 20 and a set of photovoltaic cells.
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    法律状态:
    2015-10-23| PLFP| Fee payment|Year of fee payment: 2 |
    2016-05-20| PLSC| Publication of the preliminary search report|Effective date: 20160520 |
    2016-10-28| PLFP| Fee payment|Year of fee payment: 3 |
    2017-09-01| TQ| Partial transmission of property|Owner name: LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY, LU Effective date: 20170801 Owner name: THALES, FR Effective date: 20170801 |
    2017-10-26| PLFP| Fee payment|Year of fee payment: 4 |
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    申请号 | 申请日 | 专利标题
    FR1402561A|FR3028515B1|2014-11-14|2014-11-14|COMPOSITE STRUCTURE COMPRISING A RESIN CHARGED WITH GRAPHENE PLATE SHEETS WITH THERMAL CONDUCTIVITY AND REINFORCED ELECTRICAL CONDUCTIVITY, IN PARTICULAR FOR SATELLITE|
    FR1402561|2014-11-14|FR1402561A| FR3028515B1|2014-11-14|2014-11-14|COMPOSITE STRUCTURE COMPRISING A RESIN CHARGED WITH GRAPHENE PLATE SHEETS WITH THERMAL CONDUCTIVITY AND REINFORCED ELECTRICAL CONDUCTIVITY, IN PARTICULAR FOR SATELLITE|
    EP15797926.1A| EP3218428A2|2014-11-14|2015-11-13|Composite structure comprising a resin loaded with flat graphene sheets having enhanced thermal and electrical conductivity, in particular for a satellite|
    PCT/EP2015/076556| WO2016075290A2|2014-11-14|2015-11-13|Composite structure comprising a resin loaded with flat graphene sheets having enhanced thermal and electrical conductivity, in particular for a satellite|
    US15/526,725| US20170321020A1|2014-11-14|2015-11-13|Composite structure comprising a resin loaded with flat graphene sheets having enhanced thermal and electrical conductivity, in particular for a satellite|
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