• 专利附录
  • 专利说明
  • 权利要求
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    • 专利摘要:
    The invention relates to a method for obtaining a material comprising a substrate coated on at least a part of at least one of its faces with at least one functional layer, said method comprising: a deposition step of the or each functional layer then - a step of depositing a sacrificial layer on said at least one functional layer, then - a heat treatment step by means of radiation having at least one treatment wavelength of between 200 and 2500 nm, said sacrificial layer being in contact with the air during this heat treatment step, said sacrificial layer being such that before heat treatment it absorbs at least a portion of said radiation at said at least one treatment wavelength and that after heat treatment it is likely to dissolve in a solvent.
    公开号:FR3021967A1
    申请号:FR1455151
    申请日:2014-06-06
    公开日:2015-12-11
    发明作者:Andriy Kharchenko；Bernard Nghiem；Nicolas Nadaud；Lorenzo Canova；Arnaud Huignard
    申请人:Saint Gobain Glass France SAS；Compagnie de Saint Gobain SA；
    IPC主号:
    专利说明:

    [0001] The invention relates to the production of substrates coated with at least one functional layer. Some functional layers require heat treatments, either to improve their properties or even to give them their functionality. Examples of the low-emissive functional layers based on silver or transparent conductive oxides (TCO) whose emissivity and electrical resistivity are lowered following heat treatments. Photocatalytic layers based on titanium oxide are also more active after heat treatment because the latter promotes crystal growth. Thermal treatments also make it possible to obtain porosity in silica-based layers in order to lower their light reflection factor. Application WO 2010/139908 discloses a method of heat treatment by means of radiation, in particular infrared laser radiation focused on the layer. Such a treatment makes it possible to heat the layer very quickly without heating the substrate significantly. Typically, the temperature at any point on the face of the substrate opposite to that carrying the layer does not exceed 150 ° C., or even 100 ° C. during the treatment. Other types of radiation, such as that from flash lamps can also be used for the same purpose. Some layers, however, absorb very little of the infrared radiation, so that most of the energy of the radiation passes through the material without heating it significantly. The known methods can not then be used. The application WO2012 / 022874 describes a process in which a soluble layer based on halides or sulphates is deposited on the layer to be treated, and can be surmounted by an infrared absorbing layer. The object of the present invention is to improve this type of technique by proposing a method for obtaining a material comprising a substrate coated on at least a part of at least one of its faces with at least one functional layer. said method comprising: - a deposition step of the or each functional layer and then - a step of depositing a sacrificial layer on said at least one functional layer, then - a heat treatment step by means of a radiation having at least at least one treatment wavelength between 200 and 2500 nm, said sacrificial layer being in contact with the air during this heat treatment step. The sacrificial layer is such that, prior to heat treatment, it is capable of absorbing at least a portion of said radiation at said at least one treatment wavelength and after heat treatment is capable of dissolving in a solvent. The subject of the invention is also a material that can be obtained by the process according to the invention. All the features or embodiments described below apply to both the process and the material obtained.
    [0002] The method according to the invention makes it possible to improve the efficiency of the heat treatment by means of an absorbing sacrificial layer, which can then be removed by means of a solvent.
    [0003] Preferably, the method according to the invention further comprises, after the heat treatment step, a step of removing the sacrificial layer using said solvent. The solvent is advantageously aqueous. It may for example be water, especially acidified water, for example using acetic acid, citric acid or any other acid. The solvent may also be an alcohol, for example ethanol or propanol. The step of removing the sacrificial layer implements the contact of the sacrificial layer with the solvent. This contact may or may not be accompanied by automated or manual mechanical treatment of the sacrificial layer, for example by means of brushes, rags, etc. The step of eliminating the sacrificial layer may, for example, be carried out in a glass washing installation, particularly of the type commonly used in manufacturing or glass processing workshops. The step of eliminating the sacrificial layer may in particular be carried out in a glass washing machine.
    [0004] The step of removing the sacrificial layer can be performed just after the heat treatment step, near the heat treatment plant. The removal step may alternatively be performed later or at a distance from the heat treatment plant. The sacrificial layer can indeed play a role of mechanical protection of the functional layer during its transport or its handling. For example, when the material is intended to be used in the manufacture of a glazing, the material can be delivered still coated with its sacrificial layer to a processing plant, and the sacrificial layer can be eliminated in this workshop, either before the transformation step (cutting, insertion in an insulating glazing ...) either during or after the transformation. The substrate is preferably glass or glass ceramic. It is preferably transparent, colorless (it is then a clear or extra-clear glass) or colored, for example blue, gray, green or bronze. By extra-clear glass is meant a glass whose weight content of iron oxide is at most 0.02% and whose light transmittance is at least 90%. The glass is preferably of the silico-soda-lime type, but it may also be of borosilicate or alumino-borosilicate type glass, in particular for high temperature applications (oven doors, chimney inserts, fireproof glazing). The substrate advantageously has at least one dimension greater than or equal to 1 m, or even 2 m and even 3 m. The thickness of the substrate generally varies between 0.1 mm and 19 mm, preferably between 0.7 and 9 mm, especially between 1 and 6 mm, or even between 2 and 4 mm. The glass substrate is preferably of the float type, that is to say likely to have been obtained by a process of pouring the molten glass on a bath of molten tin ("float" bath). In this case, the coating to be treated can be deposited on the "tin" side as well as on the "atmosphere" side of the substrate.
    [0005] The term "atmosphere" and "tin" faces means the faces of the substrate having respectively been in contact with the atmosphere prevailing in the float bath and in contact with the molten tin. The tin side contains a small surface amount of tin that has diffused into the glass structure. The glass substrate can also be obtained by rolling between two rollers, a technique which makes it possible in particular to print patterns on the surface of the glass. The expression "on" or "above" should be understood in that the sacrificial layer is further away from the substrate than the functional layer. This expression does not however prejudge a possible direct contact between the two layers. The sacrificial layer preferably absorbs at least a portion of the radiation at least one treatment wavelength between 800 and 1300 nm. Preferably, the absorption of the sacrificial layer at least one treatment wavelength is at least 15%, especially 20% and even 25 or 30%. The absorption can, in a known manner, be deduced from measurements carried out using a spectrophotometer. The absorption of the or each functional layer at the or each treatment wavelength is preferably at most 10%, especially 5%. It is especially for this type of layer that the use of an absorbent sacrificial layer is the most useful. The functional layer preferably provides the coated substrate with at least one functionality selected from low emissivity, low electrical resistivity, antireflection effect, self-cleaning function or ease of cleaning. The functional layer may be the only layer deposited on the substrate (in addition to the sacrificial layer). Alternatively, the functional layer may be included in a stack of thin layers. In the remainder of the text, the term "coating" refers to the assembly comprising the functional (s) and sacrificial (s) layers as well as, if appropriate, any other layer deposited on the same face of the substrate. The physical thickness of the or each functional layer is typically between 1 nm and 5 μm, in particular between 2 nm and 2 μm, more particularly between 10 nm and 1 μm. According to a preferred embodiment, the (or at least one) functional layer is a layer based on silica. This type of layer absorbs little in the range of 10 wavelengths considered, particularly in the near infrared, so that in the absence of sacrificial sacrificial layer heat treatment is inefficient. The silica-based layer is preferably, after heat treatment, essentially constituted or even composed of silica. The silica-based layer is advantageously antireflective, in the sense that the light-reflection factor on the layer side is at most 6%, especially 5% after heat treatment, when the layer is deposited on a single face of the substrate (the value is 20 therefore account for the reflection of the uncoated opposite side, which is about 4%). According to a first variant, the silica-based layer comprises, before heat treatment, silicon, oxygen, carbon and optionally hydrogen, these last two elements being at least partially removed during the heat treatment so as to obtain a porous layer consisting essentially of silica. This layer is preferably deposited by magnetron cathode sputtering of a silicon or silica target or by plasma-enhanced chemical vapor deposition using, as silicon precursor, an organometallic compound such as, for example, hexamethyldisiloxane.
    [0006] According to a second variant, the silica-based layer comprises, before heat treatment, a silica matrix and porogenic agents, the latter being removed during the heat treatment so as to obtain a porous layer consisting essentially of silica. The pore-forming agents are preferably organic, especially polymeric, for example polymethyl methacrylate, their average size preferably being in a range from 20 to 200 nm. This layer is preferentially deposited by a sol-gel type process. According to another preferred embodiment, the (or at least one) functional layer is a layer based on titanium oxide, in particular a layer made of or consisting essentially of titanium oxide. The thin films based on titanium oxide have the particularity of being self-cleaning, facilitating the degradation of organic compounds under the action of ultraviolet radiation (photocatalysis phenomenon) and the elimination of mineral soils (dust) under 20. the action of a water runoff. Crystallized titanium dioxide in the anatase form is far more effective in terms of degradation of organic compounds than amorphous or crystallized titanium dioxide in the rutile or brookite form. The titanium oxide may optionally be doped with a metal ion, for example an ion of a transition metal, or with nitrogen, carbon or fluorine atoms. Titanium oxide may also be used. be under-stoichiometric or superstoichiometric in oxygen (TiO2 or Ti0.). The titanium oxide layer is preferentially deposited by magnetron sputtering. This technique, however, does not allow to obtain very active layers, because the titanium oxide they contain is little or not crystallized. The heat treatment is then necessary to impart appreciable self-cleaning properties. In order to further improve the crystallization of these layers, it is possible to provide directly under the titanium oxide-based layer an underlayer having the effect of promoting the crystalline growth of titanium oxide, especially in the anatase form. . It may especially be a ZrO 2 sublayer, as described in application WO 02/40417, or an underlayer promoting the hetero-epitaxial growth of titanium oxide in anatase form, such as described for example in the application WO 2005/040058, in particular a BaTiO3 or SrTiO3 layer. Other sub-layers may be inserted between the substrate and the titanium dioxide layer. It may for example be barrier layers to the migration of alkali, including layers based on SiO 2, SiOC, A1203 alumina, Si3N4 silicon nitride. Other functional layers can be processed according to the invention. Mention may be made, without limitation, of metal layers, in particular of silver or molybdenum, or else of oxide layers, in particular of transparent electroconductive oxide (for example tin oxide layers). indium, layers of zinc oxide doped with aluminum or gallium, tin oxide layers doped with fluorine or antimony, etc. ") The functional layer can be obtained by any type of process Thin-film deposition can be, for example, sol-gel type processes, pyrolysis (liquid or solid), chemical vapor deposition (CVD), in particular plasma assisted (APCVD), optionally at atmospheric pressure. (APPECVD), evaporation, cathodic sputtering, in particular assisted by a magnetic field (magnetron process) In the latter method, a plasma is created under a high vacuum near a target comprising the chemical elements to be deposited. plasma, bombarding the cib the, tear off said elements, which are deposited on the substrate forming the desired thin layer. This process is called "reactive" when the layer consists of a material resulting from a chemical reaction between the elements torn from the target and the gas contained in the plasma. The major advantage of this method lies in the ability to deposit on the same line a very complex stack of layers by successively scrolling the substrate under different targets, usually in a single device. The sacrificial layer may be based on organic and / or mineral. It is chosen for its ability on the one hand to absorb the radiation used for the heat treatment and thus allow the heating of the functional layer and on the other hand to be easily removed by means of a solvent. The sacrificial layer may change in chemical nature during heat treatment. In some embodiments the sacrificial layer as deposited is not soluble in a solvent, but becomes so after the heat treatment. According to a first preferred embodiment, the sacrificial layer is a layer of a metal chosen from Zn and Mg, which is at least partially oxidized during heat treatment, or a sub-stoichiometric oxide layer of zinc oxygen or magnesium. This layer is preferably deposited by magnetron sputtering. After at least partial oxidation to ZnO. or MgO, the sacrificial layer can be easily removed by simple contact with an acidic aqueous solution. By way of example, an aqueous solution containing 2 to 5% of acetic acid or citric acid makes it possible to rapidly eliminate such layers. The thickness of this type of sacrificial layer is preferably in a range from 5 to 50 nm, in particular from 5 to 20 nm. According to a second embodiment, the sacrificial layer is an organic-based layer containing dyes or pigments. By "organic base" is meant that the layer comprises at least 30%, especially 50% by weight of organic material. The organic-based layer is preferably deposited by liquid deposition techniques from inks, or more generally liquid solutions containing dyes or pigments of organic, plant or mineral origin dispersed or dissolved in a solvent. Pigments absorbing infrared radiation include carbon black, carbon black, iron oxide or chromium, spinels of chromium (eg FeCr 2 O 4, MgCr 2 O 4, ZnCr 2 O 4) or ytterbium salts. Pigments absorbing ultraviolet radiation are chosen in particular from metal salts, cerium oxide or sulphide. In particular, dyes that absorb infrared radiation are chosen from cyanine, metal complexes (Ni, Fe, Pt, Pd, etc.) with dithiolene ligand, and organometallic complexes from ytterbium. Ultraviolet radiation absorbing dyes are especially selected from rhodamine, phthalocyanine, coumarin, fluorescein.
    [0007] The organic-based layer may be deposited by various known techniques, such as coating, spraying, rolling, curtain, etc. A material obtainable according to the invention is therefore a substrate coated with at least one functional layer, and then as the furthest layer of the substrate, an organic-based layer containing dyes or pigments. The heat treatment employs radiation preferably having a treatment wavelength between 800 and 1300 nm. Throughout the heat treatment step, the temperature at any point on the face of the substrate opposite to that carrying the functional layer is preferably at most 150 ° C, especially 100 ° C and even 50 ° C. The maximum temperature experienced by each point of the functional layer during the heat treatment is preferably at least 300 ° C, especially 350 ° C or 400 ° C, and even 500 ° C or 600 ° C. The heat treatment step uses radiation, preferably laser radiation or radiation from at least one flashlamp. According to a first preferred embodiment, the radiation is derived from at least one flash lamp. Such lamps are generally in the form of glass or quartz tubes sealed and filled with a rare gas, provided with electrodes at their ends. Under the effect of a short-duration electrical pulse, obtained by discharging a capacitor, the gas ionizes and produces a particularly intense incoherent light. The emission spectrum generally comprises at least two emission lines; it is preferably a continuous spectrum having a maximum emission in the near ultraviolet and extending to near infrared. In this case, the heat treatment implements a continuum of treatment wavelengths. The lamp is preferably a xenon lamp. It can also be a lamp with argon, helium or krypton. The emission spectrum preferably comprises several lines, especially at wavelengths ranging from 160 to 1000 nm. The duration of the flash is preferably in a range from 0.05 to 20 milliseconds, in particular from 0.1 to 5 milliseconds. The repetition rate is preferably in a range from 0.1 to 5 Hz, in particular from 0.2 to 2 Hz. The radiation may be from several lamps arranged side by side, for example 5 to 20 lamps, or still 8 to 15 lamps, so as to simultaneously treat a wider area. In this case, all lamps can emit flashes simultaneously. The or each lamp is preferably arranged transversely to the longer sides of the substrate. The or each lamp has a length preferably of at least 1 m in particular 2 m and even 3 m so as to be able to treat large substrates. The capacitor is typically charged at a voltage of 500 V to 500 kV. The current density is preferably at least 4000 A / cm 2. The total energy density emitted by the flash lamps, relative to the surface of the coating, is preferably between 1 and 100 J / cm 2, especially between 1 and 30 J / cm 2, or even between 5 and 20 J / cm 2.
    [0008] According to a second preferred embodiment, the radiation is laser radiation, in particular laser radiation focused on the functional layer in the form of at least one laser line.
    [0009] The laser radiation is preferably generated by modules comprising one or more laser sources as well as optical shaping and redirection. The laser sources are typically laser diodes or fiber lasers, including fiber, diode or disk lasers. The laser diodes make it possible to economically achieve high power densities with respect to the electric power supply, for a small space requirement. The size of the fiber lasers is even smaller, and the linear power obtained can be even higher, but at a higher cost. Fiber lasers are understood to mean lasers in which the location of generation of the laser light is spatially offset from its place of delivery, the laser light being delivered by means of at least one optical fiber. In the case of a disk laser, the laser light is generated in a resonant cavity in which is located the emitter medium which is in the form of a disk, for example a thin disk (about 0.1 mm thick) in Yb: YAG. The light thus generated is coupled in at least one optical fiber directed towards the treatment site. Fiber or disk lasers are preferably pumped optically by means of laser diodes.
    [0010] The radiation from the laser sources is preferably continuous. The wavelength of the laser radiation, and therefore the treatment wavelength, is preferably in a range from 800 to 1300 nm, in particular from 800 to 1100 nm. Power laser diodes emitting at one or more wavelengths selected from 808 nm, 880 nm, 915 nm, 940 nm or 980 nm have proved particularly suitable. In the case of a disk laser, the treatment wavelength is, for example, 1030 nm (emission wavelength for a Yb: YAG laser). For a fiber laser, the treatment wavelength is typically 1070 nm. In the case of non-fiber lasers, the shaping and redirecting optics preferably comprise lenses and mirrors, and are used as means for positioning, homogenization and focusing of the radiation. The purpose of the positioning means is, where appropriate, to arrange the radiation emitted by the laser sources along a line. They preferably include mirrors. The aim of the homogenization means is to superpose the spatial profiles of the laser sources in order to obtain a homogeneous linear power along the line. The homogenization means preferably comprise lenses enabling the incident beams to be separated into secondary beams and the recombination of said secondary beams into a homogeneous line. The means for focusing the radiation make it possible to focus the radiation on the coating to be treated, in the form of a line of desired length and width. The focusing means preferably comprise a focusing mirror or a converging lens.
    [0011] In the case of fiber laser, the shaping optics are preferably grouped in the form of an optical head positioned at the output of the or each optical fiber. The optical shaping of said optical heads preferably comprise lenses, mirrors and prisms and are used as means of transformation, homogenization and focusing of the radiation.
    [0012] The transformation means comprise mirrors and / or prisms and serve to transform the circular beam, obtained at the output of the optical fiber, into a non-circular, anisotropic, line-shaped beam.
    [0013] For this, the transformation means increase the quality of the beam along one of its axes (fast axis, or axis of the width 1 of the laser line) and reduce the quality of the beam according to the other (slow axis, or axis of the length L of the laser line).
    [0014] The homogenization means superimpose the spatial profiles of the laser sources in order to obtain a homogeneous linear power along the line. The homogenization means preferably comprise lenses enabling the incident beams to be separated into secondary beams and the recombination of said secondary beams into a homogeneous line. Finally, the means for focusing the radiation make it possible to focus the radiation at the level of the work plane, that is to say in the plane of the coating to be treated, in the form of a line of desired length and width. The focusing means preferably comprise a focusing mirror or a converging lens. When only one laser line is used, the length of the line is advantageously equal to the width of the substrate. This length is typically at least 1 m, especially 2 m and even 3 m. It is also possible to use several lines, disjointed or not, but arranged so as to treat the entire width of the substrate. In this case, the length of each laser line is preferably at least 10 cm or 20 cm, especially in a range from 30 to 100 cm, especially from 30 to 75 cm, or even from 30 to 60 cm.
    [0015] The term "length" of the line is the largest dimension of the line, measured on the surface of the coating in the first direction, and "width" the dimension in the second direction. As is usual in the field of lasers, the width w of the line corresponds to the distance (in this second direction) between the beam axis (where the intensity of the radiation is maximum) and the point where the The intensity of the radiation is 1 / e2 times the maximum intensity. If the longitudinal axis of the laser line is named x, we can define a width distribution along this axis, named w (x). The average width of the or each laser line is preferably at least 35 micrometers, especially in a range of 40 to 100 micrometers or 40 to 70 micrometers. Throughout this text we mean by "average" the arithmetic mean. Throughout the length of the line, the width distribution is narrow in order to limit as much as possible any heterogeneity of treatment. Thus, the difference between the largest width and the smallest width is preferably at most 10% of the average width value. This figure is preferably at most 5% and even 3%. The shaping and redirecting optics, in particular the positioning means, can be adjusted manually or by means of actuators for adjusting their remote positioning. These actuators (typically motors or piezoelectric shims) can be manually controlled and / or adjusted automatically. In the latter case, the actuators will preferably be connected to detectors as well as to a feedback loop. At least a portion of the laser modules, or all of them, is preferably arranged in a sealed box, advantageously cooled, in particular ventilated, in order to ensure their thermal stability. Laser modules are preferably mounted on a rigid structure, called "bridge", based on metal elements, typically aluminum. The structure preferably does not include a marble slab. The bridge is preferably positioned parallel to the conveying means so that the focal plane of the or each laser line remains parallel to the surface of the substrate to be treated.
    [0016] Preferably, the bridge comprises at least four feet, the height of which can be individually adjusted to ensure parallel positioning under all circumstances. The adjustment can be provided by motors located at each foot, either manually or automatically, in relation to a distance sensor. The height of the bridge can be adapted (manually or automatically) to take into account the thickness of the substrate to be treated, and thus ensure that the plane of the substrate coincides with the focal plane of the or each laser line. The linear power of the laser line is preferably at least 300 W / cm, advantageously 350 or 400 W / cm, in particular 450 W / cm, or even 500 W / cm and even 550 W / cm. It is even advantageously at least 600 W / cm, especially 800 W / cm or 1000 W / cm. The linear power is measured where the or each laser line is focused on the coating. It can be measured by placing a power detector along the line, for example a power-meter calorimetric, such as in particular the power meter Beam Finder S / N 2000716 Coherent Inc. The power is advantageously distributed in a manner homogeneous over the entire length of the or each line. Preferably, the difference between the highest power and the lowest power is less than 10% of the average power. The energy density supplied to the coating is preferably at least 20 J / cm 2, or even 30 J / cm 2.
    [0017] The high power densities and densities make it possible to heat the coating very quickly, without heating the substrate significantly. As mentioned above, the maximum temperature experienced by each point of the coating during heat treatment is preferably at least 300 ° C, especially 350 ° C or even 400 ° C, and even 500 ° C or 600 ° C. The maximum temperature is especially experienced at the moment when the point of the coating considered passes under the laser line or is irradiated by the flash lamp flash. At a given instant, only the points on the surface of the coating located under the laser line or under the flash lamp and in its immediate vicinity (for example less than one millimeter) are normally at a temperature of at least 300 ° vs. For distances to the laser line (measured in the direction of travel) greater than 2 mm, especially 5 mm, including downstream of the laser line, the coating temperature is normally at most 50 ° C, and even 40 ° C or 30 ° C. Each point of the coating undergoes heat treatment (or is brought to the maximum temperature) for a time advantageously in a range from 0.05 to 10 ms, in particular from 0.1 to 5 ms, or from 0.1 to 10 ms. 2 ms. In the case of laser line processing, this time is fixed both by the width of the laser line and by the relative speed of movement between the substrate and the laser line. In the case of a flash lamp treatment, this duration corresponds to the duration of the flash.
    [0018] The laser radiation is partly reflected by the coating to be treated and partly transmitted through the substrate. For safety reasons, it is preferable to dispose in the path of these reflected radiation 5 and / or transmitted means for stopping the radiation. It will typically be metal housings cooled by fluid circulation, including water. To prevent the reflected radiation from damaging the laser modules, the propagation axis of the or each laser line forms a preferentially non-zero angle with the normal to the substrate, typically an angle of between 5 and 20 °. In order to enhance the efficiency of the treatment, it is preferable that at least a portion of the (main) laser radiation transmitted through the substrate and / or reflected by the coating is redirected towards said substrate to form at least one laser radiation. secondary, which preferably impacts the substrate at the same location as the main laser radiation, with advantageously the same depth of focus and the same profile. The formation of the or each secondary laser radiation advantageously implements an optical assembly comprising only optical elements chosen from mirrors, prisms and lenses, in particular an optical assembly consisting of two mirrors and a lens, or 25 a prism and a lens. By recovering at least a portion of the lost main radiation and redirecting it to the substrate, the heat treatment is considerably improved. The choice to use the part of the main radiation transmitted through the substrate 30 ("transmission" mode) or the part of the main radiation reflected by the coating ("reflection" mode), or possibly to use both, depends on the nature of the layer and the wavelength of the laser radiation.
    [0019] When the substrate is moving, in particular in translation, it can be set in motion by any mechanical conveying means, for example using strips, rollers, trays in translation. The conveyor system controls and controls the speed of travel. The conveying means preferably comprises a rigid frame and a plurality of rollers. The pitch of the rollers is advantageously in a range from 50 to 300 mm. The rollers preferably comprise metal rings, typically made of steel, covered with plastic bandages. The rollers are preferably mounted on low-clearance bearings, typically three rolls per step. In order to ensure perfect flatness of the conveying plane, the positioning of each of the rollers is advantageously adjustable. The rollers are preferably driven by means of pinions or chains, preferably tangential chains, driven by at least one motor. The speed of the relative displacement movement between the substrate and the or each radiation source (in particular the or each laser line) is advantageously at least 2 m / min, in particular 5 m / min and even 6 m / min or 7 m / min, or 8 m / min and even 9 m / min or 10 m / min. According to some embodiments, particularly when the radiation absorption by the coating is high or when the coating can be deposited with high deposition rates, the speed of the relative displacement movement between the substrate and the radiation source (especially the or each laser line or flash lamp) is at least 12 m / min or 15 m / min, in particular 20 m / min and even 25 or 30 m / min. In order to ensure a treatment that is as homogeneous as possible, the speed of the relative displacement movement between the substrate and the or each radiation source (in particular the or each laser line or flash lamp) varies during the treatment of at most 10 % in relative, in particular 2% and even 1% compared to its nominal value. Preferably, the or each radiation source (in particular laser line or flash lamp) is fixed, and the substrate is in motion, so that the relative speed of movement will correspond to the running speed of the substrate. The heat treatment device may be integrated in a layer deposition line, for example a magnetic field assisted sputtering deposition line (magnetron process), or a chemical vapor deposition line (CVD), in particular assisted by plasma (PECVD), under vacuum or at atmospheric pressure (APPECVD). The line generally includes substrate handling devices, a deposition facility, optical control devices, stacking devices. The substrates scroll, for example on conveyor rollers, successively in front of each device or each installation.
    [0020] The heat treatment device is preferably located just after the coating deposition installation, for example at the outlet of the deposition installation. The coated substrate can thus be treated in line after deposition of the coating, at the exit of the deposition installation and before the optical control devices, or after the optical control devices and before the stacking devices of the substrates. The heat treatment device can also be integrated into the deposit facility. For example, the laser or the flash lamp can be introduced into one of the chambers of a sputtering deposition installation, in particular in a chamber where the atmosphere is rarefied, in particular under a pressure of between 10-6 mbar and 10-6 mbar. 2 mbar. The heat treatment device may also be disposed outside the deposition installation, but so as to treat a substrate located inside said installation. For this purpose, it is sufficient to provide a transparent window at the wavelength of the radiation used, through which the radiation would be used to treat the layer. It is thus possible to treat a layer (for example a layer of silver) before the subsequent deposit of another layer in the same installation.
    [0021] Whether the heat treatment device is outside of or integrated with the deposition facility, these "on-line" methods are preferable to a recovery process in which it would be necessary to stack the glass substrates between the deposition step. and heat treatment. Processes recovery can however be of interest in cases where the implementation of the heat treatment according to the invention is made in a different location from where the deposit is made, for example in a place where is performed the transformation of glass . The heat treatment device can therefore be integrated with other lines than the layer deposition line. It can for example be integrated into a production line of multiple glazing (double or triple glazing in particular), to a laminated glass manufacturing line, or to a curved and / or tempered glass production line. Laminated or curved or tempered glass can be used as building or automotive glazing. In these different cases, the heat treatment according to the invention is preferably carried out before the production of multiple or laminated glazing. The heat treatment may, however, be implemented after completion of the double glazing or laminated glazing.
    [0022] The heat treatment device is preferably disposed in a closed enclosure for securing persons by avoiding contact with the radiation and to avoid any pollution, in particular of the substrate, the optics or the treatment zone. The subject of the invention is also a material that can be obtained by the process according to the invention. Such a material can then be integrated in a glazing, for example a multiple glazing (double, triple. ").
    [0023] In the case of self-cleaning titanium oxide-based layers, the material may in particular constitute the first sheet of a multiple glazing unit, the functional layer being positioned in face of said glazing. Such a material can still be integrated in a photovoltaic cell. In the case of anti-reflective silica-based layers as mentioned above, the material which is coated therewith may form the front face of a photovoltaic cell. The invention is illustrated with the aid of the following nonlimiting exemplary embodiments. On a main surface of a silico-soda-lime-glass substrate obtained by the float process and then cut into a rectangular shape of length L = 6 m and of width 1 = 3.3 m, it was deposited by solid liquid solution. Gel a 150 nm thick silica layer containing 45% by volume of polymethyl methacrylate (PMMA) beads of about 70 nm in diameter. The colorimetric coordinates in reflection of this layer are as follows: L * = 30.45; a * = 0.03; B * = -1.13, for a light reflection factor of 8% (taking into account the reflection of the uncoated side). This type of layer is intended to form a porous antireflective silica layer after removal of the PMMA microbeads. Above the silica layer was rolled a coating approximately 5 μm thick consisting of an ink jet printer ink marketed under the reference LF-140 BLACK by the company Mimaki Engineering and absorbing in the near infrared. The substrate thus coated was then treated with a laser line formed from laser sources of the type lnGaAs laser diodes, quasi-continuous sources emitting at a wavelength of between 900 and 1000 nm. The laser line has a length of 3.3 m, equal to the width 1 of the substrate, and an average width of 50 μm. The substrate was disposed on a roller conveyor so as to run in a direction X parallel to its length. The laser line was fixed and positioned above the coated surface of the substrate with its longitudinal direction Y extending perpendicular to the substrate running direction X, i.e., depending on the width of the substrate, extending across this width. The position of the focal plane of the laser line was adjusted to be in the thickness of the ink layer when the substrate was positioned on the conveyor, the power flux density of the laser line at the focal plane being 105 W / cm2. The substrate was passed under the laser line at a speed of 8 m / min. After treatment, the ink was removed by passing through a washing machine. The colorimetric coordinates after treatment are as follows: L * = 27.80; a * = -0.18; b * = 0.65, for a light reflection factor of 5%, values corresponding to the values obtained after a thermal quenching treatment. In a comparative example, the same heat treatment was applied to the same silica layer, but not covered by an ink. In this case, the PMMA beads are not removed by the treatment, so that the characteristics in reflection are unchanged.
    权利要求:
    Claims (12)
    [0001]
    REVENDICATIONS1. A process for obtaining a material comprising a substrate coated on at least a part of at least one of its faces with at least one functional layer, said process comprising: a step of depositing the or each functional layer, and A step of depositing a sacrificial layer on said at least one functional layer, then a step of heat treatment using radiation having at least one treatment wavelength of between 200 and 2500 nm, said sacrificial layer being in contact with the air during this heat treatment step, said sacrificial layer being such that before heat treatment it is capable of absorbing at least a portion of said radiation at said at least one wavelength of treatment and after heat treatment it is likely to dissolve in a solvent.
    [0002]
    2. Method according to the preceding claim, further comprising, after the heat treatment step, a step of removing the sacrificial layer using said solvent.
    [0003]
    3. Method according to one of the preceding claims, such that the solvent is aqueous.
    [0004]
    4. Method according to one of the preceding claims, such that the substrate is glass or glass ceramic.
    [0005]
    5. Method according to one of the preceding claims, such that the absorption of the or each functional layer at or each treatment wavelength is at most 10%, especially 5%.
    [0006]
    6. Method according to the preceding claim, such that at least one functional layer is a layer based on silica.
    [0007]
    The method of claim 5, wherein at least one functional layer is a titanium oxide layer.
    [0008]
    8. Method according to one of the preceding claims, such that the sacrificial layer is a layer of a metal selected from Zn and Mg, which is at least partially oxidized during heat treatment, or a layer 15 of sub-oxide. stoichiometric oxygen of zinc or magnesium.
    [0009]
    9. Method according to one of claims 1 to 7, such that the sacrificial layer is an organic-based layer containing dyes or pigments. 20
    [0010]
    10. Method according to one of the preceding claims, such that the radiation is a laser radiation or radiation from at least one flash lamp.
    [0011]
    11. The method according to the preceding claim, wherein the radiation is laser radiation focused on the functional layer in the form of at least one laser line.
    [0012]
    12. Material obtainable by the process of claim 1.
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3021967A1|2015-12-11|PROCESS FOR OBTAINING A SUBSTRATE COATED WITH A FUNCTIONAL LAYER
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    同族专利:
    公开号 | 公开日
    US20180141858A1|2018-05-24|
    FR3021967B1|2021-04-23|
    CA2948893A1|2015-12-10|
    EA033251B1|2019-09-30|
    CN106414356A|2017-02-15|
    WO2015185848A1|2015-12-10|
    EP3152173A1|2017-04-12|
    JP6764349B2|2020-09-30|
    JP2017518951A|2017-07-13|
    EA201692450A1|2017-05-31|
    KR20170015906A|2017-02-10|
    US10882781B2|2021-01-05|
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    FR2861385B1|2003-10-23|2006-02-17|Saint Gobain|SUBSTRATE, IN PARTICULAR GLASS SUBSTRATE, CARRYING AT LEAST ONE PHOTOCATALYTIC LAYER STACK WITH THE HETEROEPITAXIAL GROWTH LAYER OF THE LAYER|
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    FR2972447B1|2011-03-08|2019-06-07|Saint-Gobain Glass France|PROCESS FOR OBTAINING A SUBSTRATE WITH A COATING|
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    FR3086590B1|2018-09-27|2021-01-01|Saint Gobain|PROCESS FOR OBTAINING A MATERIAL INCLUDING A SHEET OF GLASS.|
    WO2020070393A1|2018-10-03|2020-04-09|Saint-Gobain Glass France|Method for obtaining a sheet of glass coated with a functional layer|
    FR3092106B1|2019-01-29|2021-02-12|Saint Gobain|PROCESS FOR OBTAINING A SUBSTRATE COATED WITH A FUNCTIONAL LAYER|
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    FR3101345B1|2019-09-30|2021-09-24|Saint Gobain|Process for obtaining a curved laminated glazing|
    WO2022013495A1|2020-07-16|2022-01-20|Saint-Gobain Glass France|Low emissivity material comprising a thick titanium oxide based layer|
    WO2022013496A1|2020-07-16|2022-01-20|Saint-Gobain Glass France|Low-emissivity material comprising a coating having a titanium oxide based oxidation gradient|
    法律状态:
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    2015-12-11| PLSC| Search report ready|Effective date: 20151211 |
    2016-06-14| PLFP| Fee payment|Year of fee payment: 3 |
    2017-06-23| PLFP| Fee payment|Year of fee payment: 4 |
    2018-06-25| PLFP| Fee payment|Year of fee payment: 5 |
    2020-06-29| PLFP| Fee payment|Year of fee payment: 7 |
    2021-06-30| PLFP| Fee payment|Year of fee payment: 8 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1455151A|FR3021967B1|2014-06-06|2014-06-06|PROCESS FOR OBTAINING A SUBSTRATE COATED WITH A FUNCTIONAL LAYER|FR1455151A| FR3021967B1|2014-06-06|2014-06-06|PROCESS FOR OBTAINING A SUBSTRATE COATED WITH A FUNCTIONAL LAYER|
    EA201692450A| EA033251B1|2014-06-06|2015-06-02|Method for obtaining a substrate coated with a functional layer by using a sacrificial layer|
    US15/316,284| US10882781B2|2014-06-06|2015-06-02|Method for obtaining a substrate coated with a functional layer by using a sacrificial layer|
    KR1020167033737A| KR20170015906A|2014-06-06|2015-06-02|Method for obtaining a substrate coated with a functional layer by using a sacrificial layer|
    EP15732834.5A| EP3152173A1|2014-06-06|2015-06-02|Method for obtaining a substrate coated with a functional layer by using a sacrificial layer|
    CA2948893A| CA2948893A1|2014-06-06|2015-06-02|Method for obtaining a substrate coated with a functional layer by using a sacrificial layer|
    CN201580030119.6A| CN106414356A|2014-06-06|2015-06-02|Method for obtaining substrate coated with functional layer by using sacrificial layer|
    PCT/FR2015/051451| WO2015185848A1|2014-06-06|2015-06-02|Method for obtaining a substrate coated with a functional layer by using a sacrificial layer|
    JP2016571220A| JP6764349B2|2014-06-06|2015-06-02|Method for obtaining a substrate coated with a functional layer using a sacrificial layer|
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