• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a support (2) for a light source (s) for a lighting module and / or a light signaling device for a motor vehicle, comprising a substrate (4) made of thermally conductive material, preferably made of metallic material. at least one light source (12) of the electroluminescence diode type with a mounting face on the substrate (4), in thermal contact with the latter and a power supply control circuit (10) of the source or sources illuminated (12). The power control circuit is electrically connected with the light source or sources by means of metal son welded surface (16) by the technology commonly referred to as "wire / ribbon bonding". The invention also relates to a method of assembling such a support.
    公开号:FR3015853A1
    申请号:FR1363260
    申请日:2013-12-20
    公开日:2015-06-26
    发明作者:Marc Duarte；Zdravko Zojceski
    申请人:Valeo Vision SA；
    IPC主号:
    专利说明:

    [0001] The invention relates to the field of lighting and / or light signaling, in particular for a motor vehicle. More particularly, the invention relates to the field of mounting and electrical connection of light sources of the diode type electroluminescence (LED). The invention relates to a support for light source (s), to a module comprising such a support and to a method of assembling the support. The use of light-emitting diode-type light sources in lighting and / or light-signaling systems is becoming more and more widespread.
    [0002] In the field of lighting and automotive light signaling, so-called power diodes are used. These are often generally flat and of the type to rise to the surface. The mounting of surface components consists in soldering the components of a board on its surface (CMS or SMD for surface mounted device), rather than passing the pins through it. Since electroluminescent diodes are semiconductors, they are affected by temperature: the more they heat up, the lower their direct junction voltage decreases, and their luminous efficiency degrades. For reasons of reliability and luminous performance, measures to ensure heat dissipation must be implemented, in particular for power models.
    [0003] The published patent document FR 2 840 151 A1 discloses a power-emitting diode support for a lighting or light-signaling system for a motor vehicle. The diode is bonded to a metal substrate forming a radiator. This substrate is attached to an electrically insulating plate. It comprises two indentations each extending oppositely from a substrate edge to the edge of the diode. A conductive tongue is disposed in each of the two indentations to provide an electrical connection between the diode and the printed circuit on the plate, the metal substrate ensuring the cooling of the diode. Each of the tongues is connected by welding to one of the electrodes of the diode. The configuration of this teaching is interesting in that it allows to ensure a cooling of the diode while supporting it by means of a conventional insulating plate. The cooling capacity is however limited, mainly because of the limited size of the metal substrate. In addition, the positioning accuracy is also limited given the addition of the positioning tolerances of the diode relative to the dissipating substrate, the latter relative to the plate and then the latter relative to the reflector or the frame of the lighting or light-signaling module. The published patent document FR 2 853 200 A1 discloses, similarly to the preceding document, a power-emitting diode support for a lighting or light-signaling system for a motor vehicle. Similarly to the previous document, the diode is attached to a metal substrate capable of dissipating the heat produced by the diode. This substrate is fixed to a plate of electrically insulating material and comprises two opposite notches through which extend, respectively, two lugs or tongues of electrical connection. As an alternative to the method of bonding the diode on the heat dissipation substrate disclosed in the previous document, the diode of this teaching comprises a base consisting essentially of copper which is fixed to the substrate by laser spot welding. These measures are intended to avoid the drawbacks inherent in the use of glue, namely the drying time or crosslinking, the means necessary for its application, the time of its application and the means for holding the diode on the sink substrate until the glue ensures its fixation. Similar to the previous document, the cooling capacity in this construction is limited, essentially because of the limited size of the metal substrate. Still similar to the previous document, the positioning accuracy of the diode is limited. The object of the invention is to propose a power-emitting diode support, in particular for a lighting and / or light-signaling system for a motor vehicle, which ensures a better cooling and / or a better positioning accuracy of the diode (s). . The subject of the invention is a luminous source support (s) for a lighting module and / or a luminous signaling device for a motor vehicle, comprising: a substrate made of thermally conductive material, preferably made of metallic material; at least one light source diode electroluminescence with a mounting face on the substrate in thermal contact with the latter; a control circuit of the power supply of the light source or sources; remarkable in that the control circuit of the power supply is electrically connected with the light source or sources by means of metal son welded on the surface. In the context of the present invention, the metal son may be constituted by a wire of cylindrical section, a metal braid or a tongue. According to an advantageous embodiment of the invention, the metal wires extend overhead, preferably with loop profiles, away from the respective outer surfaces of the power control circuit and the light source or sources.
    [0004] In special cases, depending on the need for protection against vibrations or corrosion, the metal son may be covered with a drop of epoxy or silicone material, according to the coating technique known as the "glob top". The outer faces of the control circuit of the power supply and the light source or sources to which it is connected are essentially at the same height or at least have a height variation of less than 10 mm, preferably 5 mm, more preferably 3 mm. According to an advantageous embodiment of the invention, the power control circuit is supported by the substrate and comprises an edge vis-à-vis the or at least one of the light sources. According to an advantageous embodiment of the invention, the power control circuit is printed on or in a platinum of electrically insulating material and disposed on the substrate. According to an advantageous embodiment of the invention, the platen is generally flat, preferably made of thermosetting resin reinforced with solid fibers. The electrical circuit can be printed on the board. According to an advantageous embodiment of the invention, the plate is made of molded plastic material conforming to the shape of the substrate. The electrical circuit can be embedded in the plate. A connector may be unitarily formed with the board.
    [0005] According to an advantageous embodiment of the invention, the substrate comprises two opposite faces, each of the two faces supporting one of the light sources, the substrate comprising an orifice connecting the two faces and arranged in front of the plate so as to allow the electrical connection with the light source or sources on the face of the substrate opposite to that on which the plate is arranged. The substrate may comprise several such orifices. According to an advantageous embodiment of the invention, the orifice is traversed by at least one of the metal wires connected to the face of the plate in contact with the substrate and to the or one of the diodes on the face of the substrate opposite to that on which is arranged the plate. Alternatively, the wire may be replaced by a metal braid or a tongue making the electrical connection. According to an advantageous embodiment of the invention, the plate comprises a portion extending through the orifice, said portion comprising at least one electrical contact, one of the metal wires extending from said contact towards the one or more light sources. on the face of the substrate opposite to that on which the plate is arranged. The portion of the plate extending through the orifice can be integral with the rest of the plate, which can then be made by molding plastic material. The portion of the plate extending through the orifice may also be reported, in particular by gluing on the rest of the plate. According to an advantageous embodiment of the invention, the substrate comprises cooling fins. According to an advantageous embodiment of the invention, the substrate comprises a first portion forming a wall supporting the light source or sources and a second portion comprising the cooling fins. According to an advantageous embodiment of the invention, the second portion is disposed substantially in alignment with the first portion. According to an advantageous embodiment of the invention, the first and second portions of the substrate are made of material.
    [0006] According to an advantageous embodiment of the invention, the light source (s) are glued to the substrate. The glue can be loaded with silver (Ag) or ceramic particles to give it thermal conduction properties. According to an alternative embodiment of the invention, the light source (s) are welded onto the substrate, for example by means of a eutectic weld or by sintering methods. The invention also relates to a lighting module for a motor vehicle, comprising: a source of light source (s); at least one reflector adapted to reflect the light rays emitted by the or at least one of the light sources 10 into a lighting beam; remarkable in that the support is in accordance with the invention. According to an advantageous embodiment of the invention, the module comprises a first reflector arranged facing one of the two faces of the substrate, said face supporting at least one of the light sources and a second reflector arranged opposite the other of said two. faces, said other side supporting at least one of the light sources. According to an advantageous embodiment of the invention, the substrate comprises cooling fins arranged behind the reflector (s) relative to the main direction of the illumination beam. The invention may also relate to a projector or a light signaling device comprising a module according to the invention and / or a support according to the invention. The subject of the invention is also a method for assembling a support according to the invention, which is remarkable for the following steps: (a) fixing the light source or sources by bonding or welding onto the substrate and setting placing the feed control circuit on the substrate; and (b) placing the electrical wires between the power control circuit and the light source (s) by bridging and ultrasonic welding. In step (a), the operations of positioning and fixing the light source (s) and the operations of setting up the feed control circuit can be carried out concomitantly or one after the other , in one order or the other. The measures of the invention are interesting in that they make it possible to position the light sources with great precision directly on the substrate serving as a frame and as a reference piece. The cooling of the light sources is also optimized. The power supply circuit (s) can be positioned and fixed with less precision than the light sources, in particular in proportion to the size of their areas of contact with the metal wires. The bridging connection technology with wires or braids or metal tongues welded, preferably by ultrasound but also by laser welding or electro-resistive welding, then makes the electrical connections in a simple, reliable, economical and compatible with the connection with the fixing by glue or soldering of the light sources. Other features and advantages of the present invention will be better understood from the description and the drawings, in which: FIG. 1 is a perspective view of a light-emitting diode support, according to a first embodiment of FIG. embodiment of the invention, the view showing the upper face of said support; - Figure 2 is a perspective view of the support of Figure 1, the view however showing the underside of said support; FIG. 3 is a sectional view of an electroluminescence diode support, according to a second embodiment of the invention; FIG. 4 is a sectional view of an electroluminescence diode support portion according to a third embodiment of the invention, the not shown portion being similar to the support of FIG. 3; FIG. 5 is a sectional view of a light-emitting diode-supporting portion according to a fourth embodiment of the invention, the not shown portion being similar to the support of FIG. 3. FIGS. 1 and 2 illustrate a first embodiment of the invention. FIG. 1 is a perspective view of the upper face of a light-emitting diode type light source support. The support 2 essentially comprises a substrate 4 supporting electroluminescent diodes 12. More specifically, the substrate made of thermally conductive material, for example aluminum, comprises a first portion 8 that is generally thin and flat and a second portion 6 forming cooling fins. The first and second portions are preferably unitary, more preferably material. The fins 6 may extend in a generally transverse direction, preferably perpendicular, to the mean plane of the first portion. The upper face 24 of the first portion 8 supports two light-emitting diodes 12. These are power diodes, that is to say of power greater than or equal to 3 Watt, able to be fixed by their base. They comprise a base 20 and an optical portion 22 on said base 20. The base of the diodes is fixed to the substrate 8 by means of thermal glue, that is to say by means of an adhesive having transmission properties heat. It may for example be a glue sold under the trademarks Epo-tek®, Dow Corning® or Henkel®. A plate 10 covered with a printed electrical circuit (not shown) is also disposed on the first substantially flat portion 8 of the substrate 4. The plate has a profile conforming to the diodes 12 so as to follow them at a distance less than 10 mm, preferentially 5 mm. A connector 14 is provided on the board so as to allow its supply via a flexible cable or a press-fit connector or the like (not shown). Contact zones 18 are provided on the plate 10 vis-à-vis the diodes 12, these contacts being electrically connected to the printed circuit. The diodes 12 are electrically connected to the circuit for controlling the supply of the plate 10 via metal wires 16 forming bridges between the contact areas 18 of the plate and the corresponding contact areas of the diodes. These son 16 are welded to these areas including ultrasound. This is the technology commonly referred to by the Anglo-Saxon term "wire-bonding", or by the term "cabling by wire" or "bridging". This is a technique commonly used to make the electrical connections between the housing and the chip of an integrated circuit. The wiring is simply made by a wire (or bridge) welded between the two connection pads provided for this purpose on each of the elements. Welding is usually done by ultrasound. The material of the wire is aluminum, gold or copper. The diameter of the wire may be between 35 μm and 200 μm. One or more wires can be used for each connection. Optionally, a metal braid or a metal tongue can be used according to the expression in English "ribbon bonding". Laser or electro-resistive welding can also be envisaged. FIG. 2 is a view of the lower face of the support 2 of FIG.
    [0007] Similarly to the upper face, the lower face 26 of the generally thin and flat portion 8 of the substrate 4 supports a diode 12, this diode may be similar or identical to those located on the underside of said portion 8 of the substrate 4. The diode 12 is also fixed by gluing by means of a thermal glue. A plate 29 is also fixed on the upper face of the portion 8 of the substrate 4, this plate comprising a preferentially printed circuit (not shown) and intended to electrically power the diode 12. Contact zones 18 similar to those of the plate 10 from the underside are also provided. The electrical connection between the circuit board 29 and the diode 12 is also provided by soldered wires 16 forming a bridging. The plate 29 comprises a connector 28 intended to allow its supply from a flexible cable (not shown). For both faces 24 and 26, the wires 16 of the electrical connection extend in a generally curved manner away from the outer surfaces of the diodes and the plate. This bonding technique consists in applying a first end of a wire in contact with a contact zone of one of the diode and the plate, and then applying ultrasound to it to be welded to it. After welding, the wire can then be unwound from a tool and then cut and applied to the second of the two contact areas to be electrically connected. These wires are thus rigidly fixed at their ends to the respective contact areas, these rigid connections ensuring the maintenance of the remainder of the wire in its position as visible in FIGS. 1 and 2. A braid or a metal tongue can be used as a wire . Laser or electro-resistive welding can also be envisaged.
    [0008] From a process and assembly method point of view, the diodes 12 are put in place directly on the substrate in a precise manner, avoiding any accumulation of tolerances, especially when they are on a support which is itself positioned on a substrate. platinum which is itself positioned on the substrate acting as a reference piece. Indeed, the substrate comprises fixing means on a housing (not shown) and is intended to receive the reflectors cooperating with the diodes. The positioning accuracy can reach a tolerance up to 30pm. The plate (s) can be put in place before or after the establishment of the corresponding diode (s). The laying operation of the metal bridging son is carried out after the diode (s) and the platinum (s) are put in place. The support 2 illustrated in Figures 1 and 2 is intended to form a bifunctional lighting module. The diodes of the upper face 24 provide a first horizontal-off lighting function of the dipped beam type or "code". The diode of the lower face 26 forms a complementary beam to that of the first function, thus forming a second function called road lighting, that is to say without horizontal cutoff. A reflector is of parabolic profile and shaped half-shell is intended to be disposed on each of two faces of the thin and substantially flat portion 8 of the substrate 4. The substrate 4 thus forms the frame of the lighting module.
    [0009] Figure 3 illustrates a second embodiment of the invention. It is a longitudinal sectional view of a diode support similar to that of the first embodiment. The reference numbers of the first embodiment are used in the second embodiment for identical or similar elements, these numbers being increased by 100 in order to distinguish the two modes. For these elements reference is made to the corresponding description of the first mode. Specific numbers between 100 and 200 were used for the specific elements. The module 102 comprises a substrate 104 comprising, similarly to that of Figures 1 and 2, a first portion 108 generally thin and flat and a second portion 106 forming cooling fins. This embodiment is distinguished from the first in that the support 102 comprises only one feed plate 110. The latter extends along the upper face of the portion 108 of the substrate 104, above a orifice 130 passing through said portion 108. The diode 112 disposed on the lower face is electrically connected to the plate 110 on the upper face by means of welded wires 116 of the bridging type extending from the diode 112 through the orifice 130 until contact zones 118 on the lower face of the plate 110 opposite the orifice 130. The diode or diodes on the upper face are also connected via welded metal wires 116, similarly to the first embodiment of FIG. 1 and 2. The diameter of the orifice 130 is dimensioned to allow easy implementation of the welded metal wires 116. It may be greater than 5 mm, preferably 10 mm. This second embodiment makes it possible to reduce the necessary number of platinum (s) of supply, more particularly to require only one plate for two faces of a substrate, which is particularly advantageous. Figure 4 illustrates a third embodiment of the invention. It is a longitudinal sectional view of a diode support, similar to FIG. 3 of the second embodiment. The sectional view is however partial, the rest of the support not shown being similar to that of FIG. 3. The reference numerals of the second embodiment are used in the third embodiment for identical or similar elements, these numbers being increased by 100 to distinguish the two modes. For these elements reference is made to the corresponding description of the first mode. Specific numbers between 200 and 300 were used for the specific elements. The plate 201 instead of being essentially flat as in the first two embodiments of the invention, is in fact a molded plastic element whose shape conforms to that of the substrate 204. The electric circuit 234 can moreover be embedded inside the plate 210 or be printed or deposited on its outer surface. A connector 214 can be molded directly with the rest of the plate, in the mass of its material. Components 228 may be provided, in particular outside the plate to allow their replacement or their selection according to various operating parameters. The plate 210 comprises a portion 232 projecting from its inner face and passing through the orifice 230. The electric circuit 234 can then extend through the orifice 230 inside the plastic material of the plate 201, plus precisely from the protruding portion 232, until terminating at a contact zone 218 to provide an electrical connection with the diode of the corresponding face. The plastic material used for the plate 210 is preferably a thermoplastic material. It can also be fiber reinforced. Figure 5 illustrates a fourth embodiment of the invention. It is a longitudinal sectional view of a diode support, similar to FIGS. 3 and 4 of the second and third embodiments, respectively. The sectional view is, however, partial, the rest of the medium not shown being similar to that of FIG. 3. The reference numerals of the third embodiment are used in the fourth embodiment for identical or similar elements, these numbers being increased by 100 to distinguish the two modes. The plate 310 is of similar construction to the plate 110 of the second embodiment in FIG. 3, with the difference that it comprises an addition 332 on its inner face and passing through the orifice 330 of the thin and generally flat portion 308. substrate 304. This addition can be glued on the inner face of the plate 310, the latter being conventionally made of fiber reinforced epoxy resin. The adding element 332 is preferably made of electrically insulating material, such as for example a plastic material. It is then necessary to provide an electrical connection between the printed circuit on the outer face of the plate 310 and the contact zone 318 on the outer face of the added element 332. The add-on element 332 can also be made of conductive material electrically, for example metal material. In this case, this element must have a size smaller than that of the orifice 330 in order to avoid any electrical contact. An insulator on its outer face vis-à-vis the inner surface of the orifice may be provided. The electrical connection between the diode (s) and the add-on element 332 is similar to that of the previous embodiments. The same applies to the electrical connection between the diode or diodes of the opposite face and the plate 310. In general, it is understood that the description which has just been given of the various embodiments is also valid in the case an inversion of the upper and lower faces.
    [0010] Still in general, it should be noted that the number of diodes represented on the upper and lower faces of the portion of the substrate of the various embodiments described above is purely illustrative, this number may vary. Each of the faces may thus comprise one, two or more diodes according to the provisions of these figures.
    权利要求:
    Claims (18)
    [0001]
    REVENDICATIONS1. Light source (s) (2; 102; 202; 302) for a lighting and / or light-signaling module for a motor vehicle, comprising: a substrate (4; 104; 204; 304) of material thermally conductive, preferably made of metallic material; at least one light source (12; 112; 212; 312) of the electroluminescence diode type with a mounting face on the substrate (4; 104; 204; 304) in thermal contact therewith; - a control circuit of the power supply (10, 29; 110; 210; 310) of the light source or sources; characterized in that the power control circuit (10,29; 110; 210; 310) is electrically connected to the light source (s) (12,112; 212; 312) by means of surface-welded wires ( 16; 116; 216; 316).
    [0002]
    2. Support (2; 102; 202; 302) according to claim 1, characterized in that the metal wires (16; 116; 216; 316) extend overhead, preferably with loop profiles, away from the respective outer surfaces of the power control circuit (10, 29; 110; 210; 310) and the light source (s) (12,112; 212; 312).
    [0003]
    3. Support (2; 102; 202; 302) according to one of claims 1 and 2, characterized in that the control circuit of the supply (10, 29; 110; 210; 310) is supported by the substrate (4; 104; 204,304) and includes an edge vis-à-vis the or at least one of the light sources (12,112; 212; 312).
    [0004]
    4. Support (2; 102; 202; 302) according to one of claims 1 to 3, characterized in that the control circuit of the power supply is printed on or in a platinum (10, 30; 110; 210; 310) of electrically insulating material disposed on the substrate (4; 104; 204; 304).
    [0005]
    5. Support (2; 102; 302) according to claim 4, characterized in that the plate (10, 29; 110; 310) is generally flat, preferably made of thermosetting resin reinforced with solid fibers.
    [0006]
    6. Support (202) according to claim 4, characterized in that the plate (210) is molded plastic material conforming to the shape of the substrate (204).
    [0007]
    7. Support (102; 202; 302) according to one of claims 5 and 6, characterized in that the substrate (104; 204; 304) comprises two opposite faces, each of the two faces supporting at least one of the light sources ( 112; 212; 312), the substrate comprising an orifice (130; 230; 330) connecting the two faces and arranged opposite the plate (110; 210; 310) so as to allow the electrical connection with the light source (s); on the face of the substrate opposite to that on which the plate is arranged.
    [0008]
    8. Support (102) according to claim 7, characterized in that the orifice (130) is traversed by at least one of the metal son (116) connected to the face of the plate (110) in contact with the substrate (104). ) and the or one of the diodes (112) on the face of the substrate (104) opposite to that on which the plate (110) is arranged.
    [0009]
    9. Support (202; 302) according to claim 7, characterized in that the plate (210; 310) comprises a portion (232; 332) extending through the orifice (230; 330), said portion comprising at least one electrical contact (218; 318), one of the wires (216; 316) extending from said contact to the one or more light sources (216; 316) on the face of the substrate (204; 304) opposite to the one on which the plate (210; 310) is arranged.
    [0010]
    10. Support (2; 102; 202; 302) according to one of claims 1 to 9, characterized in that the substrate (4; 104; 204; 304) comprises cooling fins (6; 106; 206; 306). ).
    [0011]
    11. Support (2; 102; 202; 302) according to claim 10, characterized in that the substrate (4; 104; 204; 304) comprises a first portion (8; 108; 208; 308) forming a wall supporting the or the light sources and a second portion (6; 106; 206; 306) including the cooling fins.
    [0012]
    12. Support (2; 102; 202; 302) according to claim 11, characterized in that the second portion (6; 106; 206; 306) is arranged substantially in alignment with the first portion.
    [0013]
    13. Support (2; 102; 202; 302) according to one of claims 11 and 12, characterized in that the first (8; 108; 208; 308) and second portions (6; 106; 206; 306) of substrate came from matter.
    [0014]
    14. Support (2; 102; 202; 302) according to one of claims 1 to 13, characterized in that the light source (s) (12; 112; 212; 312) are glued or welded onto the substrate (4; 104; 204; 304).
    [0015]
    15. Lighting module for a motor vehicle, comprising: - a support (2; 102; 202; 302) of light source (s) (12; 112; 212; 312); at least one reflector capable of reflecting the light rays emitted by the or at least one of the light sources into a lighting beam; characterized in that the support is according to one of claims 1 to 13.
    [0016]
    16. Lighting module according to claim 14, characterized in that it comprises a first reflector disposed facing one of the two faces of the substrate (4; 104; 204; 304), said face supporting at least one of the sources. and a second reflector disposed opposite the other of said two faces, said other side supporting at least one of the light sources.
    [0017]
    17. Lighting module according to one of claims 14 and 15, characterized in that the substrate (4; 104; 204; 304) comprises cooling fins (6; 106; 206; 306) arranged behind the or reflectors with respect to the main direction of the illumination beam.
    [0018]
    18. A method of assembling a support according to one of claims 1 to 13, characterized by the following steps: (a) fixing the light source or sources (12; 112; 212; 312), by gluing or welding on the substrate (4; 104; 204; 304) and placing the power control circuit (10,29; 110; 210,310) on the substrate (4; 104; 204; 304); b) placing the electrical wires (16; 116; 216; 316) between the power control circuit (10,29; 110; 210,310) and the light source (s) (12; 112; 212; 312) by bridging and welding, by ultrasound, laser or electro-resistive welding.
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3015853A1|2015-06-26|LED SUPPORT WITH ELECTRICAL CONNECTION BY BRIDGE
    EP3073180B1|2020-02-19|Led mounting with receiving surface and electrical connection by bridging
    EP0127239B1|1987-08-26|Semi-conductor crystal display panel element and display panel comprising such an element
    EP3173681B1|2019-06-12|Lighting device for lighting module of a motor vehicle headlight, associated lighting module and projectors
    EP3273147B1|2021-08-18|Land vehicle light module
    FR2680859A1|1993-03-05|OPTICAL COLLIMATION ELEMENT AND ITS ASSOCIATED SUPPORT ELEMENT, IN PARTICULAR FOR A MOTOR VEHICLE SIGNALING LIGHT.
    FR2922167A1|2009-04-17|LIGHTING MODULE FOR A HEADLIGHT OR LIGHTING OF A MOTOR VEHICLE.
    EP2921772B1|2019-02-27|Light module of a motor vehicle
    EP3002511B1|2019-01-30|Device with semiconductor component mounted on a heat sink, mounting method, and lighting device for a motor vehicle comprising such a device
    EP2966342A1|2016-01-13|Lighting module for a motor vehicle projector headlight with positioning means between heat sink and reflector/lens
    EP3104074B1|2019-03-13|Positioning device of a led support on a support element and illumination or signalisation device comprising such a device
    EP2966343B1|2021-07-07|Lighting module for a motor vehicle headlight with positioning means between heat sink and reflector/circuit board
    EP2846079A1|2015-03-11|Lighting module for an illumination and/or signalling device
    FR3055401A1|2018-03-02|LUMINOUS MODULE OF A MOTOR VEHICLE WITH A COOLING GEAR
    FR2876965A1|2006-04-28|Light source e.g. smart LED, support for e.g. headlight of motor vehicle, has two conductors, each presenting respective bonding pad to be integrated by welding with respective conductors of each electronic support
    EP3072606B1|2019-07-31|Optical module for motor-vehicle headlight
    EP3383150A1|2018-10-03|Power supply device for at least one led and at least one electronic component, comprising a power supply control circuit provided with an insert
    FR3010489A1|2015-03-13|THERMAL DISSIPATOR AND LED LIGHTING MODULE
    EP3364100A1|2018-08-22|Compact light module
    EP3385607A1|2018-10-10|Light module for a motor vehicle comprising a semiconductor light source
    EP2966340B1|2022-01-19|Lighting module of a headlight for a motor vehicle
    FR3067791A1|2018-12-21|ELECTRICAL CONNECTION IN PLATE OF MULTIPLE LIGHT MODULES
    WO2021116284A1|2021-06-17|Lighting device for a motor vehicle
    FR3104679A1|2021-06-18|Optical part and light module for motor vehicle
    FR2547088A1|1984-12-07|Linear display device with semiconductor crystals
    同族专利:
    公开号 | 公开日
    US20190017672A1|2019-01-17|
    FR3015853B1|2017-01-27|
    EP3085209A1|2016-10-26|
    WO2015092034A1|2015-06-25|
    CN105830544B|2019-05-28|
    US10578266B2|2020-03-03|
    CN105830544A|2016-08-03|
    US20160298818A1|2016-10-13|
    US10094531B2|2018-10-09|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US6161910A|1999-12-14|2000-12-19|Aerospace Lighting Corporation|LED reading light|
    US20100027284A1|2008-08-02|2010-02-04|Automotive Lighting Reutlingen Gmbh|Light Module for an Illumination Device for a Motor Vehicle|
    US20110084612A1|2009-10-09|2011-04-14|General Led, Inc., A Delaware Corporation|Hybrid chip-on-heatsink device and methods|
    US20110182054A1|2010-01-26|2011-07-28|Jmk Optoelectronic. Co., Ltd.|Light source module|
    AT138268T|1990-03-20|1996-06-15|Amrad Corp Ltd|METHOD FOR CONTROLLING NEURON DEVELOPMENT AND KEEPING|
    FR2840151B1|2002-05-27|2006-09-01|Valeo Vision|ELECTROLUMINESCENT DIODE SUPPORT DEVICE FOR AUTOMOTIVE SIGNALING SYSTEM, AND METHOD FOR MANUFACTURING SUCH A DEVICE|
    FR2853200B1|2003-03-27|2005-10-07|Valeo Vision|METHOD FOR FIXING A POWER LIGHT EMITTING DIODE ON A RADIATOR, AND A SIGNALING DEVICE COMPRISING SUCH A DIODE|
    US7261437B2|2004-06-10|2007-08-28|Osram Sylvania Inc.|Wedge-based lamp with LED light engine and method of making the lamp|
    US7284882B2|2005-02-17|2007-10-23|Federal-Mogul World Wide, Inc.|LED light module assembly|
    US20090095971A1|2007-10-16|2009-04-16|Andrew Glovatsky|Wire bond led lighting unit|
    DE102009016876B4|2009-04-08|2019-09-05|Osram Gmbh|Lighting unit for vehicle headlights and vehicle headlights|
    KR101619832B1|2009-11-30|2016-05-13|삼성전자주식회사|Light emitting diode package, light emitting diode package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof|
    WO2012086109A1|2010-12-24|2012-06-28|パナソニック株式会社|Bulb-shaped lamp and lighting device|
    US8845161B2|2011-02-09|2014-09-30|Truck-Lite Co., Llc|Headlamp assembly with heat sink structure|
    CN202405253U|2011-06-30|2012-08-29|刘胜|Special LED light source packaging structure for automobile head lighter|
    US8939627B2|2011-07-29|2015-01-27|Stanley Electric Co., Ltd.|Vehicle lighting unit|
    JP5673510B2|2011-11-29|2015-02-18|豊田合成株式会社|Vehicle headlamp|FR3026467B1|2014-09-30|2019-10-04|Valeo Vision|LUMINOUS MODULE COMPRISING AT LEAST ONE COMPONENT AND A CONNECTOR ARRANGED ON A HEAT SINK, AND LIGHTING DEVICE FOR A MOTOR VEHICLE COMPRISING SUCH A MODULE|
    FR3046656B1|2016-01-11|2019-11-29|Valeo Iluminacion|LUMINOUS MODULE FOR A MOTOR VEHICLE COMPRISING TWO TYPES OF LIGHT SOURCES|
    FR3053867B1|2016-05-04|2020-11-13|Valeo Vision|LIGHT MODULE WITH ELECTROLUMINESCENT DIODES CONNECTED BY BRIDGE|
    FR3053762B1|2016-07-07|2020-08-28|Valeo Iluminacion Sa|LIGHT MODULE FOR MOTOR VEHICLES|
    FR3056690B1|2016-09-26|2019-08-02|Valeo Vision|LUMINOUS OPTICAL MODULE OF MOTOR VEHICLE|
    FR3056702B1|2016-09-27|2019-06-28|Valeo Vision|LUMINOUS MODULE WITH INTEGRATED DRIVER|
    FR3074881A1|2017-12-07|2019-06-14|Valeo Vision|LUMINOUS MODULE FOR MOTOR VEHICLE|
    KR20200027196A|2018-09-04|2020-03-12|현대모비스 주식회사|Led lamp apparatus for vehicle|
    JP2020119768A|2019-01-24|2020-08-06|スタンレー電気株式会社|Vehicle lighting appliance|
    法律状态:
    2015-12-31| PLFP| Fee payment|Year of fee payment: 3 |
    2016-12-29| PLFP| Fee payment|Year of fee payment: 4 |
    2018-01-02| PLFP| Fee payment|Year of fee payment: 5 |
    2019-12-31| PLFP| Fee payment|Year of fee payment: 7 |
    2020-12-31| PLFP| Fee payment|Year of fee payment: 8 |
    2021-12-31| PLFP| Fee payment|Year of fee payment: 9 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1363260A|FR3015853B1|2013-12-20|2013-12-20|LED SUPPORT WITH ELECTRICAL CONNECTION BY BRIDGE|FR1363260A| FR3015853B1|2013-12-20|2013-12-20|LED SUPPORT WITH ELECTRICAL CONNECTION BY BRIDGE|
    US15/102,964| US10094531B2|2013-12-20|2014-12-19|LED substrate with electrical connection by bridging|
    CN201480069792.6A| CN105830544B|2013-12-20|2014-12-19|LED substrate with the electrical connection by bridge joint|
    PCT/EP2014/078892| WO2015092034A1|2013-12-20|2014-12-19|Led substrate with electrical connection by bridging|
    EP14827758.5A| EP3085209A1|2013-12-20|2014-12-19|Led substrate with electrical connection by bridging|
    US16/134,841| US10578266B2|2013-12-20|2018-09-18|LED substrate with electrical connection by bridging|
    [返回顶部]