• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Cooking field device. The invention relates to a cooking field device with a matrix of heating elements (20a-d), which has a first heating element (22a-d) and at least a second heating element (24a-d) , and with a matrix of temperature sensors (30a-d), which has at least one temperature sensor (32a-d, 34a-d) which is arranged in the area of the first heating element (22a-d) at observed in a direction perpendicular to the main extension plane of the temperature sensor array (30a-d). In order to increase flexibility, it is proposed that the temperature sensor (32a-d, 34a-d) be provided to measure the temperature of at least a first heating area heatable by the first heating element (22a-d) and at least one second heating area heatable by the second heating element (24a-d).
    公开号:ES2684518A1
    申请号:ES201730491
    申请日:2017-03-30
    公开日:2018-10-03
    发明作者:Jose Andres Garcia Martinez；Maria Elena Moya Albertin；Jesus Manuel Moya Nogues；David Paesa García；Daniel Palacios Tomas；David Valeau Martin
    申请人:BSH Hausgeraete GmbH；BSH Electrodomesticos Espana SA；
    IPC主号:
    专利说明:

    The present invention refers to a cooking field device according to the preamble of claim 1.
    Through European patent application EP 1 575 336 A 1, an induction cooking zone with construction groups of at least two induction coils and a temperature sensor is known, which is arranged between the induction coils and connected with these through heat conductors. The position of the temperature sensor is here coupled to the position of the induction coils. In addition, all induction coils in the induction cooking zone are connected to temperature sensors by means of heat conductors.
    Furthermore, through the European patent application EP 2 337426 A 1, an induction cooking field with a temperature sensor is known, which is arranged in the central section of an induction coil or between two or more coils of induction. Here, the temperature sensor is connected to the two or more induction coils through a heat conductor. The position of the temperature sensor is here coupled to the position of the induction coils. In addition, all induction coils are connected to temperature sensors directly or through heat conductors.
    The invention solves the technical problem of providing a generic cooking field device with better properties relative to its flexibility. According to the invention, this technical problem is solved by the features of claim 1, while advantageous embodiments and improvements of the invention can be extracted from the secondary claims.
    The present invention refers to a cooking field device with an array of heating elements, which has a first heating element and at least a second heating element, and with a temperature sensor array, arranged approximately or exactly in parallel to the array of heating elements, which has at least one temperature sensor that is arranged in the area of the first heating element when viewed in a direction perpendicular to the main extension plane of the temperature sensor array, where the temperature sensor is intended to measure the temperature of at least a first area of
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    heating heated by the first heating element and at least a second heating area heated by the second heating element. By this embodiment, it is possible that the flexibility is high, in particular, a flexible and / or independent arrangement of the array of heating elements and / or of the temperature sensor array. Furthermore, it is possible to advantageously achieve efficiency, in particular, cost efficiency, measurement efficiency and / or efficiency relative to the components, in particular, that the amount of temperature sensors is reduced and / or that heat conductors are dispensed with . In addition, a universally applicable provisioning principle can be provided.
    The term "cooking field device" includes the concept of at least one part, namely, a construction subgroup, of a cooking field. The cooking field can be carried out here as a gas cooking field and / or as a heating coil cooking field, for example, cooking field of several cooking points and / or halogen cooking field. However, the cooking field is advantageously carried out as an induction cooking field. Particularly advantageously, the cooking field is also carried out as a matrix cooking field, in particular as a matrix induction cooking field. The cooking field is intended to heat at least one cooking battery and / or at least one cooking product. Advantageously, the cooking field device may also have a cooking field plate that is intended to place at least one cooking battery, and / or a control panel that is intended for the user to direct the cooking field . The term "intended" includes the concept of conceived and / or specifically provided. The expression that an object is intended for a particular function includes the concept that the object satisfies and / or performs this particular function in one or more application and / or operating states. The expression "roughly or exactly in parallel" includes the concept of the orientation of an address relative to a reference plane and / or a reference address in a plane, where the address present with respect to the reference plane and / or the direction reference is a deviation of less than 8 °, advantageously, less than 4 ° and, particularly advantageously, less than 2 °. The term "main extension plane" of an object includes the concept of a plane that is parallel to the greater lateral superty of the imaginary parallelepiped minor that completely wraps around the object, and which preferably runs through the central point, specifically , of the geometric central point, of the parallelepiped. The expression "arranged in the area of a heating element" includes the concept that the heating element overlaps at least 20%, advantageously, at least 40%, so
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    preferably, at least 60%, more preferably, at least 80% and, particularly preferably, 100% of the temperature sensor.
    The term "matrix of heating elements" includes the concept of multiple heating elements arranged as a matrix, which are intended to interact in order to heat the cooking battery and / or a cooking product. Advantageously, the heating elements are arranged in a common plane made as the main extension plane of the matrix of heating elements. In addition, the heating elements can be arranged here in any repetitive pattern, for example, a square pattern, a rectangular pattern, a triangular pattern, an alveolar pattern and / or a rhomboid pattern. The term "heating element" includes the concept of an element that is intended to transform an advantageously electrical energy into thermal energy and to be supplied to at least one heated area, namely, a heating zone, in order to heat a battery Cooking The heating area is arranged here above the array of heating elements in the direction of the force of gravity. In addition, the heating element can be realized as a resistance heating element, as a radiation heating element and / or, preferably, as an induction heating element, in particular, as an inductor.
    The term "temperature sensor array" includes the concept of multiple temperature sensors arranged as a matrix, which are intended to measure and / or monitor the temperature of the array of heating elements and / or the area surrounding the matrix of heating elements. Advantageously, the temperature sensors are arranged in a common plane made as the main extension plane of the temperature sensor array. In addition, the temperature sensors can be arranged here in any repetitive pattern, for example, a square pattern, a rectangular pattern, a triangular pattern, an alveolar pattern and / or a rhomboid pattern. The term "temperature sensor" includes the concept of a sensor that is intended to measure and / or monitor the temperature of at least one heated area, advantageously, of the first heating area and / or the second heating area and, advantageously, at least a part of the cooking battery and / or at least a part of the cooking product. The temperature sensor can be made here as a bimetal, in particular, as a thermal element, as an infrared temperature sensor, as a semiconductor temperature sensor and / or as a resistance temperature sensor, specifically as a resistance temperature sensor of platinum, as a silicon resistance temperature sensor and / or as a ceramic resistance temperature sensor. From
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    particularly advantageously, the temperature sensor differs from a thermochromic element and / or a thermochromic coating.
    In order to improve the measurement of the temperature of the particular heating elements and / or in order to achieve a defined measurement of the temperature of several heating elements by means of a temperature sensor, it is further proposed that the array of heating elements heating has at least a third heating element, which is arranged adjacent to the first heating element such that the sensor-heating element distance of the temperature sensor from the second heating element is different from another distance sensor-heating element of the temperature sensor with respect to the third heating element. The sensor-heating element distance differs from the other sensor-heating element distance by at least 5%, advantageously, at least 10%, preferably, at least 20% and, particularly preferred, at least 30%. Advantageously, the temperature sensor is provided to measure the temperature of at least one third heating area heated by the third heating element. The term "sensor-heating element distance" includes the concept of the distance of the central point of the smallest imaginary circle that surrounds the sensor fully adjusted with respect to another central point of another imaginary minor circle that completely surrounds an element of heating, advantageously arranged directly adjacent to the sensor.
    In another embodiment, it is proposed that the amount of heating elements of the heating element array be greater than the amount of temperature sensors of the temperature sensor array. In this way, the efficiency can be advantageously increased, in particular the cost efficiency, the measurement efficiency and / or the efficiency relative to the components. The amount of heating elements is greater than the amount of temperature sensors by at least 10%, advantageously, at least 30%, preferably, at least 80% and, particularly preferably, at least 200%
    Furthermore, it is proposed that the intermediate area between the temperature sensor and the second heating element does not have a thermal bridge, which is intended to provide heat conduction of the second heating element to the temperature sensor. In this way, manufacturing can be simplified and / or robustness increased. Another intermediate area between the temperature sensor and the third heating element
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    It has no thermal bridge, which is intended to provide heat conduction from the third heating element to the temperature sensor. The term "thermal bridge" includes the concept of an object that one and / or advantageously contacts at least two other objects, which is intended to provide heat conduction between the other two objects.
    In order to increase the efficiency, advantageously, the cost efficiency and / or the efficiency relative to the measurement, it is further proposed that, observing in a direction perpendicular to the main extension plane of the temperature sensor array, the surface that closely surrounds the temperature sensor array is less than at least 5%, preferably, at least 10%, advantageously, at least 15% and, particularly preferably, at less 20%, than another surface that closely surrounds the array of heating elements. Observing in the direction perpendicular to the main extension plane of the temperature sensor array, the area of a rectangle that closely surrounds the temperature sensor array is less than at least 5%, preferably, at least 10%, advantageously, at least 15% and, particularly preferably, at least 20%, than another area of another rectangle that closely surrounds the array of heating elements.
    According to another embodiment, it is proposed that the array of heating elements and the array of temperature sensors be arranged independently of each other. In this way, flexibility can be advantageously increased, in particular, to improve the flexible arrangement of the temperature sensor array with respect to the array of heating elements. The term "arranged independently of one another" includes the concept that a pattern of the arrangement and / or the distance between adjacent heating elements of the array of heating elements are configured differently from another pattern of the arrangement and / or another distance between the adjacent temperature sensors of the temperature sensor array.
    Likewise, it is proposed that the distance heating element-heating element between adjacent heating elements of the array of heating elements be different from the sensor-sensor distance between adjacent temperature sensors of the temperature sensor array . In this way, the arrangement of the temperature sensors can be advantageously decoupled from the arrangement of the heating elements. The heating element distance
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    heating element of the first heating element with respect to the second heating element is different with respect to the sensor-sensor distance of the temperature sensor with respect to another temperature sensor, arranged adjacent to the temperature sensor. Advantageously, the distance heating element-heating element of the first heating element with respect to the third heating element is different with respect to the sensor-sensor distance of the temperature sensor with respect to the other temperature sensor. Particularly advantageously, the distance heating element-heating element of the second heating element with respect to the third heating element is different with respect to the sensor-sensor distance of the temperature sensor with respect to the other temperature sensor. The term "distance heating element-heating element" includes the concept of the distance from the central point of the smallest imaginary circle that surrounds a heating element fully adjusted with respect to another central point of another imaginary minor circle that surrounds tightly by complete to another heating element, advantageously arranged directly adjacent to the heating element. The term "sensorsensor distance" includes the concept of the distance of the central point of the smallest imaginary circle that surrounds a sensor completely adjusted with respect to another central point of another imaginary minor circle that completely surrounds another sensor, advantageously disposed of way directly adjacent to the sensor.
    In order to implement a reliable and / or efficient temperature measurement, it is further proposed that the sensor-sensor distance between two adjacent temperature sensors of the temperature sensor array be less than 15 cm, preferably, less than 12 cm, advantageously, less than 10 cm and, particularly advantageously, less than 8 cm. Advantageously, the sensor-sensor distance is smaller than the minimum diameter of a cooking battery for which the matrix cooking field is provided for heating. In addition, for each possible arrangement of the cooking battery on the matrix cooking field, at least one temperature sensor is advantageously arranged below the cooking battery.
    In addition, it is proposed that the second heating element be realized as a peripheral heating element and without a sensor. In this way, the cost efficiency, the efficiency relative to the measurement and / or the efficiency relative to the components can be advantageously increased. Advantageously, the array of heating elements has at least two, advantageously, at least four, preferably, at least eight and, particularly preferably, at least sixteen,
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    peripheral heating elements and preferably without sensor. At least a large part of the peripheral heating elements is advantageously performed without a sensor. Particularly advantageously, at least a part, preferably at least a large part and, particularly preferably, all peripheral heating elements arranged adjacent to the control panel overlap with at least one temperature sensor, when observed in a direction perpendicular to the main extension plane of the array of heating elements. The term "peripheral heating element" includes the concept of a heating element of the matrix of heating elements that does not have another heating element arranged adjacent to it in at least one direction arranged parallel to the main extension plane of the array of heating elements. The term "heating element without sensor" includes the concept of a heating element which, when viewed in a direction perpendicular to the main extension plane of the array of heating elements, does not overlap with a temperature sensor. The expression "large part" of a number of objects includes the concept of at least 55%, advantageously, at least 65%, preferably, at least 75%, particularly preferably, at least 85 % and, particularly advantageously, at least 95% of the number of objects.
    Other advantages are taken from the following description of the drawing. Examples of embodiment of the invention are shown in the drawing. The drawing, description and claims contain numerous features in combination. The person skilled in the art will consider the characteristics advantageously also separately, and will gather them in other reasonable combinations.
    They show:
    Fig. 1 an example cooking field as a cooking field
    by matrix induction with acooking field device, inview
    higher,
    Fig. 2 hedevicefromcountrysidefromcookingwithamatrixfromelementsfrom
    heating and with amatrix ofsensorsOf temperatureinaview
    inside,
    Fig. 3 another embodiment ofa cooking field devicewith a
    array of heating elements and withamatrix ofsensorsfrom
    temperature in an interior view,
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    Fig. 4 another embodiment ofacooking field devicewith a
    array of heating elements and withamatrix ofsensorsfrom
    temperature in an interior view, and
    Fig. 5 another embodiment ofa device de cacooking modewith a
    array of heating elements and withamatrix ofsensorsfrom
    temperature in an interior view.
    Figure 1 shows a cooking field 10a made as an induction cooking field, in a schematic representation. In this case, the cooking field 10a is made as a matrix cooking field.
    The cooking field 10a has a cooking field device. The cooking field device has a cooking field plate 12a. The cooking field plate 12a is made in one piece and is intended to place at least one cooking battery 16a. In addition, the cooking field device has a control panel 14a. The control panel 14a is intended for the user to direct the cooking field 10a. In this case, the control panel 14a is integrated in the cooking field plate 12a.
    The cooking field device has an array of heating elements 20a (see Figure 2). In this case, the array of heating elements 20a is made as an array of induction heating elements, in particular, as a matrix of inductors. The main extension plane of the array of heating elements 20a is arranged perpendicularly to the direction of the force of gravity. In addition, the array of heating elements 20a is disposed below the cooking field plate 12a in the direction of the force of gravity. In a state of heating operation, the array of heating elements 20a is provided to heat at least the cooking battery 16a. Alternatively, an array of heating elements could be made as a matrix of resistance heating elements and / or as a matrix of radiation heating elements.
    The matrix of heating elements 20a has a first heating element 22a. The first heating element 22a is made as an induction heating element, in particular, as an inductor. In addition, the array of heating elements 20a has a second heating element 24a. The second heating element 24a is arranged adjacent to the first heating element 22a and is made as an induction heating element, in
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    concrete, as inductor. In addition, the second heating element 24a is made as a peripheral heating element. In this case, the second heating element 24a is made as a heating element without a sensor. The array of heating elements 20a has at least a third heating element 26a. The third heating element 26a is arranged adjacent to the first heating element 22a and the second heating element 24a, and is made as an induction heating element, in particular, as an inductor. The array of heating elements 20a comprises other multiple heating elements that are not indicated by a reference symbol. Alternatively, at least one heating element could be realized as a resistance heating element and / or as a radiation heating element.
    The first heating element 22a, the second heating element 24a, the third heating element 26a, and the other heating elements are arranged as a matrix. In the present case, the first heating element 22a, the second heating element 24a, the third heating element 26a, and the other heating elements are arranged in accordance with a rectangular pattern, in particular, with a square pattern. The first heating element 22a, the second heating element 24a, the third heating element 26a, and the other heating elements interact to heat the cooking battery 16a. Alternatively, the heating elements could be arranged in accordance with a triangular pattern, an alveolar pattern and / or a rhomboidal pattern.
    In addition, the cooking field device has a temperature sensor array 30a. The temperature sensor array 30a is disposed below the cooking field plate 12a in the direction of the force of gravity. The surface surrounding the temperature sensor array 30a tightly is at least 10% smaller than another surface tightly surrounding the heating element array 20a. In the present case, if it is observed in a direction perpendicular to the main extension plane of the temperature sensor array 30a, the area of a rectangle that closely fits the temperature sensor array 30a is less than at least 10% than another area of another rectangle that closely surrounds the array of heating elements 20a. Basically, it is also conceived that the surface that closely surrounds the temperature sensor array is less than at least 5% than another surface that tightly surrounds the array of heating elements.
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    The temperature sensor array 30a comprises at least one temperature sensor 32a. In this case, the temperature sensor array 30a comprises multiple temperature sensors 32a, 34a, where, for reasons of clarity, in figure 2 only two of the temperature sensors 32a, 34a are accompanied by a reference symbol. The amount of heating elements 22a, 24a, 26a of the array of heating elements 20a is greater than the amount of temperature sensors 32a, 34a of the temperature sensor array 30a. In this case, the amount of heating elements 22a, 24a, 26a is at least 30% greater than the amount of temperature sensors 32a, 34a. Alternatively, the amount of heating elements could be greater by at least 10% than the amount of temperature sensors.
    The temperature sensors 32a, 34a are arranged as a matrix. In this case, the temperature sensors 32a, 34a are arranged in accordance with a rectangular pattern, in particular, a square pattern. Each of the temperature sensors 32a, 34a is arranged in the area of exactly one of the heating elements 22a, 24a, 26a. In addition, the sensor-sensor distance between two adjacent temperature sensors 32a, 34a of the temperature sensor array 30a is less than 15 cm. Thus, for each possible arrangement of the cooking battery 16a on the cooking field plate 12a, at least one temperature sensor 32a, 34a of the temperature sensor array 30a is disposed below the cooking battery 16a. Alternatively, the temperature sensors could be arranged in accordance with a triangular pattern, an alveolar pattern and / or a rhomboidal pattern.
    If it is observed in a direction perpendicular to the main extension plane of the temperature sensor array 30a, the temperature sensor 32a is arranged in the area of the first heating element 22a. The temperature sensor 32a is provided to measure the temperature of a first heating area heated by the first heating element 22a. In addition, the temperature sensor 32a is provided to measure the temperature of a second heating area heated by the second heating element 24a. In addition, in this case, the temperature sensor 32a is provided to measure the temperature of a third heating area heated by the third heating element 26a. Additionally, an array of temperature sensors could have temperature sensors that are arranged between heating elements.
    The sensor-heating element distance of the temperature sensor 32a with respect to the second heating element 24a is different with respect to another sensor distance
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    heating element of the temperature sensor 32a with respect to the third heating element 26a. In the present case, the other sensor-heating element distance is more than 40% greater than the sensor-heating element distance. Alternatively, another sensor-heating element distance of a temperature sensor with respect to a second heating element could be more than 5% greater than the sensor-heating element distance of a temperature sensor with respect to a first element heating
    The intermediate area between the temperature sensor 32a and the second heating element 24a does not have a thermal bridge. In addition, the intermediate area between the temperature sensor 32a and the third heating element 26a does not have a thermal bridge. In this case, the areas surrounding any of the temperature sensors 32a, 34a of the temperature sensor array 30a do not have thermal bridges.
    In Figures 3 to 5, three other embodiments of the invention are shown. The following description and the drawings are essentially limited to the differences between the embodiments, where, in relation to components indicated in the same way, in particular, in terms of components with the same reference symbols, it can also be basically referred to the drawing and / or the description of the other embodiment of Figures 1 to 2. For the differentiation of the examples of embodiment, the letter "a ~ is postponed to the reference symbols of the embodiment of Figures 1 to 2. In the embodiments of figures 3 to 5, the letter "a ~ has been replaced by the letters" b "to" d ",
    In Figure 3, another embodiment of the invention is shown. The letter "b" is postponed to the reference symbols of the embodiment example of figure 3. This other embodiment example of figure 3 differs from the previous embodiment example at least basically in the embodiment of the array of heating elements 20b and of the temperature sensor array 30b.
    In this case, the heating elements 22b, 24b, 26b of the matrix of heating elements 20b are arranged in a triangular pattern, specifically, in an equilateral triangle-shaped pattern. Also, the temperature sensors 32b, 34b of the temperature sensor array 30b are arranged in a triangular pattern, specifically, in an equilateral triangle shaped pattern.
    In Figure 4, another embodiment of the invention is shown. The letter "e" is postponed to the reference symbols of the embodiment of Figure 4. This other
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    Example of embodiment of Figure 4 differs from the example of embodiment of Figures 1 and 2 at least basically in the embodiment of the array of heating elements 20c and the array of temperature sensors 30c.
    In this case, the array of heating elements 20c and the array of temperature sensors 30c are arranged independently of each other. The heating element-heating element distance between the adjacent heating elements 22c, 24c of the heating element array 20c is different with respect to the sensor-sensor distance between adjacent temperature sensors 32c, 34c of the sensor array of temperature 30c. In the present case, the sensor-sensor distance is more than twice as long as the heating element-heating element distance. In addition, the sensor-sensor distance is less than three times greater than the heating element-heating element distance. The amount of heating elements 22c, 24c, 26c is at least 200% greater than the amount of temperature sensors 32c, 34c. Alternatively, the sensor-sensor distance could be at least 5% greater than the heating element-heating element distance.
    In Figure 5, another embodiment of the invention is shown. The letter "d" is postponed to the reference symbols of the embodiment example of figure 5. This other embodiment example of figure 5 differs from the previous embodiment example at least basically in the embodiment of the array of heating elements 20d and 30d temperature sensor array.
    In this case, the heating elements 22d, 24d, 26d of the matrix of heating elements 20d are arranged in a triangular pattern, specifically, in an equilateral triangle-shaped pattern. In addition, the temperature sensors 32d, 34d of the temperature sensor array 30d are arranged in a triangular pattern, specifically, in an equilateral triangle-shaped pattern. The sensor-sensor distance between adjacent temperature sensors 32d, 34d of the temperature sensor array 30d is greater than the distance heating element-heating element between adjacent heating elements 22d, 24d, 26d of the array of elements 20d heating Also, the sensor-sensor distance is less than twice the distance heating element-heating element. The amount of heating elements 22d, 24d, 26d is at least 60% greater than the amount of temperature sensors 32d, 34d.
    N "application F. Effective F.OEPM 06/27/2017 06/27/2017

    Reference symbols
    10 Cooking field
    12 Cooking Field Plate
    14 Control panel
    16 Cooking battery
    twenty Matrix of heating elements
    22 Heating element
    24 Heating element
    26 Heating element
    30 Temperature sensor array
    32 Temperature sensor
    3. 4 Temperature sensor
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    权利要求:
    Claims (9)
    [1]
    one. Cooking field device with an array of heating elements
    (20a-d), which has a first heating element (22a-d) and at least one
    second heating element (24a-d), and with an array of sensors
    5 temperature (30a-d), which has at least one temperature sensor (32a-d,
    34a-d) which is arranged in the area of the first heating element (22a-d) to
    observed in a direction perpendicular to the main extension plane of the
    temperature sensor array (30a-d), characterized in that the sensor
    temperature (32a-d, 34a-d) is planned to measure the temperature of at least one
    10 first heating area heated by the first heating element
    (22a-d) and of at least one second heating area heated by the second
    heating element (24a-d).
    [2]
    2. Cooking field device according to claim 1, characterized in that the
    fifteen matrix of heating elements (20a; 20c-d) has at least a third
    heating element (26a; 26c-d), which is arranged adjacently
    to the first heating element (22a; 22c-d) such that the distance
    sensor-heating element of the temperature sensor (32a; 32c-d, 34a; 34c
    d) with respect to the second heating element (24a; 24c-d) it is different with
    twenty with respect to another distance sensor-heating element of the sensor
    temperature (32a; 32c-d, 34a; 34c-d) with respect to the third element of
    heating (26a; 26c-d).
    [3]
    3. Cooking field device according to claims 1 or 2, characterized
    25 because the amount of heating elements (22a-d, 24a-d, 26a; 26c-d) of the
    matrix of heating elements (20a-d) is greater than the number of sensors
    of temperature (32a-d, 34a-d) of the temperature sensor array (30a-d).
    [4]
    Four. Cooking field device according to one of the stated claims
    30 previously characterized in that the intermediate area between the sensor
    temperature (32a-d, 34a-d) and the second heating element (24a-d) no
    It has a thermal bridge.
    [5]
    5. Cooking field device according to one of the stated claims
    35 previously, characterized in that the surface surrounding tightly to the
    temperature sensor array (30a-d) is less than at least 5% than another
    fifteen
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    surface that closely surrounds the array of heating elements (20a
    gave·
    [6]
    6. Cooking field device according to one of the stated claims
    5 above, characterized in that the array of heating elements (20cd) and the temperature sensor array (30c-d) are arranged independently of each other.
    [7]
    7. Cooking field device according to one of the stated claims
    10, characterized in that the distance heating element heating element between the heating elements (22c-d, 24c-d) adjacent to the matrix of heating elements (20c-d) is different with respect to the sensor-sensor distance between the adjacent temperature sensors (32c-d, 34cd) of the temperature sensor array (30c-d).
    [8]
    8. Cooking field device according to one of the preceding claims, characterized in that the sensor-sensor distance between two adjacent temperature sensors (32a-d, 34a-d) of the temperature sensor array (30a-d) is less than 15 cm.
    [9]
    9. Cooking field device according to one of the preceding claims, characterized in that the second heating element (24a-d) is made as a peripheral heating element.
    10. Cooking field (10a-d), in particular, matrix cooking field, with at least one cooking field device according to one of the claims set forth above.
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    同族专利:
    公开号 | 公开日
    ES2684518B1|2019-07-12|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20120024840A1|2010-07-28|2012-02-02|Samsung Electronics Co., Ltd.|Temperature sensor and induction heating cooker having the same|
    WO2013118027A1|2012-02-10|2013-08-15|BSH Bosch und Siemens Hausgeräte GmbH|Induction cooking hob having an inductor coil field|
    EP3026981A1|2014-11-25|2016-06-01|E.G.O. ELEKTRO-GERÄTEBAU GmbH|Induction cooktop and method for controlling an induction cooktop|
    EP3082378A1|2015-04-09|2016-10-19|BSH Hausgeräte GmbH|Hotplate device|
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    ES201730491A|ES2684518B1|2017-03-30|2017-03-30|COOKING FIELD DEVICE|ES201730491A| ES2684518B1|2017-03-30|2017-03-30|COOKING FIELD DEVICE|
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