Light emitting device with high thermal load cooled by microchannel

专利摘要:

公开号:ES2671912T9
申请号:ES11737563.4T
申请日:2011-01-26
公开日:2018-07-23
发明作者:Jonathan S. Dahm；Mark Jongewaard；Geoff Campbell
申请人:Heraeus Noblelight Fusion UV Inc；
IPC主号:

专利说明:

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DESCRIPTION
Light emitting device with high thermal load cooled by microchannel
Background
Countryside
The embodiments of the present invention are generally related to LEDs (light-emitting diode, light emitting diode) on substrates of low thermal resistance. Specifically, the embodiments of the present invention relate to high power density, high form factor, and microchannel ultraviolet (UV) cooling channel head modules that provide high brightness, high irradiance and high energy density.
Description of the related technique
Today's ultraviolet LEDs remain relatively inefficient (typically, operating around 15% efficiency when operating at high current densities). These inefficiencies result in the production of high amounts of wasted heat and therefore require at least air cooling and often cooling liquids (e.g., heat exchangers and / or chillers) to eliminate unwanted heat waste, which is a by-product of electricity for the optical conversion process at the pn junction of the semiconductor device. If the heat is not eliminated in a very effective and efficient way, the led devices can suffer a loss of efficiency, decrease the luminous efficiency and even a catastrophic failure.
Ultraviolet led liquid cooling lamps (or light engines) are currently being used in a variety of healing applications, however, existing systems have many limitations. For example, while the industrial literature recognizes the convenience of high brightness / high irradiance sets, the currently available ultraviolet LED lamps offer insufficient performance. Existing ultraviolet led lamps generally tend to electrically connect the LEDs with their LED sets in led chains connected in series and then pair those chains together (often with integrated resistors). A disadvantage of this serial pairing methodology is that heat sinks generally have to be of a non-electrically conductive nature and / or there needs to be a dielectric layer under the led (or LEDs), any of which is traditionally stamped with a conductive printed circuit. These prints are expensive and incompatible with the operation of ultra high thermally efficient current due to the thermal contact resistance of the layers involved and / or the thermal resistance of the dielectric layer volume and / or the inherently high electrical resistivity of the prints. In addition, heat sinks are often made of expensive ceramic materials such as BeO, SiC, AIN or alumina. Another disadvantage of the parallel series led assembly model is that a single failure of a led can lead to a failure of the entire string of led in series. This dark area created by a failure in any chain of LEDs is almost always detrimental to the process where the light interacts photochemically on the surface of the workpiece.
A specific example of the prior art of the ultraviolet led assembly is exemplified in FIGS. 1A and 1B. In this example, which has been taken from US publication No. 2010/0052002 (hereinafter "Owen"), a set of LEDs 100 supposedly "dense" is represented for applications that claim a "high optical power density ". The matrix 100 is constructed by creating microreflectors 154 on a substrate 152 and mounting a led 156 on each microreflector 154. The LEDs 56 are electrically connected to a power source (not shown) through a main line 158 to a pad connected by cable to the substrate 152. Each microreflector 154 includes a reflective layer 162 to reflect the light produced by the associated led 156. Specifically, despite being characterized as a "dense" led assembly, the led assembly 100 is actually a set with a low form factor, low brightness and low heat flux in which the individual LEDs 156 are spaced quite a distance with a spacing of about 800 microns. In the best case, it would appear that the LEDs justify approximately between 10% and 20% of the surface area of the 100 led set and certainly less than 50%. Such low form factor led assemblies can create an irregular irradiance pattern, which can cause irregular treatment and visually perceptible anomalies, such as overlapping and pixelation. Additionally, microreflectors 154 fail to capture and control a substantial amount of light by virtue of their low angular extent. Consequently, the assembly 100 produces a beam that rapidly loses irradiance as a function of the distance of the reflector 154. It should also be added that even the reflectors configured optimally would not compensate for the low brightness of the led assembly 100, since the last beam of light projected on the workpiece can never be brighter than the source (in this case, the led set 100). This is due to the well-known gloss conservation theorem. In addition, Owen also discourages the use of macroreflectors due to its size and the perceived need to have a reflector associated with each individual LED 156.
Leaving the above limitations aside, the technology of the large coolant channel used in prior art cooling designs is not able to eliminate heat waste from the LEDs so that it would be effective in keeping the junction temperatures adequately low. when the current by
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square millimeter exceeds approximately 1.5 amps.
Oxygen inhibition is the competition between ambient oxygen with the cured material at a frequency comparable to that of chemical crosslinking induced by the interaction of UV light and the photoinitiator (PhI). It is known that high irradiance creates deep cures more quickly and that high irradiance addresses, at least partially, the problems of oxygen inhibition. It is now thought that ultra-high irradiance may perhaps overcome the problems of oxygen inhibition in certain process configurations, perhaps even without a nitrogen covering gas. However, to produce ultra-high irradiance to overcome oxygen inhibition, the rate of heat flux removal necessary to keep the temperatures of the joints adequately low in such high-value LED assembly environments so that they operate at extremely high current densities. high and that is simply not attainable with the UV led assembly architectures and the UV led assembly cooling technologies that are currently used.
International patent application WO 2004/011848 A2 to Dahm describes a method and equipment for using light emitting diodes for curing in numerous applications. The procedure includes cooling the light emitting diodes and mounting the same in the basic thermosiphon tubes so that it delivers ultra high power in the UV, visible and RI regions. It is claimed that the LED packaging works efficiently in a compact space and allows LEDs placed in smaller distances to operate with greater power and brightness. A lamp module, described in this reference, comprises an optical reflector, a matrix of light emitting diodes and a cooling assembly that provides an anode to the matrix.
US patent application US 2006/0214092 A1 to Kinoshita et al. Describes a microchannel structure having several microchannels through which the fluid flows, including: a housing section formed in a block, and a tube matrix arranged in the housing section and formed by grouping several tubes.
Summary
The present invention is defined in the appended claims to which reference should be made. Advantageous features are presented in the attached dependent claims.
UV curing systems by microchannel cooling and the components thereof are described being configured for photochemical curing of materials and other applications of high brightness / high irradiance. According to one embodiment, a lamp head module includes an optical macroreflector, a matrix of light emitting diodes (LEDs) and a microchannel cooling assembly. The optical macroreflector includes a window that has an outer surface. The matrix is placed in the optical reflectors and has a high form factor and a high aspect ratio. The matrix can be used to provide a high irradiance output beam pattern having an irradiance peak greater than 25W / cm2 on a workpiece surface of at least 1 mm from the outer surface of the reflector window optical. The microchannel cooling assembly can be used to maintain a substantially isothermal state between the p-n junctions of the LEDs in the matrix at a temperature of less than or equal to 80 ° Celsius. The microchannel cooling assembly also provides a common anode substrate for the matrix. A thermally efficient electrical connection is formed between the matrix and the common anode substrate by mounting the matrix to the microchannel cooling assembly.
In the above embodiment, the die can be mounted directly on the microchannel cooling assembly.
In several of the above-mentioned embodiments, the microchannel cooling assembly can maintain a substantially isothermal state between the p-n junctions at a temperature substantially less than or equal to 45 ° Celsius.
In the context of several of the above embodiments, the LEDs may be electrically matched.
In some examples of the above embodiments, at least one of the LEDs may be an ultraviolet emission led.
In several of the above embodiments, a width-to-length aspect ratio of the matrix is substantially between about 1: 2 to 1: 100.
In several of the above embodiments, a width-to-length aspect ratio of the matrix is from about 1: 2 to 1:68.
In the context of several of the above-mentioned embodiments, the irradiance peak may be greater than or equal to 100 W / cm2 and the surface of the workpiece is at least 2 mm from the outer surface of the optical reflector window.
In several of the above embodiments, there is no significant number of LEDs connected in series.
In some examples of the aforementioned embodiments, the coolant that passes through the microchannel refrigerator to
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through and below the matrix is configured to go in a direction substantially parallel to the smallest dimension of the matrix and can additionally be substantially balanced.
In several of the aforementioned embodiments, the lamp head module may include a flexible circuit, operable to individually direct the LEDs or groups of LEDs, attached to the microchannel refrigerator.
In the context of several of the aforementioned embodiments, the microchannel refrigerator may be clamped between one or more cathode connectors and one or more anode carrying bodies to facilitate replacement in factories.
In several of the aforementioned embodiments, the lamp head module may include integrated LED drivers.
In some examples of the aforementioned embodiments, the optical macroreflector may be field replaceable.
Other embodiments of the present invention provide an ultraviolet (UV) light emitting diode (LED) curing system, which includes multiple UV led lamp head modules connected in series end to end, each including optimal macroreflectors, a LED matrix and a microchannel refrigerator assembly. The optical macroreflector includes a window that has an outer surface. The LED matrix is placed in the optical reflector and has a high form factor and a high aspect ratio. The led matrix can be used to provide a substantially uniform high beam output beam pattern having an irradiance greater than 25 W / cm2 on a workpiece surface of at least 1 mm from the outer surface of the optical reflector window. The microchannel cooling assembly can be used to maintain a substantially isothermal state between the p-n junctions of the LEDs in the led array at a temperature of less than or equal to 80 ° Celsius. The microchannel cooling assembly also provides a common anode substrate for the led array. A thermally efficient electrical connection is formed between the LED matrix and the common anode substrate by directly mounting the LED matrix to the microchannel cooling assembly.
Other features of the present invention will be apparent from the accompanying drawings and the detailed description that follows.
Brief description of the drawings
Embodiments of the present invention are illustrated by example, and not by way of limitation, in the figures of the accompanying drawings and in which similar reference numerals refer to similar elements, in which:
FIG. 1A is a top view of a part of the prior art led array.
FIG. 1B is a view of the led matrix of FIG. 1A next to section line 1B-1B.
FIG. 2A is an isometric view of a UV LED lamp head module according to an embodiment of the present invention.
FIG. 2B is a front view of the LED UV lamp head module of FIG. 2A.
FIG. 2C is a side view of the UV LED lamp head module of FIG 2A.
FIG. 3A is a top isometric view of the UV LED lamp head module of FIGS. 2A-C.
FIG. 3A is a top isometric section view of the UV LED lamp head module of FIG 2A.
FIG. 3B is a top isometric view of the UV LED lamp head module of FIG 2A,
FIG. 3C is a top isometric exploded view of the UV LED lamp head module of FIG 2a
FIG. 4A is an enlarged exploded view of a lower part of a reflector and an upper part of
a body of the LED UV lamp head module of FIG. 2A.
FIG. 4B is an enlarged exploded view of a lower part of a reflector and an upper part of a body of the UV LED lamp head module of FIG 2A.
FIG. 5A is another enlarged view in isometric section illustrating a led matrix and its interface with a common layer
of anode substrate of the LED UV lamp head module of FIG. 2A.
FIG. 5B is another enlarged front view that illustrates a led matrix and its interface with a substrate layer
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common anode of the UV LED lamp head module of FIG 2A.
FIG. 6 is an enlarged sectional view of an isometric exploded view of an upper part of the body and illustrating several layers of the LED UV lamp head module of FIG. 2A.
FIG. 7 is an enlarged exploded view of an upper part of a reflector of the UV LED lamp head module of the FIG. 2A.
FIG. 8 is an isometric enlarged view of a reflector of the UV LED lamp head module of FIG. 2A with the end cap removed.
FIG. 9 is an isometric view of four LED UV lamp head modules according to an embodiment of the present invention.
FIG. 10A is an isometric view of an alternative embodiment of a led array packaging and an integrated thermal diffuser.
FIG. 10B is an isometric view of an alternative embodiment of the LED matrix and a thermal diffuser with a macroreflector in accordance with an embodiment of the present invention.
FIG. 10C is an isometric view showing the lower side of the thermal diffuser of FIGS. 10 and 10B.
FIG. 10D is an isometric sectional view of an alternative embodiment of a UV LED lamp head module.
FIG. 10E is a front sectional view of another alternative embodiment of a UV LED lamp head module.
FIG. 10F is an enlarged view in isometric section of the LED UV lamp head module of FIG. 10E.
FIG. 10G is another enlarged view in isometric section of the LED UV lamp head module of FIG. 10E.
FIG. 11A conceptually illustrates two macroreflectors substantially of the same height for different working distances according to an embodiment of the present invention.
FIG. 11B is an enlarged view of FIG. 11A illustrating marginal rays for a 2mm macroreflector in accordance with an embodiment of the present invention.
FIG. 12 shows a macroreflector optimized for a 2 mm focal plane in which each side of the reflector has a focal point that is compensated from the center line of the concentrated beam in the workpiece according to an embodiment of the present invention.
FIG. 13 is a graph illustrating an estimated convective thermal resistance for several channel widths.
FIG. 14 is a graph illustrating the power output for various junction temperatures.
FIG. 15 is a graph illustrating a dynamic resistance vs. direct current curve.
FIG. 16 is a graph illustrating the irradiance profile for a UV LED lamp head module with a reflector optimized for a 2 mm focal plane according to an embodiment of the present invention.
FIG. 17 is a graph illustrating an irradiance profile for a UV LED lamp head module with a reflector optimized for a 53 mm focal plane according to an embodiment of the present invention.
Detailed description
UV curing systems by microchannel cooling and the components thereof are configured for photochemical curing of materials and other applications that require attributes with high form factor, high current density and high brightness (which ultimately leads to high irradiance attribute). In accordance with an embodiment of the present invention, the LED matrix LEDs with high form factor of the ultra high irradiance UV curing systems are placed substantially in an electrically parallel (ie, massively parallel) circuit in an anode substrate common to achieve a very thermally efficient connection form (eg, without a dielectric layer that thermally clogs between the base of the LEDs and the substrate as typically required in a series / parallel configuration).
According to embodiments of the present invention, to accommodate the heat / thermal flux demands of a high form factor, a high current density and a high brightness of the UV LED lamp head module, it is also
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they provide practical means to achieve the isothermal behavior of the common anode substrate, even when the common anode substrate has a very high aspect ratio. According to one embodiment, the LED matrix is directly attached to the microchannel refrigerator and the coolant flows through and below the LED matrix in a direction substantially parallel to the smallest dimension of the LED matrix. In one embodiment, the coolant that flows through the microchannels under the LEDs is approximately equal (e.g., balanced) so that the p-n junctions of the LED matrix LEDs are substantially isothermal. In one embodiment, the high aspect ratio common anode substrate is substantially isothermal from side to side and end to end. This can be achieved through the use of a substantially copper microchannel cooler having microchannels that direct the coolant under the led array in a substantially lateral direction with respect to the longitudinal axis of the led array while maintaining an equilibrium range strict flow between each channel. In one embodiment, this flow balance is achieved by designing the primary coolant inlet and coolant outlet channels that are parallel to the longitudinal axis of the led array to achieve a level of pressure loss that is almost homogeneous along the route.
In several embodiments a flexible circuit is used, attached to the microchannel cooler to individually direct the LEDs or groups of LEDs of a LED array so that the LEDs can be discarded by direct voltage (Vf), amplitude wave, size, optical power, etc., thus substantially reducing the demands on the manufacturers of LEDs to distribute the groups of LEDs in only one or a few containers. This allows the UV LED lamps of the embodiments of the present invention to use multiple LED containers. This ability to use multiple LED containers improves the manufacturing capacity of UV LED lamps that do not require connection to or from them.
In some embodiments, a monolithic microchannel refrigerator that is replaceable in factories, also known as a consumable part, is used. As described below, while the LEDs and the flexible circuit may be attached to the upper surface of the microchannel refrigerator, and therefore be considered to be essentially permanently fixed, the microchannel refrigerator assembly is only attached (e.g. with screws that provide the clamping force) between several geometrically configured cathode microbars and / or connectors (eg rectangular, hook and the like) and several preferably monolithic geometrically configured anode collector bodies (eg, rectangular , flat and similar), thus facilitating its replacement.
According to various embodiments of the present invention, the UV LED lamp head module may include integrated LED drivers. In this way, they can be used outside the AC / DC power supply board designed for high-volume "server farms" and a 12V power cable can be taken to the UV LED lamp head module (eg ., a UV 200 LED lamp head module) instead of remotely executing the DC / DC and running a 5V electric cable of greater diameter (smaller width) to the UV LED lamp head module. In embodiments in which integrated led drivers of higher power density are used, these can be mounted to the main body of the lamp with an intermediate thermal conductor compound or a monolithic interface material to transfer and / or dissipate residual heat from the assemblies of drivers to the body where the residual heat is transmitted by the same coolant that cools the LED matrix.
In some embodiments, factory and / or field replaceable macroreflectors are used, which can be adapted for particular applications by providing different operating characteristics (e.g., high irradiance, highly centered, short working distances for centering, long distances of work, applications that require a great depth of focus while maintaining high irradiance, and applications of very wide angle and more uniform irradiance).
In the following description, numerous specific details are explained to offer a thorough understanding of the embodiments of the present invention. It will be apparent, however, to the person skilled in the art that the embodiments of the present invention can be practiced without some of these specific details.
Particularly, although the embodiments of the present invention can be described in the context of the UV led systems, the embodiments of the present invention are not so limited. For example, visible and IR applications are contemplated and would benefit from the architectural improvements described in this invention. Also, the variation in wavelengths can be used in the same light emitting device to mimic the output of mercury lamps when using UV, A, B or C light emitting devices and visible devices and / or IR light emitting devices. . The high form factor characteristic of the embodiments of the present invention also allows the intersalide of several wavelengths to be avoided while avoiding the effects of pixelation on the workpiece surface, which would likely result in detrimental effects on the process. In addition, according to several embodiments, the wavelength mixed with the non-imaging optical macroreflectors results in a uniform (non-pixelated) output beam from a perspective of both power density and wavelength.
For the sake of brevity, the embodiments of the present invention can be described in the context of LEDs with the anode side at the bottom, those skilled in the art will recognize that the anode side could be
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at the top surface and / or both anode and cathode contacts could be at the top or bottom. As a result, references to the anodic / cathodic structures in the present invention could be reversed or not (or could be electrically neutral) depending on the particular implementation. Similarly, flip chip LEDs without wire bonding, led chips of conductive substrate and non-conductive substrate (such as those with epilayers in sapphire, aluminum nitride, silicon or zinc oxide), matrices and / or packaged devices can be considered . The epilayer could be selected from a group of nitrides, oxides, silicons, carbides, phosphides, arsenides, etc.).
Terminology
Below are brief definitions of the terms used throughout this application.
The phrase "average irradiance" generally refers to the irradiance value across the width of an output beam pattern projected on a workpiece in which the irradiance value essentially falls to zero on each side of the beam pattern of exit. In embodiments of the present invention, at 2 mm from the window, a UV LED lamp head module produces an average irradiance of approximately 32 W / cm2 (range 40-80 W / cm2). In embodiments of the present invention, 53 mm from the window, a led UV lamp head module produces an average irradiance of approximately 6 W / cm2 (range 8-15 W / cm2).
The terms "connected", "paired", "mounted" and related terms are used in an operational sense and do not necessarily limit to a direct connection, pairing or assembly.
The phrase "diffusion welding" generally refers to a process of joining metals similar to welding but which depends solely on the surface of one diffusing with respect to the other as a means of "welding." For example, a diffusion bonding process can generally bond layers of substantially similar materials by fixing them together, some with an oxidation inhibitor culture such as nickel, and subordinating the layers to extremely high temperatures of around 1000 degrees Celsius (range 500-5000 degrees Celsius), and thus molecularly intermingling the surfaces and forming a substantially monolithic material in which the grains are intermixed and, often, the bonding line is indistinguishable from the raw material, and the properties of the materials bonded together do not differ substantially of bulk materials not bound by diffusion in terms of thermal conductivity and strength. The union by diffusion could have similarities with sintering. Thin layers of silver plating the size of microns can also be used to facilitate the joining of the layers. This last process may have some similarities with welding.
The phrase "directly mounted" generally refers to an assembly in which a layer that intervenes substantially and / or thermally obstructs between the two things that are joined or fixed. In one embodiment, a led array is mounted on a common anode substrate provided by a microchannel cooler surface with a thin welded layer. This is an example of what is intended to be covered with the phrase "directly mounted". Thus, it would be considered that the led matrix would be directly mounted to the common anode substrate. Examples of thermally obstructive layers would include most of the substrate material, aluminum, a thin film (dielectric or conductive), or other material other than a thin weld layer) introduced between the two things that are joined or fixed.
The phrase "high irradiance" generally refers to an irradiance greater than 4 W / cm2. According to the embodiments of the present invention, the highest levels of irradiance that can be achieved are approximately ten times the levels of current modern UV LED curing systems, while maintaining both high efficiency and longer service life. The LEDs As described below, according to several embodiments, the irradiance of the workpiece is substantially free of a harmful pixelation and / or of the gaps found in current UV LED curing systems. However, it should be noted that most manufacturers of UV LED lamps measure the peak irradiance in the window, while in several embodiments described herein it is measured on the work surface. The measurements taken in the window are essentially irrelevant, as the workpiece is not typically located in the window.
The phrase "matrix of high form factor LEDs" generally refers to a matrix of LEDs in which the LEDs are poorly spaced and exceed 50% (often exceeding 90%) of the surface area of the LED matrix. In one embodiment of the present invention, the LED array LEDs are spaced less than 20 microns from edge to edge and in some cases, 10 microns from edge to edge, with a range of edge-to-edge distances of 1-100 microns (A spacing of zero microns could be considered for a completely monolithic LED). Both inorganic and substantially organic LEDs are contemplated.
The phrases "in one embodiment", "according to one embodiment" and the like generally refer to a feature, structure or feature that follows the phrase being included in at least one embodiment of the present invention, and may be included in More than one embodiment of the present invention, such phrases do not necessarily refer to the same embodiment.
The term "irradiance" generally refers to the radiant power that reaches the surface per unit area (eg, watts or milliwatts per square centimeter (W / cm2 or mW / cm2).
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The phrase "light emitting device" generally refers to one or more light emitting diodes (LEDs) (emitting substantially incoherent light) and / or laser diodes (emitting substantially coherent light) regardless of whether they are edge or surface emitters. In various embodiments of the present invention, the light emitting devices can be packaged or given naked. A packaged die refers to a device that not only consists of the bare die, but also consists of a substrate on which the die (normally welded) is mounted to facilitate traces for the input and output electrical current paths , as well as thermal paths, and usually means for attaching a lens and / or reflectors, an example of what would be the Lexeon Rebel sold by Philips, USA. UU. According to one embodiment, the light emitting bare dice (eg, given that they have been extracted directly from wafers that have pn junctions due to epitaxial growth) are joined (usually welded) directly (without an additional layer that thermally obstructs significantly) to at least one diffusion bonded layer of a high thermal conductivity material (selected from the copper, Glidcop, BeO, AIN, Al2O3, Al, Au, Ag, graphite, diamond and the like group), which is itself same, in several embodiments of the present invention, typically a layer of a multilayer laminate that forms a monolithic structure of microchannel cooling adhered by diffusion. The laminate must necessarily be adhered by diffusion, since the adhesion process could be selected from welding, bonding, etc.
The phrase "light emitting diode" or the acronym led generally refers to a semiconductor device that contains a pn junction (the junction between a semiconductor type p and a semiconductor type n) designed to emit specific narrow wavelengths in the electromagnetic spectrum by means of a process known as electroluminescence. In one embodiment, a LED emits incoherent light.
The phrase "matrix of low form factor LEDs" generally refers to a matrix of LEDs in which the LEDs are scattered and do not exceed 50% surface area of the LED matrix.
The phrase "low irradiance" generally refers to an irradiance of 20 W / cm2 or less. UV LED systems rated with less than 4 W / cm2 are typically not sufficient for most curing applications other than drying (e.g., ink setting).
The term "macroreflector" generally refers to a reflector that has a height greater than or equal to 5 mm. In some embodiments, the macroreflectors range from 5 mm to 100 mm.
If the specification states that a component or characteristic "may" or "could" be included or have a characteristic, that particular component or characteristic does not need to be included.
The phrase "peak irradiance" generally refers to the maximum irradiance value over the entire width of a pattern of the output beam projected on a workpiece. In embodiments of the present invention, at 2 mm from the window, a UV LED lamp head module can reach a peak irradiance of approximately 84 W / cm2 (range 50-100 W / cm2). In embodiments of the present invention, 53 mm from the window, a UV LED lamp head module can reach a peak irradiance of approximately 24 W / cm2 (range 10-50 W / cm2)
The phrases "radiant energy density", "total output power density" or "energy density" generally refer to the energy that reaches the surface per unit area (eg, joules or kilojoules per square centimeter (J / cm2 or mJ / cm2)).
The term "sensitive" includes completely or partially sensitive.
The phrase "total output power" generally refers to the aggregate power in W / cm of the pattern length of the output beam. According to one embodiment, at 2 mm from the window, the total output power is approximately 20.5 W per cm in length of the output beam pattern, produced by each UV LED lamp head module. According to one embodiment, at 53 mm from the window, the total output power is approximately 21.7 W per cm in length of the output beam pattern, produced by each UV LED lamp head module.
The phrase "ultra high irradiance" generally refers to an irradiance greater than 50 W / cm2 in a workpiece. In one embodiment, a UV LED lamp head module can reach a peak irradiance greater than 100 W / cm2 over small working distances (e.g., ~ 2 mm). In view of the rapid advance in the power and efficiency of the LEDs, it is reasonable to expect peak achievable irradiations that improve by more than an order of magnitude in the coming decades. As such, some of today's high irradiance applications will be achieved with air-cooled led arrays and others, with this high irradiance, will benefit from or allow faster, stronger and more complete cures and / or use less photoinitiator Also unique in the context of various embodiments of the present invention is the ability to offer both ultra-high peak irradiance and ultra-high average irradiance, ultra-high total irradiance (dose) and dose concentration (as compared to the prior art) that is Delivery to the work piece.
The phrase "UV curing process" generally refers to the process in which a photoinitiator (FI) will absorb light
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UV first, causing it to go to a state of excitation. From the state of excitation, the IF will decompose into free radicals (which then begins a photopolymerization). However, there is always a certain amount of oxygen (1-2 mM) in the formulation. Therefore, the initial free radicals of the IF photodecomposition will react with oxygen first, instead of reacting with the double bond of the monomer (typically an acrylate), since the reaction rate of the free radical of the FI with oxygen is around 105 to 106 faster than that of the double unions of the acelato. In addition, in the early stages of UV curing, oxygen in the air will also diffuse in the cured film and also react with the FI, resulting in a significant inhibition of oxygen. Only after the oxygen present in the curable UV films has been consumed can photoinitial polymerization take place. Therefore, to overcome the oxygen inhibition, a large amount of free radicals on the surface of the cured film is required in a very small period of time, e.g. ex. a high intensity UV light source is required. The absorption of UV light intensity for a particular formulation depends on the wavelength of the UV light. Mathematically, the intensity of absorbed UV light (la) is given by the = 10 x [Fi] where 10 is a UV light intensity from a UV light source and [Fi] is the concentration of the photoinitiator. At the same levels [Fi], increasing 10 will increase and thus reduce oxygen inhibition. In other words, when using a high light source 10, less [Fi] can be used, which is typically the most expensive part of the formulation. UV light absorption follows the well-known Lambert Beer Law. A (absorption) = rcd where r is the extinction of Fi or absorption coefficient, c is the concentration of Fi and d is the thickness of the sample (film to be cured). As shown in the table below, the light absorption efficiency of Fi varies widely with wavelength. In this case, at 254 nm, the efficiency of absorbing light is 20 times greater than at 405 nm. Therefore, if the intensity of UV led light at 400 nm can be produced at 100 times the typical cure power at shorter wavelengths (~ 100 W / cm2), the difference in the efficiency of the photoinitiator in light absorption May reduce oxygen inhibition.
1.95 X 104 at 254 nm,
1.8 X 104 at 302 nm,
1.5 X 104 at 313 nm,
2.3 X 103 at 365 nm,
8.99 X 102 at 405 nm,
FIGS. 2A-C provide isometric, front and side views, respectively, of an ultra-bright UV 200 LED lamp head module in accordance with an embodiment of the present invention. According to one embodiment, the ultra high brightness UV led lamp head module produces ultra high irradiance. The UV 200 LED lamp head module with ultra-high brightness can be used, among other things, to polymerize or cure inks, coatings, adhesives and the like. Depending on the application, a UV curing system (a led UV emission system) (not shown) can be formed comprising one or more of the head modules of the UV 200 LED lamp and other components, including, but not limited to , LED controllers (internal or external to the UV 200 LED lamp head module), one or more cooling systems, one or more main AC / DC power supply systems (e.g., sold by Lineage, EE Or Power-One, USA that are approximately 90% efficient (or more) and weigh about 1 kg), one or more control modules, one or more cables and one or more connectors (not shown) .
According to one embodiment, the high brightness of the UV 200 LED lamp head module allows a range of possible optimal properties of the output beam (not shown) including: reduced width (eg ~, 65 cm (range 1 to 2 cm)) with high power density (eg ~ 20.5 W per cm in length of the output beam pattern (range 10-30 W), wider widths (eg ~ 3.65 cm (range 3 to 10 cm) with greater depth of focus, or short or long working distances (with or without greater depth of focus), or even output beam patterns with wide angle / large surface area (with or without greater depth of focus) The output beam patterns with homogeneous irradiance across the entire width of the beam pattern (as well as the beam length) can be considered.
As explained below, according to embodiments of the present invention, the high brightness results from a led matrix (not shown) with a high form factor (in excess of 50% and often in excess of 90%) and that the matrix LEDs are operated at high densities of electrical energy, resulting in a high irradiance output beam. High electrical energy densities result in high thermal densities (due to losses in electrical to optical conversion) that are effectively managed through several new methodologies described in detail below.
Ultimately, the UV 200 LED lamp head module aims to replace not only current UV LED lamps, but also current mercury lamps, due to the unique high irradiance and the optical and flexible properties of the output beam that allows a high brightness source. The UV 200 LED lamp head module is also considered a "green technology" since it does not contain mercury and is also very electrically efficient. This efficiency derives in part from the inherent efficiency of the LEDs compared to mercury-containing lamps, but also derives in part from the cooling methodologies (which are
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described below, which provide a very low thermal resistance between the LED junctions and the coolant (introduced into the UV 200 LED lamp head module via an inlet cooling tube 203 and evacuated from the UV 200 LED lamp head module through an outlet cooling tube 204), by creating low junction temperatures that require a highly efficient operation of the led devices.
In this representation, a housing 202 and reflectors 201 of the UV LED lamp head module 200 are illustrated. According to various embodiments, the housing 202 of the UV LED lamp head module 200 is approximately 80 mm long by 38 mm wide. x 125 mm high. The length of the new easily interchangeable and replaceable field reflector 201 that has been chosen for a given application would be substantially in the range of tens to hundreds of millimeters long, but such reflectors typically measure about 10 mm long and provide working distances. in the range of 0-1000 but more typically from 2 mm to 53 mm.
According to embodiments of the present invention, the UV 200 LED lamp head module is designed to be used alone or in series in combination with one or more UV LED lamp head modules. As described below, multiple UV 200 LED lamp head modules are easily configured in series from one head (module) (e.g., 80 mm) to perhaps 100 heads (modules), for example, with a length of 8000 mm Multiple head modules of the UV 200 LED lamp could also be configured in series in width. According to one embodiment, a unique feature of a series combination of a UV 200 LED lamp head module is that the output beam does not contain a discernible loss of irradiance at each surface point at which the heads (modules) they are joined with respect to each other in series from end to end to create a long beam pattern on the surface of the workpiece even in applications of short working distances (e.g., ~ 2 mm).
As described in more detail below, in one embodiment, reflector 201 is factory interchangeable and preferably also field replaceable. The reflector 201 can be machined from aluminum and polished, cast, extruded metallic or polymeric, etc., or by injection molding. The reflector 201 could have silver coatings and could have a dielectric coating of coatings. The reflector 201 could have a single-layer dielectric coating using deposition processes (eg, ALD, CVD, spray, evaporation, sol-gel). The reflector 201 could be brightened mechanically or electrolytically. It is contemplated that multiple LED 200 lamp head modules need to be placed frequently from end to end in long-term applications, as in large format prints. In these cases, it is convenient that the protected and / or centered beam created by the reflector 201 has an almost uniform irradiance along the entire beam path, especially in the areas between the head modules of the UV LED lamp 200 and / or led matrices, so that the coatings, inks, adhesives, etc. of the work piece be cured uniformly. It should be noted that, due to the high irradiances provided by the embodiments of the present invention, the coatings and inks etc. they can have substantially less photoinitiator in them or nothing and cure similarly to the E-beam in which electromagnetic energy is supplied in a dose sufficient to cure the material without the help of any appreciable photoinitiator.
In several embodiments, the irradiance of the UV 200 LED lamp head modules can exceed 100 W / cm2 in short working distance applications (e.g., ~ 2 mm) as in injection printing, up to a excess of 25 W / cm2 in applications of long working distances (e.g. 50 mm), as in the curing of transparent coatings. According to one embodiment, the beam widths may vary, to meet a variety of applications and operating conditions, from about 1 mm wide to 100 mm wide or more, and the length, as stated above, can be as short. as the width of a lamp head (module) (eg 80 mm) up to a length of 100 heads (modules) (eg 8000 mm). It should be noted that the length of the beam could be less than the length of the UV 200 LED lamp head module if the focus reflectors or the optics are thus used to influence the shape of this beam. External optics of refraction or defractives are also contemplated. Depending on the particular implementation, the length of the UV 200 LED lamp head module could range from tens to hundreds of millimeters in length. The LEDs could range from approximately 300 mm2 to 4 mm2 or more and could be rectangular, oriented in long single rows, long multiple or monolithic rows.
According to embodiments of the present invention, the efficiency of the led array 330 often exceeds 10-20% and the overall efficiency of the system (including the heat exchanger or the cooler, pump and power loss, often exceeds 5-10%).
Briefly returning to the inlet cooling tube 203 and the outlet cooling tube 204, these may be constructed, for example, in extruded polyurethane, vinyl, PVC (sold by Hudson Extrusions, USA) and the like and could have ~ 5/16 inches of ID and ~ 7/16 inches of ID. In one embodiment, the tubes 203 and 204 are made of polyurethane with a high tensile strength and low moisture absorption. Tube accessories from Swagelok, USA UU., Or the accessories of John Guest, EE. UU., Can be used. Depending on the environment of use, it may be preferable to use more than one inlet cooling tube 203 and one outlet cooling tube 204, such as possibly ~ 4 smaller inlet lines and ~ 4 smaller outlet lines (not shown). This could result in a less problematic unit with smaller radii of curvature and could allow a flow
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refrigerant distributed more evenly through the microchannel cooler (not shown); however, the deep main input and output channels (not shown) inside the UV 200 LED lamp head module virtually eliminate the pressure gradients at the inlet point and the outlet point from the microchannel cooler channels preferable (not illustrated). In one embodiment, the coolant enters the LED lamp head module Uv 200 through the inlet cooling tube 203 at between 1-100 PSI and preferably between about 15-20 PSI at a temperature between 5-50 degrees Celsius and preferably at about 20 degrees and exits through the outlet cooling tube 204 at a temperature between 10-100 degrees Celsius and preferably at a temperature of about 24 degrees Celsius.
According to one embodiment, the residual heat from various internal components (e.g., the LED conductive printed circuit boards and the LED matrices) of the UV curing system can dissipate in the lamp body (not shown) and transported by the coolant to a heat exchanger and / or cooler. An exemplary cooler is for sale by Whaley, USA. UU. In one embodiment, the cooler uses a highly efficient scroll compressor (sold by Emmerso, USA). Depending on the model of use, the cooler can be of the "split" variety in which the tank, pump, evaporator and controls are located inside a building that houses the UV curing system, and the rest of the components , such as scroll compressor, fan, condenser etc. they are housed outside the building (e.g., on the roof or on the side of the building). It should be noted that many or all of the heat exchanger or cooler elements can be operated in series or in parallel or a combination of both for one or more modules of the UV 200 LED lamp head and / or supply components. As an example, a large cooler could be used for multiple UV curing systems that have one or more fillers and / or reservoirs. An exemplary heat exchanger element for water to air is for sale by Lytron, USA. UU. Any cooling solution could use a bypass construction so that the pressure or different flow rates can pass through the evaporator and the refrigerator through the microchannel simultaneously.
According to one embodiment, the cooling liquid (coolant) is composed of water. The refrigerator may also include one or more bioincrustant inhibitors, antifungicides, corrosion inhibitors, antifreeze materials (eg glycol) and / or nanoparticles (eg alumina, diamond, ceramics, metal (eg nano copper), polymer or other combination) for improved heat transfer, and the cooling system would contain membrane contactors, oxygen getters and micron filters. The nanoparticles, such as titanium, are agitated by means of UV lamp energy with the double purpose of improving their thermal conductivity and / or heat transfer and, due to the photo fenton process that occurs as a result, the elimination of biological materials like mushrooms, etc. Membrane contactors effectively reduce CO2 in water and help maintain optimal pH levels for optimal corrosion resistance of copper microchannel surfaces.
In one embodiment, a sliding vane pump (available through Fluidotech, Italy) can be used. It has a flow rate greater than ~ 4 gallons per minute and a pressure that amounts to ~ 60 PSI. This flow rate is suitable for the microchannel cooler architecture described in relation to various embodiments of the present invention (eg serial connection of 4 or more UV 200 LED lamp head modules). The pump is also very quiet, compact, long-lasting and efficient, since it only consumes -25KW. In several embodiments, redundant cooling pumps can be used to reduce the chances of a single point of failure. The average flow rate can be approximately 75 gallons per minute (from 1 to 10 gallons per minute) per lamp head.
FIGS. 3A-B provide sectional views of the UV 200 LED lamp head module of FIG 2A. From these views, it can be seen that an optical reflector layer 350 is mounted comprising a reflector 201 in a body 305 included in a cover 202. According to one embodiment, the body 305 is constructed of bronze or a polymer dielectric material ( eg PEEK, Torlon, LCP, acrylic; polycarbonate, PPS potentially filled with fillers, such as graphite, ceramics, metals, carbon nanotubes, graphene, nanometric or micrometric flakes, tubes, fibers, etc.). Some of these filler resins are available from Cool Polymers of North Kingstown, RI. The lamp body 305 can be machined with 5-axis milling or injection molding. Alternatively, the body 305 can be molded by injection and, optionally and secondarily, ground or drilled. As described below, several components can be mounted to body 305 directly or indirectly; These components include, among others, the cover 202, the reflector 201, LED matrix 330, the microchannel refrigerant (preferably as part of the common anode substrate for the LED matrix 330), cathode hooks 321 and the anode body 215a-b, and one or more printed circuit boards (PCBs) 310, which would preferably be metal core PCBs (MCPCB) and anode body 315-ab could serve as the metal core of the MCPCB (also known as common anode base plate).
In the present non-limiting example, the body 305 has in its interior a main channel of coolant inlet of lamp body 360 and a main channel of outflow of coolant fluid of lamp body 361; both run along the body 305. The main channel of the coolant inlet of the lamp body 360 has fluid communication with the inlet cooling tube 203 through a first coolant inlet (not shown) formed at the base of the body 305. The main lamp fluid coolant outlet channel 361 has fluid communication with the outlet coolant tube 204 via a second coolant inlet (not shown) formed in the base of the body 305. Channels 360 and 361 have such a size
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that the refrigerant flows substantially uniformly through a microchannel refrigerator (not shown) disposed between. In one embodiment, the first and second refrigerant inlets may be at opposite ends of the body base 305 facing each other, staggered or some combination thereof to facilitate uniform refrigerant fluid from the liquid inlet channel. coolant from the lamp body 360 to the outlet channel of the coolant from the lamp body 361 along the refrigerator by microchannel. In alternative embodiments, multiple coolant inlet channels of the lamp body and multiple coolant outlet channels of the lamp body can be employed.
In one embodiment, the flow balance along the microchannel cooler is achieved by designing the multiple primary and outlet coolant inlet channels that circulate parallel to the longitudinal axis of the led array 330 so that they achieve a pressure loss that It is almost homogeneous along its length by extending the depth of the channel to a point where the differential pressure of the refrigerant near the top of the channel (nearest microchannel refrigerator (not shown)) has reached a point of almost homeostasis at along the entire length of the channel when separating from the input port, or converging to the output port through a very deep channel. In other words, the extremely deep channels 360 and 361 give the coolant sufficient time, hydraulic resistance and surface drag to extend along the length of the refrigerator by microchannel and achieve a small differential pressure near the top of each channel resulting thus in a balanced flow through each microchannel under the led array 330.
According to one embodiment, the assembly components of the led driver 310 PCBs include, but are not limited to, ICs controlled by the led drivers (not shown, which could also be part of the CD / CD converter system) , FET 312 (field effect transistor), doors (not shown), inductors 311, capacitors (not shown), resistors (not shown) and cathode busbars 304a-b. As indicated above, in one embodiment, the led controller PCBs 310 are layers of metal film (e.g., copper) / dielectric on a metal substrate (core) (e.g., the core PCBs of metal) (sold by Cofan, Canada) and paired (e.g., fixed by screws) to body 305 with a thermal conduction compound that intervenes in order to dissipate residual heat from controller assemblies in body 305 where it is transported by the flow of the refrigerant through the main channel of the lamp body refrigerant fluid 360 and the main channel of the lamp body refrigerant fluid 361. In the present example, channels 360 and 361 extend deep enough in body 305 to cool the area substantially below fEt 312 and inductors 3011, where a significant amount of residual heat is generated. Ways can be used to electrically connect the multilayer metal film layers.
In one embodiment, the 310a-b led controller assembly PCBs, which contain surface mount electrical components and other semiconductor components are at least 90% efficient. Highly efficient and high current LED driver ICs (not shown) are for sale by National Semiconductor EE. UU. (e.g., part LM 3434 or LM 3433 or substantially equivalent). Linear and Maxim, USA UU. They also make similar pieces. The LED driver ICs (not shown) are devices that contain semiconductor pn junctions, preferably with a silicone base that allow the conversion of a higher voltage / lower current input to a lower voltage and higher current susceptible to the controller conditions of high current LEDs desired in various embodiments of the present invention. PWM can also be used.
The individual LEDs or groups of LEDs of the LED matrix 330 are directed by the corresponding segments of the PCB controller PCBs 310a-b. For example, 4 groups of 17 LEDs on each side of the UV 200 LED lamp head module driven at approximately 3 A (range 5 to 30 A) per LED and approximately 4.5-5V (range 2-10V), in such embodiment, the led array 330 comprises 68 LEDs in 2 rows of LEDs (136 in total) with groups of opposite LEDs electrically driven and / or controlled by the corresponding LED driver ICs at about 3A per LED resulting in approximately 2 kW input per UV 200 LED lamp head module. Another non-limiting example would be 16 LEDs in 15 x2 groups, which can be driven at approximately 4 V and 40 A per group (range 1-10 V and 1-500 A) and it has an input of only approximately 12V on the PCB controller PCB 310a-b.
In some embodiments, due to the high efficiency of surface mounted electrical components and other semiconductor components, custom metal core PCBs (MCPCB) can be constructed such that they can be fixed, preferably by means of screws or other means, to the sides of the body 305, and they can also be cooled by conduction through the interface material and towards the thermally conductive body 305. Residual heat would be removed by convective transport of the refrigerant flow along the body 305. For example, two 310a-b led controller PCBs, one on each side of the body 305, can be constructed on a thick copper core plate 2.5 mm (range of 1-10 mm) with layers of thermally conductive dielectric material of approximately 4-12 mm. In one embodiment, highly thermally conductive dielectric layers are interposed between copper metal layers (eg 1-4 ounce copper sheets) of the 310a-b led controller PCBs that are attached to the body 305. Each pCb of led controllers 310a-b (eg x2) can have electrically insulated cathode segments corresponding to the locations of the 4 groups of LEDs isolated by flexible circuit sections (4 of them are illustrated in the detailed view of the illustration 6; two of them are driven by 310a-b led controllers PCBs opposite). In one embodiment, the 310a-b led controller PCBs and flexible circuit sections are arranged in
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orthogonal to each other. Another non-limiting example is that each side of the body 350 has a 310a-b led driver PCB attached to each side with 4 IC of led drivers located on each PCB (8 led driver ICs in total, which in sum can be driven up to about 2kW or more (e.g., 80 mm long) for each UV 200 LED lamp head module). Again, by fixing the led controller PCBs 310 to the sides of the body 305, the residual heat of the led controller PCB 310a-b can dissipate in the body 305 and transported by the cooling flow to the heat exchanger or cooler. In one embodiment, a thermally conductive grease or other compound may be placed between the 310a-b led controller PCBs in the body 305. In alternative embodiments, the 310a-b led controller PCBs could be added to the body 305 in a non-manner thermally efficient and be cooled by fans.
According to one embodiment, a layer of common anode substrate 317 is clamped between cathode clamps 320a-d and anode busbar 315a-b. A common U-shaped monolithic anode is formed by an anode collector body 315a-b (which is substantially parallel to each other) and the common anode substrate layer 317 (which is substantially orthogonal to the collector anode body 315a- b). In another embodiment, the common anode substrate 117 and the anode collector body 315a-b may form a monolithic common anode with a rectangular or square shape.
In one embodiment, a surface of cathode clamps 320a-d and 321a-d is substantially parallel to the cathode part of the common anode substrate 371 and another surface is substantially parallel to an upper surface of the led controller PCB 310a-b , thus allowing both parties to make electrical contact between these two layers. More details are given below in relation to the assembly that forms the common anode substrate layer 317, including the mounting mechanism for gluing the cathode clamps 320a-d 321a-d, the collector body 315a-b.
In the present example, the reflector 201 is large (macro: eg tens of millimeters high), modular, with a reflective structure without images having an average portion 352 significantly wider than any of the input openings 351 or output 353. Such a structure is suitable for printing applications where a short safety distance (eg, 2 mm) from the workpiece to the reflector 201 and high irradiance (eg, greater than ~ 50 W / cm2) are beneficial for high process speed, cure hardness and cure integrity (free of bonding).
In one embodiment, the reflector 201 captures and controls approximately 90% or more (range 50-99%) of the light emitted by the led array 330 and each half of the elongated reflector 201 is an ellipse having a focal point in the opposite side of the projected optical pattern centerline on the workpiece, with the result of the increase in the irradiance peak over a traditional shared focal point design approach (along the projected central beam). Composite ellipses or other composite parabolic shapes can also be contemplated. In one embodiment, reflectors 201 are designed to have a high angular extent of approximately 80 degrees (range 45-90 degrees)
The embodiments of the present invention seek to produce a high quality cure (e.g., 100% or almost) by producing both high peak irradiance and high total output power (e.g., approximately 184 W per UV 200 LED lamp head module) since photoinitiators can be toxic (and expensive) and uncured inks, coatings or adhesives are not desirable. As mentioned earlier, high irradiance results in materials cured faster, deeper and stronger. Consequently, the embodiments of the present invention seek to reach the highest levels of irradiance that are approximately ten times (or more) the levels described in the most modern UV led curing systems (and mercury lamps), at the same time as They maintain both high efficiency and longer life of the LEDs.
According to one embodiment, the reflector 201 can be easily replaced at the factory and preferably can be replaced in the field, in such a way as to allow other reflectors to be fixed to the body 305 of the UV LED lamp head module 200 for different uses; This could meet different objectives / parameters of the process. In the present example, reflector 201 is shown as an elliptical reflector with a two-part construction, where the two main components are the opposite sides of one or more ellipses. The reflector 201 can be made in a five-axis milling and then polished with a diamond polisher or it can be a metal extracted and subsequently polished, or it can be a polymer extracted without the need for subsequent polishing because the cavity of the polishing was previously polished mold / extrusion die. As described above, reflector 201 may have a modular design, such that an application, such as ink curing on a flat substrate that requires a projected "line" of high-projected thin focal beam (output power density) You may need a screw in an ultra-high intensity line generator reflector (not shown); An application on a rugged typological substrate that requires greater depth of field may require a pair of reflectors (not illustrated) designed specifically for this greater depth of field (or greater depth of focus) that is easily interchangeable with the pair of high reflectors intensity by simply unscrewing the previous pair of reflectors and screwing the new pair of reflectors into place as described below. In the same way, a pair of reflectors can be configured specifically for a greater operating distance with high intensity or a greater operating distance with a pattern of rays of wide area and soft intensity in the piece. Fixing pins between reflector 201 and common anode substrate layer 317 can be used.
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In one embodiment, the inner surface of the molded polymeric reflector 201, preferably injected, is a vacuum deposited steel layer with a protective coating of ALD (atomic layer deposition), resistant to corrosion because The AL process does not require holes. The silver layer can be deposited by means of various deposition processes (eg ALD, CVD, spray, evaporation, soldering). Since polycarbonate is a cheap polymeric reflector resin, a vapor barrier must be placed in the polycarbonate before depositing the silver, provided that the side of the silver layer facing the polymeric reflector substrate does not allow steam Corrosive (or its molecules) corrode silver from within. Low vapor permeable resins can be taken into account (eg E48R (Zeon Chemicals, USA)). Additionally, vapor barriers (eg copper, ALD oxide layers) can be considered and deposited in the reflector before applying the silver or aluminum layers. The ALD dielectric coating is selected from the group of oxides (eg AhO3) or fluorides (eg MgF2) or some combination between the two. Alternatively, a high reflection layer in the reflector 201 may be a dielectric coated aluminum layer in an injection molded polymeric reflector. The dielectric layer would preferably be a single layer magnesium fluoride or silicone dioxide adjusted for the maximum level of reflectivity in the wavelength that best corresponds to the application. A dielectric stack based on optical interference can be used for any of the above-mentioned configurations to increase the maximum irradiance in the selected wavelength range.
Embodiments of the present invention may use secondary optics (not shown) for the control of lightning and / or a window (eg a lens) 350 having an anti-glare (AR) layer. The AR layer would preferably be a BAAR layer (in English, broad angle antireflective, anti-reflective wide angle), since the emitted angles of the outlet opening 353 can exceed 45 degrees, because such high angles would receive reflections significantly detrimental to the surface of the window if the BAAR layer was not used. High-level UV resistant acrylic, used in tanning beds, could be used, but borosilicate glass is preferable for window 340 and secondary optics in one embodiment, a window holder 341 fixes window 340 as described below. . According to one embodiment, an O-ring (not shown) is located between the window 340 and the reflection 201. In one embodiment, the outer cover of the reflector 201 can be injection molded. In various embodiments, an inert gas or microporous spheres (available in Zeolite, USA) can be used to control water vapor. This vapor can represent a problem for the longevity of the LED if encapsulants are not used for the LEDs. The state-of-the-art technology does not allow a LED encapsulant (such as high purity silicone) to be used, since yellowing of high photon energies of short UV wavelengths is a problem. The low-carbon Schott (Germany) silicone encapsulants are the existing encapsulants recognized as the least yellowing today.
In order to measure the distance of the window 340 to the surface of the workpiece, it is understood that the window 340 has an inner surface (closer to the surface of the led array 330) and an outer surface (closer to the surface of the work piece). Here, the distances to the workpiece are generally measured with respect to the outer surface of the window 340.
FIG. 3C is a top isometric exploded view of the UV 200 LED lamp head module of FIG. 2A. According to the present example, the electrical power is supplied to the UV LED lamp head module 200 by means of a cathode cable 205 and an anodic cable 206, which in turn are paired to the cathode transverse plate 375 and the anodic transverse plate 376, respectively. In the present example, cross plates 375 and 376 both include tubular structures orthogonal to their upper surfaces to accept corresponding wires 205 and 206 by preferably welded connections. The cathode transverse plate 375 is wider than the anodic transverse plate 376, in order to provide an electrical connection with the cathode bodies 304a-b, which in turn are coupled to the front surface of the led controller PCBs 310a- b, which are generally cathodic layers separated by dielectrics and, ultimately, separated from the common anode anode body (the metal core of the MCPCB) by one of those dielectric layers. The anodic cross plate 376 interacts with the metal core (common anodic base plate) of the led controller PCBs 310a-b. In one embodiment, it may be preferable to locate the primary anodic cable 206 and the primary cathodic cable 205 at opposite points of the lamp base 305 for better expansion.
From the electrical and refrigerant entry point of the UV 200 LED lamp head module to the light emitting point of the UV 200 LED lamp head module, the 320a-d and 321a-d cathode clamps can have various functions. These functions include (i) bringing the electric current from the cathodic side of the led controller PCBs 310a-ba to the cathodic layer included in the flexible circuit assembly attached to the monolithic and replaceable refrigerator assembly by microchannel (eg part from package led 318); (ii) fasten the led package 318 to the lamp body 305; and (iii) fasten the led package 318 to the anodic body 315a-b. In one embodiment, the cathode clamps 320a-d and 321a-d hold the cathodic side of the led controller PCBs 310a-b, thus forming a complete cathodic electrical path for a low impediment current flow with low electrical contact resistance. . The cathode clamps 320a-d and 321a-b can be fitted to allow a clamping by means of the vertical nails 319 (at the optimum output shaft) in order to lower and compress the separation seal (o-ring) 314 and make a layer of common anode substrate of the led package 318 between necessarily in contact with the anode body 315a-b, thus forming a complete anodic electrical path for a current flow
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Low impediment with low electrical contact resistance.
Depending on the particular implementation, the 320a-d and 321 ad cathode clamps can be replaced with alternative cathode connectors / bodies in various ways, including (among others), folded metal foil, stamped elastic foil, three-dimensional metal molded geometries, circuit flexible and even wire.
In one embodiment, the microchannel refrigerator assembly is attached to the anodic body 315a-b and / or the lamp body 305; The screws provide the clamping force. By unscrewing the potentially polymeric screws that could effectively hold and tighten the above-mentioned led package 318 between the anodic and cathodic assemblies, the led package 381 or portions thereof, e.g. ex. The refrigerator assembly per channel can be easily removed and replaced.
The microchannel refrigerator can be planted in the ENEPIG or ENIG process available in Superior Plating, USA. UU. before joining the flexible circuit optionally or after joining the flexible circuit optionally, or only the flexible circuit can be plated. The advantage of the ENEPIG process is that it is a universal layer as long as the lead-free solder components can be attached to it, as well as the gold wires used in the wire connection of the LED cathodes to the flexible circuit cathodes. The use of other types of layers may be considered. It is important to note that it is preferable that only the areas of the entire device (apart from the LED fixing pads) that have a gold layer on the top layer of conductive material of the flexible circuit on the opposite side of the wires that reach the led fixing pads. In some embodiments, the microchannel cooler assembly and the anodic body 315a-b may have through holes for the cathode wires and the cathodic wires may subsequently be welded or screwed into the cathode bodies 304a-b. It is preferable to use a large core wire, high number of strands and low gauge with a minimum coating thickness so that the through holes are not excessively large and thus prevent the assembly from being excessively large. A good balance between low voltage drop and small size is a 10 gauge cable, range 1-30, with 105 threads available from Alpha Wire and / or CableCo, USA. UU. Plates can be added to the anode and cathode parts for low contact resistance. Additionally, an oil-based gel can be used if uncoated copper is chosen for any contact surface.
In the current example, the anodic transverse plate 376 is fixed to the body 315a-b by means of preferably metal screws that are inserted into threaded holes at the edge of the anodic body 315a-b. Alternatively, in case the ease of replacement and / or disassembly are not a priority, these contacts could be welded. This alternative could be considered in the context of other mounting mechanisms described herein, such as cathode clamps 320a-b and interface 321a-b with led controller PCBs 310a-b or the cathode layer of the flexible circuit (not shown). ). In the same way, the cathode transverse plate 375 is illustrated as being fixed (eg with metal screws) to the cathode bodies 304a-b, which extend slightly beyond the edge of the anodic body 315a and 31b respectively to create a air gap between the anodic body 315a-b and the cathode transverse plate 375 to avoid short circuits.
In one embodiment, an air gap (not shown) is provided between the transverse plates 375 and 376 and the lamp body 305 for several reasons. First, in one embodiment, the anode collector body 315a and 315b, the common anode substrate layer of the led packaging 381, a cathode layer of the flexible circuit (not shown) and cathode clamps 320a-d and 321a-d operate in a synergistic way to join the multiple electrical contacts (anode to anode and cathode to cathode) by means of a pinch or pinch function. Therefore, if the cross plates 375 and 376 have been brought into contact with the lamp body 305, they could discharge their inherent preloaded function of cathode clamps 320a-d and 321a-d. Secondly, it is preferable that the lamp body 305 is thermally conductive and the thermally conductive materials are sometimes also electrically conductive (e.g., the thermally conductive graphite filler in a polymeric resin, such as polycarbonate or PPS or materials metal based, such as copper, steel or aluminum). Thus, the air gap between the transverse plates 375 and 376 serves to prevent short circuit in these embodiments. In alternative embodiments, the lamp body 305 can be thermally conductive and electrically insulating, such as liquid crystalline polymer (LCP) D5506, an electrically insulating filler polymer sold by Cool Polymers, USA. UU.
Alternatively, the transverse plates 375 and 376 could be attached or fixed to the lamp body 305 with polymeric screws for the attenuation of stresses. Additionally, the bonding means and the use of wedges can be considered to facilitate assembly and compensate for the stacking of dimensional tolerance in production.
It should be noted that one should be aware of the fact that the lamp body 305 (if it is really electrically conductive) is in contact with the common anode substrate layer 317. Thus, electrochemical corrosion (e.g. galvanic) can be found. if different electrical potentials come into direct contact or even in close proximity or even indirect contact through fluid flow, for example. Therefore, the materials used for the common anode substrate layer 317 and the materials used to facilitate the thermal conductivity of the lamp body 305 should be carefully selected. In embodiments, a layer of copper anode substrate 317 is paired with a graphite filter of the lamp body 305. If the body 305 were
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Aluminum and anode substrate layer 317 were copper, this would pose a huge corrosion problem, for example.
With respect to the lamp body 305, it should be noted that, due to the deep and narrow main channels of lamp body coolant fluid 360 and 361 with high aspect ratio, injection molding may be the most practical manufacturing method; however, demolding the external surfaces of the lamp body 305 would interfere with the orthogonal quality of the electrical contact points where the anodic body 315a and 315b contacts the common anode substrate layer 317 at an angle of preferably zero or ninety degrees with the in order to provide a low electrical contact resistance (two orthogonal surfaces (plate and plate contact) as opposed to two surfaces crossing at an angle (rough edge and plate contact)).
According to one embodiment, by using a mold technique within mold (in which each half of the internal mold has a modular side of manual loading), an internal mold is used to define the outer layer and / or the characteristics of the lamp body 305. When the two halves are separated, the lamp body 305 is ejected without the need to unmold, thus allowing the desired discharge and the desired parallel and / or orthogonal mounting of the anodic body 315a-b, the layer of common anode substrate 317 and cathode clamps 320a-d and 321a-d due to the lack of demoulding angles. The need to unmold is eliminated as a result of the construction of two parts, which causes a 50% reduction in the surface area and doubles the rigidity of the mold, thus allowing the two halves of the mold to separate and the lamp body It is ejected despite the fact that there are no mold demoulds because there would be, among other factors, a 50% reduction in surface drag during ejection compared to a traditional one-piece mold. When contemplating thermally conductive polymers, their high thermal conductivity requires a mold surface temperature higher than that traditionally used (so that the resin does not "freeze" in the mold). Additionally, since no filler particle can peel off and enter the refrigerator during the operation of the UV LED lamp head module, since the microchannel cooler could become clogged, it is preferable to use even higher surface mold temperatures with in order to create a resin-rich "skin" that would contain the filler particles in their entirety within the resin matrix.
Another possible problem with using a traditional molding injection process is that the deep and narrow main inlet and outlet channels of lamp body coolant fluid 360 and 361, with high aspect ratio, can lead to thin parallel plates bending of the mold used to define the main inlet and outlet channels of lamp body coolant fluid 360 and 361. This problem is uniquely addressed in one embodiment by using a vertical injection molding process involving a flow and pressure of balanced multipoint injection in order to prevent the metal plates that form (define) the channels from bending (deforming).
According to one embodiment, a two-part clamp 306 is used to remove tension from the cathode cable 205, the anodic cable 206, the cathode transverse plate 375 and the cathode transverse plate 376, since the tension on these components could be transferred to the 310a-b led drivers PCB.
Referring to the cathode forceps 320a-d and 321a-d, in one embodiment, a corrugated strip of beryllium copper or any other conductive metal can be placed between the cathode forceps 320a-dy and 321a-d and an upper surface of an electrically insulated cathode sheet of a set of microchannel refrigerated LED 318 package with the aim of generating a spring-like action between these components. This could effectively deny the need to use preferably 0-80 screws that hold the 320a-d and 321a-d cathode clamps to the sheet. Instead, the orthogonal screws through the cathode clamps 320a-d and the led controller PCBs 310a-by in the lamp body 305 could hold the cathode clamps 320a-d and 321a-d in place if using temporarily a downward force to force the spring to a flat state or almost achieve it, which would provide a low electrical resistance connection with one less screw. The same concept, or a very similar one, could be used on the anodic edge of the anodic body 315a-b closest to the rear side of the lamp body 305, however, the use of a corrugated and substantially monolithic beryllium copper could be contemplated. or any other electrically conductive material. An anodic tie bar could wrap the PCB and have orthogonal grooves for the screws. The use of a soldering iron or conductive adhesive could be considered, but would affect the ease of repair. It is important to note that when fixing or holding the LED controller PCBs 310a-ba the sides of the lamp body 305 would match the components with optimal thermal communication, so that the refrigerant in flow would freeze the LED controller PCBs 310a-b since. According to one embodiment, they have residual heat dissipation requirements of approximately 5-1 W / cm2 +/-. The use of ultra high efficiency electronic switching SMD components with an efficiency greater than 90% is preferable. In one embodiment, the deep cooling channels 360 and 361, with high aspect ratio, would add surface area synergistically to reduce the heat transfer coefficient needed to cool the led controller PCBs 310a-bya in turn add sufficient strength Hydraulics to balance the flow through the microchannel refrigerator 410. The thin walls of the lamp body 305 not only reduce the thermal resistance between the PCB controllers 310a-b and the refrigerant flow, but allow the cathodic sheet layer 513 of the flexible circuit 510 have a shorter length (measured from the tip of the refrigerator by microchannel 410 to the edge near the wire junctions).
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Additionally, Lineage, USA UU. It will have 1000 W power supply frozen by conduction and platinum certificates available from 2011. These power supplies have an efficiency of 95% and in the beginning they will not need cooling water to eliminate residual heat, and would only use natural convection. Finally, it should be noted that if Power-One front-end AC / DC power supplies of -1100 W -12V were used, two of the units could be used per -80 mm UV LED lamp head module, containing approximately -136 LEDs (for example, semi-LED LEDs of -1.07 x 1.07 mm).
According to embodiments of the present invention, it is preferable not to weld the led packaging 318 or the microcooler assembly to the led conductor PCBs 310a-b since this procedure would decrease the modularity and increase the integration, with the net result of a decrease in the reparability or substitution of subcomponents. By way of example only, if one of the 310a-b led controller PCBs failed, it could simply be unscrewed preferably using injection molding or polymer machined screws (nylon, PEEK, Torlon), as described above, and replaced with a repaired or new plate. The same still applies to led packaging 318 preferably attached to a microcooler assembly as described in more detail below.
In relation to the assembly of several components of the UV 200 LED lamp head module, in a preferred but not limiting example, the threaded holes 0-80 can be placed on the PCB edges of the 310a-b led controllers that look towards the direction of the light output (which is the same as saying that they look towards the anode side of the microcooler assembly). Second, the small claw-shaped clamp 320a-d and 321 ad clamps that are preferably made of copper or aluminum (and machine-made, molded or stamped) and being in the aggregate of approximately the same dimension on the long axis of the led array address (individually, approximately the same length as the PCB of the 310a-by / isolated led controllers or the flexible circuit segments. When the led controller 310a-b PCBs are driven firmly (by allowing the Sliding through the gaps in the led controller PCBs 310a-b when they are lightly screwed to the lamp body 305) to the protruding anode side of the refrigerator by microchannel, and then screwed into place with screws separated to the sides of the body of lamp 305, the 320a-by 321 ab cathode clamps are placed on their respective positions on the pads of the 310a-b led driver PCBs. 0-80 polymer rings (or metal screws with non-conductive polymer sleeves and / or washers) are placed through the cathode clamps 320a-d and 321 a-d, through the led packaging 318 (p. eg, including the microchannel refrigerator / flexible circuit assembly) and into threaded holes (in the direction of upper light emission of the lamp body 305) and tightened using a preset torque screwdriver. Any embodiment could use metal screws with non-conductive polymeric sleeves and / or polymer washers or screws. For the same reason, non-conductive screws or polymeric sleeves and / or washers can be used, the cathode layers 513 or flexible circuits can be retracted to avoid contact with the metal screws to avoid an electrical short circuit of any of the layers. The metal screws could be in contact with and carry electrical current between the anode and / or cathode layers.
If used, the polymer screws (which can be machine-made or molded in Craftech, USA) are firmly tightened, which then complete the function of making a very low electrical contact resistance between the anode surfaces of the refrigerator by microchannel and led controller PCBs 310a-b; and the correct locations of the cathodic surfaces of the cathode segments of the flexible circuit and the cathode clamps 320a-d and 321a-d and the bearings of the led controller PCBs 310a-b. It should be noted that the majority or all of the aforementioned screwing and / or fixing operations could be achieved with preferably low welding or bonding melting temperatures or other fixing means. however, for the purpose of facilitating reparability, screws are described as fixing means in the context of various embodiments of the present invention. It is also contemplated to place a hole in the led controller PCBs 310a-b so that each side of the hole accepts the prominent parts of the microchannel / flexible circuit cooler. The prominent parts of the flexible circuit could then be inserted into these holes and preferably welded in place after the led controller PCBs 310a-b are preferably screwed to the side of the lamp body 305. It should also be noted that the spring contacts made of electrically conductive material such as beryllium copper, which could preferably be used instead of the aforementioned adjustable cathodic clamps.
FIGS. 4A-B provide enlarged sectional views of a lower part of the reflector 201 and an upper part of a body 305 of the UV LED lamp head module 200 of FIG. 2A. In these views, the led array 330 and various aspects of the common anode substrate layer 317 become apparent. Additionally, in these views, the separation seal 314 is illustrated composed of a plurality of o-rings 420 and a preferred multilayer construction of the led controller PDB 310a-b becomes visible.
As described in more detail below, in one embodiment, a microchannel refrigerator 410 provides the common anode substrate layer. in accordance with one embodiment, the microchannel refrigerator 410 is a diffusion bonded microchannel refrigerator including a thermal diffuser layer (not illustrated) diffusedly bonded to the film layers (not illustrated) thus having recorded several of the primary input microchannels / output 411 and internal microchannels (not shown). While microchannel cooling has a component
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Laminar in which the bonding layer is compressed, in embodiments of the present invention, impact cooling (e.g., turbulence) may result from the path engraved with the shape of the refrigerant flow path and / or directional changes. An exemplary microchannel refrigerator is illustrated by US Patent No. 7836940, which is incorporated herein by reference in its entirety for all purposes. Microchannel refrigerators that meet the cooling requirements described here are for sale by Micro-Coolin Concepts, USA. UU. Those skilled in the art will recognize that several different cooling schemes may be used. For example, microchannel cooling and other turbulent coolant flow paths (e.g., impact, jet impact) or two-phase / nuclear boiling (or some combination), and cooling schemes can be taken into account.
According to various embodiments of the present invention, it is an objective to create and maintain a relatively isothermal state (eg junction temperatures within approximately ± 1 degrees C and also a general maximum average junction of ~ 40 degrees (range 30-200 degrees C) from end to end of the led assembly 330. In order to fulfill these objectives, the embodiments of the present invention attempt to balance the flow of the refrigerant through the microchannel refrigerator 410 from front to back, from the top to the bottom , from end to end and / or from side to side In alternative embodiments, the flow can be balanced or unbalanced as needed in the design The refrigerant can flow through primary and secondary internal channels (not shown) of the microchannel refrigerator 410 in virtually any direction, selected vertically, horizontally, orthogonally, parallel, etc. or any combination of the foregoing, in relation to ion with the lower surface of, as well as under, the LEDs of the led assembly 330. Another way of describing the orientation of the channels is in relation to the pn junction plane, which is (in most LEDs) substantially parallel to the bottom surface of the led.
Similarly, the primary and / or secondary internal channels can be interconnected with virtually any orientation of the selected collector / collectors vertically, horizontally, orthogonally, parallel, diagonally, angularly, bypass, partial bypass, etc. or any combination of the above, again in relation to the orientation of the fund of the LEDs (or the p-n unions of the LEDs). It is preferable that all, or almost all (almost 100%) of the refrigerant ends up flowing from the upper portion (eg the main refrigerant fluid inlet channel of the refrigerator through microchannel 430b) of the main refrigerant fluid inlet channel from the lamp body 360 by means of the microchannel cooler 410 to the upper portion (eg the main refrigerant fluid outlet channel of the microchannel 430a) of the main refrigerant fluid outlet channel of the lamp body 361 in a orthogonal or perpendicular direction to the long axis of the led assembly 330 and / or the microchannel refrigerator 410. In one embodiment, the microchannel refrigerator 410 uses flow paths optimized by CFD (computational fluid dynamics) to reduce flow rates to a level that allows a high level of erosion reduction. In one embodiment, coolant speeds of approximately 2 meters per second are preferable in order to reduce erosion of the channels. Ceramic materials can be used in the channel substrate to further reduce the erosion potential.
As noted above, the main channel of the lamp body refrigerant fluid 360 and the main channel of the lamp body refrigerant fluid 361 have a size such that the refrigerant flows uniformly along the internal microchannels of engraved sheets , and so that preferably almost all of the refrigerant finally ends up rising in a direction substantially perpendicular to the long axis of the led array 330, in any given refrigerant molecule that begins at the main channel of the lamp body coolant fluid inlet 360 eventually terminate in the main outlet channel of lamp body coolant fluid 361, and thus, essentially each coolant molecule eventually flows substantially perpendicular to the long axis of the led array 330 (substantially parallel to the short axis of the led array 330) when going through the refrigerator through microchannel 410 and flowing under the LEDs. By making the main inlet channel of the lamp body coolant fluid 360 very narrow (e.g., approximately 1-4 mm and preferably 2.3 mm) wide and very deep (eg, approximately 1- 10000 mm and preferably 100 mm) the resulting hydraulic resistance aids in the uniform flow of the microchannel in terms of balanced flow through substantially all or most of the internal channels of the refrigerator by microchannel 410, whether or not they are primary, transverse channels, secondary, collectors, etc. It should be understood that these channels could have curves, S-turns, protrusions for turbulence, and perhaps narrowing and widening and / or increase in depth through the space under the led matrix 330 in the direction that is substantially lateral or parallel to the short axis of the led array 330. Again, the orientation of any given microchannel can be in any orientation (as well as the direction of flow) with respect to the orientation of the pn junctions of the LEDs.
As described in more detail below, the led array 330, comprising the light emitting devices, such as LEDs or laser diodes, is mounted in the refrigerator by microchannel 410. In one embodiment, the range of the number of LEDs to The length of the refrigerator per microchannel is 2 - 10,000, and the size of each LED is approximately 1.07; 1.2; 2; 4 mm in square (or 2 x 4 mm), range of 1-100 mm. The aspect ratio of the width to the length is preferably between 1:68 to 1: 200, but the range may be 1:10 - 1: 1,000. It should be noted that the LED matrices may not have a high aspect ratio and may be substantially square, substantially rectangular, substantially circular or other geometries. Exemplary LEDs are for sale by SemiLeds, USA. UU. SemiLED LEDs have a unique (often plated) copper substrate that is advantageously bonded to the cooler by copper (or ceramic) microchannel 410, thus maintaining the cost and thermal advantage of this highly thermally conductive material. According to one embodiment, the size of the LEDs
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employees are 1.07 x 1.07 mm in square and the matrix of led 330 comprises a matrix of 68 LEDs long and 2 LEDs wide.
In one embodiment of the present invention, the LED array 330 LEDs are located substantially in parallel electrical, or have at least two LEDs in parallel, in a common anode substrate preferably. This is a very efficient thermal connection because there is no need to add any thermal layer that clogs between the base of the led and the substrate for electrical insulation as needed in a serial configuration or in a parallel parallel configuration. However, it should be noted that any of these configurations could be considered in several embodiments, as well as in a purely serial distribution or in a serial / parallel distribution. While a dielectric layer could be substantially added to the overall thermal resistance, thus raising the temperature of the junction of the device (or devices) and negatively impacting the output of power and / or efficiency, it is contemplated that a very thin dielectric layer of the size a few microns thick or less, it can be developed by means such as the deposition of atomic layers and provide a very low thermal impedance layer on a material such as copper in order to electrically insulate in a series / parallel distribution. This dielectric could be selected from the group of oxides, nitrides, carbides, ceramics, diamond, polymer (ALD polyimide), DLC, etc.
According to several embodiments of the present invention, an objective is to maintain extremely low thermal resistance between the epitaxial junctions pn of the LEDs, or at least the bottom of the bare die, that is approximately 015 K-cm2 / W, but the range can be from 0010 - 15 k-cm2 / W, and is often around 024 K-cm2 / W. Very thin layers of lamination, joining pads, debris, etc. of metallic, dielectric, ceramic or polymeric layers can be considered, but they are not optimal due to the increase in thermal resistance that results from these additional layers, which inevitably results in an increase in junction temperatures, with the corresponding decrease in efficiency. Several means to decrease the attenuation of the current associated with the design and growth of the epitaxial structure, such as thicker overlays can be employed, as well as other avant-garde means (e.g., new quantum barrier designs, reducing the centers of non-radiative recombination, etc.) found in recently published scientific journals and written by employees of Philips, the Netherlands, and RPI, USA. UU. and others (see, eg Resselaer Magazine "New Led Drops the 'Droop'" March 2009 and Compound Semiconductor Magazine "Led droop: do defects play a fundamental role " July 14, 2010, both of which have been incorporated by Full reference for all purposes.
Thus, according to several embodiments, there is an extremely low thermal resistance path between the led junction and the recorded lamination layers (e.g. chemically etched) that contain the liquid fluid in the microchannels preferably chemically etched, since the LEDs they are mounted directly (preferably with a SnCu welding of 2.5 um thickness) and the thermal diffuser (if used) and the aluminum layers are thin, and preferably are not part of the intermediate dielectric layer. Other engraving, lithographic or mechanized processes can be considered in the manufacture of microchannels.
According to one embodiment, the LED matrix 330 LEDs are directly attached (e.g., without any substantial layer involved, be it bulk material, aluminum, thin film or any other material) on the LED and the microchannel cooler 410 apart from, for example, a pre-sprayed welding layer that is preferably pre-applied (eg by spray deposition means) to a lower surface of the LEDs.
As described in more detail below, a separation seal 314 may be formed by one or more o-rings 420 to seal the common anode substrate layer 317 to body 305 and also bypass the present refrigerant substantially directly below. of the led array 330. While in this and other figures, the O-ring 420a-c does not appear to be compressed, it will be appreciated that in real-world operation, they would actually be compressed to perform the intended function of preventing fluid bypass between channels or in the external environment. In the present example, the separation joint 314 is substantially parallel to, and in the same plane of the z-axis, as the lower surface (opposite the direction of light emission) of the diffusion bonded aluminum layers (not shown) of the microchannel refrigerator (either layered vertically or horizontally). The cross-section of the separation joint 314 is preferably substantially round, it can be made of a white durometer silicone, and it can be manufactured by Apple Rubber, USA. UU. In alternative embodiments, the cross section of the separation joint 314 may be square or rectangular.
Referring to the multilayer construction of the 310a-b led controller PCBs illustrated in the present example, in one embodiment, the copper metal core PCB boards (or aluminum, polymer, filled polymer, etc.) whose thickness is of approximately 2.5 mm (1-10 mm range) and available in Cofan, Canada are composed of multiple layers to keep the PCB size at a minimum level. High power FETs and door controllers and inductors and resistors and capacitors can be mounted on the Thermagon URSA layer that is closest to the metal core. Common LM 3434 or LM 3433 series anodic LED drivers (sample only) available in National Semiconductor, USA. UU. they can also be mounted as close as possible to the metal core, so that a minimum dielectric layer thickness (if any) can exist between the components and the metal core. The use of equal lengths of debris paths and the close spacing of components for stable and efficient electrical operation can be considered. Custom wound inductors can greatly increase the efficiency of the drive subset. Inductors
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can be oriented such that the magnetic fields of the separate controllers (eg 8 or 15) with a preferable common base plate (eg anodic body 315a-b) can be shared with the common anodic substrate 317 of the mounting of bending circuits of the microcooler, interacting mutually in a beneficial way in order to increase the efficiency of the preferably constant current controller (although a constant voltage controller can be used, especially with special circuits). Constant current controllers with pulse width modulation (PWM) can be used, although PWM can have a detrimental effect on the life of the LED between high currents due to the current wave, the use of Additional capacitors between inductors and LEDs. Alternatively, an iron substrate can be placed between the inductors to reduce unwanted interactions between the inductors or other components that may depend on orientation and space. The use, preferably, of armored inductors from VASHAY, India may be considered.
On the rear side of the lamp body 306 (the side where the main electrical and water power input / output sources are located), the preferably metal cores (copper, aluminum, composite) of MCPCB can have a bolted tie bar or welded (or anodic cross plate 376) between the two MCPCB (PCB with metal cores available in Cofan, Canada) to create a space and / or a strong mounting plate for a single wire connection for the anode that would reach the Front AC / DC main electrical supplies connected to the main AC.
In one embodiment, the metal cores of the 310a-b led controller PCBs are ground planes there may be more than one ground plane in each 310a-b led controller PCBs. Therefore, the edge of the PCB is preferably attached or welded to the ground plane of the common anode substrate layer 317. This is preferably achieved by allowing a common adhesive anode substrate layer to extend, hang above each side of the body 305, such that the anodic side of the common anode substrate layer 317 can touch and be in electrical communication with the anode side (edge) of the PCBs of the led drivers 310a-b and the sides cathodes of the common anode substrate layer 317 (e.g., the upper lamination layer) may preferably touch and be in electrical communication with the upper cathodic area itself of the individual cathodic segments that are in communication with the controller PCBs of led 310a-b.
FIGS. 5A-B provide enlarged views illustrating the LED array 330 and its interface with the common anode substrate 317 of the UV LED lamp head module 200 of FIG. 2. In these views, the high form factor of the led array 330, the electrical pairing of the individual LEDs, the proximity of the reflector base 201 to the surface of the LEDs and the multiple layers of a flexible circuit 510 are They become apparent. Additionally, in these views, the preferably vertically oriented lamination layers of the microchannel refrigerator 410 become visible.
According to one embodiment, the common anode substrate layer 317 may include a microchannel cooler 410 to transfer heat from the led array 330, an integrated etched support layer 525 and a solid support layer. In one embodiment, the width of the microchannel refrigerator 410 is only slightly wider (eg, less than about 400 microns (range 50-2000 microns)) than the led array 330. In one embodiment, the total width of the Microchannel refrigerator 410 is around 1.2 times (range 1; 1.1; 1.3; 1.4; 1.5; 1.6; 1.7; 1.9; 2; 2.1; 2, 2; 2.3; 2.4 to 2.5x) the total width of the led array 330. In the present context, computer modeling suggests that increasing the total width of the refrigerator per microchannel 410 to a width of almost Double (2x), the width of the led array 330 decreases the peak thermal resistance by only 5%.
The microchannel refrigerator 410 may include a 540 heat dissipation layer (thermal diffusion layer) (eg approximately 125 microns thick (from less than 500 microns, less than 250 microns, less than 200 microns, less than 150 microns, less than 100 microns, less than 50 microns to less than 25 microns), below the top surface of the freezer per microchannel 410, a plurality of primary input / output microchannels (eg primary input microchannel 411) and several multilayer entry passages, heat transfer passages (not shown) and multilayer exit passages Notably, in the present context, the heat dissipation layer 540 actually provides little real heat distribution; however, it provides a length Extremely short terminal diffusion (distance between the bottom of the LEDs and the heat transfer channels (not shown) closest to the refrigerator via microchannel 410). For example, its orientation, flow directions and dimensions are given in US Patent No. 7,836,940, which is included herein by reference.
The upper surface of the microchannel refrigerator 410 can match the microchannel refrigerator 410 with the led array 330. The primary input microchannels (not shown) can be configured to receive and direct a fluid to internal passages inside the microchannel refrigerator 410, including heat transfer passages The heat transfer passages can be configured to receive and direct the fluid in a direction substantially parallel to the upper surface and several multilayer inlet and outlet passages substantially perpendicular. The multilayer output passages can be configured to receive and direct the fluid to one or more primary input microchannels (eg primary output microchannel 411).
In one embodiment, the microchannel refrigerator 410 may be formed from a plurality of lamination sheets.
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Engravings (eg lamination sheet 520) thus forming the internal and multilayer passages to direct the flow of the refrigerant. In the current example, a monolithic microchannel refrigerator body is formed with a diffusion joint of the combined recorded support layer 525 and the solid support layer 350 to the microchannel refrigerator 410. As shown in FIG. 5A, the lamination layers of the etched support layer 525 would preferably be thicker than the lamination layers 520 of copper 410. In one embodiment, the support layers 525 and 530 can be machined.
In one embodiment in which the diffusion bonded lamination layers (eg lamination layer 520) are stacked vertically (and diffused together) with their edges below the lower portion of the LEDs as illustrated in the FIGS. 5A and 5B, the LEDs would preferably be directly attached to the vertically oriented microcooler (with or without using plates such as ENIG or ENEPIG, Superior Plating, USA), and preferably two pure copper blocks preferably machine-made (C101 or C110), with flow of macro-refrigerant and / or coolant addressing channels that mutually reflect (that apply), "squeezing" the refrigerator by recorded microchannel joined by diffusion and stacked vertically. Each copper block (which could be either a stack of diffusion-bonded sheets or a solid block) is joined by diffusion to the opposite sides of the microchannel-cooled 410 stacked vertically in one step. In other words, the lamination layers and blocks would preferably be joined by diffusion in a single step. The stacking that results from this would preferably be performed by machine excision, and the assembly will be renamed refrigerator set per microchannel; the portions of the microchannel refrigerator assembly would be called portions of outer support layer (525 and 530) and refrigerant portion by microchannel 410. The microchannel refrigerator assembly (eg portions of outer support layer 525 and 520) would preferably be drilled before performing a machine excision process and before performing surface finishing processes (eg a plating process). If a plating process is used in order to provide a weldable surface for the LED and / or a cable joint surface for the cables that would be attached to the led joint pads on the preferable upper side of the LED, a panel of Machine-made polymer will preferably be provided in order to allow an O-ring groove (preferably using the same O-ring / O-ring design mentioned above) that will allow the microchannel cooling assembly to be attached to the polymer block and that Enter a galvanized bath without solution reaching the ID of the microchannels. This process can also allow the plating of a non-corrosive surface in regions where the anode and / or cathode busbars 304a-b can finally be fixed or welded at the end of the product. The 310a-b led controller PCBs can also be plated at the edges to reduce corrosion and obtain a low voltage drop.
The microchannel refrigerator assembly could undergo a cooling or annealing or precipitation hardening process so that the hardened pure copper (which has a thermal conductivity higher than approximately 10% than Glidcop) could be used in the lamination layers (e.g. e.g., lamination layer 520). Pure copper would improve wettability in welding.
In one embodiment in which the diffusion-bonded lamination layers (e.g., lamination layer 520) are oriented horizontally, the microchannels of the microchannel refrigerator 410 can be etched in the same plane as the bottom of the LEDs (p eg, LED 531) so that the input / output microchannels (eg channel 411) can be engraved or even machined in the lamination layers. The internal microchannels of the microchannel refrigerator 410 may be formed along all or substantially all of the diffusion-bonded lamination layers (e.g., lamination layer 520) substantially as deep as the thickness of all layers together and / or stopping near or at the bottom of the heat dissipation layer 540.
Returning to the positioning of the reflector 201, it is preferable that the dielectric spacer layer 514, as of polyimide film, be placed between the bottom surface of the reflector 201 and the refrigerator by microchannel 410.This isolates the reflectors of the refrigerator by microchannel 410 both thermally and electrically, as well as providing a space for the cables (e.g., cable 530) from the LEDs (e.g., led 531) to fit under the reflector 201 and have the half-moon end of the cable attached to the Bronze-plated lamination layer that preferably contains gold 513 that is part of the flexible circuit assembly 510, which is directly attached to the microchannel refrigerator 410. In this embodiment, the dielectric spacer layer 514 is at least as thick as the thickness of the cables (e.g., cable 530).
Using a chip soldering iron such as Datacon, Austria, MRSI, USA. UU. with a ramming tool or a capillary tool, the cables (eg cable 530) can be automatically rammed (folded) so that the cable handle is lowered until it is laid in parallel (or even by contacting the layer of lamination above the polyimide layer before the half-moon termination point) to flexible circuit 510 - polyimide / copper lamination layer (s) (conductive circuit material layer). The flattened cable does not contact the anode surface or the edge of the led (eg led 531), as it could result in a short circuit. Other manual and / or automatic means could be planned, such as a long ramming tool that ram all cables in one step, or the edge reflector itself with or without a dielectric layer could be used for ramming. The primary objective of this cable bending step is to allow the reflectors to be placed in close proximity to the LEDs (eg within at least one wire diameter) and to eliminate friction, contact or short circuits to the reflector 201. reflectors (reflector 201) would preferably be designed with a non-image generating software tool such as Photopia, USA. UU. The reflectors may have different operating characteristics
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as short to long operating distances or short to long depths of field. They should be easy to replace as long as they are modular and interchangeable and with features that provide the user with maximum flexibility of operations. In one embodiment, the external dimensions of the reflector 201 does not change substantially for the reflectors configured for different distances. For example, as described below, a reflector optimized for a 2 mm focal plane could have external dimensions practically similar to those of a reflector optimized for a 53 mm focal plane.
The reflectors (eg reflector 201) can be injection molded from acrylic, polysulfone, polyolefin, etc. They can be coated in aluminum and / or silver with layers of dielectric enhancement offered by DSI, USA. UU. They can also be extruded from a polymer or metal. It is important to note that the halves of the monolithic reflector 201 that run through the entire assembly of all the LED UV lamp head modules 200 placed end to end (serial length) can be used. These long reflectors can have one or more polished and coated end layers at each end. They could be created from a 5-axis 6061 Al and diamond polished machine and a horsehair brush (since the reflectors can be polished) and coated with, for example, a single layer of optimized MgF2 or SO2, for example (as in all previous examples) at 390-400 nm.
One skilled in the art could conceive any length of the LED array 330, reflector 201 and lamp body 305. As described above, a possible length for the lamp body 305 is approximately 80 mm. This allows approximately 60 45 thousand for lateral LEDs or 60 40 thousand for lateral LEDs, both preferably in two rows with a gap of about 15 microns (range 5-50 um) (eg, hole 532) between the two rows . A single row or multiple rows (from 1-n) of LEDs can be considered. You can even consider LEDs that have a longer length along the long axis of the led array. Along the long axis, it is preferable to have a gap of less than 25 microns (range 5-100 um) (eg, hole 533). In one embodiment, the center-to-center distances between the LED matrix 330 LEDs are approximately 10 to 20 microns greater than the combined lengths of the edges of the neighboring LEDs.
The embodiments of the present invention take into account the general z-axis stacking of the metal and dielectric layers of the flexible circuit 510 (minus the dielectric spacer layer 514), plus the thickness of the cable layer (diameter of each cable or thickness of each cable sheath) that extend above the preferably cathodic flexible circuit layer 513 and extend to the cathode cable junction pad 534 shown below the ball-tip joints of the cables (eg cable 530 ) on the preferably upper surface of the LEDs.
In one embodiment, the total z-axis stacking is not thicker than the thickness of the LEDs (led layer). In several embodiments of the present invention, the led layer may have a thickness of approximately 145 microns and whose thickness ranges from approximately 250 microns or less, 200 microns or less, 150 microns or less, 100 microns or less, 50 microns or less to 25 microns or less.
In several embodiments of the present invention, in which the flexible circuit layer 510 includes the dielectric spacer layer 514, the flexible circuit layer may have a thickness of approximately 7.8 millimeters or less and whose thickness ranges from approximately 12 millimeters or less , 10 millimeters or less, 5 millimeters or less up to 3 millimeters or less.
In several embodiments of the present invention, in which the flexible circuit layer 510 excludes the dielectric spacer layer 514, the flexible circuit layer may have a thickness of approximately 5.3 millimeters or less and whose thickness ranges from approximately 10 millimeters or less , 8 millimeters or less, 2.5 millimeters or less up to 0.5 millimeters or less.
In one embodiment, the total z-axis stacking is not thicker than the thickness of the LEDs (led layer). In several embodiments of the present invention, the led layer may have a thickness of approximately 145 microns and whose thickness ranges from approximately 250 microns or less, 200 microns or less, 150 microns or less, 100 microns or less, 50 microns or less to 25 microns or less.
In one embodiment, a lower surface of the optical reflector 201 is approximately 1-1.5x of the thickness of the cable layer above an upper surface of the matrix layer of the light emitting apparatus. This allows the reflector 201 to fit very closely to either or both edges of the LEDs or in relation to the upper surface of the LEDs, which would maintain its irradiance by maximizing the number of emitted photons controlled by the reflector 201 and minimizing the number of photons emitted that avoid reflector 201 when moving below reflector 201. Placing reflector 201 near the edge of the led also allows a more compact reflector in terms of height. This proximity of the reflector 201 to the led array 330 also allows for a cathodic layer 513 of shorter length of the flexible circuit 510, which also allows the cathodic layer 513 to be thin and can still conduct high currents without many impediments. The further the edge of the reflector moves away from the LED, the higher the reflector must be according to optical principles of common knowledge. Although a slightly higher irradiance can be achieved with higher reflectors, higher reflectors may be impractical in certain implementations.
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Additionally, flexible circuit 510 is not expensive to make and is very compact and thin, so it is suitable for use in the context of embodiments of the present invention in which the general z-axis stacking of the metal and dielectric layers of the circuit flexible would preferably be minimized. Lenthor, USA UU., Is an example of an excellent manufacturer of flexible circuits. In one embodiment, flexible circuit 510 may extend beyond the microchannel refrigerator assembly and be connected (directly or indirectly) to an external DC / DC and / or electrical supplies.
As described above, another novel feature of the embodiments of the present invention includes the use of a microchannel cooler 410 preferably bonded by diffusion (although the layers can be welded or glued) and preferably of etched sheet that preferably has a high aspect ratio of at least one or more short and literally engraved (along the short (width) direction of the led array 330) that may be in a thermal parallel and preferably formed such that it is side by side across a length long where the refrigerant flows and below the led matrix 330 in the direction preferably and practically parallel to the shorter dimension (or dimensions) of the matrix 330, normally the width dimension (and not the length dimension). In other embodiments, the refrigerant may flow in one direction through the length of the led array 330 and / or the refrigerant 410, and may flow vertically (towards the bottom surface of the LEDs) in some areas. In one embodiment, many channels can flow below the bottom of the LEDs and very close to the bottom of the LEDs with a separation of no more than 125 um of copper (range of 1-1000 um), plus a thin sheet of welding that is used to join the LED directly to the common anodic substrate 317. Additionally, the use of multidirectional coolant paths and orientations can be considered, individually or in groups, also described as internal heat transfer channels, which run in parallel , perpendicular, vertical or horizontal, connected or not connected, or some combination of the previous two, oriented in relation to the length or width or some combination of the previous two, of the led array 330 and / or the lower surface of the led or the LEDs.
According to one embodiment, the internal heat transfer channels can be oriented such that (i) two or more adjacent LEDs in the shortest dimension of the led array have substantially independent heat transfer channels under each led and (ii) the LEDs that are above these channels are cooled independently (the group of channels under each LED have virtually no convective communication between them or with the group of channels under the adjacent LED). Therefore, it could be said that the two or more adjacent LEDs have to be cooled in thermal parallel instead of thermal series. The thermal series would result if the flow of the channel that is substantially and directly below the LEDs intermingles or if a common channel flows substantially and directly below both LEDs.
The lamination layers (eg lamination layer 520) of the microchannel refrigerator 410 would preferably be and substantially copper, and would preferably have about 1% (1-10% range) of an intermingled ceramic material such as Al2O3, commonly known as Glidcop, known for maintaining its rigidity, strength and shape after being subjected to high diffusion binding temperatures. Gildcop is now available and has almost the same thermal conductivity as pure copper.
In one embodiment, the microchannel freezer 410 is constructed as a high aspect ratio apparatus corresponding to the high aspect ratio of the directly mounted LED array 330. In other words, the refrigerator 410 has a length greater than its width in which the LED matrix 330 is mounted, and the refrigerator 410 usually has very short channels side by side and with the refrigerant flowing in a direction frequently parallel to the width of the led array 330 and perpendicular to the long axis of the refrigerant 410 (the largest dimension) and which can have 1-n channels located next to each other. The internal microchannels can be oriented to form multilayers that are parallel, perpendicular, horizontal and / or vertical to one or two of the following axes: long axis (length) or short axis (width) of the led array 330. The sheets (p eg lamination layer 520) would preferably be stacked one on top of the other (or joints), and each channel would preferably be located below the channel that is located above or within the sheet that is directly above the nearby sheet regardless of whether the sheets are stacked vertically, horizontally or in any other angular or rotational orientation in a three-dimensional space. In one embodiment, the LEDs are mounted directly on the surface (eg a common anodic substrate) formed by the edges (when the sheets are stacked vertically) of a multiple laminate stacked and joined by diffusion. It is preferable that the surface formed by the edges of the laminate is first flattened before welding the led array 330 to this surface.
As a non-limiting example, the LEDs could be mounted in two rows (1-n) along the width of the row and be organized from 50 to 300 LEDs along the length of the row. The row length would preferably be approximately 90% (10-100%) or more than the length of the refrigerator 410. In other words, the led array 330 extends as close as possible to the edge of the refrigerator by microchannel 410. In this way, there are no significant irradiance gaps in the UV led lamp head modules connected in series. This configuration is the most beneficial in the context of short working distances (~ 2 mm).
It is preferable that the internal microchannels under the LED matrix 330 LEDs have an approximately equal flow so that the LED joints are of approximately the same temperature. For some specialized applications, the flow may be different in some channels for the LEDs to work
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hotter or colder shape, especially if the LEDs have different wavelengths, since the short wavelength LEDs will require more cooling. It should be noted that not all embodiments require that 100% of the refrigerant flow through the refrigerator through the microchannel to pass through heat transfer channels of the refrigerant through the microchannel.
According to one embodiment, it is preferable to use CFD to design the inlet and outlet coolant multilayers formed in the base of the body 305 to improve or build the coolant flow as needed to meet the almost equal desired flow in the microchannels. . It is preferable that MicroVection USA perform the CFD. An improvement can be achieved by making the channels deeper or wider or both, or alternatively, constriction can be achieved by making the channels more superficial or narrower or both. All these geometries can be three-dimensional with simple or compound contours or almost straight or sharp geometries. As for the microchannels, they can be of different size, shape, depth, width, number, center-to-center spacing, number of engraved lamination layers, curves, bumps, scribbles, gull-wing profiles (gull-wings) ), etc. as necessary to balance the flow and / or reduce the thermal resistance between the channels and the led junctions.
FIG. 6 is an enlarged and detailed isometric sectional view of an upper portion of the body 305 and illustrating several layers of the LED UV lamp head module 200 of FIG. 2. In this example, the led array package 318 includes the dielectric spacer layer 514, the cathodic layer 513, the dielectric separator layer 512, the adhesive layer 511 and the common anodic substrate layer 317. The flexible circuit 510 could also include an anodic layer (not illustrated). As described above, layers 511-514 can collectively form a flexible circuit 510 of the Pyralux family of products. In one embodiment, the flexible circuit 510 may not include the dielectric spacer layer 514, which may be attached to a lower surface of the reflector 201 or simply be free floating between the lower surface of the reflector or attached to an upper surface of the flexible circuit 510. In alternative embodiments, a rigid flex circuit or a rigid circuit with a rigid dielectric (eg FR4, ceramic, glass or related materials) could replace flexible circuit 510.
In one embodiment, the dielectric spacer layer 514 and the dielectric separator layer 512 include a polyimide layer (eg Kapton, available from DuPont, USA), PEN or PET. The cathodic layer 513 is preferably a copper foil. The cathodic layer 513 and the dielectric separator layer 512 preferably form an integrated layer of cathodic and dielectric sheet (known as "non-adhesive" in the Pyralux family of products available in DuPont, USA). As described above, these layers that form the led package 318 are between the cathode clamps 320a-d and 321a-d and the anodic body 315a-b.
One design option is to accommodate individual UV LED lamp head modules (which when forming arrays in series would typically require connecting the lamps in the same container) as opposed to housing the LEDs in the UV LED lamp head modules. Having the ability to bin in the UV LED lamp head modules means that the individual lamps do not need to be accommodated. As noted above, in one embodiment in which the housing is carried out in the UV LED lamp head module 200, the flexible circuit 510 (e.g., comprising an electrically insulated (segmented) cathode layer 511, a separator layer dielectric 512 and a dielectric spacer layer 514), is used to potentially individually direct each led of the matrix of led 330 or groups of LEDs so that the LEDs are classified by Vf, wavelength, size, power, etc., in 1-n groups, substantially reducing demands on the demands of the LED manufacturers to distribute the LED groups in only one or a few bins. According to one embodiment, the containers may be about 1 Vf or less and preferably, 05 Vf or less, or even, 01 Vf or less. Depending on the particular implementation, the LED matrix 330 LEDs could be in a single or two large Vf bins, as that single or two long strips of LEDs in the matrix are substantially in the same Vf container. Conversely, the bins could be as tight as, 00001 Vf. In this example, the segmentation of the flexible circuit layer 510 and / or the led controller PCBs 310a-b could be reduced or even eliminated. This can be achieved when very high volumes and / or very long chips are produced and there are substantial numbers of LEDs available by manufacturers in Vf that are close to, 001 Vf or less.
However, the segmentation of the led controller PCBs 310a-b and the flexible circuit 510 allows numerous options to classify by Vf values or none. In the present example, the LED matrix 330 LEDs are divided into eight individually addressable groups by placing them in eight flexible circuit segments (four of which are visible in the present view, e.g., segments 611a-d) . In one embodiment, the segments 611a-d are formed by photolithographically stamping the cathode layer 513 and deburring the metal sheet to form electrical insulation residues (e.g., the rest of the electrical insulation 610). The dielectric layer 512 in the area under the LEDs is removed by laser machining, routing or stamping.
In general, the most suitable UV LED wavelengths are in the range of about 360-420 nm, and more preferably ~ 395 nm. It should be noted that a mixture of wavelengths can be used in each UV 200 LED lamp head module and smaller groups and / or even individual LEDs or some combination of both, can be individually addressed by cable connection to an individual conductive band (not illustrated) of cathode layer 513 (layer stamped with conductive circuit material) in flexible circuit 510, the conductive band (layer of conductive circuit material) being preferably reproduced and recorded
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photolithographically with preferably a polyimide (electrically non-conductive layer, that is, dielectric layer) below it. The cathodic layer 513 is normally copper.
According to one embodiment, the separation seal 314 (e.g., a monolithic O-ring 420) fits into a groove machined or molded into the body 305. As shown in the present example, the groove shape (or gland) ) machined in the body 305 can be roughly described as an "o" with radii fitted at the corners and a part that cuts through the middle of the joint in the direction of the long axis. This design of preferably single plane joint is made possible by the design of the single lamination layer in which the recorded internal ducts of the microchannel refrigerator 410 for the refrigerant are only found in the part that lies under the led array 330 and not in the parts around the areas that fall substantially under the peripheral regions of the heat sink. This allows the lower part of the preferably monolithic microchannel refrigerator assembly to be flat and substantially parallel to the coupling part of the lamp body 305 containing the groove for the separation joint 314.
The peripheral regions of the microchannel refrigerator assembly explained above are best explained as the regions that exist substantially outside the refrigerant flow zones and / or the regions that exist under the preferable cross-sectional seal. A benefit of this design is that multiple seals or a seal with different z-axis planes are avoided. In essence, a seal configured in three dimensions (z axis in two or more planes) is not necessary, as a simple flat seal in two dimensions (z axis in a plane) will suffice. The diffusion-bonded lamination layers (eg, sheet 520) are engraved not only with thermal transfer conduits prior to diffusion bonding, but the primary input / output microchannels can also be recorded (eg primary microchannel output 411) in an embodiment of the present invention. Thus, when the sheets 520 that make up the refrigerator are connected by microchannel (410) p. 200 microns thick) with the sheets that make up the microchannel portion of the refrigerator 410 that typically have no thermal transfer conduits (e.g., solid support layer 530 and etched support layer 525), results a monolithic microchannel refrigerator assembly (including microchannel refrigerator 410) having a flat bottom side that is used to compress the single shaped seal that exists between the preferably monolithic microchannel refrigerator assembly and the preferably monolithic lamp body 305 .
A monolithic layer of diffusion-bonded heat dispersion (e.g., approximately 5 mm thick (range 1 to 1 mm)) that may encompass the upper surface of the common anode substrate 317 is not illustrated.
FIG. 7 is an exploded sectional isometric view of a top of a reflector 201 of the UV LED lamp head module 200 of FIG. 2. According to one embodiment, the reflector 201 is approximately the same length as the led array 330, preferably a few mm longer, and the reflector could include end caps 207a-b. End caps 207a-b can be fixed to reflector 201 with screws and / or magnets not illustrated.
In one embodiment, very long reflectors can be employed so that the 80 mm lamp module sections are arranged end to end even if the reflectors are monolithic and provided that all the multiple modules of the 1-n lamp are fixed from edge to edge. This fixing can be done to a common duct assembly.
It should be noted that in UV LED curing systems, including multiple lamp head modules, reflector 201 may be used in conjunction with the mini-reflectors (as will be described below) located in the area between the lamp head modules, and more specifically, in the area located between the respective ends of the led array in each border lamp head module.
In one embodiment, a field replaceable window 340 covers the outlet opening of the reflector 201. The window 340 is preferably made of a borosilicate glass with a visible UV or AR high angle coating. The window 340 can be attached to the reflector 201 by one or more magnets if the iron band (s) (e.g., window assembly 341) is (s) placed on the top of the window 340. The magnets 342 are preferably placed in the corresponding cavities 342 in the reflector 201. Of course, alternative means of fixing the window 340 to the reflector 201 can be considered, such as 90 degree angle bars in which a part wraps around and holds the glass, and a part with orthogonal grooves to the clamping surface contains screws that are located on the side of the reflector 201. In one embodiment, the window assembly 341 is embedded in the upper surface of the reflector 201 to provide alignment and location. In some embodiments, window assembly 341 can be attached to reflector 201 by screws.
In one embodiment, the serial connection of multiple UV 200 LED lamp head modules can be facilitated by including an orthogonally oriented steel pin (with respect to magnets 342) or magnets in holes 345. Alternatively, magnets or steel pins (not shown) could be placed in the mini-reflectors (not shown).
FIG. 8 is an isometric enlarged view of a reflector 201 of the UV LED lamp head module of FIG. 2 with the end cap removed. This view is intended to illustrate the modularity of reflector 201. In this example,
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they illustrate two of four screws 815 that fix the reflector 201 to the lamp body 305. By simply removing these screws 815, a new reflector with different optical properties can replace the reflector 201. In the current example, the feet molded by integral injection (p e.g., foot 816) can be used as alignment features for mini-reflectors (explained below) or end caps. Steel screws 815 could be used to orient, align and / or hold such mini-reflectors in place if, for example, the mini-reflectors contained magnets (with their magnetic fields properly oriented with respect to the screws 815).
Likewise, the fixing pins or male / female coupling characteristics that extend from the bottom of the reflectors to the refrigerator by microchannel 410 or vice versa, can be used to facilitate the alignment of the reflector 201 with respect to the led array 330. These Pins or coupling characteristics may be part of the injection molded reflector.
In one embodiment, the fixing pins, such as pin 805, could be used to align the mini-reflectors or the end cap reflectors. The screws 810 could be used to fix the reflectors of end caps to the reflector 201.
A protective housing 202 is shown which is preferably injection molded and each half can be a reflected image of the other.
FIG. 9 is an isometric view of four head modules of the UV 200 LED lamp according to an embodiment of the present invention. In one embodiment, each of the UV 200a-d LED lamp head modules can be designed such that it is mounted on a common mounting rail (not shown), associated with a client's UV curing apparatus or machine. In order to facilitate serial integration in length of the LED lamp head modules UV 200a-d (from 1 an in number), mini-reflectors (eg mini-reflectors 910a-c) are made available in order to allow the ability to obtain a practically contiguous ray pattern in the workpiece with virtually no discernible loss of irradiance in the area between each LED lamp head module UV 200a-d (eg the area under the portion of the mini-reflector 910a-c on the surface of the workpiece). Since photons can exit the LED at any angle, it is possible for a photon to cross the entire serial connection of UV LED lamp head modules before leaving the window.
The window (s) 340 may have a physical gap in its length (eg every 320 mm, assuming there are 4 modules of LED head lamp UV 200 of 80 mm). In an alternative embodiment, the windows 340 can be 80 mm long so that there are three gaps in 320 mm, and each of them could be covered by a separate mini-window (not shown). Separate mini-windows can be installed in these physical gaps and fixed using a magnetic strip (not shown) or another strip held mechanically, resulting in preventing dust or foreign materials from entering. Other manufacturers use a fluid or adhesive index adapter; however, as specified above, these materials (available from Schott, Germany and Dow, USA) may yellow or degrade. In one embodiment, one or both separate mini-windows and fluid and / or reflective index adapter adhesive can be used.
The major reflectors and mini-reflectors can be fixed between them with their own grooved rails that can be between each main reflector, and the mini-reflector would be under the rail and between the major reflectors. Larger reflectors are defined as the longest portions of the reflector halves that exist in the assembly for the purpose of being used for different purposes. The use of long assemblies for wide-format printing and coating can be considered, as well as short reflectors for applications such as adhesive components of surgical masks.
In connection with the interconnected UV LED lamp head modules, the intervening end caps are removed and mini-reflectors (e.g., 910a-c mini-reflectors) are inserted in place between the connected LED UV lamp head modules serially. The 910a-c mini-reflectors serve to create a uniform irradiance pattern in the workpiece and avoid areas that lack irradiance; otherwise, this could create a difference between maximum irradiance points in the length of the beam projected on the workpiece when UV 200 LED lamp head modules connected in series are used. This could have detrimental process effects.
In order to provide this practically uniform irradiance between LED lamps, the use of several novel methods can be considered. First, the reflective end caps between the lamps can be removed. The distance between the two led arrays can be ~ 6 mm, range 1 - 100 mm. One or more subsections of small reflectors of ~ 6 mm (eg mini-reflector 910a-c) can be placed between the two main reflectors. As described above, the 910a-c mini-reflectors can also have fixing pins, screws, tie rods and / or beams (not shown) in the perpendicular plane (towards the reflector halves on the other side) and / or parallel planes ( parallel to the reflector halves on the same side with the function of connecting them). Small tie rods (not illustrated) that are screwed into place can be strategically placed between the reflector halves in order to achieve mechanical rigidity and to load the separation gasket 314 or o-ring 420. These tie rods, in case if used, they must be of a rigid and high modulus material with the cross section minimally exposed to the emitted photons of the LEDs. This would minimize any impact.
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that they can have the bars of union in the projected ray and their uniformity of irradiance in the work piece, since the ideal would be to avoid interrupting or blocking the trajectory of the emitted photons as far as possible. The reflectors (reflector 201) would preferably be two separate halves fixed to the microcooler assembly with their polished portions and curves placed in front of each other, and may have fixing pins and it may be easy to exchange reflectors with screw fasteners (e.g. 815), so that different reflectors with optical properties can be easily exchanged between lamp assemblies. Alternatively, the 910a-c mini-reflectors may have no screws (no clamping) and the magnetic cylinders can be used to match the 910a-c mini-reflectors to the main reflectors 200a-d. Additionally, a magnetic bar (eg window mount 341) (eg laser cut steel) that holds the window in place may have fixing pins (not shown) that can be molded on the top surface of the reflector and pass through holes in the window mount 341 and serve to locate the outlet portions of all reflectors in a straight line almost adjacent. FIG. 7 shows that the window mount 341 is embedded in the upper surface of the reflector 201 to provide additional alignment and location. The mini-reflectors can be fixed to the lamp body 305 by screws.
In relation to FIGS. 10A-C, an alternative embodiment of a led array package (eg a led array 1015 paired with a flexible circuit (not shown) and a heat dissipation layer 1030) is described below. This alternative embodiment has the objective of illustrating, among others, the fixing / clamping function of the cathode clamps 320a-d and 321a-d can be achieved with connectors with different geometries. In the present example, the cathodic bodies, the cathode body 1010 and the monolithic anodic lamp body 1020 are fixing / securing the heat dissipation layer 1030 and the flexible circuit layer 1040 with one another. Additionally, holes may be formed, e.g. ex. 1050 holes, n these layers to allow the passage of 1051 anodic and cathodic cables or conductive screws with or without a dielectric sheath.
In one embodiment, the high current density UV LEDs (SemiLEDs, USA) massively in parallel (eg virtually all LED matrix LEDs are electrically placed in parallel) can be mounted directly on a plate 1030 common copper anodic. Individual LEDs or groups of LEDs can be approached with flexible circuit (which helps in manufacturing flexibility in terms of binning requirements of Vf, power, wavelength, etc.). A matrix of LEDs with a high aspect ratio (with a length longer than its width in such a way as to allow a narrow and concentrated output beam), a high filling factor matrix (which allows the brightness to be preserved), modular macroreflectors (which they control a much higher percentage of photons than microreflectors and that allow user flexibility for dose applications at greater working distances, energy densities and depth of field). In one embodiment, a rectangular two-sided shape as opposed to the elliptical reflector (in which the central portion is wider than the inlet and outlet openings) allows a very slightly focused beam.
The anodic substrate 1030 is screwed to a replaceable lamp body 1020 that has at least one liquid flow channel (eg channels 1045) that has a high heat transfer coefficient for low thermal resistance (this allows LEDs they are operated in high currents in a matrix of high filling factor Additionally, the anodic plate 1030 (support) is fixed in the lamp body (a segment of the lower heat sink that can be machined or injection molded) in disposition of "clam" (thus allowing a simple sealing method when compressing the formed o-ring (eg o-rings 420a-c) (Apple Rubber Products, USA) and low thermal resistance, since the liquid refrigerant can have intimate contact with the 1030 anodic plate.
The individual cathodic bodies (cathode body 1010) are screwed by means of the anode substrate 1030, making electrical contact with the cathode flexible circuit 1040 and at the same time keeping the anode 1030 firmly attached to the lamp body 1020 and / or the anodic body (in effect , the anodic plate 1030 with the cathode flexible circuit 1040 would be "fixed" between the lower anodic body 1030 and the upper cathodic body 1010; the lower anodic body 1030 is in fact the anodic substrate 1030 of the led controller plates (not shown) ).
In one embodiment, a Kapton (dielectric) spacer layer between the reflector 1011 and the cathode flexible circuit sheet 1040 allows the wires (not shown) that connect the LEDs to the cathode sheet 1040 to bend and "clear" the long edge ( in the form of a rectangle) of the reflector.It also electrically insulates the reflector if the reflector must be made of aluminum or must have a metallic layer such as silver, the groups of LEDs receive their power from their own controller chips, such as LM 3433 ( National Semiconductor, USA), which are part of the DC / DC power supplies (thus allowing control of the groups with varying power, mostly due to a variable Vf bin) In some embodiments, the use of Power supplies that go directly from AC to DC output in the 4-5V range.
In one embodiment, an insignificant number of LEDs are connected in series (so that a single malfunctioning LED would not cause an entire string to stop working and the use of electrically inefficient load-balancing resistors would no longer be necessary). The bottom of the anodic plate 1030 has channels 1045 chemically etched for the flow of the refrigerant (thus allowing a lower thermal resistance) and includes a lead-free component (tin solder) on the back side (bottom) of the chip, thus allowing a simple and highly reliable vapor phase reflux (in order to ensure that the large number of LEDs are connected with
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uniform form to the anodic plate 1030).
In one embodiment, the vapor phase reflux process involves the use of a steam phase oven. In one embodiment, an adherent flow (Tack-Flux 7, available from Indium Corporation, USA) is used to adhere the led array LEDs in place before placing the microchannel refrigerator assembly in the phase oven steam. A steam phase furnace uses an inert liquid that, when heated, creates a uniform and very stable means of heat transfer in the form of steam. This medium replaces thermal energy very quickly and transfers heat to the refrigerator assembly by microchannel by condensing this heated steam. The maximum temperature reached by the microchannel refrigerator assembly is linked to the boiling point of the inert liquid. The boiling point must be higher than the melting temperature of the weld. A very isothermal temperature is reached throughout the microchannel refrigerator assembly, thus creating one of the most repeatable and most reliable welding reflux processes known.
Molded polymer screws can fix the anodic bodies 1010 to the anodic substrate 1030 through holes in the anodic plate 1030 / flexible circuit assembly 1040 (thus eliminating any concern that there is a short circuit due to its polymeric character; they are also low cost due to the molding technique), a very flexible 1011 ultra-high wire number cable (CableCo, USA) can be used to carry the current to the LEDs (thus reducing resistivity and tension). A very flexible refrigerant tube can be placed in the holes of the lamp body 1020 (lower heat sink) at the opposite ends of the lamp (thus allowing a longitudinal flow of the refrigerant, a compact assembly and low voltage connections).
FIG. 10B illustrates the alternative led array package of FIG. 10A with a macroreflector 1001 according to an embodiment of the present invention. In this view, a cathode body 1010 would be removed to show a cathode cable 1011 leaving the assembly to contact the cathodic body removed (not shown).
FIG. 10C is an isometric view illustrating the underside of the heat dissipation layer 1030 of FIG. 10A and 10B. This view illustrates the removed cathode body 1010 and the microchannels 1045 engraved on the lower surface of the heat dissipation layer 1030 to facilitate heat transfer by means of the heat dissipation layer 1030 by affecting the flow of the cooling flow by turbulence. of the cooling fluid.
With reference to FIG. 10D, an alternative embodiment of a UV led lamp head module 1099 is now described. This alternative embodiment is provided to illustrate, inter alia, an alternative configuration of a microchannel engraved sheet chiller 1098, heat dispersion layer 1090 (approximately 5 mm thick), anode busbars 1091a-b, cathode busbars (eg cathode busbar 1094), deep and long primary channels of coolant inlet and outlet 1093a-b in the body of lamp 1095 and a single plane separation joint 1097. In this example, more than integrated LED controllers, cables (eg cable 1092) are provided to individually direct the LED array LEDs 1096. In alternative embodiments , the cables could be replaced with a flexible circuit (not shown) to direct the individual groups of LEDs.
Regarding FIGS. 10E-G, another alternative embodiment of a UV 1000 LED lamp head module is now described. In accordance with the present example, a "t" shaped microchannel refrigerator assembly (1068 and 1067) is shown, supported by areas of optional outer laminating sheets 1075 and 1076. In one embodiment, the microchannel refrigerator 1068, the heat dissipation layer 1067 and the outer laminating sheet areas 1075 and 1076, form a monolithic refrigerator assembly by replaceable microchannel.
In accordance with the present example, a copper anode substrate (which could be considered as a thick lamination sheet) is provided by the "t" shaped microchannel assembly 1067 and 1068, which is connected by diffusion to the side sheets (flat) of copper / alumina with 1090 engraved microchannels to create a monolithic part of high thermal conductivity.
In this example, the upper part of the "t" is the heat dispersion layer 1067 and the vertical part of the "t" are the stacks of sheets 1068 with recorded channels. The two parts of the "t" are preferably joined by diffusion after, or possibly together with, the joining of the lamination layers 1070. In this example, a multiplan seal (similar to the single plane seal provided by the joints may be necessary) O-rings 420a-c) with a section under the lamination layers (near the previously mentioned O-rings) that prevents the bypass from being in a different plane like the peripheral regions around the bottom of the heat dispersion plate that prevents the flow of liquid to the surrounding outside environment. A pairing lamp body could be built to accommodate these features and construction. A difficulty may arise to avoid the derivation of fluid around the ends of the vertical part "t" composed of the diffusion joint layers and the lamp body 1062 which may contain a main coolant inlet channel 1063 and a main channel of refrigerant outlet 1064. In other words, the fluid could potentially, without other sealing means in this region, flow from one channel 1063 to another 1064 without passing through the microchannels 1090. This could be prevented by having the seal vertically in the part end of stacking the sheets, or perhaps it could be considered glue or solder. The vertical stacking of sheets could be joined by diffusion, welded, bonded or welded with soft solder to the bottom of the heat dispersion layer as well. There could be a layer
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intermediate between the lamp body 1062 and the heat dispersion layer 1067 that runs along the periphery of the area between the lamp body 1062 and the heat dispersion layer 1067 whose height of the z axis is substantially the same height as the vertical part "t" composed of stacked layers of recorded lamination microchannel 1068.
In this example, the main coolant inlet channel 1063 and the main coolant outlet channel 1064 are parallel to the long axis length with high aspect ratio of the led array 1071 (which is attached to the anode substrate of copper with an optional intermediate layer of heat dispersion 1067). In one embodiment, the refrigerant inlet and outlet tubes 1080 are positioned at opposite ends of the parallel but opposite main channels 1063 and 1064, thus creating a manifold arrangement where the microchannels 1090 have a substantially uniform refrigerant flow.
1061a-b monolithic anodic bodies are attached to the lamp body 1062 with polymeric pins that hold the cathode busbars 1060a-ba the anodic bodies 1061a-b with the flexible circuit cathode sheet attached to the anodic substrate (1068 and 1067) clamped between . This clamp also comprises the O-ring 1069 and prevents the derivation of refrigerant, as well as the leakage of refrigerant to the external environment.
The monolithic anodic bodies 1061 ab directly oppose each other and are connected, and in thermal communication, to the sides of the lamp body 1062, parallel to the main input and output channels 1063 and 1064, and perpendicular to, and in electrical communication with the anodic copper substrate 1068 and 1067, which is itself clamped between the anodic bodies 1061 ab and the cathode busbars 1060a-b by polymeric bolts. This configuration provides an extremely low thermal resistance and its inherent isothermal nature, they combine to allow practical means to operate a matrix of LED led of high form factor, high density, high power and high brightness in a practical way.
The heat dispersion substrate 1067 could itself be considered a lamination layer. The heat dispersion could be allowed to take place simply at the distances between the layers and / or between the recorded channels. It should be noted that the vertical orientation of the layers may provide a lower thermal resistance, but it has an easy assembly and functionality of the equipment. The scribbles, curves, or "seagull wings" in the channels and in, or with the interconnecting channels, can be advantageously considered, such as recorded bumps or variable widths and depths of the channels for the purpose of generating turbulence. or compression of the bonding layer. It is preferable that the substrate (also known as a heat disperser, if one is actually needed) finds a balance between the thermal energy dispersion, without being so thick that it substantially adds thermal resistance between the LED junctions and the refrigerant flow. Likewise, it should not be so thin since it must be mechanically flexed by the internal pressure or turbulence of the flowing refrigerant, therefore, it is reasonable to make the substrate from about 125 um to 250 um thick, range of 10-1000 um , and have about 8-16 layers of lamination, range 1-100 that are between 2550 um thick, range 1-500 um and have a channel engraving depth of around 12.5-25 um, range 1 -500 um, and center to center of around 30-60 um range 1-1000 um, and finally, a channel length of around 4000-4300 um, range 1-100000. The refrigerators can be plated internally or externally in order to avoid erosion, bio-fouling, corrosion and / or reduction of electrical impedance. The internal lining should generally be avoided since it can peel and have a detrimental impact on the life of the refrigerator. The lamination layers could be made of a material such as nickel that is more resistant to erosion and / or could be coated with a ceramic or metal in a conformal coating process such as ALD, preferably after diffusion bonding. . It should be noted that it is very common to pre-coat the layers with nickel before diffusion bonding. A micron or submicron range filter can be used both upstream and downstream or both from the refrigerator, and a GUV C deep light source, such as a lamp or LED, could be used to reduce bioincrustation. Preferably, a 1-15 micron filter of 3M, EE. UU. and / or membrane contractors of Membrana, USA. UU. which are very effective in removing carbon dioxide, which can have a detrimental effect on the pH of the coolant and can increase corrosion.
FIG. 11A conceptually illustrates a cross section of the two macroreflectors 1110a-b and 1120a-b superimposed on top of each other in accordance with an embodiment of the present invention. In this example, the 1110a-b and 1120a-b macroreflectors have substantially the same weight and width, but are optimized for different working distances. Having a unique deep reflector length and then having different internal curved surfaces for different foci is efficient from a manufacturing point of view since only a single outer mold is necessary and different curves are simply different molding inserts.
In the present example, the macroreflector 1110-b is optimized for a focal plane 1140 of 53 mm and the macroreflector 1120a-b is optimized for a focal plane 1130 of 2 mm. Each curved part illustrated is a mirror image of the other (assuming they have the same focal length) and represent a part of a complete ellipse, parabola and / or combination of the two. A parable is a special case of an ellipse and would generally be used for collimated light.
An ellipse has two foci, a primary focus and a secondary focus. In the current example, the primary focus is in the plane of the led 1170 and the secondary focus is in the plane of the workpiece 1130 or 1140.
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In several embodiments of the present invention, the marginal ray 1111 (representing the first ray captured by the reflector 1110a) and the last ray (not illustrated) captured by the reflector 1110a and leaving a led array define an angular aperture 1150 from approximately 60 to 89 degrees and preferably 80 to 85 degrees, thus exemplifying (using a simple two-dimensional analysis) that the 1110a-b 53 mm macroreflector controls more than approximately 80% of the photons leaving the led array. In reality, a 3-dimensional computer analysis suggests that such reflector depth design (when the end caps (e.g., end caps 207a-b) are in place) controls more than 90% of the photons that leave the led array. The greater the angular aperture, the greater control over the photons that leave the LEDs. Therefore, the angular aperture can be increased, but practical considerations need to be taken into account for reflector sizes (lengths and widths).
With reference to FIG. 11B, it can be seen that the marginal rays 1121 ab (representing the first ray captured by the reflector 1120a and the last ray captured by the reflector 1120a, respectively) leaving the LEDs 1150a and 1150b and reflected in the reflector 1120a, define an aperture 1160 angle of approximately 65 to 89 degrees and preferably between 82 and 87 degrees, thus exemplifying (using a simple two-dimensional analysis) that the 2mm 1120a-b macroreflectors control more than 82% of the photons leaving the matrix of LED according to an embodiment of the present invention. In reality, a 3-dimensional computer analysis suggests that such reflector depth design (when end caps (e.g., end caps 207a-b) are in place) controls more than 96% of photons that leave the led array.
FIG. 12 shows a portion of the macroreflector 1210 optimized for a focal plane 1240 of 2 mm in which each side of the reflector has a focal point 1220 that is outside the central axis 1231 of a focused beam 1230 (having a total pattern width of approximately 7 mm and a central part of high irradiance of approximately 65 cm) in a workpiece (not illustrated) according to an embodiment of the present invention. As illustrated in the drawings, in such a configuration, the rays of light reflected from the right side of the reflector move from the left of the central axis 1231 inward towards the center and the rays of light reflected from the left side of the reflector are they move from the right of the central axis 1231 inwards towards the center. In this way, the two sets of reflected light rays overlap to create the 1230 high irradiance beam. Computer modeling indicates about 10% more irradiance level than if the two sets of reflected light rays are not overlap. In particular, in one embodiment, at distances of longer focal planes (e.g., ~ 53 mm), there is no significant loss (less than 5%) of irradiance in planes of +/- 3mm from the focal point.
FIG. 13. is a graph illustrating an estimated convective thermal resistance for several channel widths. This figure graphically illustrates the linear decrease in thermal resistance with the decrease in width of the individual microchannels. It is noteworthy that the embodiments of the present invention typically employ channels that have widths of less than, 1 mm and often, 05, 025 mm or less. This contrasts with the width of the channels used in the prior art of UV led lamp devices, such as those manufactured by Phoeseon (USA) and Integration Technology (United Kingdom), which are thought to employ macrochannels of the order of 5 mm or greater. Meanwhile, the UV led lamp devices of this prior art also suffer from high contact resistance at the point where the led array is attached to separate refrigerators. They also suffer from the high gross thermal resistance of the substrate to which the led matrix is attached.
As can be seen in the graph, everything else being equal, the decrease in the order of magnitude of the thermal resistance of a channel of 55 mm to a channel of 025 mm would in itself result in a decrease of the order of magnitude in The junction temperature of led. However, everything else is not the same. As currently understood by the inventors, the prior art has only one thermal factor that works in its favor. This factor is the use of a matrix of low brightness, little filling factor (led packing density), which disperses heat sources and results in a low thermal density, which consequently requires a more heat transfer coefficient low for the same junction temperature.
However, counteracting the prior art UV LED curing systems, there is the fact that they typically employ a series / parallel LED array that results in the need for a thermally resistive dielectric layer between the chip binding pad and the substrate It should be noted that even if a dielectric of high thermal conductivity (expensive) such as DOC was used, there would still be an additional contact resistance at both interfaces, which often exceeds the gross thermal resistance of the dielectric. Second, Phoseon uses a silicon substrate that has less than half the thermal conductivity than copper. As far as we know, Phoseon then also bonds this silicon substrate to a heat exchanger creating even more thermal resistance. In reality, all these thermal resistances accumulate to a point where even if a microchannel refrigerator was used in that medium, the benefits of the low thermal resistance of the microchannel refrigerator would be seriously compromised. As regards Integration Technology (whose LED matrices are currently produced by Enfis Group PLC, United Kingdom), its technology does not at least use the silicon substrate, perhaps an AIN substrate (in English, Aluminum Nitride, aluminum nitride) (about half of the thermal conductivity of copper) or they can use a thick copper substrate (eg, approximately 1 mm). A
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DLC dielectric layer could have a very small but quantifiable benefit since the DLC has high gross thermal conductivity, but the layer is so thin and the contact resistances are so large as to crush the benefits gained by the high gross thermal conductivity of the DLC Therefore, the UV LED systems of the prior art suffer significant high resistance compared to the embodiments of the present invention in which problems of bonding pads, debris, or degradation of dielectric thermal resistance are not created, because no binding pad, rest or dielectric pad is used between the led (or LEDs) (e.g., led 531) and the substrate (e.g., common anode substrate 317) not required due to the electrical arrangement of the led purely parallel. Additionally, the embodiments of the present invention minimize the loss of gross thermal resistance through the copper substrate due to the minimum thickness (often around 125 um (range 5-5000 um)) between the lower surface of the LEDs and Heat transfer ducts (microchannels), there is no extra interfacial resistance from the layers of joint pads. The higher voltage of the LEDs can lead to certain AC / DC conversion efficiencies and reductions in cable resistance (for a given cable diameter).
FIG. 14 is a graph illustrating the power output for various junction temperatures. This figure shows a severe drop in the efficiency of the UV LED with an increasing junction temperature. A drop of inefficiency of 40% is observed with an increase in the junction temperature of 20 to 88 degrees Celsius. UV LEDs are much more sensitive to heat than some blue and green LEDs with longer wavelengths. Therefore, it is desirable to use superior thermal management in order to keep the junction temperatures low to achieve both long life and maintain reasonable efficiency.
In accordance with embodiments of the present invention, the LED junction temperatures of approximately 40-45 degrees Celsius are obtained, even when operating at current densities of more than 2.5 A / mm2 and sometimes more than 3A / mm2. This can be counteracted with the heads of UV LED lamps of Phoseon and Integration Technology that probably operate at current densities of less than 1.5A / mm2, with the LEDs much more spaced (low fill factor / low packing), which Of course it leads to lower peak irradiance and lower total energy delivered to the work piece.
FIG. 15 is a graph illustrating a dynamic resistance against a direct current curve for a typical led in a typical heatsink. It should be noted how the dynamic resistance approaches an asymptote as the current approaches 1500 mA. This illustrates several factors, including the detrimental impact of a temperature difference between any of the two LEDs in an electrically parallel array. Since a negative temperature coefficient of electrical resistance is inherent in LEDs, the graph shows that only a small change in resistance (dynamics) can have a great effect on current. Therefore, it is convenient to create a substantially isothermal substrate on which the LEDs can be mounted. For example, the LEDs can be mounted on a substrate that has low thermal resistance (in addition to being mounted with a direct welding technique with low thermal resistance), high thermal conductivity, high heat transfer coefficient (10000-35000 Wm2K), and high thermal diffusivity (thermal conductivity divided by thermal capacity) in order to create an almost isothermal condition between substantially all led junctions in parallel.
A microchannel refrigerator with short thermal diffusion lengths (e.g., approximately 125 microns) between the LED (or LEDs) and the refrigerant channels (heat transfer channels) ideally fulfills this condition. Thermal diffusivity is a measure of the index at which a temperature disturbance at one point travels to another point. By means of an analogy, by rapidly diffusing a temperature increase that exists in a LED and quickly transferring this energy to its surroundings, all LEDs are kept in an essentially isothermal state. In reality, "essentially" is a relative term, since the upstream of the LEDs (near where the refrigerant enters the lamp body, as well as the closest where the refrigerant enters the heat transfer channels) It can be of a certain small to infinitely small temperature as a result of the microchannel design of the refrigerator used. In one embodiment, the microchannel cooler heat transfer channels are designed so that the ducts are in parallel thermal (e.g., there is no essential temperature difference between the LEDs as the refrigerant flows low (e.g. , 2 rows of) LEDs in parallel), not in series. Thus, there is less chance of a temperature difference.
However, as long as there is a difference of Vf and output power in a bin of LEDs, those differences can be resolved with a single element of embodiments of the present invention as long as the entire upstream bank (row) and each segment of the Upstream row can be tackled individually. Therefore, LEDs with previously tested upper / lower Vf (impedance) and / or higher / lower output power can be strategically located near the upper / lower temperature output / input areas of the refrigerant (whether primary inputs / outputs 360 and 316 of the internal coolant or microchannels). Additionally, LEDs with variable operational characteristics may be used, including, among others, Vf, wavelength, optical power, etc.
According to one embodiment, the 310 led controller PCB does not operate with dynamic resistance or voltage, but current. The current mode operation measures the current and, by means of resistors (eg small of 0.005 ohms), amplifies, measures and uses this current information for the control loop. The current wave is designed to have a maximum (eg 10%) of full load, or 0.3A if operated at 3A per LED. This wave
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maximum would be in the worst case, since it does not include the output capacitors that would reduce the wave.
The dynamic resistance is simply Vf / If. For example, if the Vf is 4.5 V at 3 A, it is 1.5 ohms per led. Since the resistors are divided in parallel, one can divide 1.5 ohms by (eg 17 LEDs) to achieve dynamic resistance (eg 88 milliohms) by 51 A for the entire controller. In one embodiment, and as described below, each segment has its own controller IC (s), each controller segment can control precise currents even in a short circuit, so we could cause a short circuit. output, controlling 51 A and the short circuit voltage would be zero. The controller does not differentiate between the output voltages, it only maintains the current in which it is fixed. If it opens, the output would go to the input voltage of (eg 12 V). If there were a short circuit, it would reach a level very close to zero volts. The LEDs are at a point between the range of approximately (eg 4-4.5 V). The K factor is the change in Vf divided by the change in the junction temperature of a led. K factors can be taken into account in relation to designing LED UV lamp head modules. Smaller K factors indicate a lower thermal resistance package.
With respect to individual LEDs, the exceptionally low thermal resistance with the range of approximately, 05 K-cm2 / W a, 01 K-cm2 / W and preferably approximately, 020 K-cm2 / W or less may help; However, using binning is still useful. An individual LED with a lower natural dynamic resistance will attract more current / heat than its neighboring components; If it heats up more, its resistance will be reduced and there would be overflow (runaway reaction), so the cycle would continue until the LED burns (opening). The low thermal resistance keeps all thermally monolithic (isothermal) LEDs and this keeps the delta of dynamic resistance at a low level and dramatically reduces the possibility of runaway. With a sufficiently low thermal resistance (e.g. in the range of approximately, 05 K-cm2 / W a, 005 K-cm2 / W), each of the parallel and closely located groups in bin could be considered as a single unity. The more airtight the Vf binning (e.g., 01;, 001;, 0001 V), the less likely it is that any given LED within a bin will work with a sufficiently high output power (due to its consumption of disproportionate current) as to reduce its useful life compared to the other LEDs in the same bin.
The asymptotic quality of dynamic resistance is the same as the asymptote of Vf. The more intense the control on the led bank, the less voltage change will be required exponentially to affect the drive current. In LEDs controlled by a voltage mode controller, when the Vf is reduced due to temperature, there would be an exponential change in current and a runaway could result if the voltage was not reversed. However, since the led controller PCBs 310 are constant current mode controllers in various embodiments of the present invention, the voltage (and therefore the resistance) is irrelevant.
FIG. 16 is a graph illustrating an irradiance profile for a UV LED lamp head module with a reflector optimized for a 2 mm focal plane according to an embodiment of the present invention. In accordance with the present example, a maximum irradiance (peak) of approximately 84.8 W / cm2 is achieved with an output beam pattern width of approximately 65 cm and producing an average irradiance along the pattern width of output beam of approximately 31.6 W / cm2 and total output power of approximately 20.5 W per cm of length of the output beam pattern. This example has been generated with a computer model assuming the use of SemiLEDS LEDs of - 1.07 x 1.07 mm, with each LED producing an output of 300mW at 350mA. It should be noted that embodiments of the present invention could execute each LED at higher currents (eg, approximately 2.5 A) approximately between 75W and 1.25 W.
FIG. 17 is a graph illustrating an irradiance profile for a UV LED lamp head module with a reflector optimized for a 53 mm focal plane according to an embodiment of the present invention. In accordance with the present example, a maximum irradiance (peak) of approximately 24 W / cm2 is achieved with an output beam pattern width of approximately 3.65 cm and producing an average irradiance along the width of the pattern of output beam of approximately 5.9 W / cm2 and total output power of approximately 21.7 W per cm of length of the output beam pattern. This example has been generated with a computer model assuming the use of SemiLEDS LEDs of - 1.07 x 1.07 mm, with each LED producing an output of 300mW at 350mA. It should be noted that embodiments of the present invention could execute each LED at higher currents (eg, approximately 2.5 A) approximately between 75 W and 1.25 W.
According to an embodiment in which the LED drivers are integrated in the UV LED lamp head module, AC / DC power supplies designed for high volume "server networks" can be used. Exemplary front supplies are the CAR2512FP and 2500W series electrical supplies available from Lineage Power, USA. u. An example of a preferable supply is Power-One LPS100 12V 1100W single-fan servers that are platinum and highly efficient certified AC / DC certified power supplies, in parallel electrical and with GUI i2C interface; Lineage supplies are available with a subsystem incorporating four of these ready-to-use units. In 2011, these Lineage units will be similar, but with conduction cooling (without fans). In accordance with embodiments of the present invention, in addition to cooling the integrated controllers, the cooling water can also be used advantageously to cool these power supplies simply by passing the refrigerant line in a heat sink communicated with the elements (or the base plate) of the Supply that needs to cool down. It is the wavelength, optical in order to degrade these Lineage supplies since they work more efficiently in a portion of their maximum power.
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Using a non-limiting example, operating each PCB with ~ 15 controllers at ~ 40 amps and ~ 4-5 volts would use approximately 60% of the available -10000 W. It is the wavelength, optical in order to design for -50A or more and -5.5V to have some more margin for future uses when it is preferable to operate the preferably -16 LEDs that are approximately -1000-1200 um in square (in each of the four lateral ones; although they can be of any size and shape as in a rectangle or with a larger size such as -2000 um or -4000 um or more per side) in a current of -3A per led or -48 per group only by a non-limiting example. In one embodiment, the cathode bodies 313a-b on each PCB 310a-b near the rear side of the lamp body 305 can almost completely cross the long circuit of preferably -300 mm (not shown), as well as the welding pads running almost the whole PCB In one embodiment, the transverse plate 375 represents a tie bar fixed in the cathode bodies 313a-b, thus offering an effective fixing point for the preferably single main cathode cable 205 which runs from the UV LED lamp head module 200 to AC / DC power supplies preferably more or less similar to the preferably unique and main AWG (US wire gauge) -1-10 major range and the preferably -2 AWG anodic core cable that runs from the DC PCB circuits of preferably constant current of the UV 200 LED lamp head module to the supplies preferably connected to the AC network to provide a highly efficient power supply to low wave LEDs, preferably less than 10%, to maximize the life of the LED . There may be some common components in the PCBs of the above-mentioned non-limiting example of -15 constant current controllers so that there is no definitive requirement for -15 separate components that there is no need to isolate their cathodes. Importantly, cathode and anodic 1-n cables can supply electric power to the lamp from power supplies or 1-n networks. It may be preferable to use four Lineage EE power supplies. UU. 2500 W per lamp and run them with reduced energy for greater efficiency. They are available with a common rear end for -4 power supplies. With or without that rear end, four anodic and cathode cables / wires separated by lamp can be used to allow the use of smaller diameter cables (Methode / CableCo, USA) and / or larger and smaller cables Resistive losses
In view of the foregoing, it can be seen that the embodiments of the present invention are based on matrix / matrices of sparsely spaced LEDs, also known as matrices of high fill factor, in order to obtain the maximum possible brightness. In other words, the optical power is maximized per unit area per solid angle, since the brightness can be broadly defined as the unit area per solid angle. This high brightness is also almost linearly correlated with the thermal / heat flux demand, since the residual heat from the conversion of electrical to optical power becomes denser as the matrix density increases. The embodiments of the present invention preferably use a matrix of LED fill factor of 90% or higher, but have a range of 30-100%. The application of a matrix with high fill factor, according to the embodiments of the present invention, leads to an extremely high and dense thermal load in the order of 1000 W / cm2 or more, range of 10-10,000 W / cm2. This high thermal flux is an artifact of high brightness, e.g. ex. the LEDs are very close (proximity of 1-1000 pm, operated in currents of 2-3 or more amps per square mm, (range of 0.1 to 100 A), resulting in extremely high thermal flux demands and naturally in turn, it would require extremely low thermal resistance refrigeration technology that combines a very high degree of cooling (eg convective cooling and / or conductive cooling (eg high and thin conductivity layers between the LED and gas or flowing liquid)) in order to reach junction temperatures that are preferably at levels as low as 40 degrees Celsius or less for long life and effective operation with extremely high output power.
Although embodiments of the present invention have been illustrated and described, it will be apparent that the invention is not limited solely to them. Numerous modifications, changes, variations, substitutions and equivalents will be apparent to those skilled in the art, without departing from the scope of the invention, as set forth in the claims.

权利要求:
Claims (16)
[1]
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1. A lamp head module comprising:
An optical macroreflector includes a window that has an outer surface;
a matrix of light emitting diodes (LEDs) positioned in the optical reflector, the matrix has a high fill factor while the LEDs exceed 50% of the matrix area and a high aspect ratio of width to length in the range from 1: 2 to 1: 1000 and operational to provide a high irradiance output beam pattern, with a maximum irradiance greater than 25W / cm2 on a workpiece surface at least 1 mm away from the outer surface of the optical reflector window; Y
an operable microchannel refrigerator assembly to maintain a substantially isothermal state between the pn junctions of the LEDs in the matrix at a temperature of less than or equal to 80 ° Celsius, the microchannel refrigerator assembly also provides a common anode substrate for the matrix, where a thermally efficient electrical connection is formed between the matrix and the common anode substrate by mounting the matrix in the microchannel refrigerator assembly;
where the optical macroreflector comprises a right half and a left half, each of which represents a part of an ellipse, each ellipse has two foci, where the two foci of the right half have corresponding focal points that are displaced to the left of the central axis of the planned output beam and the two foci in the left half have corresponding focal points that are offset to the right of the central axis.
[2]
2. The lamp head module of claim 1 wherein the die is mounted directly on the microchannel refrigerator assembly.
[3]
3. The lamp head module of claim 1, wherein the microchannel cooling assembly maintains a substantially isothermal state between the p-n junctions at a temperature substantially less than or equal to 45 ° Celsius.
[4]
4. The lamp head module of claim 1, wherein the LEDs are electrically connected in parallel.
[5]
5. The lamp head module of claim 4, wherein at least one of the LEDs, is an ultraviolet emission led.
[6]
6. The lamp head module of claim 5, wherein a width-to-length aspect ratio of the die is substantially between about 1: 2 to 1: 100.
[7]
7. The lamp head module of claim 6, wherein an aspect ratio is approximately 1:68.
[8]
8. The lamp head module of claim 5, wherein the irradiance peak may be greater than or equal to 100 W / cm2 and the surface of the workpiece is at least 2 mm from the outer surface of the window of the optical reflector
[9]
9. The lamp head module of claim 1, wherein there is no significant number of LEDs connected in series.
[10]
10. The lamp head module of claim 1, wherein the coolant that passes through the refrigerator through a microchannel through and below the die is configured to go in a direction substantially parallel to the smallest dimension of the die.
[11]
11. The lamp head module of claim 10, wherein the flow of refrigerant flowing through the microchannels of the refrigerator through the microchannel is substantially balanced.
[12]
12. The lamp head module of claim 1, further comprising a flexible circuit, connected to the microchannel cooler, the flexible circuit being operable to individually direct the LEDs or groups of LEDs.
[13]
13. The lamp head module of claim 1, wherein, the microchannel cooler is pinched between one or more cathode connectors and one or more anode carrying bodies to facilitate replacement in factories.
[14]
14. The lamp head module of claim 1 further comprises:
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a flexible circuit, which includes an anode layer with patterns, to independently address a plurality of one or more matrix LEDs;
a thermally conductive lamp body having thin outer walls The lamp head module of claim 1 further comprises:
integrated LED drivers; a thermally conductive body; Y
where the led controllers comprise a plurality of metal core printed circuit boards (MCPCB) mounted to opposite sides of the thermally conductive body and where the plurality of MCPCB are cooled by conduction through the thermally conductive body.
[16]
16. The lamp head module of claim 1, wherein the optical macroreflector is field replaceable.
[17]
17. A "UV" ultraviolet "led" light emitting diode curing system comprising:
a plurality of UV led lamp head modules connected in series end to end, each including:
an optical macroreflector that includes a window that has an outer surface;
a led matrix located in the optical reflector, the matrix having a high fill factor where the LEDs exceed 50% of the matrix area and a high aspect ratio of width to length in the range of 1: 2 to 1 : 100, and operable to provide a substantially uniform high beam output beam pattern having an irradiance greater than 25 W / cm2 on a workpiece surface of at least 1 mm from the outer surface of the window of the optical reflector; Y
a microchannel refrigerator assembly that can be used to maintain a substantially isothermal state between the pn junctions of the LEDs in the led array at a temperature of less than or equal to 80 ° centigrade, the microchannel refrigerator assembly also provides a common anode substrate for the matrix, where a thermally efficient electrical connection is formed between the matrix and the common anode substrate by mounting the matrix in the microchannel refrigerator assembly;
where the optical macroreflector comprises a right half and a left half, each of which represents a part of an ellipse, each ellipse has two foci, where the two foci of the right half have corresponding focal points that are displaced to the left of the central axis of the planned output beam and the two foci in the left half have corresponding focal points that are offset to the right of the central axis.

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JP3203785U|2016-04-14|Fluid-cooled lamp

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KR20160010352A|2016-01-27|Light irradiation apparatus

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TW201736775A|2017-10-16|Heat radiating apparatus and light illuminating apparatus with the same

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TW201409761A|2014-03-01|Micro-channel-cooled high heat load light emitting device

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KR102097708B1|2020-04-06|Heat radiating apparatus and light illuminating apparatus with the same

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JP2021051156A|2021-04-01|Irradiation unit and liquid crystal panel manufacturing device

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TWI358180B|2012-02-11|Heat sink array device of high power laser diode

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CN114096795A|2022-02-25|Heat transfer system and electrical or optical component

同族专利:

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公开号 | 公开日

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EP2529156B9|2018-07-04|

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JP2013522812A|2013-06-13|

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EP2610014B1|2018-01-03|

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US20130187063A1|2013-07-25|

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CN102906497B|2016-08-17|

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TW201235604A|2012-09-01|

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CN104613441B|2018-04-27|

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EP2610014A2|2013-07-03|

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JP5820397B2|2015-11-24|

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ES2671912T3|2018-06-11|

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WO2011094293A1|2011-08-04|

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HK1211682A1|2016-05-27|

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EP2529156A4|2014-08-20|

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CN102906497A|2013-01-30|

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EP2610014A3|2014-08-20|

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CN104613441A|2015-05-13|

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US20110204261A1|2011-08-25|

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EP2529156A1|2012-12-05|

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US8378322B2|2013-02-19|

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TWI557379B|2016-11-11|

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EP2529156B1|2018-03-07|

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US8723146B2|2014-05-13|

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法律状态:

优先权:

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申请号 | 申请日 | 专利标题

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US33697910P| true| 2010-01-27|2010-01-27|

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US336979P|2010-01-27|

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US34159410P| true| 2010-04-01|2010-04-01|

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US341594P|2010-04-01|

---

US45642610P| true| 2010-11-05|2010-11-05|

---

US456426P|2010-11-05|

---

PCT/US2011/022551|WO2011094293A1|2010-01-27|2011-01-26|Micro-channel-cooled high heat load light emitting device|

---