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    • 专利摘要:
    PILE OF INK JET PIEZELETRIC PILLS AND PIEZELETIC PRINTER HEAD A pile of piezoelectric inkjet inserts consists of a circuit tablet stacked on a substrate tablet, a piezoelectric drive tablet stacked on the circuit tablet, and a tablet buffer stacked on the piezoelectric drive insert. Each subsequent insert from the circuit insert to the buffer insert is smaller than the previous insert.
    公开号:BR112013031746B1
    申请号:R112013031746-9
    申请日:2011-06-29
    公开日:2020-10-20
    发明作者:Tony S. Cruz-Uribe；Joseph E. Scheffelin；Tsuyoshi Yamashita；Silam J. Choy
    申请人:Hewlett-Packard Development Company, L.P；
    IPC主号:
    专利说明:

    Background
    Command drop inkjet printers are typically classified according to one of two drop-forming mechanisms inside a print head.
    Thermal bubble inkjet printers use thermal printer heads with trigger heater elements that vaporize ink (or other fluid) inside ink-filled chambers to create bubbles that force ink droplets out through the printhead inserts. Piezoelectric inkjet printers use piezoelectric inkjet printheads with ceramic piezoelectric actuators that generate pressure pulses inside ink-filled chambers to force ink droplets (or other fluid) out through the printhead inserts.
    Piezoelectric print heads are preferred over inkjet print heads that use jetting fluids whose higher viscosity and / or chemical composition prohibits the use of thermal inkjet print heads, such as inks for curable UV printing. Thermal inkjet printheads are limited to jetable fluids whose compositions can withstand boiling temperatures without suffering mechanical or chemical damage. Because the printheads use electromechanical displacement (and not vapor bubbles) to create the pressure that forces ink droplets to exit through the inserts, piezoelectric heads can accommodate a wider selection of jetable materials. In this way, piezoelectric printheads are used to print a wide variety of media.
    Piezoelectric inkjet printheads are generally made of multilayer batteries. Efforts are being made to improve inkjet piezoelectric heads that involve reducing manufacturing costs and materials for piezoelectric batteries and, at the same time, involve increasing their performance and robustness. Brief description of the drawings
    The current configurations will now be described, as examples, with reference to the accompanying drawings, in which: Figure 1 shows a fluid ejection device configured as an inkjet printing system suitable to incorporate a fluid ejection assembly that has a stack of piezoelectric inserts as shown here, according to a configuration;
    Figure 2 shows a partial partial cross-sectional side view of an example of a piezoelectric chip stack in a PIJ printhead, according to a configuration;
    Figure 3 shows a cross-sectional side view of an example of a piezoelectric chip stack from a PIJ printhead, according to a configuration;
    Figure 4 shows a top view of insert layers of an example of a piezoelectric insert stack, according to a configuration;
    Figure 5 shows a top view of a partial stack of tablets containing a circuit die driver, according to a configuration;
    Figure 6 shows a top view of a partial stack of inserts that contains drivers that are not fractionation drivers, according to a configuration; and
    Figure 7 shows a top view of insert layers of an example of a piezoelectric insert stack with an alternative path diagram, according to a configuration. Detailed Description Overview of the problem and solution
    As mentioned above, improving piezoelectric inkjet printheads can involve developing more economical, higher performing, and more robust silicon cells. As part of this ongoing trend, multiple silicon wafers are used more and more for many layers of a stack, since smaller and more densely packed resources can be etched into the silicon. Several issues in the development of silicon chip stacks include the appropriate vertical alignment of features such as collector compliance, drive electronics, and multiple ink feeds to the pressure chambers. Other issues include shortening the length and improving the performance of the electrical interconnections between the die and the external signal cables. Reducing the high costs of certain inserts in the stack is a constant challenge.
    Previous attempts to improve piezoelectric inkjet printheads include the use of insert stack concepts with wire loops attached to the back of the insert, of insert grooves for passing drive wires between insert layers, fluidically oriented around instead of through layers of inserts, inserts of varying shapes and the same shapes within the insert stack, and control loops of close control, but not integrated into the insert stack.
    Configurations of the present exhibition present these issues through a piezoelectric droplet ejector (printhead) that contains a stack of multiple layers of MEMS tablets that have a thin piezoelectric drive film and a set of driving circuits. Each die in the stack is smaller than the next die, to allow direct alignment and interconnection during assembly. This facilitates proper matching of collector compliance, drive electronics, multiple ink feeds, and so on, to the opposite resources in the adjacent die. The tablet stack concept furthermore reduces the widths of the most expensive layers of the stack such as the piezoelectric die and the nozzle plate, which results in cost savings. The pellet stack concept allows the piezo-driver to be positioned on the same side of the pressure chamber as the nozzle. This, in turn, allows the ink inlets and outlets of the chamber to be just below the chamber itself, which allows for shorter chambers. A circuit die has a set of control circuits (for example, an ASIC) to control the triggering transistors of the driver piezo. Part of the circuit die surface forms the floor of the pressure chambers and contains inlet and outlet holes through which ink enters and exits the chambers.
    In one configuration, a stack of inkjet piezoelectric pads contains a substrate die, a circuit die stacked on the substrate die, a driver piezoelectric wafer stacked on the circuit die, and a blind die stacked on the trigger die. piezoelectric. Each die in the stack from the substrate die to the buffer die is smaller than the previous die.
    In another configuration, a piezoelectric inkjet print head contains a pressure chamber made in a piezoelectric drive die. A pressure chamber roof contains a membrane and a piezoelectric actuator in the membrane. A circuit die adheres to the driver die and forms a floor for the pressure chamber opposite the ceiling. A set of control circuits, for example, an ASIC) is made in the circuit die on the floor of the pressure chamber to bend the membrane in a controlled manner by activating the piezoelectric actuator. Representative configurations
    Figure 1 represents a fluid ejection device configured as an inkjet printing system 100 suitable for incorporating a fluid ejection assembly (i.e., a printhead), which has a stack of silicon wafers as shown here. , according to an exposure setting. In this configuration, a fluid ejection set is displayed as a jet print head 114. The jet print system 100 contains a print head set 102, an ink supply set 104, an assembly set 106, an assembly of means of transport 108, an electronic printer regulator 110, and at least one power source 112 that supplies power to the various electrical components of the inkjet printing system 100. The inkjet printing system 102 contains at least one fluid ejection assembly 114 (print head 114) that ejects ink drops through a plurality of nozzles or nozzles 116 towards a printing medium 118 in order to print on a printing medium 118. The printing medium printing 118 can be any suitable type of sheet or reel of suitable material, such as paper, stock cards, transparencies, polyester, plywood, chipboard, fabric, canvas, and the like. The nozzles 116 are typically arranged in one or more columns or series so that an ink ejection of the nozzles 116 properly sequenced causes letters, symbols and / or other graphics or images to be printed on the media 118 according to the head assembly inkjet printer 102 and media 118 move relative to each other.
    The ink supply set 104 supplies fluid ink to the printhead assembly 102 and contains a reservoir 120 for storing ink. Ink flows from reservoir 120 to the printhead assembly 102. The ink supply assembly 104 and the printing head 102 can constitute either a one-way ink supply system or an ink recirculating supply system. In the one-way ink supply system, substantially all of the ink supplied to the printhead assembly 102 is used during printing.
    In the ink supply recirculating system, however, only a part of the ink supplied to the printhead 102 is used during printing. The ink not used during printing is returned to the ink supply set 104.
    In one configuration, the ink supply set 104 supplies ink under positive pressure through an ink conditioning set 105 to the print head 102 via an interface connection, such as a supply tube. The ink supply set 104 contains, for example, a reservoir, pumps and pressure regulators.
    Conditioning in ink conditioning set 105 may contain filtration, preheating, pressure wave absorption, and degassing. The ink is brought under negative pressure from the printhead assembly 102 to the ink supply assembly 104. The pressure difference between the inlet and outlet of the printhead assembly 102 is chosen to obtain the correct counter pressure at nozzles 116, and it is normally a negative pressure between 1 negative inch and 10 negative inches of water. The reservoir 120 of the ink supply set 104 can be removed, replaced and / or refilled.
    Mounting set 106 positions the inkjet print head assembly 102 in relation to the media transport set (media) 108, and the media transport set 108 positions the media 118 in relation to the media set inkjet printhead 102. Therefore, a printing zone 122 adjacent to nozzles 116 is defined in an area between the inkjet printhead assembly 102 and the media 118. In one configuration, the printhead assembly inkjet printer 102 is a scan type head assembly. As such, mounting set 106 contains a cart to move the inkjet print head assembly 102 relative to the media transport assembly 108 to scan media 118. In another configuration, the print head assembly inkjet printer 102 is a non-digitizing print head assembly. As such, mounting assembly 106 locks the inkjet print head assembly 102 in a previously established position in relation to the media transport set 108. Thus, the media transport set 108 positions the media 118 in with respect to the inkjet print head assembly 102.
    The electronic control of the printer 110 typically contains a processor, an internal program, software, one or more memory components including volatile and non-volatile memory components, and other printer electronics to establish communications with each other and to control the assembly from the inkjet print head 102, the mounting set 106, and the media transport set 108. The electronic control 110 receives data 124 from a host system, such as a computer, and temporarily stores data 124 in memory .
    Typically, data 124 is sent to the inkjet printing system 100 over an electronic, infrared, optical or other transfer medium. Data 124 represents, for example, a document and / or a file to be printed. As such, data 124 constitutes a print job for the inkjet printing system 100 and contains one or more print job commands and / or command parameters.
    In one configuration, the electronic printer control 11 0 controls the print head assembly 102 in the ejection of ink droplets through the nozzles 116. Therefore, the electronic control 110 defines a pattern of ejected ink droplets that form letters, symbols and / or other graphics or images on the media 118. The pattern of the ejected ink droplets is determined by the print job commands and / or the command parameters from data 124. In one configuration, electronic control 110 comprises thermal compensations and control module 126 stored in control memory 110. Thermal compensation and control module 126 are performed on electronic control 110 (that is, on a processor of control 110) and specify the temperature that the circuitry must maintain at stack of tablets (for example, an ASIC) to print. The temperature in the pellet stack is controlled locally by a set of circuits in the pellets that contain temperature sensing resistors and heating elements in the pressure chambers of the fluid ejector assemblies (ie, the print heads) 114. More precisely, the 110 control follows instructions received from module 126 to feel and maintain ink temperatures within the pressure chambers by controlling the resistors to sense the temperature and heating elements in the circuit die adjacent to the chambers.
    In one configuration, the inkjet printing system 100 is a piezoelectric droplet inkjet printing system by command, with a fluid ejection assembly 114, which contains a piezoelectric inkjet printing head (PIJ) 114 The PIJ 114 printhead comprises a MEMS multilayer stack of pellets in which each die in the pellet stack is smaller than the die below. The tablet stack comprises a thin piezoelectric film trigger and ejection control element as well as a set of drive circuits configured to generate pressure pulses within the pressure chamber that force the ink droplets out through the nozzles 116. the deployment, the inkjet printhead assembly 102 comprises a single PIJ 114 printhead. In another deployment, the inkjet printhead assembly 102 comprises a large series of PIJ printheads
    Figure 2 shows a partial partial cross-sectional side view of an example of a piezoelectric chip stack 200 in an inkjet PIJ printhead 114, according to an exposure configuration. In general, the PIJ 114 printhead comprises multiple layers of inserts, each with a different functionality. The overall shape of the stack of tablets 200 is pyramidal, where each tablet in the pile is smaller than the die below (i.e., the reference die 202 of Figure 2 as the die below). That is, each spinneret that starts with the substrate insert 202 becomes increasingly narrow as it progresses upward in the insert stack towards the nozzle layer (nozzle plate) 210. In some configurations, where more is desired space at the ends of the die for alignment marks, tracking routes, connection paths, fluid passages, etc., a die from a layer above may also be shorter than the die below. The narrowing and / or shortening of the insert from the base to the top of the insert stack 200 forms a ladder effect on the sides (and sometimes at the ends) of the insert which allows the layers of inserts that have circuitry to be connected via wires connection between the pathways on the exposed stairs.
    The layers of stack 200 comprise a first (i.e. base) substrate insert 202, a second insert from circuit 204 (or ASIC insert), a third driver insert / chamber insert 206, a fourth insert 208, and a fifth layer nozzles 210 (or nozzle plate). In some configurations, the blank insert (buffer) 208 and the nozzle layer 210 are joined as a single layer. There is also a dry layer (not shown) on top of the nozzle layer 210 that comprises a water-repellent coating to help prevent ink from puddling around nozzles 116.
    Each layer of the pellet stack 200 is typically made of silicon, except for the dry layer and sometimes the nozzle layer 210. In some configurations, the nozzle layer 210 can be made of stainless steel or a chemically and durable polymer inert as polyimide or SU8. The layers are joined with a chemically inert adhesive, such as epoxy (not shown). In the configuration shown, the wafer layers have fluid passageways such as grooves, channels or holes to lead to and from the pressure chambers 212. Each pressure chamber 212 comprises two ports (intake port 214, exhaust port 216 ) located on floor 218 of the chamber (that is, opposite the nozzles in the chamber) that are in clear communication with an ink distribution manifold (intake manifold 220, exhaust manifold 222). The floor 218 of the pressure chamber 212 is formed by the surface of the peripheral layer 204. The two doors (214, 216) are on opposite sides of the floor 218 of the chamber 212 where they cut the peripheral layer of insert204 and allow the ink to circulate through of the chamber by means of external pumps from the ink supply system 104. The piezoelectric actuators 224 are on a flexible membrane that serves as a roof for the chamber and is located opposite the floor of the chamber 218. Therefore, the piezoelectric actuators 224 are located on the same side of the chamber 212 as well as the nozzles 116 (i.e., on the ceiling or upper part of the chamber). Referring still to figure 2, the lower substrate tablet 202 is made of silicon, and comprises fluid passages 226 through which ink can flow to and from the pressure chamber 212 through the distribution manifold (intake manifold 220, exhaust 222). The substrate tablet 202 supports a thin deformation film 228 configured to relieve pressure surges from pulsating ink flows through the ink distribution manifold due to starting transients and ink ejections, for example. Deformation film 228 has a damping effect on interference between adjacent nozzles, as well as acting as a reservoir to ensure that ink is available as long as the flow is established by the ink supply during high volume printing. The deformation film 228 has a thickness of the order of 5-10 microns if it is made of a polymer such as polyester or SPF (polyphenylene sulfide).
    The deformation film 228 holds a gap in the substrate tablet 220 which forms a cavity or air bubble 230 at the back of the deformation to allow it to expand freely in response to pressure pulses in the manifold. The air bubble 230 is typically, but not necessarily, released into the environment. In both cases, the air bubble 230 is configured to be pressurized or to create a vacuum that allows the deformation film 228 to readily move up and down in the bubble 230 and absorb the pressure pulses of the ink. A typical gap between the deformation film and the floor of the cavity 230 is 100 to 300 microns. There is a similar gap on the sides of the ink channel of the deformation film. A width of 1 to 2 mm provides sufficient deformation. If the deformation film is deposited, then thicknesses of 1 to 2 microns with a width of less than 1 mm are possible. Deformation film 228a is narrower than deformation film 228b since deformation film 228a serves half of the ports (i.e., an exit port 216) of deformation film 228b (i.e., two ports 214).
    The insert of circuit 204 is the second insert in the insert stack 200 and is located above the substrate insert 202. The insert area 204 is attached to the substrate insert 202 and is narrower than the substrate insert 202. In some configurations , the circuit chip 204 may also be shorter than the substrate chip 202.
    Circuit chip 204 comprises the ink delivery manifold, which consists of an ink intake manifold 220 and an ink exhaust manifold 222. The intake manifold 220 provides flow of ink to chamber 212 through the port inlet 214, while outlet port 216 allows ink to escape from chamber 212 to exhaust manifold 222. Circuit chip 204 also comprises fluid bypass channels 232 that allow some ink from the exhaust manifold inlet 220 bypass pressure chamber 212 and flow directly to exhaust manifold 222 through bypass 232.
    As mentioned in more detail below in relation to figure 3, the bypass channel 232 comprises a properly sized flow limiter that reduces the size of the channel so that the desired flow of ink is achieved within the pressure chambers 212 and, thus, are sufficient pressure differences are maintained between chamber 214 inlet ports and 216 outlet ports.
    The circuit chip 204 also comprises sets of CMOS 234 electrical circuits implanted in an ASIC 234 and made on its upper surface adjacent to the driver insert / chamber insert 206. The ASIC 234 comprises sets of ejection control circuits that control the pulsation of the pressure (ie ignition) of the piezoelectric actuators 224. At least part of the ASIC 234 is located directly on the floor 218 of the pressure chamber 212. Due to the ASIC 234 being made on the floor of the chamber 218, it can come into direct contact with the ink inside the pressure chamber 212. However, the ASIC 234 is burned under the thin film of a passivation layer (not shown) that comprises a dielectric material to provide insulation and protection against the ink in the chamber 212. One or more temperature sensing resistors (TSR) and heating elements such as electrical resistance films are included in the ASIC 234 circuit pack. ASIC 234 RSTs and heaters are configured to maintain the ink temperature in chamber 212 at a desired and uniform level that favors the ejection of ink drops through nozzles 116. In one configuration, the established temperature of RSTs and heaters in the ASIC 234 is specified by the temperature control and compensation module 126 that acts on the control 110 to feel and adjust the ink temperature inside the pressure chambers 212. If the ink needs to be at a high temperature when entering the print head assembly 102, temperature control 126 will turn on the preheater within the ink conditioning set 105.
    The circuit board 204 also comprises a set of piezoelectric circuits of the motion driver / transistors 236 (e.g., FETs) made at the edge of the board 204, outside of the connecting wires 238 (commented below). Therefore, drive transistors 236 are on the same circuit chip 204 as the control circuits of ASIC 234 and are part of ASIC 234. Drive transistors 236 are controlled (ie turned on and off) by the ASIC control circuitry. 234. The performance of chamber 212 and actuators 224 is sensitive to changes in temperature, and because the driving transistors 236 are externally on the edge of circuit chip 204, they retain the heat generated by transistor 236 outside chamber 212 and the actuators 224.
    The next layer of the chip stack 200 located above the circuit chip 204 is the driver / chamber insert 206 ("driver insert 206", hereinafter). The driver pad 206 is attached to the circuit pad 204 and is narrower than the circuit pad 204. In some configurations, the driver pad 206 may also be shorter than the circuit pad 204. The driver pad 206 comprises the pressure chambers 212 having floors of chambers 218 comprising the adjacent circuit chip 204. As seen above, the floor of chamber 218 also comprises the set of control circuits such as ASIC 234 made in circuit chip 204 that forms the floor of the chamber 218. The driver insert 206 furthermore comprises a thin film, flexible membrane 240 such as silicon dioxide, located opposite the floor of the chamber 218 which serves as a ceiling for the chamber. Above and attached to the flexible membrane 240, there is the piezoelectric actuator 224. The piezoelectric actuator 224 consists of a thin film of piezoelectric material such as ceramic piezo material that reacts mechanically in response to an application of electrical voltage. When activated, the piezoelectric actuator 224 expands or contracts physically, which causes the piezo blades and the membrane 240 to flex. This flexion displaces the ink in the chamber which generates pressure waves in the pressure chamber 212, which, in turn, ejects drops of ink through the nozzle 116.
    In the configuration shown in figure 2, both the flexible membranes 240 and the piezoelectric actuator 224 are divided by a downward divider 242 that extends between the pressure chamber 212 and the nozzle 116. Therefore, the piezoelectric driver 224 is a bipartite piezoelectric driver 224 which has a segment on each side of the chamber 212. In some configurations, however, the downward divider 242 and the nozzle 116 are located on the side of the chamber 212 so that the piezoelectric actuator 224 and the membrane 240 are not divided.
    The blank insert (buffer) 208 is attached above the driver insert 206. The buffer insert 208 is narrower than the driver 206, and in some configurations it may also be shorter than the driver insert 206. The buffer insert 208 forms a buffer cavity 244 in the piezoelectric driver 224 that encapsulates the driver 224. The cavity 244 is a sealed cavity that protects the driver 224. Despite the cavity 244 not being ventilated, the sealed space it provides is configured with open volume and sufficient clearance allowing the piezo driver 224 to bend without influencing the movement of the driver 224. The buffer cavity 244 has a ribbed upper surface 246 opposite the driver 224, which increases the volume of the cavity and the surface area (for greater water absorption and other molecules harmful to the long-term performance pzt thin film). The ribbed surface 246 is designed to reinforce the upper surface of the buffer cavity 244 in order to better resist damage from handling and servicing of the print head (for example, cleaning with a cloth). The ribs reduce the thickness of the buffer insert 208 and shorten the descending divider 242.
    The buffer insert 208 also comprises the descending divider 242. The descending divider 242 is a channel in the buffer insert 208 that extends between the pressure chamber 212 and the nozzle 116, which allows ink to flow from the chamber 212 and through the nozzle 116 during the ejection event caused by the pressure waves coming from the actuator 224. As seen above, in the configuration of figure 2, the descending divider 242 and the nozzle 116 are located in the center of the chamber 212, which divides the piezoelectric actuator 224 and the flexible membrane 240 between the two sides of chamber 212. Nozzles 116 are made in the layer of nozzles 210, or nozzle plate. The nozzle layer 210 adheres to the top of the buffer insert 208 and is typically the same size (i.e., length and width, but not necessarily thickness) of the buffer insert 208.
    Figure 2 shows only a partial cross-sectional view (i.e., the left side) of the stack of inserts 200 of a PIJ 114 printhead. However, the stack of inserts 200 continues towards the right side, after the dashed line 258 shown in figure 2. In addition, the stack of pads 200 is symmetrical, and therefore contains details on its right side (not shown in figure 2) that mirror the details shown on its left side in figure 2. For example, the ink intake manifold 220 and the ink exhaust manifold 222 shown in figure 2 on the left side of the tablet 200 form a mirror image of the right side of the tablet pile 200, which is not shown in figure 2. Additional characteristics of the ink distribution manifold, such as the mirror images of the intake and exhaust manifolds, are shown in figure 3.
    Figure 3 shows a cross-sectional side view of an example of a piezoelectric chip stack 200 in a PIJ 114 print head, according to an exposure configuration. As a comment, many of the features described above in relation to figure 2 are not included in the illustration or in the comments of the stack of tablets 200 shown in figure 3. Figure 3 shows a complete cross-sectional view of the pile of tablets 200, but it is primarily designed to illustrate additional collectors, chambers and nozzles, as they appear in the width of an example of a stack of inserts 200 as in the configuration commented above in relation to figure 2. In the stack of inserts 200 of figure 3, there are four rows of pressure chambers 212 and respective nozzles 116 in the width of the tablet stack 200. Five fluid passageways 226 through the ink channel of the substrate tablet 202 (for example, from an ink supply system 104) to and from five respective collectors in circuit insert 204. More precisely, three exhaust collectors 222, two at the edges of the insert stack 200 and one in the center of the insert stack 200, ink channel f now from pressure chambers 212 in the stack of tablets 200. The three exhaust manifolds 222 provide ink channels for the ink to come out of the four pressure chambers 212 (that is, four rows of pressure chambers) through four outlet ports 216 in chambers 212. Two intake manifolds 220 inside the stack of tablets provide channels for the ink to enter the four pressure chambers 212 (that is, four rows of pressure chambers) through four respective inlet ports 214 in the chambers 212. Fluid bypass channels 232 (e.g. 232a, 232b) are also shown in the stack of pads 200 of Figure 3 made on circuit chip 204. As mentioned above, bypass channels 232 allow a portion of the ink that enters an intake manifold 220 flows directly into the exhaust channel 222 through the bypass 232 without first passing through the pressure chamber 212. Each bypass channel 232 comprises a flow constrictor 300 that effects again narrows the channel to restrict the flow of paint from the intake manifold 220 to the exhaust manifold 222. The restriction caused by the flow constrictor 300 in the bypass channel 232 helps to obtain the proper flow within the pressure chamber 212. 0 flow constrictor 300 also helps to maintain sufficient pressure differentials between inlet ports 214 and outlet ports 216. Note that flow constrictor 300 shown in figure 3 is intended for commentary purposes only and is not necessarily understood as an illustration of a physical representation of a real flow constrictor. The actual flow restriction is established by controlling the length and width of the bypass channels themselves (for example, 232a and 232b). Therefore, for example, the length and width of bypass channel 232a may differ from the length and width of bypass channel 232b in order to obtain different levels of flow through channels and pressure chambers 212.
    Figure 4 shows a top view of insert layers in an example of a piezoelectric insert stack 200, according to an exposure configuration.
    In the tablet stack 200 of figure 4, the substrate tablet 202 is shown at the bottom of the stack, with a smaller (i.e. narrower and shorter) circuit chip 204 on the substrate chip 202. On the circuit chip 202 there is a smaller driver insert (i.e., narrower and shorter 206. Alignment guarantees 400 are shown on the corner edges of the substrate insert 202. Referring in general to FIGURES. 4 and 2, the progressively smaller inserts create a stack with pyramidal or staircase 200 format that provides space at the edges of the insert to make visible the alignment guarantors 400, an increased number of connection paths 250 and 238 wires, and the tracking routes between connection paths 250 (not shown) all connection paths, wires and lines). The additional space at the edges of the inserts also helps encapsulants 252 to protect wires 238 and connection paths 250 from damage, and in general allows an alignment frankly straight hament as well as an interconnection during assembly to ensure the adequately vertical fixation of the conformities of the collectors, the drive electronics, and multiple ink supplies. Because the circuit chip 204 is adjacent (that is, directly below), the driver chip 206 allows a shorter length of wires 238, which reduces damage during manufacture and decreases the amount of material exposed to be protected by encapsulation. The extra surface area at the edges of the pellet also provides space for a seal 254 between a protective mantle 256 and the pellet stack 200.0, seal 254 reduces the likelihood of ink penetrating the electrical connections of the pellet stack 200.
    Referring further to FIGURES 2 and 4, flexible cable 248 is shown to be connected to the stack of pads 200 on a side edge of a substrate pad surface 202. However, in other configurations, flexible cable 248 can be coupled to another layer of chips 200, such as circuit chip 204. The flexible cable 248 comprises around 30 lines that carry low voltage digital control signals from a signal source such as a control 110, energy from a 112 power source, and ground. Serial digital control signals received over lines on flexible cable 248 are converted (multiplexed) by the ASIC 234 circuitry on circuit board 204 into parallel analogically triggered signals that turn on and off drive transistors 236, activating piezoelectric triggers individual 224.
    In this way, a relatively small number of wires (for example, wires 238a are connected from substrate chip 202 to circuit chip 204 to carry serial control and power signals from flexible cable 248 to the ASIC control circuit assembly and to the driving transistors 236 of the circuit chip 204. However, a very large number of wires (for example, wires 238b) are connected between the connection paths 250a of the circuit chip 204 and the respective connection paths 250b of the chip actuator 206 to carry the many parallel control signals from ASIC 234 on circuit insert 204, along individual wires 238b, to individual piezoelectric actuators 224 (not shown in figure 4) of actuator insert 206. Note that not all wires 238b between connection paths 250a and 250b have been shown in figure 4 and that the wires 238b shown are just a representative example. connections can be as high as 200 lanes per row per inch with two off-center rows having up to 400 lanes per inch.
    In a configuration as shown in figure 4, grounding lines 402 start from flexible cable 248 and extend along one side of the edge of the substrate insert 202 to grounding routes 404. Wires 238c are connected to grounding routes 404 and extend to earthing paths 406 in the adjacent circuit chip 204 above. Grounding lines 408 run from grounding paths 406 along the two edges of the circuit chip 204 end to grounding paths 410 located at the end edges of the center of circuit board 204. Wires 238d are connected to grounding paths 410 of the circuit insert 204 and extend to the center earthing paths 412, from the edges of the driver insert 206 ends. The ground pickup bar 414 runs through the center of the driver insert 206 between the opposite ends of the insert 206. Therefore, the grounding coming from flexible cable 248 is initially attached to the stack of pads 200 on the substrate pad 202, and directed to the driver pad 206 along the side and edges of the substrate pad 202 and the circuit pad 204. From the center bar grounding 414, grounding lines extend outward towards the side edges of the driver insert 206 to connect with the piezoelectric actuators 224 (not shown in figure 4) as commented below in relation to FIGURES 5 and 6.
    Fig. S shows a top view of a partial stack of pads 200 comprising a driver pad 206 on a circuit pad 204, according to an exposure configuration. Paths of connecting wires 250b are shown on driver insert 206 running along the edges of the long side of insert 206. The space in insert 206 between connection paths 250b has at least four rows of piezoelectric actuators 224. In other configurations, However, the number of rows of triggers 224 can be increased, for example, up to six, eight, or more rows. In this configuration, grounding connections made at both ends of the central grounding bar 414 (ie via wires 238d from circuit insert 204) keep the resistance along the bar below a maximum acceptable level while helping to minimize bar width. As shown in figure 5, the grounding lines 500 start from the central bar 414 and extend outwards towards the two lateral edges of the driver insert 206. Therefore, the grounding lines 500 are "inside-out" grounding lines, that run between the trigger lines and provide earthing connections from the central earthing bar 414 to each trigger 224. Earthing connections 502 from earthing lines 500 are typically (but not necessarily) made at the base of the trigger electrodes ceramic piezo 224. Drive signal lines 504 start from connection paths 250b on the side edges of drive insert 206 and extend inward towards the center of insert 206. Therefore drive lines 504 are drive lines of " out to in "running between the rows of actuators, with each 504 actuation line providing actuation signals that activate a piezo actuator ceramic 224. The connections of the drive lines 506 from the drive lines 504 are typically (but not necessarily) made on the upper electrodes of the piezo ceramic actuators 224. The plan of the lines with the "inside-out" 500 and the "outside-in" drive lines 504 allow for a tighter line compression scheme, which allows more rows of 224 drivers in various configurations. In addition, the layout of the lines allows the grounding lines and the drive lines to be at the same manufacturing level, or within the same or common manufacturing plan. That is, during manufacturing, the same standardization and deposition processes used to lower the drive lines are also used to lower the grounding lines at the same time. This eliminates process steps as well as eliminating the insulation layer between the drive lines and the grounding lines.
    The pressure chambers 212, also shown in the driver insert 206 of figure 5, are sketches of the inlet and outlet ports (214, 216) in the underlying circuit insert 204, and sketches of the descending dividers 242 and the nozzles 116 that are in the overlying blank (buffer) 208 and in the nozzle layer 210, respectively. In the configuration of FIG; 5 and Figure 2, each chamber 212 has a division driver 224. The drivers 224 are divided into two segments by the downward dividers 242 and the nozzles 116, which are located in the middle of the chamber. In this concept, both segments of the split drive 224 are coupled to a grounding line 500 and a driving line 504. The tight compaction scheme of the plant of the lines that has the "inside-out" grounding lines 500 and the drive lines "outside in" 504 best accommodates this split drive concept.
    Figure 6 shows a top view of a partial stack of inserts 200 comprising a driver insert 206 that has drivers 224 that are not divided, according to an exposure configuration. In this configuration, the downward divider 242 and the nozzle 116 are located on one side of chamber 212 instead of in the middle of chamber 212 as in the split driver design of the configuration in figure 5. This allows a single driver 224 to cover the width of the chamber 212 as a single element. This concept, therefore, has half of the connections of the grounding lines 500 and the driving lines 504, the connections being made with the actuators 224 as in the concept of the split actuator in figure 5. In fact, there are fewer lines that occupy space inside the rows of drivers on driver insert 206.
    Figure 7 shows a top view of the insert layers in an example of a piezoelectric insert stack 200, according to an exposure configuration. Figure 7 is similar to Figure 4 mentioned above, except that the illustrated configuration shows an alternative plan for orienting the grounding connections from the flexible cable 248 on the substrate insert 202 to the central grounding bar 414 of the driver insert 206. In this configuration, the central grounding bar 414 comprises a perpendicular segment 700 at each end of bar 414. Perpendicular segments 700 extend perpendicularly away from the ends of bar 414 in two directions towards the edges of both sides of the drive insert. Perpendicular segments 700 facilitate earthing connections with the central earthing bar 414 in various implantations of the insert stack 200, such as when circuit insert 204 and driver insert 206 are of the same length, or are closer to the same length than in previously commented configurations. In these deployments, there may not be enough space at the end edges of the circuit chip 204 to place connection paths or grounding paths, or to extend grounding lines. This avoids the special grounding scheme shown in figure 4 that connects the ground to the central grounding bar 414 on the driver insert 206 from circuit insert 204. Therefore, the configuration in figure 7 provides an alternate direction of the ground connections from from the flexible cable 248 to the central grounding bar 414 on the driver pad 206 in deployments where there may not be enough space at the end edges of the circuit pad 204.
    In the configuration of figure 7, the grounding lines 402 start from the flexible cable 248 and extend along a lateral edge of the substrate insert 202 to the grounding paths 404. The wires 238c are connected at one end to the grounding paths 404 and extend to circuit insert 204 where they are connected at the other end to grounding paths 406. From grounding paths 406 of circuit insert 204, wires 702 are connected up to the perpendicular extensions 700 of the end edges of the insert actuator 206, which provides a ground connection with the central grounding bar 414. In some configurations, the perpendicular extensions 700 of the actuator insert 206 can also be used to provide ground connection to the other side edge of the circuit insert 204. In these cases, as shown in figure 7, wires 704 are connected to the other side of the perpendicular extensions 700 and extend back to the other side edge of the pad circuit island 204 where they are connected to earthing routes 706. Therefore, in addition to providing an alternative path for earthing connections from flexible cable 248 to the central earthing bar 414 of the driver insert 206, the perpendicular extensions 700 for the central grounding bar 414 also allows grounding connections from one side of the circuit insert 204 to the other side, over the driver insert 206. These alternative ground line routes are especially useful in implantation of insert stack 200 where there may not be enough space at the end edges of circuit insert 204, such as when circuit insert 204 and driver insert 206 are of the same or similar length.
    Making general reference to figures 4-7, in alternative configurations, the roles of the central grounding bar and the individual actuation lines can be inverted. Therefore, the central grounding bar 414 is, on the contrary, at the peak voltage of the drive. Thus, in relation to figure 4, for example, in these alternative configurations, the previously described grounding lines 402, which start from the flexible cable 248 and which extend along the edge of the substrate insert 202 are, on the contrary, driving lines peak voltage.
    Likewise, grounding routes 404, 406, 410 and 412, and wires 238c and 238d carry the peak drive voltage instead of the peak ground voltage. Therefore, the drive voltage lines (instead of grounding lines) extend outward from the central grounding bar 414 towards the side edges of the driver insert 206 to connect with the piezoelectric actuators 224. In addition, the piezoelectric actuators 224 are connected to the ground by the individual parallel lines 504, through the connection paths 250b on the side edges of the drive insert 206, and then by the drive transistors 236. Through this line path configuration, the drive transistors 236 turn off and alternately connect the piezoelectric actuators 224 to the ground to actuate the actuators 224. Where, in these alternative configurations, the actuation lines are "inside-out" actuation lines that run from the central bar 414 to each actuator 224 between the rows of actuators to provide actuation voltages that activate 224 piezoelectric actuators, while grounding lines are grounding lines "from outside to inside" that run between the rows of actuators to provide ground connections for each actuator 224 through actuation transistors 236.
    权利要求:
    Claims (20)
    [0001]
    1. Pile of piezoelectric inkjet rows (200), characterized by the fact that it comprises: - a row of circuit (204) stacked on a row of substrate (202); - a piezoelectric drive row (206) stacked on the circuit row (204); and a blind row (208) stacked on top of the piezoelectric driving row (206), where each row in succession from the circuit row (204) to the blind row (208) is narrower than the previous row.
    [0002]
    2. Stack of rows (200) according to claim 1, characterized in that an additional row is inserted in the stack that is equal to or greater in width than the row above in the stack.
    [0003]
    3. Row stack (200) according to claim 1, characterized in that it contains a fluid passageway that extends through each row to allow fluid to flow from the substrate row (202) to the row blind (208) and return.
    [0004]
    4. Row stack (200) according to claim 3, characterized in that the fluid passage path comprises: - two exhaust manifolds (222) opposite each other at the edges of the row stack; - two intake manifolds (220) opposite each other between the edges and the center of the stack of rows; and - an exhaust manifold (222) in the center of the stack of rows.
    [0005]
    5. Stack of rows (200), according to claim 1, characterized by the fact that it also comprises: a pressure chamber (212) in the piezoelectric drive row (206); - an intake manifold (220) and an inlet port (214) in the circuit row (204) for supplying ink to the pressure chamber (212); - an exhaust manifold (222) and an outlet port (216) in the circuit row (204) to allow the paint to escape from the pressure chamber 9212); and - a bypass channel (232) between the intake manifold (220) and the exhaust manifold (222) to allow the paint to bypass the pressure chamber (212).
    [0006]
    6. Stack of rows (200) according to claim 5, characterized in that the bypass channel (232) comprises a flow constrictor (300) to limit the flow of the paint.
    [0007]
    7. Row stack (200) according to claim 1, characterized by the fact that it also comprises: - a blind cavity (plug) (244) in the blind row (plug) (208) to protect a piezoelectric driver (224) ; and - a ribbed upper surface (246) in the blind cavity opposite the piezoelectric driver (224).
    [0008]
    8. Row stack (200), according to claim 4, characterized by the fact that it also comprises: - a deformation film (228) that covers a gap in the substrate row (202) and creates a space for the passage of air, the deformation film (228) being configured to bend in the air bubble during an ink pressure pulse inside an intake manifold (220).
    [0009]
    9. Row stack (200), according to claim 1, characterized by the fact that it also comprises: a pressure chamber (212) in the piezoelectric drive row (206); and - a floor (218) for the pressure chamber comprising a control circuit (234) of the application specific integrated circuit (ASIC).
    [0010]
    10. Stack of rows (200) according to claim 9, characterized in that the pressure chamber (212) comprises: - a flexible membrane roof opposite the floor (218); and - a piezoelectric actuator (224) adjacent to the ceiling to cause the flexible membrane to fold.
    [0011]
    11. Stack of rows (200) according to claim 10, characterized in that it also comprises a cavity formed in the blind row (208) to seal the piezoelectric driver (224).
    [0012]
    12. Stack of rows (200) according to claim 11, characterized in that it also comprises a ribbed upper surface (246) of the cavity to provide resistance to the cavity.
    [0013]
    13. Stack of rows (200) according to claim 9, characterized in that it further comprises: - a layer of nozzles (210) with a nozzle (116) stacked on the blind row (208); and - a descending divider (242) in the blind row opposite the floor (218) of the pressure chamber (212) to provide frank communication between the pressure chamber (212) and the nozzle (116).
    [0014]
    14. Row stack (200) according to claim 13, characterized in that the downward divider (242) is located in the center of the chamber ceiling so that the piezoelectric actuators (224) is a divided actuator, which has a first driving segment on one side of the descending divider and a second driving segment on the other side of the descending divider.
    [0015]
    15. Stack of rows (200), according to claim 9, characterized by the fact that it also comprises a passivation layer that covers the control circuit (234) of the ASIC and is configured to be in direct contact with the ink in the chamber pressure (212).
    [0016]
    16. Stack of rows (200), according to claim 9, characterized by the fact that it also comprises a temperature sensor resistor and a heating element as part of the control circuit (234) of the ASIC to control the temperature of the ink inside the pressure chamber.
    [0017]
    17. Row stack (200), according to claim 9, characterized by the fact that the control circuit (234) of the ASIC is in the row of circuit (204), the stack of rows still comprising drive transistors ( 236) at one edge of the circuit row.
    [0018]
    18. Row stack (200) according to claim 9, characterized in that it further comprises: - a flexible cable (248) coupled to an edge of the substrate row (202); - wire connections (250b) from the edge of the substrate row (202) to the edge of the circuit row (204); and - wire connections (250a) from the edge of the circuit row (204) to the edge of the driver row (206).
    [0019]
    19. Piezoelectric print head (114), characterized by the fact that it comprises: - a pressure chamber (212) formed in a piezoelectric actuating row (206); - a ceiling for the pressure chamber comprising a membrane and a piezoelectric actuator on the membrane; - a circuit row (204) attached to the driving row and forming a floor (218) for the pressure chamber (212) opposite the ceiling; and - a set of control circuits (234) made in the circuit row on the floor of the pressure chamber to control the membrane controllably by activating the piezoelectric actuator.
    [0020]
    20. Head (114), according to claim 19, characterized by the fact that it also comprises: - a descending divider (242) located in the center of the ceiling so that the membrane and the driver contain a divided membrane and a divided driver respectively ; and a nozzle (116) opposite the pressure chamber (212) at one end of the downward divider, the downward divider allowing open communication between the pressure chamber and the nozzle.
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    同族专利:
    公开号 | 公开日
    EP3427960B1|2020-05-13|
    CN103619599B|2015-11-25|
    US20140192118A1|2014-07-10|
    EP2726294B1|2018-10-17|
    TWI507302B|2015-11-11|
    JP2014522755A|2014-09-08|
    US9221247B2|2015-12-29|
    JP5894667B2|2016-03-30|
    TW201304971A|2013-02-01|
    EP2726294A4|2016-12-07|
    EP3427960A1|2019-01-16|
    WO2013002774A1|2013-01-03|
    CN103619599A|2014-03-05|
    EP2726294A1|2014-05-07|
    KR20140045451A|2014-04-16|
    BR112013031746A2|2016-12-13|
    KR101846606B1|2018-04-06|
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    法律状态:
    2018-12-26| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-05-07| B06T| Formal requirements before examination [chapter 6.20 patent gazette]|
    2020-04-14| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2020-10-20| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/06/2011, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    PCT/US2011/042265|WO2013002774A1|2011-06-29|2011-06-29|Piezoelectric inkjet die stack|
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