light heatsinks and led lamps using the same

专利摘要:
light heatsinks and led lamps using them the present invention relates to a heatsink (1 °) comprising a heatsink body (12), a reflective layer (204) disposed over the heatsink body heat (12) which has a reflectivity greater than 90% for light in the visible spectrum and a protective transmissive light layer (206) disposed on the reflective layer (204) which is transmissive from light to light in the visible spectrum. the heatsink body (12) may comprise a heatsink structural body and a thermally conductive layer (202) disposed over the heatsink structural body where the thermally conductive layer (202) has greater thermal conductivity than structural body of the heat sink (12) and the reflective layer (204) is disposed on the thermally conductive layer (202). a lamp based on a light-emitting diode (led) comprises the heat sink (10) mentioned above and a led module attached with and in thermal communication with the heat sink. the led-based lamp can have a bulb configuration of line a or it can comprise a directional lamp in which the heatsink defines a hollow light-collecting reflector.
公开号:BR112013007741B1
申请号:R112013007741
申请日:2011-03-18
公开日:2020-01-14
发明作者:I Chowdhury Ashfaqul；R Allen Gary
申请人:Ge Lighting Solutions Llc；
IPC主号:

专利说明:

Invention Patent Descriptive Report for LIGHT HEAT SINK AND LED LAMPS USING THEM.
This application claims the benefit of North American Provisional Application No. 61 / 388,104, filed on September 30, 2010. North American Provisional Application No. 61 / 388,104 filed on September 30, 2010 is hereby incorporated by reference into its full. BACKGROUND
The present invention relates to light techniques, lighting techniques, solid state lighting techniques, thermal control techniques and related techniques.
Conventional incandescent, halogen and high-intensity discharge (HID) light sources have relatively high operating temperatures, and as a consequence, the heat output is dominated by the radiative and convective heat transfer pathways. For example, radiative heat output occurs at a temperature raised to the fourth power, so that the radioactive heat transfer pathway becomes superlinearly more dominant as the operating temperature increases. Thus, thermal control for incandescent, halogen and HID light sources typically equates to providing adequate air space near the lamp for efficient transfer of radiative and convective heat. Typically, in these types of light sources, it is not necessary to increase or modify the lamp's surface area to intensify the radioactive or convective heat transfer in order to achieve the desired lamp operating temperature.
Light emitting diode (LED) lamps, on the other hand, typically operate at substantially lower temperatures for reasons of device performance and reliability. For example, the junction temperature for a typical LED device should be below 200 ° C and, on some LED devices, it should be below 100 ° C or even lower. At these low operating temperatures, the pathway for transferring radioactive heat to the environment is weak compared to
2/42 that of conventional light sources, so that the transfer of convective and conductive heat to the environment typically dominates over irradiation. In LED light sources, the convective and radioactive heat transfer from the outer surface area of the lamp or luminaire can be enhanced by the addition of a heat sink.
A heatsink is a component that provides a large surface to radiate and transfer heat away from LED devices by convection. In a typical design, the heat sink is a relatively solid metal element having a large projected surface area, for example, having fins or other heat dissipating structures on its outer surface. The large mass of the heat sink efficiently conducts the heat from the LED devices to the thermal fins and the large area of the thermal fins provides efficient heat output through irradiation and convection. For lamps based on high power LEDs it is also known to use active cooling using fans or synthetic jets or heat pipes or thermoelectric coolers or pumped refrigerant to intensify heat removal.
BRIEF SUMMARY
In some embodiments disclosed here as illustrative examples, a heatsink comprises: a heatsink body, a reflective layer disposed over the heatsink body that has reflectivity greater than 90% for light in the visible spectrum and a protective layer transmissive light arranged on the reflective layer that is transmissive from light to light in the visible spectrum. In some embodiments, the heatsink body comprises a heatsink structural body and a thermally conductive layer disposed over the heatsink structural body, the thermally conductive layer having higher thermal conductivity than the heatsink structural body , the reflective layer being arranged over the thermally conductive layer.
In some embodiments disclosed here as illustrative examples, a heatsink comprises: a heatsink body, a specular reflective layer arranged over the heatsink body.
3/42 lor and a transmissive protective layer of light arranged over the specular reflective layer, the transmissive protective layer of light selected from a group consisting of: a layer of silicon dioxide (S1O2), a layer of silica, a plastic layer and a polymeric layer. In some embodiments, the heatsink body is a plastic or polymeric heatsink body, which optionally includes a copper layer disposed on the plastic or polymeric heatsink body with the specular reflective layer being disposed on the copper.
In some embodiments disclosed here as illustrative examples, a light emitting diode (LED) lamp comprises a heat sink as shown in any of the two immediately preceding paragraphs and an LED module attached with and in thermal communication with the heat sink of heat. The LED-based lamp can have an A-line bulb configuration and also include a diffuser illuminated by the LED module and the heat sink can include fins arranged inside or outside the diffuser with the reflective layer and the transmissive protective layer of light being arranged on at least the fins. The LED-based lamp may comprise a directional lamp, in which the heatsink defines a hollow light-collecting reflector and in which the reflective layer and the transmissive protective layer of light are disposed on at least the inner surface of the hollow collecting reflector of light. In some directional lamps, the heatsink may include inwardly extending fins arranged within the hollow light collecting reflector with the reflective layer and the transmissive protective layer of light being additionally arranged over at least the fins extended inward.
In some embodiments disclosed here as illustrative examples, a light emitting diode (LED) lamp comprises a hollow diffuser, an LED module arranged to illuminate within the hollow diffuser and a heat sink including a plurality of fins in which at least at least some of the fins are arranged inside the hollow diffuser.
In some embodiments disclosed here as illustrative examples, a directional lamp comprises a heatsink purchased
4/42 having a hollow light-collecting reflector having a relatively smaller inlet opening and a relatively larger outlet opening and a light-emitting diode (LED) module optically coupled to the inlet opening, where the heat sink still includes a plurality of fins extending inwardly from an inner surface of the hollow light-collecting reflector.
BRIEF DESCRIPTION OF THE DRAWINGS
Figures 1 and 2 show diagrammatically thermal models for a conventional heatsink using a metal heatsink component (Figure 1) and for a heatsink as revealed here (Figure 2).
Figures 3 and 4 diagrammatically show the side sectional and side perspective views, respectively, of a heatsink suitably used in an MR or PAR lamp.
Figure 5 diagrammatically shows a side sectional view of an MR or PAR lamp including the heat sink in Figures 3 and
4.
Figure 6 shows a diagrammatic side view of the optical / electronic module of the MR or PAR lamp in Figure 5.
Figure 7 shows diagrammatically flowcharts of a manufacturing process suitable for the manufacture of a light heatsink.
Figure 8 marks the thickness of the coating against the equivalent thermal conductivity data for a simplified plate type heatsink portion (for example, a planar fin).
Figures 9 and 10 show thermal performance as a function of the material's thermal conductivity for a loose metal heatsink.
Figure 11 diagrammatically shows a side sectional view of a line A bulb incorporating a heatsink as disclosed here.
Figure 12 shows diagrammatically a perspective view
5/42 side of a variation of the line A bulb in Figure 9, in which the heatsink includes fins.
Figures 13 and 14 show diagrammatically side perspective views of additional modalities of the A-line bulb lamps with fins.
Figure 15 shows calculations for weight and material cost of a PAR-38 heatsink manufactured as disclosed here using copper from a plastic heatsink body, when compared to a loose aluminum heatsink of equal size and shape.
Figures 16 to 20 show perspective views, alternate perspective, side, top and bottom, respectively, of an A19-based LED lamp or LED-based replacement light bulb having a heat sink including a reflective layer and a transmissive protective layer of light arranged on the reflective layer.
Figures 21 and 22 show a sectional side view and a frontal view, respectively, of a directional lamp having reflective heat dissipation fins arranged inside the conical reflector.
Figure 23 shows a side view of a lamp having a line A bulb shape similar to that of Figures 16 to 20, but having internal fins surrounded by a diffuser.
Figure 24 marks several optical parameters and Figures 25 and 26 mark the flow of total heat against the thickness of SiO2 at different scales, for an example described in the text.
DETAILED DESCRIPTION
In the case of incandescent, halogen and HID light sources, all of which are thermal light emitters, the transfer of heat to the air space near the lamp is controlled by the design of the radioactive and convective thermal trajectories in order to reach a temperature elevated target during light source operation. In contrast, in the case of LED light sources, photons are not thermally excited, but are preferably generated by the recombination of electrons with holes in the p-n junction of a semiconductor. Both the performance and duration of the light sources
6/42 are optimized by minimizing the operating temperature of the p-n junction of the LED, preferably than operating at a high target temperature. By providing a heatsink with fins or other structures to increase the surface area, the surface for convective and radioactive heat transfer is enhanced.
Referring to Figure 1, a finned MB metal heatsink is shown diagrammatically by a block and the MF fins on the heatsink are shown diagrammatically by a dashed oval. The surface through which heat is transferred to the surrounding environment by convection and / or irradiation is referred to here as the heat dissipating surface (for example, the MF fins) and must be of a large area to provide sufficient heat dissipation for LD LED devices in steady state operation. The dissipation of convective and radioactive heat to the environment from the MF heat dissipation surface can be modeled in the steady state by thermal resistances Rconvection θ Laugh, respectively or, equivalently, by thermal conductances. The Rconvection resistance models the convection of the outer surface of the heat sink to the surrounding environment by natural or forced air flow. The Rir resistance models the infrared (IR) radiation from the outer surface of the heat sink to the remote environment. In addition, a thermal conduction path (represented in Figure 1 by the Respaihador resistors θ Rconductor) is in series between the LD LED devices and the MF heat dissipation surface, which represents the thermal conduction of the LD LED devices to the heat dissipation MF. A high thermal conductance for this series thermal conduction path ensures that the heat output from LED devices to the nearby air via the heat dissipation surface is not limited by the series thermal conductance. This is typically accomplished by constructing the MB heatsink as a relatively massive block of metal having a finned or otherwise intensified surface area MF defining the heat dissipating surface - the metal heatsink body provides high desired thermal conductance between the LED devices and the surface
7/42 heat dissipation. In this design, the heat dissipation surface is inherently in continuous and intimate thermal contact with the metal heat sink body that provides the high thermal conductance path.
Thus, the conventional heat dissipation for LED-based lamps includes the MN heat sink comprising a metal block (or metal alloy) having the large MF thermal dissipation surface area exposed to the nearby air space. The metal heat sink body provides a high thermal conductive Rconducting path between the LED devices and the heat dissipating surface. The Rconductor resistance in Figure 1 models the conduction through the MB metal heatsink body. The LED devices are mounted on a metal core circuit board or other support including a heat spreader, and the heat from the LED devices leads through the heat spreader to the heat sink. This is modeled by the resistor R _eS paihador. In addition to the heat dissipation into the environment through the heat dissipation surface (resistances R _CO nvection θ Laugh), there is typically also some thermal output (ie heat dissipation) through the Edison base or another lamp connector or LB lamp base (shown diagrammatically in the model in Figure 1 by a dashed circle). This thermal output through the LB lamp base is represented in the diagrammatic model of Figure 1 by the resistor Sink, which represents the conduction through a solid or heat pipe to the remote environment or to the construction infrastructure. However, it is recognized here that, in the common case of an Edison type base, the LB base's thermal conductance and temperature limits will limit the heat flow through the base to approximately 1 watt. In contrast, for LED-based lamps designed to produce lighting for indoor spaces, such as rooms, or for outdoor lighting, the heat output to be dissipated is typically around 10 watts or higher. Thus, it is recognized here that the base of the LB lamp cannot provide the primary heat dissipation path. Preferably, the heat output of LD LED devices is predominant
8/42 via conduction through the metal heatsink body to the external heat sink surface of the heatsink where heat is dissipated into the surrounding environment by convection (Rconvection) and (to a lesser extent) irradiation (Laugh). The heat dissipation surface can be finned (for example, MF fins in diagrammatic Figure 1) or otherwise modified to intensify its surface area and therefore increase heat dissipation.
Such heat sinks have some disadvantages. For example, heatsinks are heavy due to the large volume of metal or metal alloy comprising the MB heatsink. A heavy metal heatsink can put mechanical stress on the base and socket, which can result in failure and, in some failure modes, an electrical hazard. Another concern with such heat sinks is the cost of manufacture. Machining, casting or molding a loose metal heatsink component can be expensive and, depending on the choice of metal, the cost of the material can also be high. In addition, the heatsink is sometimes used as a housing for electronics, either as a mounting point for the Edison base or as a support for the circuit board of LED devices. These applications require the heat sink to be machined, cast or molded with some precision, which again increases the manufacturing cost.
The inventors analyzed these problems using the simplified thermal model shown in Figure 1. The thermal model in Figure 1 can be expressed algebraically as a series-parallel circuit of thermal impedances. In the steady state, all transient impedances, such as the thermal mass of the lamp itself, or the thermal masses of objects in the immediate environment, such as lamp connectors, wiring and structural bezels, can be treated as thermal capacitances. Transient impedances (ie, thermal capacitances) can be ignored in the steady state, just as electrical capacitances are ignored in DC electrical circuits and only resistances need to be considered. The total thermal resistance Rérmica between the LED devices and the environment
9/42 _ η ^{1 1 1} ^ thermal ~~ ^ spreader ^ conduction Μη η ρ I can be written as where: Ripple is the thermal resistance of heat passing through the Edison connector (or other lamp connector) to the ambient electrical wiring , Rconvection θ the thermal resistance of heat passing from the heat dissipation surface to the surrounding environment by transferring convective heat, Rir is the thermal resistance of heat passing from the heat dissipating surface to the surrounding environment by transferring radioactive heat and R _esp aihador + Rconduction is the series thermal resistance of the heat passing from the LED devices through the heat spreader (Respaihador) θ through the metal heat sink body (Rconduction) to reach the heat dissipation surface. It should be noted that for the term 1 / Ripple, the corresponding series thermal resistance is not precisely R _eS paihador + Rconduction, since the series thermal path is for the lamp connector instead of the heat dissipating surface - however, since the thermal conductance 1 / wattage through the base connector is small for a typical lamp, this error is negligible. In reality, a simplified model neglecting heat dissipation through the entire base / V ¹
D. - P 4 * R 4-1 ------------ 4- —__ 'thermal' spreader conduction I n η ^nly can be written as ^Viw * · _
This simplified equation shows that the thermal resistance in series Rconduction through the heatsink body is a control parameter of the thermal model. In reality, this is a justification for the conventional heatsink design using the loose metal heatsink MB - the heatsink body provides a very low value for the thermal resistance in series Rconduction- In view of the foregoing, it is recognized that it would be desirable to obtain a heat sink that has a low thermal resistance in series Rconduction, while simultaneously having reduced weight (and, preferably, reduced cost) when compared to a conventional heat sink.
One way this could be done is to intensify the dissipation of thermal heat through the base, so that this path can be intensified to provide a heat dissipation rate of
10/42 watts or higher. However, in light source retrofit applications where an LED lamp is used to replace a conventional incandescent or halogen or fluorescent or HID lamp, the LED replacement lamp is mounted on a conventional base or socket or type lamp originally designed for an incandescent, halogen or HID lamp. For such a connection, the thermal resistance to the building infrastructure or to the remote environment (for example, earth soil) is large compared to Rconvection or Rir, so that the thermal path to the environment through convection and irradiation dominates.
In addition, due to the relatively low operating temperature of the steady state of the LED array, the irradiation path is typically dominated by the convection path (ie, Rconvection <Laugh), although in some cases they are comparable. Therefore, the dominant thermal path for a typical LED-based lamp is the series thermal circuit comprising Rconduction θ Rconvection · Therefore, it is desired to provide a low thermal resistance in series Rconduction θ Rconvection, while reducing the weight (and, preferably, the cost) of the heat sink.
The present inventors have carefully considered from the point of view of first principles the problem of removing heat in an LED-based lamp. It is recognized here that, of the parameters typically considered of significance (heat sink volume and mass, heat sink thermal conductance, heat sink surface area and the removal and dissipation of conductive heat through the base), the two attributes dominant design factors are the thermal conductance of the path between the LEDs and the heat sink (ie Rconduction) θ 3 external surface area of the heat sink for transferring convective and radioactive heat to the environment (which affects Rconvection θ Laugh) ·
The further analysis can proceed through a process of elimination. The heat sink volume is of importance only since it affects the heat sink's thermal conductance and surface area
11/42 of the heat sink. The mass of the heat sink is important in transient situations, but it does not strongly affect the heat removal performance in the steady state, which is what is of interest in a continuous operation lamp, except to the extent that the heat sink body metal heat 5 provides low series resistance Rconduction- The heat dissipation path through the base of a replacement lamp, such as a PAR or MR or reflector or A-line lamp, may be important for lower power lamps - however, the thermal conductance of an Edison base is only sufficient to produce approximately 110 watts of heat dissipation into the environment (and other types of bases, such as pin-type bases are likely to have comparable or even thermal conductance conductive heat dissipation through the base into the environment is therefore not expected to be of primary importance for lamina commercially viable LED-based powders that are assumed to generate heating load up to several orders of magnitude higher in the steady state.
With reference to Figure 2, based on the foregoing, an improved heatsink is disclosed here, comprising a lightweight LB heatsink body, which is not necessarily thermally conductive, and a thermally conductive layer CL arranged over the heatsink body. to define the heat dissipation surface. The heatsink body is not part of the thermal circuit (or, optionally, it can be a minor component via some thermal conductivity of the heatsink body) - however, the LB 25 heatsink body defines the shape of the layer thermally conductive CL which defines the heat dissipation surface. For example, the LB heatsink body may have LF fins that are coated by the thermally conductive layer CL. Because the LB heatsink body is not part of the thermal circuit (as shown in Figure 2), it can be designed for manufacturing capabilities and properties, such as structural integrity and low weight. In some embodiments, the LB heat dissipating body is a molded plastic component comprising a plastic that is thermally insulated or has relatively low thermal conductivity.
The thermally conductive layer CL arranged over the body of the LB light heatsink performs the functionality of the heat dissipation surface, and its performance in terms of heat dissipation to the surrounding environment (quantified by the thermal resistances Rconvection θ Laugh) is substantially the same as in the conventional heat sink modeled in Figure 1. In addition, however, the thermally conductive layer CL defines the thermal path of the LED devices to the heat dissipation surface (quantified by the series resistance Rconduction) - This is also shown diagrammatically in Figure 2. To achieve a sufficiently low value for Rconduction, the thermally conductive layer CL must have a sufficiently large thickness (since Rconduction decreases with increasing thickness) and must have a sufficiently high material thermal conductivity (since Rconduction also decreases with cres thermal conductivity of the material). It is disclosed here that, by the proper selection of the material and thickness of the thermally conductive layer CL, a heat sink comprising a light heat sink body LB (and possibly thermally insulating) and a thermally conductive layer CL disposed on the body of the heat sink. heat and defining the heat dissipation surface can have heat dissipation performance comparable to, or better than, an equivalent sized and formed loose metal heat sink, while simultaneously being substantially lighter, and cheaper to manufacture, than than the equivalent loose metal heat sink. Again, it is not merely the surface area available for dissipating radioactive / convective heat into the environment that is determinant of the performance of the heat sink, but also the thermal conductance of the heat across the outer surface defined by the heat dissipation layer (ie , corresponding to the resistance in series Rcondução) that is in thermal communication with the environment. Higher surface conductance encourages more efficient heat distribution over the entire heat dissipating surface area and therefore promotes the dissipation of radioactive and convective heat into the environment.
13/42
In view of the foregoing, heatsink embodiments are disclosed here that comprise a heatsink body and a thermally conductive layer disposed in the heatsink body at least on (and defining) the heatsink's heat dissipation surface . The material of the heatsink body has a lower thermal conductivity than the material of the thermally conductive layer. In fact, the heatsink body can even be thermally insulating. On the other hand, the thermally conductive layer must have (i) an area and (ii) a thickness and (iii) be made of a material of sufficient thermal conductivity so that it provides the dissipation of radioactive / convective heat to the environment that be sufficient to maintain the semiconductor pn junctions of the LED devices of the LED-based lamp at or below a specified maximum temperature, which is typically below 200 ° C and sometimes below 100 ° C.
The thickness and thermal conductivity of the thermally conductive layer material together define a thermal sheet conductivity of the thermally conductive layer, which is analogous to an electrical sheet conductivity (or, conversely, an electrical sheet resistance). A thermal sheet resistance ^d can be defined, where p is the thermal resistivity of the material and σ is the thermal conductivity of the material and d is the thickness of the thermally conductive layer. The inversion produces the conductance of the thermal sheet K _s = σ. d. Thus, an exchange can be made between the thickness of the thermal conductivity of the material σ of the thermally conductive layer. For materials with high thermal conductivity, the thermally conductive layer can be manufactured thin, which results in reduced weight, volume and cost.
In the embodiments disclosed here, the thermally conductive layer comprises a metallic layer, such as copper, aluminum, various alloys of them and so on, which is deposited by electroplating, vacuum evaporation, crackling, physical vapor deposit (PVD), deposit of plasma-enhanced chemical vapor (PECVD) or other suitable layer forming technique operable at a sufficiently low temperature14 / 42 to be thermally compatible with plastic or other material from the heatsink body. In some illustrative embodiments, the thermally conductive layer is a copper layer that is formed by a sequence including chemical galvanization followed by electrogalvanization. In other embodiments, the thermally conductive layer comprises a non-metallic thermally conductive layer, such as boron nitride (BN), a layer of carbon nanotubes (CNT), a thermally conductive oxide and so on.
The heatsink body (ie, the heatsink not including the thermally conductive layer) does not strongly impact the removal of heat, except as it defines the shape of the thermally conductive layer that performs the heat spread (quantified by resistance in series R _CO nduction in the thermal model of Figure 2) and defines the heat dissipation surface (quantified by resistances Rconvection θ 15 Laugh in the thermal model of Figure 2). The surface area provided by the heatsink body affects subsequent heat removal via irradiation and convection. As a result, the heat sink body can be chosen to achieve desired characteristics, such as low weight, low cost, structural rigidity or strength, thermal strength (for example, the heat sink body must withstand operating temperatures without melt or improperly soften), ease of fabrication, maximum surface area (which in turn controls the surface area of the thermally conductive layer) and so on. In some illustrative embodiments disclosed here, the heatsink body is a molded plastic element, for example, made of polymeric material, such as poly (methyl methacrylate), nylon, polyethylene, epoxy resin, polyisoprene, sbs rubber, polydicyclopentadiene , polytetrafluoroethylene, poly (phenylene sulfide), poly (phenylene oxide), silicone, polyketone, thermoplastics and so on, the heatsink body can be shaped to have fins or other surface area / convection enhancement structures / heat radiation.
To minimize the cost, the heatsink body is preferred.
15/42 formed using a one-step molding process and therefore has a uniform material consistency and is uniform everywhere (as opposed, for example, to a heatsink body formed by multiple molding operations using different molding materials, such that the heatsink body has a consistency of non-uniform material and is not uniform everywhere) and preferably comprises a low-cost material. For the latter purpose, the material of the heatsink body preferably does not include any metal filler material and most preferably does not include any electrically conductive filler material and even more preferably does not include any filler material at all. However, it is also considered to include a metal filler or other filler, such as dispersed metallic particles, to provide some enhancement of thermal conductivity or non-metallic filler particles to provide enhanced mechanical properties.
In the following, some illustrative modalities are described.
Referring to Figures 3 and 4, a heatsink 10 has a suitable configuration for use in a MR or PAR type LED based lamp. The heatsink 10 includes a heatsink body 12 made of plastic or other suitable material as already described and a thermally conductive layer 14 disposed on the heatsink body.
12. The thermally conductive layer 14 can be a metallic layer, such as a copper layer, an aluminum layer, or various alloys thereof. In illustrative embodiments, the thermally conductive layer 14 comprises a copper layer formed by chemical galvanization followed by electrogalvanization.
As best seen in Figure 4, heatsink 10 has fins 16 to enhance the final removal of radioactive and convective heat. Instead of the illustrated fins 16, other surface area enhancing structures could be used, such as multi-segment fins, rods, micro / nanoscale surface and volume aspects and so on, the heatsink body 12 illustrative defines the dissi
16/42 heater 10 as a generally tapered hollow heatsink having inner surfaces 20 and outer surfaces 22. In the embodiment shown in Figure 3, the thermally conductive layer 14 is arranged on both inner surfaces 20 and outer surfaces 22. Alternatively, the thermally conductive layer can be arranged on only the external surfaces 22, as shown in the alternative heat sink mode 10 'of Figure 7.
Referring further to Figures 3 and 4 and with additional reference to Figures 5 and 6, the generally tapered hollow illustrative heatsink 10 includes a hollow apex 26. An LED module 30 (shown in Figure 6) is suitably disposed at apex 26 , as shown in Figure 5, in order to define a lamp based on MR or PAR. The LED module 30 includes one or more (and in the illustrative example three) light-emitting diode (LED) devices 32 mounted on a metal core printed circuit board (MCPCB) 34 in thermal communication with a heat spreader 36 , which may alternatively comprise a metal layer of MCPCB 34. The illustrative LED module 30 further includes a threaded Edison base 40; however, other types of bases, such as a bayonet pin type base or a flexible electrical connector, can be replaced on the illustrative Edison base 40. The illustrative LED module 30 still includes 42 electronics. The electronics can comprise a Included electronics 42, as shown, or can be electronic components arranged at the hollow apex 26 of the heatsink 20 without a separate housing. The electronics 42 adequately comprise a set of power supply circuits to convert the AC electric power (for example, 110 volts US residential, 220 volts US industrial or European and so on) to DC voltage (typically lower) suitable for operating the LED devices 32. Electronics 42 can optionally include other components, such as electrostatic discharge protection (ESD) circuitry, a fuse or other safety circuitry, lighting dimming circuitry, and so on.
As used here, the term LED device should be understood to encompass naked semiconductor integrated circuits of inorganic or organic LEDs, encapsulated semiconductor integrated circuits of inorganic or organic LEDs, LED integrated circuit packages in which the LED integrated circuit it is mounted on one or more intermediate elements, such as a sub-frame, a conductor frame, a surface bezel support and so on, inorganic or organic LED semiconductor integrated circuits that include a length-conversion phosphor coating wave with or without an encapsulant (for example, a blue or violet LED integrated circuit or 10 an ultraviolet coated with yellow, white, amber, green, orange, red or other phosphorus designed to cooperatively produce white light), inorganic LED devices or organic multiple integrated circuits (for example, a white LED device including three LED integrated circuits emitting red, green and blue and possibly other colors of light, respectively, so as to collectively generate white light) and so on. The one or more LED devices 32 can be configured to collectively emit a beam of white light, a beam of yellowish light, a beam of red light or a beam of light of substantially any other color of interest for a given lighting application. 20 It is also considered that the one or more LED devices 32 include LED devices emitting light of different colors and that the electronics 42 includes suitable circuitry to independently operate LED devices of different colors to produce an adjustable color output.
The heat spreader 36 provides the thermal communication of the LED devices 32 with the thermally conductive layer 14. A good thermal coupling between the heat spreader 36 and the thermally conductive layer 14 can be achieved in several ways, such as by welding, adhesive thermally conductive, a firm mechanical option optionally aided by the high thermal conductivity pad between the LED module 30 and the apex 26 of the heatsink 10 and so on. Although not illustrated, it is considered to have the thermally conductive layer
18/42 also being arranged on the inner diameter surface of the apex 26 to provide or intensify the thermal coupling between the heat spreader 36 and the thermally conductive layer 14.
With reference to Figure 7, an appropriate manufacturing approach is presented. In this approach, the heatsink body 12 is first formed in an operation S1 by a suitable method, such as molding, which is convenient for forming the heatsink body 12 in the modalities in which the heatsink body Heat 12 comprises a plastic or other polymeric material. Other approaches to forming the heatsink body 12 include casting, extrusion (in the case of a cylindrical heatsink, for example) and so on. In an optional S2 operation, the molded heatsink body surface is processed by applying a polymeric layer (typically around 2-10 microns, although greater or lesser thicknesses are also considered), carrying out surface wrinkling or by application of another surface treatment. The optional S2 surface processing operation (or operations) can perform several functions, such as stimulating the adhesion of subsequently galvanized copper, providing stress relief and / or intensifying the surface area for heat dissipation into the environment. In the last point, due to the wrinkling or corrosion of the plastic heatsink body surface, the subsequently applied copper covering will follow the wrinkling or corrosion, in order to provide a greater heat dissipation surface.
In operation S3, an initial layer of copper is applied by chemical galvanizing. Chemical galvanizing can be carried out advantageously in an electrically insulating heatsink body (for example, plastic). However, chemical galvanizing has a slow deposit rate. Design considerations presented here, especially providing sufficiently low thermal conductivity in series, motivate the use of a layer of galvanized copper, the thickness of which is in the order of a few hundred microns. In this way, chemical galvanizing is used to deposit an initial copper layer
19/42 (preferably having a thickness not greater than 50 microns, in some embodiments, less than ten microns and in some embodiments having a thickness of approximately 2 microns or less), so that the plastic body of the heat sink with this initial copper layer is electrically conductive. The initial chemical galvanizing S3 is then followed by an electrogalvanizing operation S4 that quickly deposits the balance of the copper layer thickness, for example, typically a few hundred microns. Electroplating S4 has a much higher deposit rate when compared to chemical galvanizing S3.
A problem with the copper coating is that it can stain, which can have an adverse impact on the thermal transfer of heat dissipation from the surface to the environment and can also be aesthetically unpleasant. Thus, in an optional S5 operation, a suitable passivation layer is optionally deposited on copper, for example, by electroplating a passivation metal, such as nickel, chromium or platinum, or a passivating metal oxide, on copper. . The passivation layer, if provided, is typically less than 50 microns thick, in some embodiments no more than ten microns, and in some embodiments, approximately two microns or less in thickness. An optional S6 operation (or operations) can also be performed, to provide various surface intensifications, such as surface wrinkling, application of an optically thick powder coating, such as a metal oxide powder (for example, dioxide powder titanium, aluminum oxide powder or a mixture of these and so on), an optically thick paint or lacquer or varnish and so on. These surface treatments are designed to enhance the heat transfer from the heat dissipating surface to the environment through enhanced convection and / or irradiation.
With reference to Figure 8, simulation data is shown to optimize the thickness of the thermally conductive layer for a thermal conductivity of the material in a range of 200 - 500 W / m-K, which
20/42 are typical thermal conductivities of copper material for various types of copper. (It is to be noted that, as used here, the term copper is intended to cover various copper alloys or other variations of copper), the heatsink body in this simulation has a material thermal conductivity of 2 W / mK, but it turns out that the results are only weakly dependent on that value. The values in Figure 8 are for a simplified plate heatsink having a length of 0.05 m, a thickness of 0.0015 m and a width of 0.01 meters, with thermally conductive material lining both sides of the plate. This may correspond, for example, to a portion of the heat sink, such as a planar fin, defined by the plastic body of the heat sink and galvanized with 200-500 W / m-K thick copper. It is observed in Figure 8 that for the 200 W / m-K material, a copper thickness of approximately 350 microns provides an equivalent thermal conductivity (magnitude) of 15 100 W / m-K. In contrast, a 500 W / m-K material that is more thermally conductive, a thickness less than 150 microns is sufficient to produce an equivalent thermal conductivity (magnitude) of 100 W / m-K. Thus, a layer of galvanized copper having a thickness of a few hundred microns is sufficient to produce a stable state performance related to the conduction of heat and removal of the subsequent heat into the environment via irradiation and convection which is comparable with the performance of a loose metal heatsink made of a metal having thermal conductivity of 100 W / mK.
In general, the thermal conductance of the foil of the thermally conductive layer 14 should be high enough to ensure that the heat from the LED devices 32 is spread evenly across the radiating / heat convection surface area. In the simulations performed by the inventors, it was found that the improved performance with increasing thickness of the thermally conductive layer 14 (for a given thermal conductivity of the material) levels after the thickness exceeds a certain level (or more precisely, the performance curve against thickness decays approximately exponentially). Without being limited to
21/42 any particular theory of operation, it is believed that this is due to the heat dissipation for the environment to become limited at higher thicknesses by the radioactive / convective thermal resistance Rconvection θ Laugh, rather than by the thermal resistance Rconduction of the transfer of heat through the thermally conductive layer. In other words, the thermal resistance in series Rconduction becomes insignificant compared to Rconvection and Laugh θητι higher layer thicknesses.
With reference to Figures 9 and 10, a leveling performance similar to the increasing thermal conductivity of the material is observed in thermal simulations of a loose metal heatsink. Figure 9 shows results obtained by generating the simulated thermal image of a loose heatsink for four different material thermal conductivities: 20 W / mk, 40 W / mk, 60 W / mk and 80 W / mk. The temperature on the printed circuit board on which the LEDs are mounted (T _p i _aC a) for each simulation is marked in Figure 9. It is observed that the Tpiaca temperature drop begins to level at 80 W / mk. Figure 10 marks the temperature T _p i _aC a against the thermal conductivity of the material of the loose heat sink material for extreme thermal conductivities up to 600 W / mk, which shows a substantial performance leveling over the range of 100-200 W / mk . Without being limited by any particular theory of operation, it is believed that this is due to the dissipation of heat for the environment to become limited at higher material conductivities (magnitude) by the radioactive / convective thermal resistance Rconvection and Laugh, rather than by thermal resistance Conduction of heat transfer through the thermally conductive layer. In other words, the thermal resistance in series Rconduction becomes insignificant compared to Rconvection θ Laugh ^at high thermal conductivity of the material (magnitude).
Based on the foregoing, in some embodiments considered, the thermally conductive layer 14 has a thickness of 500 microns or less and a thermal conductivity of 50 W / m-k or greater. For copper layers of higher material thermal conductivity, a substantially thinner layer can be used. For example, typical aluminum
22/42 has a thermal conductivity (magnitude) of approximately 100-240 W / mk, depending on the composition of the alloy. From Figure 8, it is observed that the heat dissipation performance exceeding that of a loose aluminum heatsink is attainable for a 500 W / mk copper layer having a thickness of approximately 150 microns or thicker. The heat dissipation performance exceeding that of a loose aluminum heatsink is attainable for a 400 W / mk copper layer having a thickness of approximately 180 microns or thicker. The heat dissipation performance exceeding that of a loose aluminum heatsink is attainable for a 300 W / mk copper layer having a thickness of approximately 250 microns or thicker. The heat dissipation performance exceeding that of a loose aluminum heatsink is attainable for a 200 W / mk copper layer having a thickness of approximately 370 microns or thicker. In general, the thermal conductivity of the material and the thickness of the layer reduce according to the conductivity of the thermal sheet K _s = σ. d.
With reference to Figures 11 and 12, the revealed aspects of the heatsink can be incorporated into various types of LED-based lamps.
Figure 11 shows a side sectional view of an A-line bulb of a type that is suitable for retrofitting incandescent A-line bulbs, the heatsink body 62 forms a structural foundation and can be properly fabricated as a plastic element molded, for example, made of a polymeric material, such as polypropylene, polycarbonate, polyimide, polyetherimide, poly (methylmethacrylate), nylon, polyethylene, epoxy resin, polyisoprene, sbs rubber, polydicyclopentadiene, polytetrafluoroethylene, poly (phenylene sulfide) , poly (phenylene oxide), silicone, polyketone, thermoplastics and so on. A thermally conductive layer 64, for example, comprising a copper layer, is disposed on the heatsink body 62. The thermally conductive layer 64 can be manufactured in the same way as the thermally conductive layer 14 of the MR / PAR lamp modalities of Figures 323/42 and 7, for example, according to operations S2, S3, S4, S5, S6 of Figure 8.
A section of the lamp base 66 is secured with the heatsink body 62 to form the lamp body. The lamp base section 66 includes a threaded Edison base 70 similar to the Edison base 40 of the MR / PAR lamp modalities in Figures 3-5 and 7. In some embodiments, the heatsink body 62 and / or the lamp base 66 defines a hollow region 71 that contains electronics (not shown) that converts the electrical force received at the Edison base 70 into a suitable operating force to drive the LED devices 72 that produce the light output from the lamp. LED devices 72 are mounted on a metal core printed circuit board (MCPCB) or other heat spreading support 73 that is in thermal communication with the thermally conductive layer 64. A good thermal coupling between the heat spreader 73 and the thermally conductive layer 64 can optionally be enhanced by welding, thermally conductive adhesive and so on.
To produce a substantially omnidirectional light output over a large solid angle (for example, at least 2π steroradians) a diffuser 74 is arranged over LED devices 72. In some embodiments, diffuser 74 may include (for example, be coated with ) a wavelength conversion phosphor. For LED devices 72 producing a substantially Lambertian light output, the illustrated arrangement in which the diffuser 74 is substantially spheroidal or ellipsoidal and the LED devices 72 are located on a periphery of the diffuser 74 intensifies, in an omnidirectional way, the output illumination .
Referring to Figure 12, a varied line A bulb lamp is shown, which includes the base section 66 with the Edison 70 base and the bulb diffuser 74 of Figure 11 and also includes LED devices 72 (not visible in the side view of Figure 12). The lamp in Figure 12 includes a heatsink 80 analogous to heatsink 62, 64 of the lamp in Figure 11 and which has a heatsink body (not visible in view
24/42 side of Figure 12) which is coated with the thermally conductive layer 64 (indicated by the cross hatch in the side perspective view of Figure 12) disposed on the heatsink body. The lamp in Figure 12 differs from the lamp in Figure 11 in that the heatsink body of the heatsink 80 is formed to define fins 82 that extend over portions of diffuser 74. Instead of the illustrative fins 82, the body of the heatsink heat can be shaped to have other heat surface / convection / radiation intensifying structures.
In the embodiment of Figure 12, the heatsink body of the heatsink 80 and the diffuser 74 are considered to comprise a single unit molded plastic element. In this case, however, the only unitary molded plastic element must be made of an optically transparent or translucent material (so that the diffuser 74 is transmissive of light). In addition, if the thermally conductive layer 64 is optically absorbent to the light output of the lamp (as is the case for copper, for example), then as shown in Figure 12, the thermally conductive layer 64 should only cover the heat sink 80 and not the diffuser 74. This can be accomplished by adequately masking the diffuser surface during the chemical S3 coating operation, for example. (The S4 electroplating operation galvanizes copper only on the conductive surfaces - thus, masking during the S3 chemical coppering operation is sufficient to prevent electroplating on the 74 diffuser).
Figures 13 and 14 show alternative heatsinks 80 ', 80 that are substantially the same as the heatsink 80, except that the fins do not extend much over the diffuser 74. In these embodiments, the diffuser 74 and the heatsink body heat sink 80 ', 80 can be separately molded elements (or otherwise manufactured separately), which can simplify the processing to arrange the thermally conductive layer 64 on the heat sink body.
Figure 15 shows calculations for weight and material cost of a
25/42 Illustrative PAR-38 heatsink manufactured as disclosed here using copper from a plastic heatsink body when compared to a loose aluminum heatsink of equal size and shape. This example assumes a gal5 polypropylene heat sink body vanished with 300 microns of copper. The material costs shown in the
Figure 15 are estimates only. The weight and cost of the material are both reduced by approximately half when compared to the equivalent loose aluminum heatsink. Additional cost reduction is expected through reduced manufacturing processing costs.
Attention is now focused on the combined optical and optical / thermal aspects of revealed heatsinks.
Referring to Figures 16-20, a lamp based on
Type A19 LED or LED-based replacement light bulb is described15. The illustrative lamp mode, which is suitable for use as an LED-based light bulb, is shown in Figures 16-20 (showing perspective, alternate, side, top and bottom views, respectively). The illustrated LED lamp includes a diffuser 110; a finned heatsink 112 and a base 114. An Edison base is shown in the illustrated embodiment; however, a GU, a type of bayonet or another type of base is also considered. Diffuser 110 is similar to diffuser 74 in Figure 11, but has an ovoid shape that has been found to provide improved omnidirectional lighting. The heatsink 112 includes fins that extend over a portion of the diffuser 110 and the heatsink 112 also includes a body portion BP (marked in Figures 17 and
18) that houses the power conditioning electronics (not shown) that converts the 110V AC input electrical power (or 220V AC, or other selected input electrical power) to the appropriate electrical power to drive the LEDs that insert light in an opening of diffuser 110. The diffuser 30 110 is illuminated by an LED-based light source arranged in the opening similarly to the arrangement shown in Figure 11 for the spherical diffuser 74. The diffuser 110 illustrated has an ovoid shape with a single axis geometrical26 / 42 symmetry located along the N direction of the elevation or latitude coordinate Θ = 0 corresponding to the geographic north or N. The illustrative ovoid diffuser 110 has rotational symmetry around the geometric axis of symmetry or the N direction. The illustrative ovoid 110 comprises an ovoid invention having a hollow interior, and is suitably made of glass, transparent plastic and so on. Alternatively, the ovoid diffuser is considered to be a solid component comprising a light transmissive material, such as glass, transparent plastic and so on. The ovoid diffuser 110 may also optionally include phosphor of 10 wavelength conversion disposed on or in the diffuser, or inside the diffuser. Diffuser 110 is made light diffuser by any suitable approach, such as surface texture and / or light scattering particles dispersed in the ovoid shell material and / or light scattering particles arranged on a surface of the ovoid shell and so on. against. The ovoid diffuser 110 has an egg shape and includes a relatively narrower close section near the BP body portion of the heatsink 112, and a relatively wider distal section than the BP body portion of the heatsink 112. The fins of the heatsink 112 produce relatively less optical losses for the distal section of the diffuser 110 20 when compared to the nearby section. Because the fins of the heatsink 12 have a substantially limited extent in the longitudinal direction (φ), the fins 120 are expected not to strongly impact the distribution of omnidirectional lighting in the longitudinal direction. However, measurements performed by the inventors indicate that the fins actually produce some reduction in light output, especially at angles directed downwards, that is, in a direction more than 90 ° away from the north N direction. Without being limited by any theory of operation, it is believed that these optical losses are due to light absorption, light scattering or a combination of these caused by the fins. Furthermore, the BP body portion 30 of the heatsink 112 (or, more generally, the lamp body portion) still limits the amount of omnidirectional lighting in the downward direction. It was found that the ovoid shape of the ovoid diffuser
27/42
110 reduces the optical loss caused by the fins of the heatsink 112. In short, the ovoid shape increases the surface area of the relatively narrower proximal section, in order to increase the light output in the downward direction when compared to the distal section. smaller area in order to compensate for the optical losses caused by the heatsink 112 and generate more omnidirectional lighting (as this term is generally used in the technique, for example, in the Energy Star® Program Requirements for integral LED lamps, finished in December 3, 2009).
The preceding optical analysis assumes that heatsink 112 has diffusely reflecting surfaces. Referring again to Figure 7, the optional S6 operation (or operations) may include applying a white powder coating, such as a metal oxide powder (for example, titanium dioxide powder, aluminum oxide powder or a mixture of these and so on). Such a white powder produces a reflective surface.
However, it is recognized here that such a reflective surface provides very diffuse reflection, with only a few percentages of incident light being reflected in a specular manner (and thus forming a visually perceived reflection) and the rest being reflected diffusely, while a very small percentage is absorbed. In addition, the white powder can interfere with the dissipation of convective / radioactive heat produced by the heat sink. In quantifying the amount of specular reflection against diffuse, it is convenient to adopt the definition of Total Integrated Disperser (TIS) (see, for example, OPTICAL SCATTERING, John C. p ^TIS = - ^ 7i
D * p
Stover, page 23, SPIE Pressurization, 1995) given by ', where P, is the power incident on a surface, typically in normal incidence, R is the total reflectance of the surface and P _s is the dispersed power, integrated over all angles not covered by the specular reflectance angle. Typically, the angular integration of the scattered light is performed for all angles greater than some small angle that is typically ~ a few degrees or less. For general lighting systems such as
28/42 lamps and luminaires, the intensity distribution in the beam pattern is typically controlled with precision -Ta 5 ^o . Therefore, in such applications, the angular integration of scattered light in the definition of TIS would include scattering angles that exceed ~ T.
With particular reference to Figure 18, an embodiment of the heatsink surface is shown by means of a small illustrative sectional view V of a portion of one of the heatsink fins 112. The illustrative heatsink includes a hinge fin body. plastic heatsink 200 which is part of the plastic heatsink body, as already described, the heatsink fin body 200 is coated on both external surfaces by a layer of electrogalvanized copper 202, for example, properly formed on the heatsink fin body 200 by operations S2, S2, S3, S4, as described with reference to Figure 7. The copper layer 202, for example, may be approximately 300 microns thick or may be of another suitable thickness determined on the basis of Figure 8 or another appropriate design approach. The copper layer 202 is coated with a reflective layer 204, such as a silver layer, by electroplating or other suitable approach. The reflective layer 204 must be of sufficient thickness that the incident light is reflected without an evanescent wave reaching the copper layer 202. If the reflective layer 204 is silver, a thickness of approximately 1 micron is sufficient, although a thicker layer or a slightly thinner layer is also suitable. A light transmissive protective layer 206 is disposed over the reflective layer 204. The light transmissive protective layer 206 may comprise, for example, a light transmissive plastic layer or another light transmissive polymer layer or a glass layer or transmissive silica or a light transmissive ceramic layer.
The light transmissive protective layer 206 provides passivation for the reflective layer 204. For example, if the reflective layer 204 is silver, it will dazzle in the absence of the protective layer 206 and such dazzle greatly reduces the reflectivity of silver.
29/42
The light transmissive protective layer 206 must also be optically transparent to the light from the lamp emitted from diffuser 110. In this way, light striking the surface of the heat sink 112 passes through the light transmissive protective layer 206, reflects off the layer. reflective 204 and the reflected light passes back through the transmissive protective layer of light 206 as a reflection. In some embodiments, the reflective layer 204 has a smooth mirror surface, such that the multilayer structure 204, 206 produces the specular reflection that obeys Snell's law (that is, the angle of reflection equals the angle of incidence, both being measured outside the normal of the surface). In some embodiments, the multilayer structure 204, 206 including the reflective layer 204 and the light transmissive protective layer 206 comprises a specular reflector having less than 10% light scattering. In some embodiments, the multilayer structure 204, 206 including the reflective layer 204 and the light transmissive protective layer 206 comprises a specular reflector having less than 5% light scattering. In some embodiments, the multilayer structure 204, 206 including the reflective layer 204 and the light transmissive protective layer 206 comprises a specular reflector having less than 1% light scattering. Although a specular reflector has substantial advantages, the multilayer structure 204, 206 including reflective layer 204 and light transmissive protective layer 206 is also considered to be a more diffuse reflector, for example, having substantially more than 10% light scattering (but preferably with high reflectivity).
The light transmissive protective layer 206 also impacts the thermal characteristics of heat sink 112. In order to both achieve high optical transparency and limit thermal impact, the light transmissive protective layer 206 would be expected to be made as thin as practicable while while still providing the desired surface protection. Under such guidelines, the protective layer could be made as thin as a few nanometers or a few tens of nanometers.
However, the inventors recognized that the manufacture of
Substantially thicker 30/42 light transmissive protective layer 206 is actually more beneficial. In such a design, the material of the 206 light transmissive protective layer is chosen to have little absorption (a) or ideally zero or, equivalently, a small or ideally zero optical extension coefficient (k) in the visible spectrum (or other spectrum) of the light emitted by the diffuser 110). This condition is satisfied for most layers of glass or silica and for many plastic or polymer layers, as well as for some ceramic layers. For sufficiently low or zero absorption (or extinction coefficient), the thickness of the light transmissive protective layer 206 has little or no impact on the reflectivity of the multilayer structure 204, 206.
Thermally, it is recognized here that the thickness of the light transmissive protective layer 206 can be optimized to maximize the net heat transfer from the heat sink 112 to the environment (or, more precisely in the case of the embodiment of Figure 18, from the covers 202 for the environment). This approach is based on the observation that the light transmissive protective layer 206 generally has a high emission in the infrared, which can be substantially higher than the corresponding emission of the reflective layer 204. For example, SiO ₂ material is more efficient in irradiation of heat (that is, emitting in the infrared, for example, in the range of -3-20 microns of wavelength) than silver. This can be seen as follows.
Assuming that the high reflectivity of the reflective layer 204 extends to the infrared spectrum (which is the case for most highly reflective metals, such as silver), it follows that the reflective layer 204 inherently has low optical emission (typically almost zero ) in the infrared. The incident optical energy equals the sum of the absorbed energy plus the transmitted energy plus the reflected energy. For the highly reflective layer 204, almost all of the incident optical energy is converted to reflected optical energy (i.e., reflectivity ~ 1 and transmissivity - 0) and, in this way, the absorbed optical energy is almost nil. When the optical emittance equals the optical absorption, it follows that the reflective layer 204 has an
31/42 almost zero optics in the infrared. In other words, the reflective layer 204 is a very weak black body radiator.
On the other hand, the light transmissive protective layer 206 is more absorbent in the infrared than the reflective layer 204. In other 5 words, the low absorption (or extinction coefficient) or zero in the visible spectrum for SiO ₂ and other materials suitable for the transmissive protective layer of light 206 does not extend to the infrared, but rather the absorption (or extinction coefficient) rises as the spectrum extends to the infrared. As a consequence, the transmissive protective layer 10 of light 206 has a higher emission in the infrared when compared to the reflective layer 204. In other words, the transmissive protective layer of light 206 is a better blackbody radiator in the infrared than the reflective layer. 204.
However, the light transmissive protective layer 206 can only radiate the heat it receives as an element in the thermal circuit between the LED (heat source) and the ambient air. The light transmissive protective layer 206 primarily receives heat by conducting and irradiating the adjacent underlying reflective layer 204. If the light transmissive protective layer 206 is very thin, then it will absorb little heat and the blackbody radiation from the layer stack. 204, 206 will be dominated by the properties of the weak blackbody radiator of the reflective layer 204. On the other hand, at some point, the light transmissive protective layer 206 becomes thick enough to be substantially completely opaque to the heat that is radiated from the reflective layer 204.
The preceding principles are further illustrated with reference to Appendix A - Determination of a suitable coating thickness for a composite heatsink including a highly specular reflective layer coated with a light transmissive protective layer. Appendix A discloses the quantitative determination of suitable thicknesses for the light transmissive protective layer 206. Based on these calculations, it is desired that the light transmissive protective layer 206 be optically thick for infrared radiation. Depending on the mate
32/42 the desired heat flux, in some modalities, the transmissive protective layer of light must be greater than or equal to one micron. As seen in Figures A-2 and A-3 of Appendix A, for typical dielectric or polymer materials, such as SiO ₂ , a suitably thick layer is optically greater than or equal to three microns, and in some embodiments, greater than than or equal to 5 microns, and in some embodiments, greater than or equal to 10 microns (than for typical SiO ₂ , it is more than 50% absorbent for infrared irradiation). In some embodiments, a greater thickness, for example, greater than or equal to 20 microns, is also considered. As can be seen in Figures A-2 and A-3, the thermal performance of the composite surface 204, 206 does not decrease rapidly above approximately 10 microns and thus greater thicknesses for the light transmissive protective layer 206 are considered. In reality, as noted in Figure A-3, a thickness of several tens of microns is thermally acceptable for the light transmissive protective layer 206. However, the longer deposition time and the material cost tend against thicknesses substantially greater than 10 microns. Additionally, if the light transmissive protective layer 206 has non-zero absorption for visible light (i.e., the extinction coefficient k not identically zero in the visible), then reduced optical reflectivity of the composite surface 204, 206 can result in thicknesses of the light transmissive protective layer 206 substantially greater than 10 microns. Thus, in some modalities, the transmissive protective layer of light has a thickness less than 25 microns and, in some modalities, less than 15 microns and, in some modalities, less than 10 microns.
The composite surface 204, 206 shown in Figure 18 in the context of the finned heat sink of a light bulb type lamp can also be used in other heat sinks where a reflective surface is beneficial.
With reference again to Figure 3, for example, a different modality is indicated, in which at least the internal surfaces 20 of the
33/42 hollow heatsinks generally tapered include the composite surface comprising (in order) the copper layer 202, the reflective layer 204 (for example, a silver layer, in some embodiments smooth as a mirror and therefore reflective specular) , and the light transmissive protective layer 206. In some embodiments, only the inner surfaces 20 include the layers 204, 206 in order to produce high reflectivity, while the outer surfaces 22 may include only the copper layer 202 to provide conduction thermal (optionally including white powder coating or other cosmetic surface treatment). In other embodiments, both the inner surfaces 20 and the outer surfaces 22 include the layers 204, 206 - the optional inclusion of these layers on the outer surfaces 22 would typically be motivated by manufacturing convenience in the case of certain layer deposition techniques.
The illustrative heatsinks use the heatsink body made of plastic or other suitable material as already described, in order to advantageously produce a light heatsink. In any such heatsink, additional layers 204, 206 can be included to provide the high reflectivity combined with environmental robustness produced by the protective layer 206 and maintained or even improved thermal performance produced by the enhanced emission of the light transmissive protective layer 206 when compared to an outer layer of metal, for example, silver or copper. If the reflective layer 204 is manufactured sufficiently smooth, then the multilayer structure 204, 206 provides specular reflectivity, which can be advantageous for certain applications in which the heat sink serves as a reflective optical element.
In some embodiments, the thermally conductive layer 202 and the reflective layer 204 can be combined as a single layer having the required thickness to provide the required thermal conduction and reflectivity.
As yet another variation considered, the heatsink body may be entirely copper or aluminum or another thermally conductive metal34 / 42 or metal alloy, for example, an aluminum heatsink or loose copper (without any plastic or other component of the light heatsink body) that is coated with additional layers 204, 206 to provide a robust reflective surface with high thermal emission.
Revealed heat sinks facilitate new lamp designs.
With reference to Figures 21 and 22, a directional lamp is shown. Figure 21 shows a side sectional view of the directional lamp, while Figure 22 shows a view looking in the marked direction seen in Figure 21. The directional lamp of Figures 21 and 22 includes one or more LED devices 300 arranged on a plate. circuits 302 mounted on a base 304 including appropriate force conversion electronics (internal components not shown) to convert the voltage from the AC line 15 received into a threaded Edison type 306 base to the proper strength for operating the 300 LED devices. The directional lamp further includes an optical system including a beam forming Fresnel lens 308 and a conical reflector 310 cooperating to generate a directional beam along an OA optical geometric axis. It is to be understood that the Fresnel 308 20 lens is transparent, so that the internal details behind the Fresnel 308 lens in the view of Figure 22 are visible through the transparent lens in the view of Figure 22.
The directional lamp in Figures 21 and 22 has certain similarities to the directional lamp in Figures 3-6. A similarity is that in both modes the conical reflector serves as a heat sink.
However, in the form of Figures 3-5, the heatsink has fins on the outside of the conical reflector. This arrangement is conventional, since it places the fins out of the optical path. In contrast, the directional lamp of Figures 21 and 22 includes fins 312 extended towards the interior of conical reflector 310. These fins 312 include the composite or multilayer reflective surface including (in order) a planar fin body 314 made plastic or other lightweight material, the thermal conductance layer
35/42
202 (for example, a copper layer of 150-500 microns in some embodiments) coating both sides of the planar fin body 314, the reflective layer 204 (for example, a silver layer having a thickness in the range of a few tens of one micron to a few microns) and the light transmissive protective layer 206 (e.g., a clear plastic or SiO ₂ layer having a thickness in the range of approximately 3-15 microns). The structure of the composite layer 202, 204, 206 also lines the internal surface of the conical reflector 310 (that is, the surface visible in Figure 22, analogous to the coating shown in detail in Figure 3 for the directional lamp modality of Figures 3-6 ) and optionally also lines the outer surface of the conical reflector 310 (i.e., the surface not visible in Figure 22). Alternatively, the outer surface of the conical reflector 310 can be uncovered or can be cosmetically treated for aesthetic reasons.
The use of the reflective composite layer structure (preferably specular reflective, although diffuse reflective is also considered), but also very thermally conductive and thermally emissive and environmentally robust 202, 204, 206 facilitates the configuration of Figures 21 and 22, in which the fins 312 are located inside the conical reflector 310 and, therefore, in the optical path. Conventional heat sinks have a reflectivity of approximately 85% or less for visible light. Although this may appear loud, it amounts to substantial optical losses, especially in the case of multiple reflections, as they are prone to occur with fins extended inwardly inside a conical reflector.
In contrast, the structure of the composite layer 202, 204, 206 provides substantially the same reflectivity as, or even better than, the native reflectivity of the high reflectivity layer 204. In the case of silver, this native reflectivity can be well above 90% and is typically around 95%. The transmissive protective layer of light 206 generally does not degrade this reflectivity and can even improve reflectivity due to the passivation of the surface and / or equal refractive index. As a result, it is practical to use the 312 inwardly extended fins on the
36/42 directional lamp while still maintaining high optical efficiency.
The inwardly extending fins 312 have substantial advantages over the outwardly extending fins of the embodiment of Figures 3-6. By using the fins extended inwards 312, the directional lamp is manufactured more compact and aesthetically pleasing. In addition, if the directional lamp is mounted in a recessed mode, the outwardly extended fins can be spatially confined in a small recess which can substantially reduce its effectiveness. In contrast, the placement of the inwardly extended fins 312 in the optical path ensures that they face a substantially open volume, even in the case of recessed mounting. The inwardly extending fins 312 also tend to expel heat away from the front of the lamp, while the outwardly extended fins tend to expel heat backwards towards the mounting surface or into the mounting cavity when mounting demoted. The inwardly extended fins 312 also tend to preserve the optical performance of the tapered reflector and beam-forming lens if the inwardly extended fins are specularly reflecting and are symmetrically arranged around the lamp's optical geometric axis, and if each fin is in a radial plane parallel to the optical geometric axis. In such a plane, each fin speculatively reflects the light into the pattern of the lamp beam, such that the radial distribution of the light in the beam is unchanged by the reflected light from the fin, and the azimuth distribution of the light in the beam pattern is invariable in rotation around the optical geometric axis, regardless of whether light reflects from a fin or is emitted from the lamp without reflecting from a fin.
Figure 23 shows a lamp similar to the lamp in Figures 16-20, with Figure 23 showing the same side view as Figure 18. The modified lamp in Figure 23 replaces the heatsink 112 with fins having fins external to the diffuser 110 with the internal fins 350 which are surrounded by a larger diffuser 352 (translucent diffuser 352 indicated by the dashed lines). The inner fins 350 can be manufactured wider than the corresponding outer fins extending further to
37/42 in towards the center of the bulb. If the diffuser 352 is sufficiently diffusive, then the inner fins 350 are blocked from view or only diffusely visible. Eliminating the outer fins is expected to be an aesthetic improvement for most people and to make it easier to maintain and manipulate the bulb portion when screwing the lamp into a threaded light socket. As shown in the circular magnification V view, each fin has a plastic or other lightweight planar fin body 354 providing structural support, and is coated on either side by the multilayer composite structure 202, 204, 206.
In any of the modalities in which a thin planar fin support is coated on both sides by the multilayer structure composed 202, 204, 206 (for example, as shown in Figures 18, 22, 23), it is also considered that the composite multilayer structure 202, 204, 206 also cover the edge, i.e., the thin surface connecting the opposite main planar surfaces of the planar fin support. Alternatively, since this edge has a small area and is protected from the path of direct light by the fin body in some modalities, the edge can be left uncovered.
In the following, an example is given of determining a suitable coating thickness for a composite heatsink including a highly reflective specular layer coated with a light transmissive protective layer. In this example, it is assumed that the heatsink body (for example, the heatsink fin body 200 in Figure 18 or the planar fin body 314 in Figure 22 or the planar fin body 354 in Figure 23) is a polymer, that layer 202 is a copper layer (Cu), that reflective layer 204 is a silver layer (Ag) and that the light transmissive protective layer 206 is a layer of silicon dioxide (SiO ₂ ). We also let Ti represent the temperature at the interface between Ag and SiO ₂ . Let T ₂ represent the ambient temperature (which is treated as a blackbody radiator in this model) and let T _w represent the temperature of the SiO ₂ layer at the air interface. To summarize, the composite heatsink structure
38/42 includes a molded polymer spine 200, 314, 354 galvanized to the desired thickness of copper (Cu) or other conductive material 202, such as nickel (Ni), silver (Ag) and so on. This first galvanized layer 202 is overcoated with a thin layer of silver (Ag) 204 to provide high specular reflectance. The Ag 204 layer is then overcoated with a transparent coating of silicon dioxide (SiO ₂ ) 206. (Alternatively, another protective transmissive light layer, such as a polymer coating that is transparent in the visible part of the electromagnetic spectrum structure, it can also be used as layer 206. The illustrative calculations presented in this example are for SiO ₂ ). The effective rate of heat transfer from that surface of the multilayer heat sink 202, 204, 206 is dependent on the thickness of the light transmissive protective layer 206 (for example, SiO ₂ in the illustrative example). Under simplification assumptions, the optimal thickness of the light transmissive protective layer 206 for any particular project can be calculated as shown by the illustrative example now presented.
For a semi-infinite plate (that is, the plate is considered to be of infinite length in the vertical dimension) in ambient air, the following assumptions can be made. First, the environment acts as a blackbody radiator at temperature T ₂ . Second, the primary mechanism for heat loss to the environment is convection and irradiation. The temperature in the Ag interface SiO ₂ can be maintained in the stable state at a fixed temperature Ti providing heat to the structure equivalent comprised the total heat fluid lost to the environment through the outer surface of the SiO ₂ layer (SiO ₂ interface -ar) calculated to maintain the Ag-SiO ₂ interface at the Ti temperature. In the regime where the SiO ₂ layer is optically thin with respect to infrared radiation, the heat loss through the SiO ₂ -ar interface can be summarized as follows:
Q = Qconv ⁺ QRad where Q is the net heat loss to the environment, Q _CO nv θ 3 heat convection of the SiO ₂ interface -ar to the environment and QRad is the sum of and the net irradiation39 / 42 tion to the environment at the SiO ₂ -ar interface. Furthermore, in the optically thin SiO _{2 region} , QRad can be subdivided as:
Qxad ⁼ Q Rad-SiO2 ⁺ Qr ^ I -Àg — Ollt (2), where QRad-siO2 θ the irradiation generated within the SiO ₂ layer via absorption and re-emission and Q Rad Ag_out is the fraction of the net irradiation of the interface Ag-SiO ₂ that passes through the SiO ₂ layer without being absorbed. The following list is derived from Kirchhoff's law:
Quad-SlOl ⁼ QAbs — SiOl (3), (4), where QAbs-siO2 is the radiation absorbed by the SiO ₂ layer. On the other hand, at the limit of the non-reflective absorbent system at the infrared wavelengths of interest, the following applies:
QRad ~ Ag-Oiíl Qlrans-SlOl where Qirans-siO2 θ is the radiation transmitted through the SiO2 layer. In the region of interest of the infrared wavelength, the transmittance of the SiO ₂ layer changes as the thickness is increased and the layer becomes translucent and eventually opaque at greater thicknesses. The functional relationship of Q-rrans-siO2 to the thickness of SiO ₂ and the absorption coefficient of SiO ₂ can be written in terms of the Beer-Lambert law for transmittance through an absorption medium where:
Τ '_ * SiOl · (5), a = 1 - β ~ “ ^A stoi ^{1 and} (6), where in these equations Tsío2 is the transmittance of the SiO ₂ layer, Asío2 θ θ absorbance of the SiO ₂ layer, t is the thickness of the SiO ₂ and α layer is the mediated absorption coefficient of the black body of the SiO ₂ layer. Using Planck's irradiation function:
G è ^íT ~ ¹ hi G _β Λτ-1 (7), where:
40/42
6Zi = -J- (8), and where C4 = 3.742 x 10 ⁸ W-gm ⁴ / m ² , C2 = 1.4387 x 10 ⁴ gm-K, T is the temperature in Kelvin units (K), k is the extinction coefficient (that is, the imaginary part of the refractive index) of SiO2 as a function of the wavelength and λ is the wavelength of the irradiation of interest. An additional list can be written as:
Qxad-Ag-aa ~ Qrrans-SiOl ~ QRad-Ag * 7siO2 where Q Rad_Ag (per unit area) is the calculated radiated heat of a silver gray body (Ag) at the temperature of the Ag-SiO ₂ interface and can be written how:
σ (τί-τί) (10).
where SAg is the emissivity of silver and σ is the constant of Stefan Boltzmann = 5.67 x 10 ' ⁸ W / (m ² - K ⁴ ). Furthermore:
S ^ -r _a02 σ (Ν-ΤΪ) - (1-β- ^α ) σ (7; ⁴ -7ΐ) where T _w is the temperature of the SiO ₂ layer at the air interface. In the optically thin SiO _{2 region} , it can also be assumed that irradiation is independent of convection and conduction, such that:
Õcond-SIO2 ~ Q _Com (12), where Qconv is the convection of the SiO ₂ -ar interface heat to the environment and Qcond-siO2 θ the heat conducted through the SiO ₂ layer. Additionally:
_n _ KSiO2 (Tl ~ T _ín .
ZCond-SiO2 - U-Ά e
Qcan, ^ hsOl-alST '~ TJ O ⁴ )' where Ksío2 θ the thermal conductivity of the SiO ₂ and hsiO2-air layer is the convective heat transfer coefficient at the SiO ₂ -ar interface. Equations 13 and 14 can be used with appropriate physical data to calculate T _w (that is, the temperature of the SiO ₂ layer at the air interface), than equations (1) - (12) can be solved.
41/42
A quantitative example of the precedent for a light transmissive protective layer of SiO ₂ in a reflective specular silver layer follows. The quantitative example uses values of the extinction coefficient provided in Palik, Handbook of Optical Constants, of which the SiO ₂ absorption coefficient is calculated to be 0.64 in the range of the relevant infrared spectrum from 3.5 microns to 27 microns . The values used in the quantitative examples are listed in table A-1.
Table A-1
Ag Temperature T1 100 Ç Room temperature T2 25 Ç Stefan Boltzman's constant Sigma 5.67E-08 Wm-2K-4 Thermal conductivity of glassy silica K 0.9 Wm-1K-1 Ag Emissivity Eps1 0.02Convective htc H 5 W / (m2-K)
Figure 24 shows spectra of the optical properties for the 10 SiO ₂ used in the quantitative example. The acronym HTC stands for heat transfer coefficient. The silver temperature of 100 ° C is selected as corresponding to a desired operating temperature typical of a high power light-emitting diode (LED) device and assumes efficient heat transfer to the silver, such that the temperature of the silver is 15 comparable to the LED operating temperature. Figure 24 marks the SiO ₂ extinction coefficient (k), absorption (alpha or a), blackbody emission (BB) at 100 ° C and integrated absorption coefficient (alpha * BB). Note that SiO ₂ has substantial absorption peaks and general BB radiation in the infrared despite being optically transparent (or almost optically transparent) in the visible spectrum.
With reference to Figures 25 and 26, for the configuration of table A-1, the total flow curve against the thickness of the SiO ₂ layer is shown in different scales in Figure 25 and in Figure 26 respectively. SiO ₂ is more efficient at radiating heat than silver. However, SiO ₂ can only radiate the heat it receives, for example, by absorbing the infrared. This explains the increase in the total heat flow with increasing thickness of SiO ₂ up to approximately 5-15 microns. For thickness of
42/42
SiO ₂ above this range, the total heat flow starts to decrease slowly, since SiO ₂ is now opaque for infrared radiation and the additional thickness does not contribute to the absorption of infrared. These results indicate that a suitable thickness for SiO ₂ in silver for efficient total thermal loss is approximately 5 to 15 microns, in addition to which the additional thickness of SiO ₂ begins to decrease the net heat removal. This is because above approximately 5-15 microns, the SiO ₂ layer becomes opaque to infrared radiation, and any additional thickness of SiO ₂ does not contribute to the absorbed infrared heat 10 that can be radiated by the emission of the SiO layer ₂ .
Preferred embodiments have been illustrated and described. Obviously, modifications and changes will occur to others with the reading and understanding of the previous detailed description. The invention is intended to be interpreted as including all such modifications and changes, as long as they fall within the scope of the appended claims or their equivalents.

权利要求:
Claims (14)
[1]
1. Heatsink comprising:
a structural heatsink body;
a reflective layer (204) disposed on the heatsink body which has a reflectivity greater than 90% for light in the visible spectrum; and a transmissive protective layer of light (206) disposed on the reflective layer (204) which is transmissive from light to light in the visible spectrum;
characterized by the fact that a thermally conductive layer (202) disposed on the heat sink structural body, the thermally conductive layer having higher thermal conductivity than the heat sink structural body, the reflective layer being disposed on the thermally conductive layer.
[2]
2. Heatsink according to claim 1, characterized in that the multilayer structure including the reflective layer (204) and the transmissive protective light layer (206) comprises a specular reflector having less than 10% of light scattering.
[3]
Heatsink according to claim 1, characterized in that the heat sink structural body comprises a plastic or polymeric heat sink structural body.
[4]
Heat sink according to claim 1, characterized in that the thermally conductive layer (202) comprises a copper layer (Cu) and / or the reflective layer (204) comprises a silver layer (Ag) .
[5]
5. Heat sink according to claim 1, characterized in that the transmissive protective layer of light (206) is absorbent of light for infrared light and is optically thick for infrared light.
[6]
6. Heat sink according to claim 1, characterized by the fact that the protective transmissive light layer (206)
Petition 870190076889, of 08/09/2019, p. 5/10
2/3 comprises a light transmissive layer of plastic, polymer, glass, ceramic, silicon dioxide (SiO2) or silica.
[7]
7. Heat sink according to claim 1, characterized in that the reflective layer (204) is of sufficient thickness that the incident light is reflected without an evanescent wave passing through the specular reflective layer.
[8]
8. Heat sink according to claim 1, characterized by the fact that the heat sink body includes fins of heat radiation and the reflective layer (204) and the transmissive protective layer of light (206) are arranged on at least minus the heat radiation fins.
[9]
9. Light emitting diode (LED) lamp characterized by the fact that it comprises:
a heatsink as defined in claim 1; and an LED module attached with and in thermal communication with the heat sink.
[10]
10. LED-based lamp, according to claim
9, characterized by the fact that:
the LED-based lamp has an A-line bulb configuration and also includes a diffuser (74) illuminated by the LED module; and the heatsink includes fins arranged inside or outside the diffuser and the reflective layer and the transmissive protective layer of light are arranged on at least the fins.
[11]
11. LED-based lamp, according to claim
10, characterized by the fact that the diffuser (74) is hollow and the heatsink includes fins arranged inside the hollow diffuser.
[12]
12. LED-based lamp according to claim 9, characterized in that the LED-based lamp comprises a directional lamp, the heat sink defines a hollow light-collecting reflector, and the reflective layer (204) and the light transmissive protective layer (206) are arranged on at least the inner surface of the hollow light collecting reflector.
Petition 870190076889, of 08/09/2019, p. 6/10
3/3
[13]
13. LED-based lamp, according to claim
12, characterized by the fact that the heat sink includes inwardly extending fins arranged within the hollow light-collecting reflector, and the reflective layer (204) and the transmissive protective layer of light (206) are additionally arranged on at least the fins extended inward.
[14]
14. LED-based lamp, according to claim
9, characterized by the fact that the heatsink comprises a reflective optical component of the lamp based on LED.

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法律状态:
2018-03-27| B15K| Others concerning applications: alteration of classification|Ipc: F21V 7/22 (2018.01), F21K 99/00 (2016.01), F21V 29 |

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2019-01-08| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|

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2019-06-11| B06T| Formal requirements before examination [chapter 6.20 patent gazette]|

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2019-10-29| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|

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2020-01-14| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 18/03/2011, OBSERVADAS AS CONDICOES LEGAIS. |

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2021-10-05| B15K| Others concerning applications: alteration of classification|Free format text: RECLASSIFICACAO AUTOMATICA - A CLASSIFICACAO ANTERIOR ERA: F21V 7/22, F21K 99/00, F21V 29/00 Ipc: F21V 7/22 (2018.01) |

优先权:

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申请号 | 申请日 | 专利标题

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US38810410P| true| 2010-09-30|2010-09-30|

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US12/979,573|US8672516B2|2010-09-30|2010-12-28|Lightweight heat sinks and LED lamps employing same|

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PCT/US2011/028943|WO2012044364A1|2010-09-30|2011-03-18|Lightweight heat sinks and led lamps employing same|

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