• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    THERMO-SIPHON REFRIGERATORS FOR COOLING SYSTEMS WITH COOLING TOWER. In one embodiment, a cooling system can include a cooler siphon that cools a cooling fluid through dry refrigeration and a cooling tower that cools a cooling fluid through evaporative cooling. The cooler siphon can use natural convection to circulate a refrigerant between an enclosure and the evaporator tube and a cooled air condenser. The cooler siphon can be located in the cooling system upstream of, and in series with, the cooling tower, and can be operated when the cooler siphon is more economically efficient and / or resource to operate than the cooling tower. According to certain modalities, factors, such as room temperature, the cost of electricity and the cost of water, among others, can be used to determine whether to operate the cooler siphon, the cooling tower, or both.
    公开号:BR112012030204B1
    申请号:R112012030204-3
    申请日:2010-07-21
    公开日:2020-11-10
    发明作者:James W. Furlong；Joseph W. Pillis；Delmar E. Lehman
    申请人:Johnson Controls Technology Company；
    IPC主号:
    专利说明:

    Cross Reference to Related Orders
    [0001] This order claims priority and benefit from US Provisional Order Serial No. 61 / 349,080, entitled "THERMO-SIPHON REFRIGERATORS FOR COOLING SYSTEMS WITH COOLING TOWER", filed on May 27, 2010, which is here incorporated by reference. Background
    [0002] The present invention generally relates to thermosiphon coolers, and more particularly, thermosiphon coolers for use in refrigeration systems employing cooling towers.
    [0003] Cooling towers are often used to remove heat from heating, ventilation, and air conditioning (HVAC) systems, power plants, and industrial processes. In general, cooling towers can include nozzles that direct water down through the tower, while a fan, or free circulation, directs air up through the tower. The interaction between air and water can promote the evaporation of a portion of the water, thereby cooling the remaining water. In open-loop cooling towers, the water cooling tower can be circulated directly through the cooling system, while in closed-loop cooling towers, the water from the cooling tower can be directed over a heat exchange coil that cools a separate flow of cooling fluid which in turn circulates through the cooling system.
    [0004] During evaporation, water can be lost from the cooling tower and impurities, such as salts or other dissolved solids, can be concentrated inside the cooling tower. A portion of the cooling tower water, containing concentrated impurities, can be removed as a purge. To explain water losses due to evaporation and purging, formation water can be added to the cooling towers. As a result, cooling towers can consume very substantial amounts of water, in some cases millions of gallons of water each year, and can be one of the largest consumers of water within a process. graphics
    [0005] FIGURE 1 is a schematic diagram of a modality of a cooling system that employs a cooler siphon and an open loop cooling tower.
    [0006] FIGURE 2 is a perspective view of an embodiment of the cooler siphon shown in FIGURE 1.
    [0007] FIGURE 3 is a schematic diagram of an embodiment of the cooler siphon shown in FIGURE 1.
    [0008] FIGURE 4 is a schematic diagram of another modality of a cooling system that uses a thermo-siphon cooler and an open loop cooling tower.
    [0009] FIGURE 5 is a schematic diagram of a modality of a cooling system that employs a thermo-siphon cooler and a closed-loop cooling tower.
    [00010] FIGURE 6 is a flow chart representing a method for operating a refrigerator thermosiphon.
    [00011] FIGURE 7 is a flow chart continuing the method for operating a refrigerator thermosiphon shown in FIGURE 6.
    [00012] FIGURE 8 is a graph representing inputs and outputs that can be used to operate a refrigerator thermosiphon.
    [00013] FIGURE 9 is a schematic diagram of a cooling system modality that employs a dry heat rejection system and an open loop cooling tower.
    [00014] FIGURE 10 is a flow chart representing a method for operating a dry heat rejection system.
    [00015] FIGURE 11 is a schematic diagram of another modality of a cooling system that employs a cooler siphon and an open loop cooling tower. Detailed Description
    [00016] This description is intended for thermosiphon coolers that can be used in cooling systems that use cooling towers. As used here, the term "cooling tower" includes open-loop and closed-loop cooling towers that cool a fluid, such as water, evaporative cooling using ambient air. Cooling towers can be particularly useful for the process of cooling fluids due to the relatively low temperatures that can be achieved by evaporative cooling, when compared to dry cooling. In addition, cooling towers can provide flexibility in determining a system blueprint because cooling towers can be located well away from a process, allowing for a real state in the vicinity of the building or refrigerated process to be cooled to be used for other purposes. However, due to evaporative cooling, cooling towers can consume large amounts of water. To conserve water, it may be desirable to employ other types of cooling systems in conjunction with cooling towers, particularly in areas where water is in short supply and / or expensive.
    [00017] Therefore, the present description is addressed to dry heat rejection systems, such as thermosiphon coolers, which can be used to provide additional and / or alternative refrigeration in cooling systems that include cooling towers. . Thermosiphon coolers can be located in cooling systems upstream of, and in series with, cooling towers, and can be operated when thermosiphon coolers are more economical and / or resource efficient to operate than the cooling towers. For example, when ambient temperatures are low, it can be beneficial to operate thermosiphon coolers to reduce water consumption in cooling towers. When ambient temperatures are high, it may be desirable to operate the cooling towers to provide the lowest process coolant temperatures that can be achieved through evaporative cooling. According to certain modalities, factors such as ambient temperature, the cost of electricity, the cost of water, the temperature of the heated coolant leaving the process heat exchanger, and the desired temperature of the coolant entering the heat exchanger. Process heating, among others, can be used to determine whether to operate thermosiphon coolers, cooling towers, or both.
    [00018] In an exemplary arrangement, a thermosiphon cooler will include a tube housing and evaporator and an air cooling condenser. The water cooling tower can flow through the evaporator tubes and can transfer heat to the refrigerant circulation between the evaporator and the cooled air condenser. The cooler siphon can be designed to minimize the pressure drop within the system so that the refrigerant is circulated between the evaporator and the condenser through natural convection. As used here, the term "natural convection" means circulation of a fluid without mechanical force, for example, without mechanical force as provided by a pump or a compressor. According to certain modalities, the buoyancy of the heated refrigerant and the difference in height between the condenser and the refrigerated air evaporator and can provide driving force for the circulation of the refrigerant through natural convection. Because the refrigerant can be circulated using natural convection, the condenser fans and their motor (s) may be the only parts moving in the cooler siphon. As a result, thermosiphon coolers can have relatively low proportions of energy consumption and maintenance when compared to traditional dry chillers that implement pumped freeze-free cooling loops.
    [00019] The evaporator inside the cooler siphon can also include access covers and / or removable components that allow the interior of the evaporator tubes to be cleaned. Therefore, thermosiphon coolers can be particularly well suited for circulating cooling tower water in open loop cooling tower systems where water can be exposed to dissolved solids or other contaminants. In addition, the cooler siphon can include a freeze protection system, which can allow the cooler siphon to cool the cooling tower water directly, instead of employing a separate loop, which contains a freeze protector, such as glycol .
    [00020] FIGURE 1 is a schematic view of a cooling system 10 that employs a cooling thermo-siphon 12 and a cooling tower 14. The cooling system 10 can be mainly located inside a building 16 or area that is maintained in temperatures above freezing. However, certain components of the cooling system 10, such as the cooling thermo-siphon 12 and the cooling tower 14, can be located outside building 16, for example, on the roof of building 16. Still, in other embodiments, the cooling tower cooling 14 can be located at a distance away from building 16, or the process area and, in certain embodiments, can be located at floor level.
    [00021] The cooling system 10 includes a process heat exchanger 18 that can be used to transfer heat from a process loop 20 to a cooling system loop 22. According to certain embodiments, the process loop 20 can circulate a process fluid, such as a refrigerant, steam, or other vapor to be condensed. For example, process loop 20 can circulate compressed refrigerant vapor to be condensed from a water cooler. In another example, process loop 20 can circulate steam to be condensed from a steam turbine. In another example, the process loop 20 can circulate a process fluid to an industrial process that may require refrigeration.
    [00022] The cooling system loop 22 can circulate a fluid to be cooled, such as water or a mixture of water from other components. When a coolant flows through a heat exchanger 18, the coolant can absorb heat from the coolant. According to certain embodiments, an intermediate fluid such as refrigerant can be used to transfer heat from a process fluid within the process loop 20 to the refrigerant within the cooling system loop 22. For example, in certain embodiments, the process heat exchanger 18 can be a chilled water condenser that is part of a cooler circulating a refrigerant to transfer heat from process loop 20 to the cooling system loop 22. In these embodiments, the process fluid can flow through a refrigerator evaporator. However, in another embodiment, the intermediate fluid can be omitted and the process heat exchanger 18 can be used to transfer heat directly from the process fluid to the refrigerant. Furthermore, in still other embodiments, the process heat exchanger 18 can be omitted and the cooling fluid within the cooling system loop 22 can be circulated directly to the process to be cooled.
    [00023] When the coolant flows through the process heat exchanger 18, the coolant can absorb heat from the process fluid. Therefore, the heated coolant can leave the process heat exchanger 18 and can flow through the cooling system loop 22 through a valve 24 to the cooler siphon 12. In certain embodiments, a pump can be included to circulate the coolant to the cooler siphon 12 from valve 24. However, in other embodiments, the pump can be omitted.
    [00024] The heated coolant can enter the cooler thermostat 12 where the coolant can be cooled. As described below with respect to FIGURES 2 and 3, the refrigerator thermostat 12 can include an enclosure and an evaporator tube 76 and a chilled air condenser 78. A refrigerant loop 80 can be employed to transfer heat from a refrigerant flowing through the housing and evaporator tube 76 to the cooled condenser 78. Heat can be discharged from the cooler siphon 12 through ambient air directed over the cooled air condenser 78 via one or more fans 26 directed by one or more motors 28. According to certain modalities, motors 28 can incorporate variable speed actuators (VSD's) that allow the speed of fans 26 to be adjusted to increase and decrease the amount of cooling provided by the cooler thermostat 12. The cooling fluid it can then come out of the cooler siphon 12 and can flow through valves 30 and 32 to the cooling tower 14, in which the refrigerant igeration can be further cooled through evaporative cooling.
    [00025] Inside the cooling tower 14, the cooling fluid can be cooled through evaporative cooling with ambient air. Cooling fluid can enter cooling tower 14 through nozzles 34 that direct cooling fluid down through cooling tower 14 onto a filler material 36, such as splash bars, foil fill packs, or any another suitable surface. A fan 38 driven by a motor 40 can direct the air upward through the cooling tower 14 so that the air mixes with the cooling fluid flowing through the cooling tower 14 to provide evaporative cooling. According to certain modalities, the fan 38 can be a centrifugal or axial fan by a VSD. However, in other embodiments, the fan 38 can be omitted and the movement of the air inside the cooling tower will be induced by natural convection. Cooling tower 14 can be cross flow or a cross flow cooling tower. Yet, although shown as a cooling tower-induced draft, in other embodiments, the cooling tower 14 can be a forced draft of the cooling tower.
    [00026] The refrigerated refrigerant can then leave the cooling tower 14 and can be collected inside a collecting ditch 42. As shown, the collecting ditch 42 is located inside building 16, which, in certain modalities, can inhibit the freezing of the cooling fluid within the collecting ditch 42. However, in other embodiments, the collecting ditch 42 may be an integral part of the cooling tower 14 and may be located outside building 16, as described further below with respect to FIGURE 4.
    [00027] As the coolant flows through the cooling tower 14 and contacts the ambient air, solids and other contaminants can become trapped or trapped within the coolant. Additional minerals, salts, and other contaminants can enter the coolant with formed water. As pure water is removed from the refrigerant through evaporation, the concentration of such contaminants will increase within the refrigerant. Therefore, a portion of the refrigerant, which may contain particulates, dissolved solids, and / or contaminants, can be removed as a purge by opening a valve 46. A valve 44 can also be opened to direct the formation of refrigerant in the collector well 42 to explain losses in the refrigerant due to purification and evaporation. The cooled refrigerant from the sump 42 can then be returned to the process heat exchanger 18 via a pump 48 in which the fluid can again absorb heat from the process fluid circulating within the process fluid loop 20.
    [00028] Cooling system 10 can also include a controller 50 that governs the operation of cooling system 10. Controller 50 can receive input signals 52 from components, such as valves and sensors within system 10, in the form of analog inputs and / or digital as shown in FIGURE 8. Based on the input signals, controller 50 can send output signals 54, as analog and / or digital outputs shown in FIGURE 8, to vary the operation of the cooling system 10. As further described below, with respect to FIGURES 6 and 7, controller 50 can use input and output signals 52 and 54 to enable the operation of cooler siphon 12 whenever it is efficient to operate cooler siphon 12 in addition a, or instead of the cooling tower 14.
    [00029] According to certain modalities, controller 50 may also govern the operation of a freeze protection system 56 included within the cooling system 10. Freeze protection system 56 may include a differential pressure switch 58 that measures the pressure difference between the refrigerant entering and leaving the cooler siphon 12 and a temperature sensor 57 that measures the temperature of the refrigerant inside the evaporator housing 76. Controller 50 can use input signals 52 from the pressure switch 58 to determine if coolant is flowing through cooler siphon 12. If controller 50 detects that there is no flow of coolant based on the input of differential pressure switch 58, controller 50 can initiate a low temperature protection of the freeze protection system 56, which can inhibit the freezing of the freezing fluid used inside the cooler siphon 1 2. To initiate low temperature protection mode, controller 50 can close valve 97 to promote the collection of refrigerant inside condenser 78. The lack of refrigeration flow to evaporator 76 can inhibit the freezing of refrigerant inside evaporator 76. Controller 50 can also connect supplemental heat to evaporator 76 to provide an influx of heat to evaporator 76 to inhibit freezing of the refrigerant included within evaporator 76.
    [00030] Controller 50 can also use temperature sensor input 57 to govern the operation of freeze protection system 56. For example, when controller 50 receives input from temperature sensor 57 which indicates that the temperature inside of the evaporator 76 is below a certain set point, the controller 50 can initiate a freeze protection mode of the freeze protection system 56, which can drain the cooling fluid from the cooler siphon 12 and can divert the flow of the refrigerant around the thermo-siphon cooler-generator 12. To drain the refrigerant from the thermo-siphon cooler 12, controller 50 can open valves 60 and 62 to direct the coolant to a drain line 64 As shown, drain line 64 can direct coolant to collection well 42. However, in other embodiments, for example, where collection well 42 is located outside the building building 16, drain line 64 can be connected to a sewer or a collection reservoir.
    [00031] Controller 50 can also close valve 30 to direct coolant from the cooler siphon 12 to drain line 64 through valve 62. In addition, controller 50 can open valve 66 to inject air into of the cooler siphon 12 to facilitate the drainage of the refrigerant from the cooler siphon 12. According to certain modalities, valve 66 can be designed to inject air into the evaporator tubes of the cooler siphon 12 to move the refrigerant fluid from the evaporator tubes. To inhibit the flow of additional coolant into the cooler siphon 12, controller 50 can also change the position of valve 24 to direct coolant from heat exchanger 18 to bypass cooler siphon 12 and flow directly to valve 32. According to certain modalities, valves 60, 62, and 66 can be solenoid valves designed to leave in the open position, which, in the event of a power failure, can automatically enable the protection system freezing system 56.
    [00032] Cooling system 10 can also include temperature sensors 68, 70, 72, and 74 that can be used to detect temperatures used by controller 50 to govern the operation of cooling system 10. For example, the temperature sensor temperature 68 can detect the ambient air temperature; the temperature sensor 70 can detect the temperature of the cooling fluid exiting the cooler siphon 12; the temperature sensor 72 can detect the temperature of the cooling fluid of the process heat exchanger leaving; and the temperature sensor 74 can detect the temperature of the refrigerant entering the heat exchanger 18. Temperature sensors 68, 70, 72, and 74 can provide the temperatures for controller 50 in the form of input signals 52, that can be used to control the operation of the cooling system 10.
    [00033] According to certain modalities, controller 50 may use temperatures sensed by some, or all sensors 57, 68, 70, 72, and 74 to determine when to enable freeze protection system 56. For example, the controller 50 can initiate the low temperature protection mode of the freeze protection system 56 when there is no flow, as detected by the differential pressure switch 58, and when the ambient temperature, as detected by sensor 68, is below a prescribed value of room temperature. In another example, controller 50 can disable a freeze protection mode of freeze protection system 56 when the temperature of the refrigerant leaves the cooler siphon 12, as detected by sensor 70, is above the prescribed temperature value intermediate.
    [00034] Controller 50 can also use temperatures sensed by any, or all, sensors 57, 68, 70, 72, and 74 to determine operational parameters of the thermo-siphon cooler 12. According to certain modalities, the cooling system 10 can be designed to cool the cooling fluid by entering the heating process exchanger 18 to a specific temperature, which can be referred to as the prescribed temperature of the cooling system. If the temperature of the refrigerant entering the heating process exchanger 18, as detected by sensor 74, is above the prescribed temperature of the cooling system, controller 50 can provide output signals for motor 28 to increase the speed of condenser fans 26. Similarly, if the temperature of the refrigerant entering the heat exchanger 18, as detected by sensor 74, is below the prescribed temperature of the cooling system, controller 50 can provide output signals for motor 28 to slow the capacitor fans 26.
    [00035] Controller 50 can also use the temperatures felt by some, or all, sensors 57, 68, 70, 72, and 74 to determine when to operate cooling tower 14. For example, if the coolant temperature is rising of the thermo-siphon 12, as detected by sensor 70, is equal to or below the prescribed value of the cooling temperature system, controller 50 can provide an output signal for valve 32 to change the position of valve 32 in such a way that the cooling fluid deviates from the cooling tower 14 and proceeds directly to the collecting well 42. In this operating mode, the cooling thermo-siphon 12 may be able to provide sufficient cooling capacity to reach the prescribed temperature of the cooling system. cooling, and therefore, the cooling system 10 can be operated without using the cooling tower 14, which can reduce water consumption within the cooling system 10.
    [00036] As further described below with respect to FIGURES 6 and 7, controller 50 may also use temperatures sensed by any, or all, sensors 57, 68, 70, 72, and 74 to determine when to operate the refrigerator thermosiphon 12 For example, controller 50 can use temperatures sensed by sensors 72 and 68 to determine the temperature difference between the cooling fluid exiting the heat exchanger 18 and the ambient air. Controller 50 can then use this temperature difference in conjunction with water and electricity rates to determine when it is economically and / or resource efficient to operate the refrigerator thermosiphon 12.
    [00037] FIGURES 2 and 3 represent a refrigerator modality of the refrigerator thermosiphon 12. As shown in FIGURE 2, the refrigerator thermosiphon 12 includes an enclosure and the evaporator tube 76 and a chilled air condenser 78. The enclosure and the evaporator tube 76 can receive heated refrigerant from the heating process exchanger 18 (FIGURE 1) and can transfer heat from the refrigerant to refrigerant flowing through the evaporator 76. According to certain modalities, the refrigerant can be a refrigerant type HFC or HFO; however, in other embodiments, any appropriate refrigerant can be employed. The heated refrigerant can be directed through piping from the refrigerant loop 80 to condenser 78, where the refrigerant can be cooled by the ambient air directed through condenser 78 by fans 26. The cooled refrigerant can then be returned to the evaporator 76 through the refrigerant loop 80. According to certain modalities, the evaporator 76 and the condenser 78 can be included within a common structure 82 that allows the refrigerator thermosiphon 12 to be sold as a single integrated package. However, in other embodiments, evaporator 76 and condenser 78 may be arranged within separate structures or may be installed within separate parts of the cooling system 10. Furthermore, although the modality reflected in FIGURE 2 and FIGURE 3 shows evaporator 76 as a tube enclosure and evaporator, other embodiments may include another type of evaporator, such as an evaporator design plate, in place of a tube enclosure and design.
    [00038] Refrigerant and coolant can circulate through cooler siphon 12 as shown in FIGURE 3. Housing and evaporator tube 76 may include housing 84 which contains refrigerant when refrigerant flows through evaporator 76. Housing 84 can also accommodate tubes 86 which circulate the refrigerant through the evaporator 76. The refrigerant can insert tubes 86 through an inlet 87 arranged in housing 84 and can let out pipes 86 through an outlet 89 arranged in housing 84. When the refrigerant flows through the tubes 86, the refrigerant can transfer heat to the refrigerant flowing inside the housing 84. When the refrigerant absorbs heat, the heated refrigerant, which is more buoyant than the refrigerant, can be extracted by natural convection through pumps 80 into condenser 78, which is at a lower temperature than evaporator 76. The heated can then flow through a transfer coil 88 included inside the condenser 78 and fans 26 can extract ambient air through the coil 88 to cool the refrigerant flowing into the coil 88. The refrigerated refrigerant can then return by gravity to the housing 84 wherein the refrigerant can again absorb heat from the refrigerant inside tubes 86.
    [00039] To promote the return of the refrigerant refrigerant into the evaporator 76, the condenser 78 can be arranged at a height 90 above evaporator 76 to promote the return of the refrigerant refrigerant to the evaporator 76. Condenser 78, evaporator 76, and piping of the refrigerant loop 80 can be dimensioned to minimize the pressure drop inside the cooler siphon 20, thus enabling a height less than 90 to be used to return the condenser refrigerant 78 to the evaporator 76 through natural convection. According to certain arrangements, the height 90 can be less than approximately 10 to 12 feet to allow for thermo-siphon cooler 12 to be shipped as a single integrated package on a conventional road truck. However, in other embodiments, height 90 can be any height appropriate. In certain embodiments, the evaporator 76 can also be arranged at an angle to provide cooling fluid drainage from the evaporator 76. According to certain embodiments, the evaporator 76 can be tilted at an angle of approximately 5 degrees to the horizontal .
    [00040] Evaporator 76 can be designed as a cleanable evaporator in which the interior of tubes 86 can be accessed for cleaning to remove contaminating formation of particles and / or dissolved solids that enter tubes 86 with the refrigerant. For example, the refrigerant can absorb solids from the ambient air that contacts the refrigerant in the cooling tower 14. To provide access to tubes 86, the evaporator 76 may include an access cover 92 that can be removed to expose openings in the tubes 86. In addition, in other embodiments, instead of, or in addition to, a removable access cover 92, the evaporator 76 may include a section of a removable head 94 that may allow access to tubes 86 for cleaning.
    [00041] In certain embodiments, the evaporator 76 may also include a sensor 95, such as an optical sensor, designed to detect the level of the coolant within the evaporator 76. In these embodiments, the sensor 95 can be used in conjunction with the system freeze protection 56 to ensure that the refrigerant was drained from the evaporator 76 when the freeze protection mode 56 freeze protection system was allowed. In addition, in certain embodiments, the cooler siphon 12 may include a valve 97 disposed within the piping of the refrigerant loop 80 to stop the flow of refrigerant along the refrigerant loop 80. In these embodiments, valve 97 can be closed by the controller 50 upon detection of a condition, such as a low ambient temperature, low evaporator temperature, for example, measured in temperature sensor 95, and / or no flow within the cooler siphon 12, which can produce freezing. When closed, valve 97 can promote the collection of refrigerant within coil 88 of condenser 78, which can inhibit the circulation of refrigerant within circuit 80 and prohibit the circulation of refrigerant to evaporator 76. In these modalities, evaporator 76 also it may incorporate additional heating and / or insulation, to provide an influx of heat to the evaporator 76 upon detection of potential freezing condition.
    [00042] FIGURE 4 illustrates another cooling system modality 10 that includes open loop cooling tower 14 and cooler thermo siphon 12. The cooling system modality 10, shown in FIGURE 4, is generally similar to the cooling system modality cooling 10 described above with respect to FIGURE 1. However, the cooling tower 14 shown in FIGURE 4 includes an integrated collecting well 42 instead of a collecting well that is disposed within building 16, as shown in FIGURE 1.
    [00043] As shown in FIGURE 4, the refrigerant can be cooled within the cooler siphon 12. The cooler siphon 12 includes freeze protection system 56, which can operate as described above with respect to FIGURE 1. However, the drain line 64 can be directed to a sewer or collection reservoir, instead of the collection well 42. The coolant fluid leaving the cooler siphon 12 can flow through valve 32 to the cooling tower 14 Inside the cooling tower 14, the cooling fluid can be directed through filler material 36 by the nozzles 34 and can be collected inside the collecting well 42, which can be located in the lower portion of the cooling tower 14. The valve 44 it can be opened to direct the formation of the coolant into the collection well 42 to justify losses in the coolant due to purging and evaporation. The valve 46 can also be opened to remove bleeding from the cooling tower 14. The cooled refrigerant from the sump 42 can then be returned to the heat exchange process 18 via the pump 48. Within the process of the heat exchanger heat 18, the cooling fluid can again absorb heat from the fluid process circulating within the fluid process loop 20.
    [00044] As described above with respect to FIGURES 1 through 4, the cooling siphon 12 can be used in a cooling system 10 that includes an open loop cooling tower in which ambient air can directly contact the refrigerant flowing through the cooling system 10. However, in other embodiments, the cooler siphon 10 can be employed within a circuit cooling tower as shown in FIGURE 5. Closed loop cooling towers can be particularly useful in systems in it may be desirable to reduce contaminants in the refrigerant.
    [00045] The cooling system modality 10 shown in FIGURE 5 can generally be similar to the cooling system described above with respect to FIGURE 1. However, instead of letting the cooling fluid inside the cooling system loop 22 be directly exposed to ambient air inside the cooling tower 14, as in FIGURE 1, the cooling system 10 in FIGURE 5 is isolated from contacting the ambient air using closed circuit cooling tower 91 in place of the cooling tower 14. Inside the tower closed-loop cooling system 91, the cooling fluid flowing through the cooling system loop 22 can be cooled through the closed-circuit cooling tower by cooling coil 98 which can transfer heat to a spray water loop 102 which is integral for the closed circuit cooling tower 91. The spray water circulating inside the loop inside the spray water loop 93 can be cooled through refriger before evaporator with ambient air, thus enabling the refrigeration fluid to flow through the cooling system loop 22 from being exposed to air transport and formation of water born contaminants normally associated with open cooling system loops. The spray water loop may include nozzles 34 that direct spray water through the closed circuit cooling tower cooling coil 98, a collecting well 42 for collecting spray water, spray water pipe 99, and the spray water pump 101. A fan 38 guided by an engine 40 can direct air upward through the closed circuit cooling tower 91 to provide evaporative cooling of the spray water. A purge valve 46 can be used to remove contaminants from the spray water loop 93 and the formation of water valve 44 can be used to direct the formation of spray water into the collection well 42 to justify losses in spray water. due to purging and evaporation.
    [00046] FIGURE 6 illustrates a method 100 that can be employed to govern the operation of a cooling system 10 that includes an open loop cooling tower, as shown in FIGURES 1 and 4, or a closed loop cooling tower, as shown in FIGURE 5. Method 100 can begin by determining (block 102) whether cooling system 10 is starting operation. For example, cooling system 10 can start operation by starting the heat exchange process 18. If cooling system 10 is starting operation, controller 50 can start (block 103) a freeze protection mode of the freeze protection system 56. To start the freeze protection mode, controller 50 can position valve 24 to direct coolant to bypass cooler siphon 12. Controller 50 can also leave valves 60 , 62, and 66 in the open position. In addition, controller 50 can close valve 97 to interrupt the refrigerant within refrigerant loop 80 of cooler siphon 12.
    [00047] If cooling system 10 is not starting operation, controller 50 can determine (block 104) whether to start a low temperature protection mode of freeze protection system 56. For example, controller 50 can receive the ambient temperature as an input of the temperature sensor 68 and can determine if the ambient temperature is below a prescribed value of the ambient temperature, which, in certain embodiments, can be 36 ° F. However, in other embodiments, the prescribed room temperature may vary. If the room temperature is below the prescribed room temperature value, controller 50 can then determine whether there is flow through the cooler siphon 12. For example, controller 50 can detect flow through the cooler siphon 12 using a pressure switch. differential 58.
    [00048] If controller 50 determines that there is no flow through cooler siphon 12, controller 50 can initiate (block 105) the low temperature protection mode of the freeze protection system 56. The temperature protection mode low temperature can enable the refrigerant to be trapped inside the cooler siphon 12 during relatively short periods of ambient temperatures and / or during relatively short periods of cooling system 10. For example, the low temperature protection mode can be started when the cooling system 10 is interrupted at night when there is no demand for cooling of the heat exchanger process 18.
    [00049] To initiate the low temperature protection mode, controller 50 can adjust the operation of the cooling system 10 to protect the refrigerant fluid inside the cooler siphon 12 from freezing. For example, controller 50 can turn off the fans in the cooler siphon 26. Controller 50 can also ensure that valves 24 and 30 are open to allow coolant to flow through cooler siphon 12. controller 50 can close valve 97 to interrupt the refrigeration flow through refrigerant loop 80. Closing valve 97 can allow refrigerant to collect inside condenser 78, which can inhibit freezing of the refrigerant inside evaporator 76. controller 50 also it can turn on supplementary heat for evaporator 76, which can provide heat for evaporator 76 to inhibit the freezing of the refrigerant contained within evaporator 76.
    [00050] If there is a flow through the cooler siphon 12 and / or if the ambient temperature is above the prescribed ambient temperature, controller 50 can then determine (block 106) whether the temperature of the evaporator temperature is below one prescribed value for the evaporator temperature. For example, controller 50 can receive the evaporator temperature as an input from the temperature sensor 57, which can indicate the refrigerant temperature within the side of the evaporator housing 76. According to certain modalities, the prescribed evaporator temperature value it can be 33 ° F. However, in other embodiments, the prescribed evaporator temperature may vary.
    [00051] If controller 50 determines that the evaporator temperature is below the prescribed evaporator temperature, controller 50 can initiate (block 108) the freeze protection mode of the freeze protection system 56. To start in the freeze protection mode, controller 50 can adjust the operation of the cooling system 10 so that the refrigerant bypasses the cooler siphon 12. In particular, controller 50 can turn off the fans of the cooler siphon 26 and can divert the water away from the cooler siphon 12 using valve 24. Controller 50 can also position valve 32 to direct the coolant from the cooler siphon 12 directly to the collecting well 42. After the fluid cooling system has drained from the cooler siphon 12, controller 50 can position valve 32 to allow cooling fluid to flow through cooling tower 14, when and the cooling fluid can be cooled by evaporative cooling.
    [00052] In freeze protection mode, controller 50 can also drain coolant from cooler siphon 12. For example, controller 50 can close valve 30 and open valves 60 and 62 to direct the refrigerant from inside the cooler siphon 12 to drain line 64. Controller 50 can also open valve 66 to inject air into cooler siphon 12 to add coolant drainage from the coolant cooler siphon 12. According to certain modalities, the cooling drain fluid from cooler siphon 12 in freeze protection mode can protect tubes 86 from damage due to expansion and / or freezing of coolant.
    [00053] If controller 50 determines that the freeze protection mode should not be started, controller 50 can then determine (block 110) whether the freeze protection mode should be disabled. First, controller 50 can determine and freeze protection mode is currently enabled, for example, based on valve positions 24, 60, 62, 66, and 30. If freeze protection mode is currently enabled, the controller 50 can then determine whether the intermediate temperature (that is, the temperature of the cooling fluid exiting the cooler siphon 12), as measured by temperature sensor 70, is above a prescribed intermediate temperature value, which, in certain embodiments , it can be approximately 50 ° F. However, in other embodiments, the prescribed intermediate temperature value may vary.
    [00054] If the intermediate temperature is not above the prescribed intermediate temperature, controller 50 can enable the cooling system 10 to continue operating in the freeze protection mode. However, if the intermediate temperature is above the prescribed intermediate temperature value, controller 50 can initiate (block 112) a sequence to re-start freezing to allow the refrigerant to flow through the cooler siphon 12. In particular, controller 50 can close drain valves 60 and 62 and can also close vent valve 66. In addition, controller 50 can adjust the positions of valves 24 and 30 to allow coolant to flow through the cooler thermostat 12. As a result, the cooling system 10 may now be operating in a cooling mode process in which the cooling fluid flows through the cooler siphon 12 to be cooled by ambient air.
    [00055] As shown in FIGURE 7, method 100 can then continue to determine (block 114) whether the cooling system 10 is operating in a cooling process mode. In the cooling process mode, the cooling system 10 can be set up in such a way that the cooling fluid is directed through both the cooling thermosiphon 12 and the cooling tower 14. Consequently, the controller 50 can detect the operation. in cooling process mode based on inputs from motors 28 and 40 and valves 24 and 32. If controller 50 detects that cooling system 10 is not operating in cooling process mode, controller 50 can leave the cooling system 10 operate in its current mode. For example, if the cooling system 10 is not operating in the cooling process mode, the cooling system 10 may be operating in the freeze protection mode or in the low temperature mode.
    [00056] If the cooling system 10 is operating in the refrigeration process mode, the controller 50 can then perform (block 116) calculations that can be used to determine (block 118) whether the refrigeration with the refrigerator siphon 12 should be allowed. For example, controller 50 can calculate the economic strength consumption limit of the thermo-siphon (TEPCL). As shown in FIGURE 8, TEPCL can be the maximum kilowatt of electricity that should be used by condenser fans 26 per degree of cooling temperature drop achieved by cooler siphon 12, to ensure that water costs avoided are greater than the costs of incremental electricity used to operate the refrigerator thermosiphon 12.
    [00057] The TEPCL can be calculated using inputs such as the cost of water, the cost of electricity, the temperature of wet and dry pipe in the environment, use of cooling tower water, the cost of waste water, the cost of water treatment, and / or power consumption of cooling tower fans, among others. Water and electricity costs can be entered by an operator or can be obtained by controller 50 over a network connection. Using water and electricity rates, controller 50 can calculate the TEPCL as the maximum kilowatts to be used by condenser fan motors 28 per degree of refrigeration measured by the temperature difference between the temperature of the refrigerant leaving the process of heat exchange 18, as measured by sensor 72, and the temperature of the refrigerant leaving the cooler siphon 12 (i.e., the intermediate temperature), as measured by sensor 70.
    [00058] The TEPCL can be used to calculate the start of starting the thermosiphon (TST). As shown in FIGURE 7, the start-up of the thermosiphon can be the minimum temperature difference that should exist between the temperature of the refrigerant leaving the heat exchanger process 18, as measured by the temperature sensor 72, and the ambient air temperature, as measured by temperature sensor 68, to enable the cooler siphon 12 to be operated at an economical level of power consumption below TEPCL, when condenser fans 26 are operated at a low fan speed.
    [00059] Controller 50 can then use the calculated TST to determine (block 118) whether the actual temperature difference between the cooling fluid of the outlet process heat exchanger 18 and the ambient air temperature is greater than the TST . For example, controller 50 can calculate the actual temperature difference based on the temperatures received from sensors 70 and 68. If the actual temperature difference is below TST, controller 50 can disable (block 120) the operation of the cooler siphon 12. For example, the controller 50 can position the valve 24 and in such a way that the cooling fluid deflects the cooler siphon 12. Furthermore, in certain embodiments, the controller 50 can shut off the condenser fans 26.
    [00060] Furthermore, in certain embodiments, controller 50 can also determine whether an ambient temperature is above a prescribed high temperature value. For example, controller 50 may receive an input from temperature sensor 68 which indicates the ambient temperature. If the ambient temperature is above the prescribed high temperature value, controller 50 may disable (block 120) the operation of the cooler siphon 12. According to certain modalities, the high temperature prescribed value may be above room temperature, the heat of which must be added to the refrigeration fluid flowing through the cooler siphon 12. Therefore, in certain embodiments, the high temperature prescribed value may depend on the temperature of the process heat exchanger exiting the refrigerant 18, which can be detected by the temperature sensor 72. In situations where the ambient temperature is approximately equal to or greater than the temperature of the process heat exchanger exiting the refrigerant 18, it may be desirable to bypass the refrigerator thermosiphon 12 to avoid adding heat from the ambient air to the coolant.
    [00061] If, on the one hand, controller 50 determines (block 118) that the ambient temperature is below the prescribed high temperature value and / or if the actual temperature difference is greater than the TST, controller 50 can enable (block 122) the operation of the cooler siphon 12. For example, the controller 50 can position the valve 24 to allow the refrigerant to flow through the cooler siphon 12. Therefore, the coolant can flow through the thermo-siphon 12 in which the fluid can be cooled by ambient air.
    [00062] After the cooler siphon 12 is enabled, the controller 50 can then adjust the fan operation 26 to vary the amount of cooling provided by the cooler siphon 12. According to certain modalities, the fan operation 26 can be adjusted to minimize electricity consumption while still providing the desired amount of cooling. For example, controller 50 can determine (block 124) whether the intermediate temperature, as measured by temperature sensor 70, is below the prescribed value for the temperature of the cooling system. When the intermediate temperature is at or below the prescribed value for the temperature of the cooling system, which is the desired temperature of the cooling fluid entering the heat exchanger process 18, the cooling thermosiphon 12 may be able to provide sufficient cooling to reach the setpoint of the cooling system temperature, without additional cooling from the cooling tower 14. Furthermore, when the intermediate temperature is below the setpoint for the cooling system temperature, the thermosiphon 12 can currently super cool the cooling fluid, and therefore the fan speed of condenser 26 can be reduced.
    [00063] If the intermediate temperature is below the prescribed cooling system temperature, controller 50 can then determine (block 126) whether the condenser fans are operating at minimum speed. If the condenser fans are operating at the minimum speed, controller 50 can turn off (block 128) the condenser fans. In these embodiments, the ambient air temperature can be low enough to cool the cooling fluid to the prescribed temperature of the cooling system without using electricity to operate the fans. In this mode of operation, the thermo-siphon cooler 12 can be operated without consuming electricity. On the other hand, if controller 50 determines (block 126) that the fans are not operating at a minimum fan speed, controller 50 can decrease (block 130) the fan speed. Reducing the fan speed can reduce the amount of electricity consumed by the cooler siphon 12.
    [00064] If controller 50 determines (block 124) that the intermediate temperature is above the prescribed temperature value for the cooling system, the cooler siphon 12 may not currently be providing sufficient cooling to reach the prescribed temperature value of the cooling system. Therefore, controller 50 can determine whether to increase the cooling capacity of the cooling thermosiphon 12 by adjusting the speed of the condenser fans. First, controller 50 can determine (block 132) whether the condenser fans are operational. If the fans are operational, controller 50 can then determine (block 134) whether the fans are operational in an economically efficient manner. According to certain modalities, controller 134 can calculate the current economic power consumption of the thermo-siphon (TEPC) used by the refrigerator thermo-siphon 12. For example, controller 50 can calculate the actual kilowatts being used by the engine 28 and can divide these kilowatts by the temperature difference between the coolant temperature exiting the process heat exchanger 18, as measured by the temperature sensor 72 and the coolant temperature exiting the cooler siphon 12, as measured by the temperature sensor temperature 70.
    [00065] Controller 50 can then compare the actual TEPC with the TEPCL. If the actual TEPC is above the TEPCL, controller 50 can then decrease (block 135) the fan speed. Decreasing the speed of the fans can reduce the amount of cooling provided by the thermo-siphon cooler 12 and therefore more cooling can be provided by the cooling tower 14. In these examples, controller 50 can increase the speed of the cooling tower fan 38 to provide additional cooling capacity. On the other hand, if the TEPC is below the TEPCL, controller 50 can increase (block 136) the speed of the condenser fans to increase the amount of cooling provided by the cooler siphon 12. In addition, if controller 50 determines ( block 132) that the fans are not connected, controller 50 can turn on (block 138) the fans for the minimum fan speed. Controller 50 can then again determine (block 124) whether the intermediate temperature is below the prescribed value for the temperature of the cooling system and can then adjust the operation of the condenser fans as described above with respect to blocks 126 to 138.
    [00066] As can be seen, a certain amount of hysteresis can be used when varying the operation of the condenser fans. For example, in certain embodiments, controller 50 can adjust the operation of the condenser fans after detecting a limit amount of change in the intermediate temperature, as measured by temperature sensor 70.
    [00067] FIGURE 8 illustrates various inputs and outputs that can be used by controller 50 to govern the operation of the cooling system 12. As described above, the inputs and outputs can be analogous and / or digital outputs and can be used by controller 50 to enable the freeze protection system 56 and to govern the operation of the cooler siphon 12 and the cooling tower 14. In addition, in certain embodiments, the inputs and outputs shown in FIGURE 7 can be used by controller 50 to determine when directing the cooling fluid along the cooler siphon 12, through the cooling tower 14, or through both, cooler siphon 12 and the cooling tower 14.
    [00068] Although FIGURES 6 and 7 describe method 100 in the context of a cooler siphon, in other embodiments, portions of method 100 can be used to control refrigeration systems with other types of dry heat rejection systems, such as a refrigerated air condenser used in parallel with an evaporator condenser in a system circulating refrigerant directly to the rejection devices.
    [00069] Although FIGURES 6 and 7 describe method 100 in the context of a cooler siphon, in other embodiments, portions of method 100 can be used to control refrigeration systems with other types of dry heat rejection systems, such as dry refrigerators used in conjunction with a freeze-protecting refrigerant. FIGURE 9 illustrates another embodiment of the cooling system 10, which includes a dry cooler 142 and a heat exchanger 143. According to certain embodiments, dry cooler 142 may be similar to the air cooler condenser 78 employed within the term -fridge siphon 12. However, in other embodiments, any suitable refrigerated air condenser, or other type of dry heat rejection device can be used. As used here, the term "dry heat rejection device" can refer to a heat transfer device that does not employ wet or evaporative cooling. According to certain modalities, the heat exchanger 143 can be similar to the evaporator 76 used in the thermo-siphon cooler 12. However, in other modalities, any appropriate type of heat exchanger, such as a plate heat exchanger, can be used .
    [00070] As shown in FIGURE 9, the cooling system 10 includes a dry heat rejection system that includes the heat exchanger 143, dry cooler 142, a freezing protective refrigerant loop, such as a glycol or brine loop 138, and a pump 140. The cooling fluid from the process heat exchanger 18 can flow through the heat exchanger 143, where the refrigerant can transfer heat to the freeze-protective refrigerant, such as glycol or brine, flowing through from the heat exchanger 143. The refrigerant can then exit the heat exchanger 143 and flow to the cooling tower 14 where the refrigerant can be further cooled as described above with respect to FIGURE 1. In certain embodiments where the heat exchanger 143 is a shell and tube heat exchanger, the coolant can flow through the tubes of the heat exchanger 143, while the cooler protector from freezing, like a glycol or salt Moorish, flows through the side of the heat exchanger housing 143.
    [00071] Within the dry heat rejection system, the heated freeze protective cooler from heat exchanger 143 can flow through cooler loop 138 to dry cooler 142 through pump 140. Although not shown, pump 140 can be guided by one or more engines. Inside the dry cooler 142, the freeze-protective coolant can be cooled by the air that is driven through the dry cooler 142 by the fans 26. The cooled coolant can then leave the dry cooler 142 and return to the heat exchanger 143 where the coolant it can again absorb heat from the cooling fluid flowing through the heat exchanger 143.
    [00072] Because of the additional freeze protective cooling loop 138, the cooling fluid can be contained within building 16 and cannot be exposed to ambient air. Consequently, a freeze protection system cannot be employed because the cooling system can be protected from low temperature environments by construction 16. Consequently, blocks 102 to 112 of method 100 (FIGURE 6) can be omitted when operating the mode of the cooling system shown in FIGURE 9. However, as shown in FIGURE 10, a method 146 that is similar to blocks 114 to 138 of FIGURE 7 can be employed to operate the dry heat rejection system shown in FIGURE 9.
    [00073] As shown in FIGURE 10, method 146 can start by detecting (block 148) that cooling system 10 that is operating in a process cooling mode. For example, controller 50 can detect operation in process cooling mode based on valve positions 24 and 32. If controller 50 detects that the system is operating in process cooling mode, controller 50 can then calculate ( block 150) the limit of consumption of economic dry rejection force (DEPCL).
    [00074] DEPCL can be similar to the TEPCL described above with respect to FIGURES 5 to 7. For example, DEPCL can be maximum kilowatts of electricity used by the dry heat rejection system by the degree of coolant temperature drop, achieved by the dry heat rejection system to ensure that the avoided water costs are greater than the incremental electricity costs used to operate the dry heat rejection system. For example, as shown in FIGURE 8, electricity costs can be based on the electricity consumption of the motor 28 used to guide the fans 26, as well as the electricity used by the motor that drives the pump 140. Controller 50 can then calculate ( block 152) the threshold of the start of the dry heat rejection system (DST). The DST can be similar to the TST described above with respect to FIGURES 5 to 7. For example, the DST can be the minimum temperature difference that must exist between the temperature of the cooling fluid exiting the process heat exchanger, as measured by sensor 72, and the ambient temperature, as measured by temperature sensor 68, which is known to enable real power consumption of the dry heat rejection system, which is below DEPCL.
    [00075] Controller 50 can then use the calculated DST to determine (block 154) whether the actual temperature difference between the cooling fluid exiting the process heat exchanger 18 and the ambient air is greater than the DST. If the actual temperature difference is below DST, controller 50 may disable (block 156) operation of the dry heat rejection system. For example, controller 50 can position valve 24 to direct coolant to bypass heat exchanger 143 and flow directly through valve 32 to cooling tower 14. Furthermore, in certain embodiments, controller 50 can shut down fans 26 and pump 140.
    [00076] On the other hand, if controller 50 determines (block 154) that the actual temperature difference is greater than DST, controller 50 may enable (block 158) the dry heat rejection system. For example, controller 50 can adjust valve 24 to direct coolant through heat exchanger 143 to transfer heat from coolant to the freeze cooler that flows through dry cooler 142. In addition, controller 50 it can turn on fans 26 and pump 140. Furthermore, while the dry heat rejection system is operating, controller 50 can govern the operation of fans 26, as described above in FIGURE 6, with respect to blocks 124 to 138 .
    [00077] FIGURE 11 represents another modality of the cooling system 10 that includes cooler siphon 12 and an open loop cooling tower 160, which is a hyperbolic natural graph of the cooling tower. A steam condenser 162 can be used to transfer heat from a turbine to the cooling system loop 22. According to certain embodiments, the cooling system 10 can be used to provide cooling for the power plant. The cooling system shown in FIGURE 11 can operate in a manner generally similar to the cooling system described above with respect to FIGURE 1, and method 100 can be employed to operate the cooling system, as described above with respect to FIGURES 6 and 7 .
    [00078] Although only certain characteristics and modalities of the invention have been illustrated and described, many modifications and changes can occur to those skilled in the art (for example, variations in sizes, dimensions, structures, shapes, and proportions of the various elements, parameter values (for example, temperatures, pressures, etc.), setting up arrangements, using materials, guidelines, etc.) without materially departing from the new teachings and advantages of the subject mentioned in the claims. For example, the order or sequence of any steps in the process or method can be varied or re-sequenced according to alternative modalities. In addition, although individual modalities are discussed here, the description is intended to cover all combinations of these modalities. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as they fall within the true spirit of the invention. Furthermore, in an effort to provide a concise description of the exemplary modalities, all features and actual implementation may not have been described (ie, those unrelated to the currently considered best way of carrying out the invention, or those unrelated to enable the claimed invention). It should be noted that in the development of any of these current implementations, as in any engineering or design project, numerous implementation-specific decisions can be made. Such a development effort may be complex and time consuming, but it should nevertheless not be a routine undertaken in design, manufacture, and preparation for those of ordinary knowledge having the benefit of this description, without proper experimentation.
    权利要求:
    Claims (15)
    [0001]
    1. Refrigeration system characterized by the fact that it comprises: a dry heat rejection system configured to transfer heat from a refrigeration fluid to the ambient air through dry refrigeration; a cooling tower disposed downstream of the dry heat rejection system with respect to the refrigerant and configured to transfer heat from the refrigerant to the ambient air through evaporative refrigeration; and a controller configured to determine whether the operation of the dry heat rejection system should be enabled or disabled based on water cost, electricity cost or a combination thereof.
    [0002]
    2. Cooling system according to claim 1, characterized by the fact that the dry heat rejection system operates without a mechanical circulation device.
    [0003]
    3. Cooling system according to claim 1, characterized by the fact that the dry heat rejection system comprises a cooler siphon comprising: a first heat exchanger configured to transfer heat from the cooling fluid to a circulating refrigerant through the first heat exchanger; a second heat exchanger configured to transfer heat from the refrigerant to the ambient air; and piping sized to circulate the refrigerant between the first heat exchanger and the second heat exchanger based on natural convection.
    [0004]
    4. Cooling system according to claim 3, characterized by the fact that it comprises a valve system operably coupled to the controller, and in which the controller is configured to adjust the valve system to drain the refrigerant from the cooling system. dry heat rejection in response to detecting a refrigerant temperature within the first heat exchanger that is below a prescribed temperature value.
    [0005]
    5. Refrigeration system according to claim 3, characterized by the fact that it comprises a valve system operably coupled to the controller, and in which the controller is configured to adjust the valve system to interrupt the flow of refrigerant within the pipeline in response to detecting an ambient temperature, a refrigerating temperature, or a refrigerating temperature fluid, or a combination thereof that is below a prescribed temperature value.
    [0006]
    6. Cooling system, according to claim 1, characterized by the fact that the dry heat rejection system comprises: a first heat exchanger configured to transfer heat from the cooling fluid to a freezing protective cooler circulating around along the first heat exchanger; a second heat exchanger configured to transfer heat from the protective cooling refrigerator to the ambient air; and a pump configured to circulate the refrigerant between the first heat exchanger and the second heat exchanger.
    [0007]
    7. Cooling system according to claim 3, characterized by the fact that: the first heat exchanger comprises a removable section for cleaning tubes from the first heat exchanger.
    [0008]
    8. Cooling system according to claim 6, characterized by the fact that the thermosiphon cooler comprises a unique structure containing the first heat exchanger, the piping, and the second heat exchanger.
    [0009]
    Cooling system according to claim 7, characterized in that the removable section comprises a removable access cover from one end of the head and the first heat exchanger or a removable head end from the first heat exchanger.
    [0010]
    10. Refrigeration system, according to claim 6, characterized by the fact that it comprises a valve coupled to the pipeline to selectively block the return of the refrigerant to the first heat exchanger from the second heat exchanger.
    [0011]
    11. Refrigeration system according to claim 7, characterized by the fact that it comprises a controller configured to selectively operate the thermosiphon cooler based on water rates and electricity rates.
    [0012]
    12. Method for operating the refrigeration system characterized by the fact that it comprises: determining a thermo-siphon economic power consumption limit value (TEPCL) which is below which it is cost effective to operate a refrigerator thermo-siphon, in which the TEPCL value is determined based on the cost of water, cost of electricity or both; determine, using the TEPCL value, a desired temperature differential between a first temperature of the cooling fluid leaving a heat exchanger process cooled by the cooling system and an ambient temperature; and to enable the operation of the refrigerator thermosiphon in response to detect that a temperature differential felt between the first temperature and the ambient temperature, is greater than the desired temperature differential.
    [0013]
    13. Method, according to claim 12, characterized by the fact that it comprises calculating a real power consumption of the thermosiphon cooler and adjusting a speed of one or more fans of the thermosiphon cooler based on the actual consumption of the thermosiphon cooler.
    [0014]
    14. Method, according to claim 12, characterized by the fact that it comprises enabling a refrigerant protection mode in response to detecting a refrigerant temperature below the prescribed freeze protection temperature, in which to enable the protection mode freezing system comprises: adjusting the position of one or more valves to drain the refrigerant from the thermosiphon refrigerant, or opening a valve to inject ambient air into the thermosiphon refrigerator to drain a refrigerant from the refrigerator. thermosiphon.
    [0015]
    15. Method, according to claim 12, characterized by the fact that it comprises: detecting an intermediate temperature of a refrigeration fluid leaving the thermosiphon cooler; and make it possible to operate a cooling tower in response to detecting that the intermediate temperature is greater than a prescribed value for the refrigerant entering a heat exchanger process.
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    同族专利:
    公开号 | 公开日
    JP2013528277A|2013-07-08|
    AU2010354078A1|2012-11-29|
    US10302363B2|2019-05-28|
    US10451351B2|2019-10-22|
    CN103282734A|2013-09-04|
    US20160348979A1|2016-12-01|
    CN110118493A|2019-08-13|
    KR20170062544A|2017-06-07|
    US9939201B2|2018-04-10|
    EP2577205A2|2013-04-10|
    KR20160027208A|2016-03-09|
    AU2010354078B2|2014-05-15|
    KR102035103B1|2019-10-22|
    WO2011149487A3|2013-04-18|
    JP5800894B2|2015-10-28|
    ZA201208280B|2014-01-29|
    US10295262B2|2019-05-21|
    WO2011149487A2|2011-12-01|
    US20160348978A1|2016-12-01|
    US20160348977A1|2016-12-01|
    US20110289951A1|2011-12-01|
    KR20180102706A|2018-09-17|
    BR112012030204A2|2017-01-24|
    KR20130031300A|2013-03-28|
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    法律状态:
    2019-01-15| B06F| Objections, documents and/or translations needed after an examination request according art. 34 industrial property law|
    2019-07-16| B06T| Formal requirements before examination|
    2020-06-30| B09A| Decision: intention to grant|
    2020-11-10| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 10/11/2020, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    US34908010P| true| 2010-05-27|2010-05-27|
    US61/349,080|2010-05-27|
    PCT/US2010/042737|WO2011149487A2|2010-05-27|2010-07-21|Thermosyphon coolers for cooling systems with cooling towers|
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