专利摘要:
thermographic testing process and testing device for carrying out the testing process. the present invention relates to a thermographic test process for the detection and identification with localized resolution of defects close to the surface in a tested object, an area of the tested object's surface will be heated, for example, inductively. a sequence of subsequent thermographic images will be recorded over time and within a thermal expansion phase, with each thermographic image representing a temperature distribution located in a surface area of the object tested, recorded by the thermographic image. from the thermographic images will be determined temperature profiles allocated to the correct position, and each temperature profile, allocated to the correct position, is allocated to the same measurement region of the surface of the tested object. for a variety of measurement positions in the measurement area, captured by the temperature profile, time paths of temperature values will then be determined from the temperature profiles. these will be evaluated at least according to an evaluation criterion that characterizes the thermal flow in the measurement region. the process takes into account the thermal flow in the region of corresponding defects and offers, in comparison with conventional systems, better suspension of interference and an improved degree of selectivity between real and pseudo defects.
公开号:BR112012025659B1
申请号:R112012025659
申请日:2011-04-07
公开日:2020-04-07
发明作者:Traxler Gerhard;Palfinger Werner
申请人:Foerster Inst Dr Gmbh & Co Kg;
IPC主号:
专利说明:

Descriptive Report of the Invention Patent for THERMOGRAPHIC TESTING PROCESS AND TESTING DEVICE FOR THE TESTING PROCESS.
Background of the Invention [0001] The present invention relates to a thermographic testing process for localized detection and identification of defects close to the surface in a tested object, as well as covering a test device for carrying out the testing process.
[0002] Semi-finished products and electrically conductive material such as rods, bars, tubes or wires and metallic materials can serve as basic materials for high quality end products and are often subject to the highest quality requirements. The text regarding material flaws, especially those made close to the surface, such as cracks, cavities or other material heterogeneities, are an important part of the quality control of these products. In this case, the aim is normally to carry out a more continuous and flawless examination of the material surface with a high localized resolution, which, according to the possibility, is carried out as early as possible in the production chain, so that on the basis of the test results, depending on the species of the defects found, decide whether the defects are not critical for further processing or at least a repair can be made by means of a finish, such as grinding, or whether the material will have to be a refugee.
[0003] In addition to the magnetic methods, often used for these tests, such as the swirling current technique or the diffuser flow technique, thermographic test processes are also currently used for the detection with localized resolution and identification of defects close to the surface in tested objects.
[0004] In a well-known thermographic testing process, an obje
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2/33 the tested electrical conductor is, for example, a steel rod, after lamination it passes through an induction coil subjected to high frequency alternating current, which induces a current flow close to the surface of the tested object. Based on the Skin effect, the current density near the surface of the part is greater than that inside the tested part. Interference in the fabric, for example, cracks that are located in the cross section of the induced electric current flow act as electrical resistances and deflect the current flow, which, in the tested material, seeks the path of the least resistance (electrical). Higher current densities and therefore also greater energy dissipation at the so-called narrow points of the current flow in the defect region are the consequence. The dissipation of energy generated in the region of the weaving disturbances is noticed by the production of heat, in such a way that the area in question, located and limited, immediately, in the case of a weaving disturbance, presents a higher temperature in comparison with the environment free from disturbances. With the aid of a thermochamber or other suitable recording set, sensitive to thermal rays, based on the local temperature values, within a surface area covered by the recording set, the presence of defects close to the surface can be detected, with local resolution. Normally, there is also a visualization of the surface areas covered, and perceptible points, determined by the thermographic process, can be automatically evaluated with a sequential evaluation system.
[0005] DE 10 2007 055 210 A1 describes a thermographic test process, as well as a test device, prepared to carry out the test process. The test device has an induction coil for heating a surface area of a tested metallic object that passes through the induction coil, through
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3/33 using, for example, a steel rod, as well as having one or more infrared chambers for measuring the temperature profile of the steel rod in passing. The measurement results will be used to activate a system of colored marks, in order to mark defects that have been verified. To evaluate the thermographic images (thermal images), recorded by the infrared cameras, according to the description, an evaluation software is provided that analyzes a thermal image or thermal images, identifying differences in temperatures above a predetermined threshold value, communicating them as defect. The extent of the temperature difference above the predetermined threshold value will be considered as an indication of the depth of the defect. The evaluation software can evaluate defects both in terms of its length and also in relation to the extent of the temperature differential above the threshold value. The evaluation software can remove defects with a length below a minimum defect length, promoting its removal from a list of defects, so that these defects are not evaluated as defects. When, however, a defect is located below a minimum defect length, however, the differential temperature extension is above the threshold value, which is above a maximum temperature differential extension, then a defect of this type so it will be reported as a defect. In this way, a defect will be identified depending on the extent of the defect and the temperature differential in relation to the environment.
[0006] Normally, an increase in the temperature profile above 2 K, in relation to the environment, will be considered as a defect, however, the threshold temperature can also be selected lower. A temperature differential in relation to the environment of 5 K or more will be clearly identified as a defect.
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4/33 [0007] As a rule, a temperature profile to be evaluated, in practice is superimposed by an interference signal of significant amplitude. As sources of failure are considered, among others, localized oscillations of emissions from the surface of the tested object, reflections of the environment, and generally unavoidable circumstances in the actual test operation, such as foreign bodies on the surface of the tested part. Wrong indications can also be produced by the geometry of the tested part, since, for example, edges in polygonal profiles often have a higher temperature in relation to the environment. Typically, the temperature differentials that present a defect similar to a crack, in comparison with the surrounding surface, are situated in the order of magnitude from 1 K to 10 K. It was observed that interference amplitudes may also be situated in this order of greatness. Therefore, despite possible measures to reduce the amplitude of interference, it cannot be excluded that interferences are erroneously classified as structural failures, that is, defects.
Task and solution [0008] It is a task of the invention to offer a thermographic test process and a thermographic test device, suitable for carrying out the process, which offer - compared to the state of the art - an improved interference suppression in signal evaluation thermographic. In particular, the degree of selectivity in the differentiation between real and pseudo-defects that can be attributed to other interferences should be improved. Preferably, a continuous surface test of elongated objects, of electrical conductive material, should be offered with greater reliability in the recognition and identification of defects.
[0009] To solve this and other tasks, the invention offers a thermographic test process with the characteristics of the invention.
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5/33 claim 1, as well as a thermographic test device, prepared for carrying out the process, presenting the characteristics of claim 10. Advantageous modalities are indicated in the dependent claims. The text of all claims, by reference, will constitute content of the description.
[00010] In the test process, a segment to be tested from the test object will be exposed to the action of a heater assembly. This will also be referred to hereinafter as heating. In this case, thermal energy will be applied in such a way that a thermal imbalance is formed between defective areas, that is, flawed points, which have defects, and a tested material free from defects. It is part of a defective point, or a defective area, the effective failure, for example, a crack, and the immediate surroundings. The defect-free environment can eventually - when subjected to the heating set - can preserve its temperature, that is, it will not be heated, or it can be heated to a lesser extent than the defective points.
[00011] In the case of electrically conductive test objects, for example, in metal rods, bars, wires or similar material, for heating an inductive process can be used, for example. The application of thermal energy in the defect areas of the tested object can also be done with the aid of ultrasound.
[00012] Within a thermal expansion phase, a sequence with two or more thermographic images will be recorded and these will be recorded at the reciprocal temporal distance. The expansion phase begins when the heat flow from the local defective area is noticed to the environment. The thermal expansion phase extends within the cooling phase, sequential to heating and in many cases corresponds to a cooling phase. However, there is often no strict limit between the
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6/33 heating and cooling phase. The beginning of the thermal expansion phase may temporarily overlap with the localized heating phase, because the thermal energy can already expand during the heating itself.
[00013] Each of the thermographic images represents, in this case, a temperature distribution located in a surface area, registered by the thermographic image, of the tested object, at different times during the thermal expansion. When the record set, provided for capturing thermographic images, for example, a thermographic camera, and the tested object are inactive, that is, at rest, then the surface areas of the tested object can be identical, and were recorded at different times . In the case of a relative movement between the state object and the record set, the surface areas can be arranged in relation to one another spatially out of step.
[00014] From the thermographic images of a sequence, temperature profiles allocated in the correct position will be determined, and each temperature profile allocated reciprocally in the right position is allocated the same measurement region of the surface of the tested object. The expression measurement area refers to a one-dimensional or two-dimensional expansion area that occupies a fixed position in the coordinate system of the object being tested. There are many measurement positions in the measurement area.
[00015] The term temperature profile designates a local resolution profile, in which there are different locations, that is, different positions, within the temperature profile, values of a measurement quantity representing the temperature in the respective location are allocated. The temperature profile can be understood as a localized function that describes the dependence of the temperature value located within the temperature profile. A temperature profile can
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7/33 refer, for example, to a linear profile, to a more or less narrow, almost linear region. It can also be a 2D profile, that is, a surface profile when the localized distribution of temperature values will then be described in a spatial segment of shape and size predetermined by the temperature profile. The measured quantity allocated to the different locations of the temperature profile can be designated as the temperature value. In this case, as a rule, the temperature will not be directly measured, but, for example, the intensity, that is, the amplitude of the thermal irradiation that is verified from the respective location and that, with conventional means in thermography, can be recalculated to a localized temperature of a profile location.
[00016] In this way, several temperature profiles (at least two) will be determined that represent the temperature path located within the same measurement region at different times during cooling. The time paths of temperature values of the temperature profiles for a variety of measuring positions in the measuring area, determined by the temperature profiles, will then be quantitatively determined, so that for a variety of measuring positions in the measuring area, localized development of local temperature values. The routes, that is to say, local traces will then be evaluated at least according to an evaluation criterion that is adequate to characterize the heat flow in the measurement area.
[00017] In the process, not only the temperature profiles will be analyzed in relation to the tracing of the localized temperature, which, however, also represent their temporal change. A sequence is received, that is, a continuity of temperature profiles for a defined measurement area on the surface and a defined time area. An essential aspect of the process is the integration of the flow
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8/33 thermal, that is, the dynamics of the temporal development of the temperature profile and its evaluation, that is, interpretation.
[00018] According to another formulation, it will therefore be proposed to use a variant of the thermography of the local resolution thermal flow for the purpose of detecting and identifying defects close to the surface in suitable test objects, with the temporal development of the localized distribution that can be verified on the surface of the temperature tested part will be determined and evaluated. In this case, among other factors, the lateral thermal flow in a quantitative sense will be recorded and evaluated.
[00019] Compared to the state of the art, an essentially more reliable classification of defects results, for example, as cracks or structural failure, because the process allows an improved separation of temperature effects caused by defects and effects not conditioned to thermal flow. . Furthermore, this results in a possibility of improved evaluation of the thermographic information, also in the case of reduced signal amplitudes, because not only the amplitude, that is, the intensity of the temperature signals in the profiles, but also their dynamics on the axis, is decisive. temporal. In this way, a considerably improved interference suppression results even when the interference amplitude (not attributable to the sought defects) is greater than the useful signal amplitude, and the useful signal amplitude here designates the signal amplitude produced by structural failures .
[00020] The test process makes it possible to register and quantify the thermal expansion located in space, after a sudden, limited thermal application. The spatial-temporal thermal expansion takes place - in a simplified way - in such a way that the heat concentrated in the area of a potential defect, with the passage of time, seeps into colder areas of the object's material
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9/33 tested. This flow is revealed in a lateral surface temperature distribution, since the temperature profile, at the point of excitation, over time has its amplitude reduced, but, in this case, there is an increase in temperature in the immediate vicinity of the position of excitement. It follows from this situation that the shape of the temperature profiles changes under these conditions in a characteristic way and form over time. The influences of more frequent disturbances, for example, superficial reflections, are subject, on the other hand, to none, that is, there is only a small temporal alteration, in relation to their localized specificities and / or show a temporal alteration clearly divergent from the behavior of typical thermal flow (for example, short flash and a reflection). These interference influences can therefore be clearly distinguished from real defects, due to their typical spatio-temporal behavior. Many influences of interference start to be visualized in the temperature profile with a space-time dynamic, however, normally, these influences are clearly different from the space-time thermal expansion that occurs in the environment of a defect within an unaffected thermal conductive material. . Therefore, an evaluation that analyzes the spatio-temporal behavior of temperature profiles under the visualized angle of the laws of thermal expansion, that is, of thermal diffusion in a physical body, offers a greatly improved degree of interference suppression selectivity compared to conventional processes.
[00021] Therefore, the evaluation can also be described in such a way that in the evaluation there is a comparison of the thermographic data with a signature, the signature being a description of the spatial-temporal thermal expansion in a solid body, which aims, after one with localized thermal concentration, recompose the thermal balance.
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10/33 [00022] Preferably, the thermal profiles will be analyzed in an automatic preparatory evaluation step, in order to verify if the temperature profile shows characteristic aspects, similar to defects, that is, only characteristics that can be attributed to a defect, however, not absolutely necessary. In the identification of defect-like characteristics, a maximum located in the temperature maximums within the temperature profiles is preferably sought. A localized maximum corresponds, in this case, to a location within a temperature profile, whose temperature is unequivocally higher than the temperature of profile locations in the immediate environment of the located maximum. By the identification step, for example, in the test for cracks, for example, essentially narrow and hot spots in a normally cooler environment should be located, for example. In this identification step, suitable image processing filtering routines can be used to differentiate, for example, localized maximums from edge locations in which temperatures, from one side of the environment to the other side of the environment, for a short distance , increase or decrease almost in a saltiform or staggered way. In this case, normally, two or more filtering routines will be employed that operate according to different criteria, in order to identify those locations of the image (pixels or groups of pixels) that can be allocated, unequivocally, to a maximum temperature located.
[00023] The assessment can then focus on those regions in which localized temperature peaks were found. In a process variant, as an evaluation criterion, the time course of the amplitude of a temperature value value will be evaluated in the range of the maximum located of the temperature values of a temperature profile. From this assessment it can be determined,
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11/33 for example, the cooling box in the region of the maximum located and in its vicinity. It has been shown that cooling boxes in the region of structural interference such as cracks, within a normally flawless environment, can be well described by the laws of thermal diffusion and, thus, can be used as a reliable evaluation criterion. Therefore, cracks and other defects can often be differentiated only on the basis of typical cooling rates, such as interference not attributable to defects. [00024] Alternatively or in addition to the evaluation, a thermal volume concentration value can be determined in the range of a localized maximum of the temperature values within a temperature profile and the time course of the thermal volume concentration value can be evaluated . The concentration value of the thermal volume is a measure for the ratio of the thermal volume of the localized maximum in comparison with the surrounding environment. If this concentration of the thermal volume decreases over time, then the heat will flow into the environment, as is typical, for example, in the crack environment. If, on the other hand, the localized maximum is not attributable to a structural interference or a crack, the thermal concentration value often has another important component, when, for example, the thermal concentration, after the end of heating, may initially even even increase. This will then indicate that the maximum of the localized temperature is not attributed to a crack or similar failure.
[00025] So that it is possible to determine, for the evaluation of the temporal paths, through calculated characteristics, with sufficient precision, temporal functions, in preferred modalities, three temperature profiles, recorded in temporal sequence will be evaluated together in order to obtain an adequate number support points. Typically, they will be jointly assessed between four and
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12/33 ten temperature profiles, so that a sufficient number of support points will be present in the temporal scope, and a reliable differentiation between defects and artifacts can be performed.
[00026] As an alternative or additional to the determination and evaluation of characteristics resulting from temporal functions, it is also possible to perform the time paths of temperature values within the temperature profiles on the basis of image elements (pixels) or groups of image elements (groups of pixels). The results will then be reciprocally correlated in order to achieve spatiotemporal signatures. Generally, any variant of the signal evaluation that allows measurement numbers, that is, measurement data, can be used for the purpose of comparing the signal properties with the theoretical bases of thermal expansion in the solid body. For example, space-time line profiles, registration sequences, surface segments, layouts, that is, random pixel patterns, can be used. Observation is essential, that is, the common inclusion of spatial and temporal aspects, without which a reliable indication of all abilities and defects is almost possible.
[00027] It is feasible to employ the test process in the test devices, in which both the tested object and the thermographic image registration set are at rest. In this way, the allocation of the temperature profiles in a reciprocal direction will be considerably simplified, since the same measurement region, in thermographic images produced in temporal sequence, always corresponds to the same image (identical image coordinates) in the thermographic images.
[00028] In cases of preferred uses, however, the test process will only be used for testing allocated test object such as, for example, bars, tubes, wire or similar material. To test
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13/33 elongated test objects, a relative movement can be produced between the tested object and the recording set of the thermographic images, in parallel to a direction of movement which conveniently projects in parallel to the longitudinal direction of the object of elongated test. Preferably, the register set will be inactive, while the tested object is moved relative to the register set. The relative movement will be produced in such a way that the surface regions that were registered with the thermographic images in a temporal sequence, are out of phase, along a determined path, in parallel with the direction of movement. Preferably, there will be an overlap of surface areas temporally recorded in immediate sequence in such a way that each location on the test surface is recorded by two or more thermographic images. In this way, a continuous surface test of longitudinally wrapped test objects becomes possible. Preferably, each location on the surface of the tested part will appear in three or more thermographic images, for example, in four to twenty or more thermographic images, and the location - due to the relative movement in each thermographic image - is located in another point (image position).
[00029] The allocation of the correct position of temperature profiles of differentiated thermographic images, in the test of moved test objects, presents a special challenge. In a variant of the process, a first thermographic image demonstrated at first, part of a series of thermographic images, will be analyzed by processing the image in order to identify at least a first selected cutout of the image containing thermographic data and the first cutout surface as a defect-like feature. The cutout of the identical surface will then be automatically located in a second cutout of the image,
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14/33 corresponding to the first crop of the image. The second section of the image will be found in a second thermographic image recorded with a temporal distance in relation to the first thermographic image in a second later moment. Then, a joint evaluation of the thermographic data of the first and second image slices will be carried out in order to reach the location of the right position.
[00030] For automatic localization, an expected position of the surface cutout that contains the characteristic similar to the defect in the second thermographic image, preferably on the basis of a relative speed measured or otherwise known between the object tested and the set, will be determined. recorder in the time interval between the first time point and a second time point in order to locate that path that was covered by the surface clipping between the first moment and the second moment of the movement direction. In this way, the evaluation of the second thermographic image can immediately focus on that cut-out of the surface, in which, in the analysis of the thermographic image recorded earlier, a characteristic similar to the defect was found.
[00031] To locate the characteristic similar to the defect, a localized maximum of the temperature values will be sought, at least within a temperature profile of approximately linear or spatial format in the first thermographic image. Therefore, suitable filtering routines can be employed in image processing.
[00032] The invention also relates to a thermographic test device prepared to carry out the process, aiming at detection with localized resolution and identification of defects close to the surface in a tested object. The test device covers:
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15/33 a set for heating a segment of the tested object in such a way that a thermal imbalance is formed between defective areas and defect-free test material;
at least one set to record a minimum sequence of two temporally sequential thermographic images; and a set to evaluate thermographic data of the thermographic images, and the set of evaluation is configured to determine temperature profiles, allocated in the right position, originating from the thermographic images to determine time paths of temperature values from the temperature profiles for a variety of positions measured in the measurement area, by the temperature profiles, and for the purpose of evaluating the time paths, according to at least one evaluation criterion that characterizes the thermal flow in the measured region.
[00033] Preferably, the recording set is a space chamber sensitive to thermal radiation with a variety of image lines, whose image information is evaluated together. [00034] These and other characteristics can be understood in addition to the claims - also from the description and the drawings, the different characteristics of which can be realized separately or together, in the form of sub-combinations or in a modality of the invention and in other fields, being able to represent advantageous modalities, as well as, capable of offering protection. Examples of execution are shown in the drawings and will be explained below.
Brief Description of the Drawings [00035] Figure 1 - shows a modality of a test device for a thermographic test of elongated test objects, of electrical conductive material, in the continuous process.
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16/33 [00036] Figure 2 - shows an example of a temperature profile registered perpendicularly to the direction of displacement of the tested object.
[00037] Figure 3 - shows in 3A a schematic view of a heated segment of the test object in motion, located in the registration area of a thermographic camera, with a selected image clipping, presented in an enlarged form, containing a defect and, in 3D, it presents an explanation of a process for joint assessment in the right position, at different times, covering temperature profiles recorded in the same surface cutout.
[00038] Figure 4 - shows, in 4A and 4B, the temporal development of parts of a temperature profile in the region of a localized maximum of temperature, with 4A showing the cutouts of temperature profiles allocated in the right position, in the area of an interference not resulting from a crack and Figure 4B shows corresponding temperature profiles in the area of a crack close to the surface.
[00039] Figure 5 - shows in figures 5A and 5B the time paths of two characteristics that mark the thermal flow in the region of the maximum local level of temperature, and figure 5A shows the time paths of the characteristics for an interference not attributable to a crack, and figure 5B shows the corresponding time paths for a crack close to the surface; and [00040] Figure 6 - shows, in 6A, a section of a temperature profile as a maximum of localized temperature, attributable to a reflection, Figure 6B shows the temporal development of the trace located at the temperature in the area of the maximum localized temperature , shown in figure 6A, and figure 6C shows a localized development of two remarkable characteristics of the thermal flow in the area of the located maximum.
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17/33
Detailed Description of the Preferred Modes [00041] Figure 1 is a schematic presentation of a modality of a thermographic test device 100 for the continuous surface test of elongated test objects of electrically conductive materials, in the continuous process. In the exemplified case, test object 180 is a rectangular cross-section steel rod that originates from a rolling mill not shown and with the aid of a conveyor assembly also not shown, for example, a roller conveyor, is moved with a largely constant passing speed vP from the area between about 0.1 m / s and 1.5 m / s in a direction of movement 184 (arrow) that projects in parallel to its longitudinal axis 182. After rolling the When hot, the steel rod does not have a smooth and clear surface, however, a so-called black surface, whose surface temperature is typically between 0 ° C and 50 ° C. The thermographic test and the evaluation of the thermographic data then recorded will be explained based on the test of the microscopically flat test surface 185. Corresponding tests will also be carried out at the same time for the three other surfaces of the test object.
[00042] The test device has an inductive heater assembly 110 for heating the segment of the test object that penetrates the active area of the heater assembly, in such a way that a thermal imbalance is formed between defective areas and test object material. free from defects. The heater assembly comprises an induction coil 112 which is formed as a continuous flat coil for the test object, with a coil plane aligned perpendicularly to the direction of the passage. The induction coil is electrically coupled to an alternating voltage generator 115, which for activation, is coupled to a central control assembly 130 of the test device. On coil excitation
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18/33 induction 112 with alternating voltage of adequate frequency, in regions close to the surface of the tested object, swirling currents will be induced that can heat the regions close to the surface when passing through the induction coil to temperatures above room temperature. Normally, heating in areas of defect-free surfaces is relatively uniform. However, if in the cross section of the induced current flow there are structural interferences such as cracks, cuts, cavities or similar conformations, they act as electrical resistances and produce a deviation of the current flow. This results in higher current densities and therefore greater energy dissipated at the narrow points of the current flow. This energy dissipated in the structural interferences becomes notable for an additional thermal generation, so that the defective area in question, located and limited, immediately in the structural interference presents a higher temperature in comparison with the environment free from failures. Therefore, there is a localized heating in front of a lower temperature level of the most distant environment. Typical temperature differentials between the region of a crack and the environment of immediately bordering material without interference, are often in the order of magnitude between about 1 K to 10 K. These localized increases in temperature and their spatio-temporal development will be used in the process of test for the detection of localized resolution and identification of defects close to the surface. [00043] In the exemplified case, the generator has an electrical potential of up to 150 kW, with alternating voltage frequencies in the range between 10 kHz and 350 kHz being used. Heater assemblies with other specifications are also possible. For example, the alternating voltage generator can be operated with potentials of up to several MW, which can be advantageous, for example, in test objects
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19/33 te larger (for example, with a diameter greater than 800 mm). The frequency range may be suitable for the task targeted with the measurement. For example, frequencies of up to 1 mHz can be useful to locate especially small faults, close to the surface, since with increasing frequency, the depth of penetration of the swirling current becomes smaller and, therefore, the measurement volume decreases. Higher frequencies are also advantageous when testing electrical conductive steels with high electrical resistance and magnetic permeability close to 1, in order to achieve rapid localized heating of defective areas in relation to their environment.
[00044] Through the heater assembly, the global system, that is, the test / defect object, will be moved to a state of thermal imbalance. With the help of the test process and the test device it is possible to observe both in the localized environment and also in the temporal environment, how the system reacts to the state of thermal equilibrium.
[00045] For this purpose, the test device has a recording set 120 of localized resolution and sensitive to thermal irradiation 100, to record two-dimensional thermographic images that can be taken with a high image frequency of up to one hundred images per second. The recording set, then also designated as a thermocamera, for controlling the registration of the images and for accepting and evaluating the thermographic data, obtained in the thermographic images, is coupled to the central command set 130. In this set, a data processing system is integrated. computerized image that is prepared for evaluation according to different criteria the thermographic data obtained from the thermographic images. A thermochamber of this type can display on the basis of localized temperature values, that is, on the basis of the thermal radiation emitted
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20/33 of the location, the presence and some specificities of structural disturbances, and these characteristics can be automatically evaluated with the aid of appropriate means of image processing in a corresponding evaluation system.
[00046] Thermochamber 120 is called a space chamber and has a capture region 122 in a rectangular shape also designated here as image field 122 and, in the example case, covers the entire width of the tested part 185, facing it , going beyond the side edges. In the exemplified case, thermochamber 120 covers an image field 122 of the size 270 mm x 216 mm as a resolution of 640 x 512 pixels (image elements). An image element (pixel) corresponds, in this case, with a relatively small rectangular surface cutout, from 0.5 mm to 0.8 mm in diameter on the surface of the tested piece 185. A thermographic image registered with the space camera consists of a variety of lines that project essentially in a perpendicular direction towards the longitudinal direction of the tested object (y-direction) and slits that essentially project parallel to the longitudinal direction (that is, in the y-direction). The thermographic images will be evaluated by line in order to be able to be reliably detected, especially longitudinal faults. A narrow linear measurement area 124, belonging to a thermochamber line, projects transversely towards a defect 188. In the analysis, this measurement area will also be referred to as measurement lines.
[00047] At moment t1, shown in figure 1, defect 188 near the surface is in the form of a longitudinal fissure, projected more or less in parallel with the longitudinal direction of the tested object, close to the entrance side of the area register, facing the direction of induction coil 112. The positions of this same longitudinal fissure in later temporal moments t2> t1
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21/33 and t3> t2 are shown dashed to demonstrate that the same defect, that is, the same surface cutout, can be found at different times in the capture area 122 of the thermochamber, although, however, the positions of the image within the thermographic image, depending on the speed of passage VP and the temporal distance between the moments of recording of sequential thermographic images in temporal distances, in the direction of movement 184, are reciprocally out of step in the direction of movement 184 for a given session of the route.
[00048] The frequency of image recording used by the thermocamera is so adjusted to the speed of passage of the tested object that each surface segment of the tested part 185 appears in several thermographic images at a different point, for example, in at least five or at least 10, or at least 15, thermographic images, recorded at reciprocal temporal distance.
[00049] An indicator and command unit 140, coupled to the command set, has a screen, on which the data and determined interrelations of the thermographic images can be shown. With the aid of a keyboard and / or other recording means, the test device can be adjusted and operated by an operator comfortably for different testing tasks.
[00050] A speed meter set 150 is also attached to the control set 130 to determine the current VP movement speed of the tested object. This set that serves as a route indicator works, in this case, exemplified, with the aid of laser rays without contact. In other modalities, a tactile path indicator may be provided, for example, a measuring wheel that moves along the surface of the tested part.
[00051] The accuracy of the thermographic testing process can be markedly influenced by fluctuations in the degree of emissions from the
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22/33 surface of the tested object thermographically registered. In order to keep correlated negative influences to the least possible extent, an active homogenization of the degree of emission of the tested and measured part surface is carried out, and the tested part surface, with the aid of a sprinkler set 160, before passing through the induction coil, it will be evenly sprayed with a liquid, for example, water. This technique has proven to be effective at surface temperatures up to 50 ° C to largely prevent the appearance of pseudo-indications, attributable to localized oscillations in the degree of emission.
[00052] If a characteristic is unequivocally determined by the test device as being defective, this point may be marked with the aid of an automatic marking set 170, coupled to control set 130, by spraying paint or similar material, so that, in a controlled manner, possible machining of the surface of the tested part with defect or a refuse of segments of serious defects.
[00053] A preferred variant of a test process, which can be performed with the aid of the test device, will be described below for the detection with localized resolution and identification of defects close to the surface in high-speed test objects speed of passing through the test device. By the induction coil 112, areas close to the surface of the tested object will be inductively heated, while in the area of cracks and other structural interferences, maximum localized temperature levels are present. After the respective segments of the tested object pass through the induction coil, these regions cool down again. The registered set 120 is integrated in the direction of movement immediately behind the induction coil, registering the surface areas in this cooling phase.
[00054] In a first step of the process, the
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23/33 thermal characteristics in the part of the surface of the tested object that moves within the registration area 122. For this purpose, corresponding lines will be evaluated, placed next to the entrance, in order to obtain, for example, a temperature profile (profile resolution) along a measurement line 124 perpendicular to the direction of the passage. Figure 2 shows, for example, a temperature profile of this type. The POS position of measurement sites within a measurement area and projecting perpendicularly to the direction of movement (y-direction) in the x-direction, in a linear form, is indicated on the abscissa by the indication of pixel numbers (elements of corresponding to a line in the displayed field. The ordinate represents the AMP amplitude of the thermal irradiation allocated to the locations and, in the exemplified case, it is presented as an absolute surface temperature, in degrees Celsius. It can be seen that the surface temperature between the lateral edges (possibly with pixel numbers 90, that is, 540) is in the range between 55 ° C and 60 ° C and varies in some K locations. The temperature profile receives two characteristics, namely, a first maximum temperature localized ST eventually in pixel number 150 and a second maximum level of local temperature DEF approximately in pixel number 495. In the two local temperature maximums the differential temperature ΔΤ in relation to the immediate environment is around 6 to 7 K. An evaluation later explained indicates that the first local maximum temperature ST is attributable to an interference not resulting from a crack or other structural interference, whereas the second maximum temperature DEF was effectively caused by a crack close to the surface. It can be recognized that the extent of the temperature difference ΔΤ does not exclusively constitute a reliable criterion for a differentiation between real structural interferences and other characteristics. Petition 870190100184, of 10/07/2019, p. 31/50
24/33 characteristics not attributable to structural interference.
[00055] Each thermographic image receives a variety of temperature profiles of this nature of resolution located in the x-direction. The incidence of maximum localized temperature levels is automatically recorded by the image processing evaluation software, using appropriate filtering routines to compare the temperature values of pixels or groups of pixels within a temperature profile with pixel temperature values. neighbors or groups of pixels and, based on the comparison, identify temperature maximums unequivocally located as such and differentiate from other artifacts, for example, the steep drop in temperature on an edge. In filtering, the evaluation software operates by lines within strips that project transversely towards the direction of movement and that contain a variety of adjacent temperature profiles. Figure 3 shows a strip 125 of this nature that contains defect 188. The probability of the presence of a defect similar to a crack in the longitudinal direction increases in this evaluation when in a large number of adjacent temperature profiles, within the strip, approximately in the same pixel position, if the maximum localized temperature of remarkable intensity is present.
[00056] The test process is not based exclusively on the evaluation of spatial temperature profiles, that is, those temperature profiles that represent the localized temperature distribution, but it is also based on the analysis of its temporal change. This combination here will also be referred to as space-time analysis. Therefore, it is not enough to analyze a punic temperature profile, however, for the same area of the surface measurement, several temperature profiles recorded temporally out of phase in reciprocal direction will be correlated in order to
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25/33 to be able to analyze the spatio-temporal dynamics of the development of temperature distribution. In the modality described here of the testing process, a special variant of pattern recognition is used to find, in the right position, a characteristic identified in a thermographic image that was temporally anterior and that could represent a defect in thermographic images taken later, thus creating the possibility - despite the movement of the tested object in relation to the thermochamber - to obtain a time sequence of several temperature profiles in the same measurement area. For this purpose, a strip 125, belonging to a certain surface cut-out, will be evaluated by lines from a first, temporally anterior thermographic image, being analyzed for the presence of characteristics, especially localized maximum temperatures. On the basis of the temperature data of the different lines, a related area will be calculated which covers the area of the characteristic localized temperature maxima. A selected rectangular image cutout 128, which involves defect 188, cutout number 128, is shown in figure 3 on the left inside strip 125 and, on the right, in an enlarged presentation. The coordinates located in the selected image segments 128, that is, their position within the thermographic image, represents the position of the surface segments of the belonging test object, containing defect 188, at the time of recording the first thermographic image. The image information that contains the selected image clipping, from the spatially connected pixels, can be treated in the image processing software as a so-called Binary Large Object (BLOB) = large binary object and represents a certain data pattern that in thermographic images subsequently taken, can be found again.
[00057] Based on the sample represented by data structure
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26/33 of the area around defect 188, in several thermographic images subsequently taken at temporal distances, the same sample will be searched for to find those cutouts of the images that correspond in the best possible position accuracy to that surface cutout that was used in the analysis of the first thermographic image for the purpose of calculating the sample sought. Preferably, at least 5 to 10 sequentially made thermographic images will be searched for the image clippings corresponding to a given surface cutout, and then their image information will be jointly evaluated.
[00058] To spatially limit the search area in thermographic images subsequently made and to speed up the evaluation, an expected position of the surface cutout will be determined, containing the characteristic similar to the defect, in thermographic images subsequently made based on the speed of movement vP of the object tested, speed is measured with the aid of the speed meter system 150, the direction of movement 184 and the time interval that was verified between the different moments of the recording of the thermographic images so that, based on these data, calculate that path that was covered by the superficial cutout in question between the underlying moment of the first analysis and the moment of registration of the respective thermographic image. It became evident that in this way the specific surface segment, that is, the data belonging to this segment, in the case of a slightly oscillating passing speed, is found with a precision in the range of the measurement accuracy of the route indicator (here, for example, about +/- 1 mm), which in the exemplified case corresponds to a location precision in the order of magnitude of about +/- 2 pixels on the surface of the tested piece. Final corrections for overlapping in the right position will then be made through calculations
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27/33 with software by means of screening, that is, by sample recognition, with which an effective position accuracy of about +/- 1 pixel is achieved, that is, +/- 0.5 mm on the surface of the tested part. [00059] This procedure takes into account that the test conditions in practice are generally not ideal. Thus, for example, due to sliding between the tested material and the displacement system, flexing of the tested material and / or braking of the tested material when loading on a cylinder and subsequent acceleration can result in speed fluctuations and other causes for inaccuracies of position. The resulting test problems will be avoided by combining speed measurement, the correlation of potentially defective surface segments and the subsequent search for surface samples (screening).
[00060] In each of the image clippings, temporarily recorded in sequence, one or more temperature profiles that project over the location of the potential defect can then be determined and evaluated together. When the locations of the temperature profiles, as shown in figure 3b, are always at the same point within the selected image segment, each temperature profile allocated in the right position will correspond to the same linear measurement area of the tested object's surface, being that this measurement area extends beyond the potential defect. For an explanation in this sense, three image clippings 128, 128 'and 128, shown at different times t1, t2> t1 and t3> t2, belonging to the same surface clip, are shown in figure 3B, on the left side. in each of the clippings in the image a temperature profile is projected that projects in the x-direction on the defect. In the right partial figure, the sequentially recorded temperature profiles are presented together, with the abscissa indicating the POS (x) position in the x-direction and the ordinate indicating the temperature ΔΤ. Tor
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28/33 it is possible in this way to determine with high precision the space-time thermal expansion in a moving object in the region of a potential defect.
[00061] Each of the temperature profiles represents a area that projects transversely towards the defect, in which the defect is located approximately in the center. Each temperature profile has the maximum localized temperature whose height, in relation to the environment (quantified, for example, by the temperature differential ΔΤ), decreases over time, while the width of the maximum level at the location, given by width of the half-value of the maximum level in place decreases with time. These localized temperature profiles, allocated in the right position, and temporally sequential, now allow quantitative conclusions about the spatial-temporal thermal expansion in the area of a potential defect, and can be evaluated as follows.
[00062] Figure 4 shows in 4A and 4B, in common presentations, a variety of temperature profiles allocated in the right position, with the upper temperature profiles in the presentations being recorded earlier in time than the temperature profiles shown below. Figure 4A shows typical temperature profiles for an ST interference, which nevertheless generates a maximum temperature located approximately at pixel number 7, but which is not attributed to a crack close to the surface. Figure 4B shows, for comparison, the temperature profiles allocated in the right position, resulting from the region of a DEF defect similar to a fissure, and here also the maximum temperature located is in the range of pixel number 7. The temperature profiles allocated in the right position will now be analyzed based on evaluation criteria that allow relatively reliable conclusions due to the spatio-temporal development of the profiles
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29/33 of temperature, if the spatio-temporal development of the predicted temperature distribution, or in another structural failure, corresponds to the dynamics conditioned by the thermal flow or if other laws are followed.
[00063] One of the evaluation criteria, that is, for striking criticisms is AMPM amplitude of the temperature value at the location of the maximum temperature located within a temperature profile. Another characteristic quantity that proved to be very reliable for evaluating the dynamics of thermal expansion is the KONZ thermal concentration value in the area of a localized maximum of the temperature values within the temperature profiles. Figure 5 shows in 5A the time path of the AMPM amplitude and the KONZ concentration value in different stages t for an ST interference, not attributable to a crack, showing in Figure 5B the time path of the same striking characteristics in the same time window for a DEF crack close to the surface. In the ordinates the temperature differential ΔΤ is always indicated at the location of the maximum located compared to the environment.
[00064] In a variety of tests it was shown that in the area of cracks, both the rate of cooling, that is, the change in temperature at the localized maximum temperature, over time, as well as the loss of concentration, are relatively large , differing, significantly, from the corresponding values that can prove in the area of interferences that are not attributable to cracks or other structural interferences. At the maximum temperature that is represented by the AMPM amplitude of the temperature at the location of the maximum located, it became evident that after the end of the heating phase, that is, during cooling, it decreases continuously and with a relatively high cooling rate. In the exemplified case, a high probability
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30/33 of the presence of a crack will then be accepted when the cooling rate in the region of at least five thermographic images, sequentially recorded, is greater than a predetermined threshold value for the cooling rate. The KONZ thermal volume concentration value is a measure of the behavior of the thermal volume immediately at the maximum localized temperature compared to the nearest environment. If, over time, the value of the thermal concentration decreases, this will indicate that the heat, among other procedures, flows laterally into the environment. This occurs, for example, in the case of cracks and will therefore be evaluated as an indication that the observed signal was caused by the thermal expansion in the solid body close to a crack.
[00065] In the exemplified case of an interference not attributable to a crack, explained on the basis of figure 5A, in turn, the concentration of KONZ thermal volume from the beginning is lower than in the case of a crack, and in addition , the value of the thermal volume concentration increases initially, before it starts to decline progressively. Also, the maximum amplitude AMPM increases initially before it starts to decline with a relatively low cooling rate that is clearly lower than the expected cooling rate (figure 5B) in the area of a crack.
[00066] Other deviations from the spatio-temporal behavior of the thermal volume concentration of the typical behavior, caused by the thermal flow, in the case of defects, can also be used as indications of interference not attributable to a crack or similar failure. For example, the value of the thermal volume concentration over a longer period of time may be largely unchanged or may appear to increase or may decrease in an unrelated manner.
[00067] These examples show that through analysis and evaluation
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31/33 quantitative of spatio-temporal developments of temperature profiles a reliable differentiation between different causes for localized temperature maximums, initially determined in a temperature profile, is possible. If, in the case of an initially determined characteristic, in principle the characteristics described in connection with figures 4B and 5B are verified, then the cause will be classified as crack and the respective surface segment will eventually be marked by the marker set 170. If, on the contrary , the spatio-temporal analysis presents an atypical behavior (for example, compare with figures 4A and 5A) in relation to cracks, cavities and other structural interferences, then there will be no indication of cracks. In this way, with a high degree of reliability, pseudo-indications can be avoided. The integration of space-time thermal expansion in the area of a potential defect contributes decisively to the elimination of failures in the detection and identification of defects with the aid of thermographic signals.
[00068] Based on figure 6, it will be explained once more, by way of example, how the analysis of the spatiotemporal thermal distribution can contribute to the suppression of interference. For this purpose, figure 6A shows a section of a temperature profile that contains, approximately in the 455 pixel region, a localized maximum temperature, markedly expressed, with a temperature differential of ΔΤ of at least 10 K in relation to the environment. In some conventional test systems, such indications would automatically be evaluated as a sure indication of the presence of a deep crack and the tested object would be correspondingly marked and eventually even scrapped. The space-time analysis of the thermal expansion shows, however, that it is not a crack. Figure 6B shows temperature profiles allocated in the right position, from the region of the maximum located for temporal moments
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32/33 different. A specificity in comparison with the profiles in figure 4 is that the profile with the highest amplitude was registered at a later time (t2> t1) than the profile previously registered t1 as a clearly smaller amplitude. This anomaly can also be recognized in the temporal plots shown in figure 6C of the amplitude characteristics at the maximum localized (AMPM) and in the value of the concentration of the thermal volume (KONZ). Both values increase over time, which cannot be explained by a thermal expansion in the region of a heated local crack. In the exemplified case, the high maximum temperature located, shown in figure 6A, is attributed to a reflection in the respective location of the tested part surface as the temporal development of the temperature profiles in no way presents a typical expansion behavior for cracks, a reflection of this nature, therefore, would not result in a classification as fissure. In conventional systems, in turn, the reflection would be interpreted, with high probability, and in a wrong way, as a crack.
[00069] Alternatively or in addition to the characteristics explained here as an example, other characteristics can also be used as an evaluation criterion. Here, for example, derivations of the described time functions can be used, for example, modifying the cooling rate over time. As the thermal expansion in its essence can be described by solutions of the thermal diffusion equation, it is also possible to quantify the temporal development of the temperature profiles within a localized maximum due to the adequacy of a Gauss curve or a fault function, and in these cases can break, in the event of a good suitability of a thermal expansion dominated by thermal flow, whereas a poor suitability allows conclusions that point to other causes. It is also possible to adapt polynomials such as
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33/33 functions for approximation of temperature profiles and perform through the analysis of polynomial efficiency a differentiation between the defects sought (for example, cracks) and non-critical interferences (for example, reflections).
权利要求:
Claims (8)
[1]
1. Thermographic test process for detection with local resolution and identification of defects close to the surface in a tested object, characterized by comprising the following steps:
heating a segment of the tested object in such a way that a thermal imbalance forms between defect areas, and defect-free test object material, with a defect-free environment of a defect area not being heated, or being heated with less intensity than the defect area;
recording a sequence of temporal sequential thermographic images within a heat expansion phase, which begins when a heat flow from the heated defective area becomes noticeable to the environment of the defect area, with each thermal image representing a distribution of temperature located in a superficial area, registered by the thermographic image of the tested object;
determination of temperature profiles allocated in the right position from the thermographic images, the temperature profile being a localized resolution profile, in which differentiated locations within the temperature profile are allocated values of a measurement quantity that represents the temperature in a respective location, and being that each temperature profile allocated in the right position is allocated the same measurement region of the surface of the tested object;
determination of temporal occurrences of temperature values resulting from temperature profiles for a variety of measurement positions in the measurement area, captured by temperature profiles; and evaluation of time paths at least according to an evaluation criterion that characterizes the thermal flow in the measurement area,
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[2]
2/4 and in the evaluation, at least a localized maximum of the temperature values is sought within the temperature profiles, and a heat concentration value is determined in the area of a maximum localized level of the temperature values within the temperature profiles , and being evaluated a time path of the value of the concentration of the thermal volume to evaluate the lateral thermal flow, being that the value of concentration of the thermal volume constitutes a measure of how the thermal volume of the maximum located in comparison with the immediate surroundings of such so that the concentration value of the thermal volume decreases over time when the value of the thermal concentration flows laterally into the environment.
2. Thermographic test process according to claim 2, characterized by the fact that in the evaluation an evaluation is made of a time course of the range of values and temperature in the area of the located maximum.
[3]
3. Thermographic test process according to claim 1 or 2, characterized by the fact that at least three are evaluated together, preferably between four and twenty temperature profiles allocated in the right position.
[4]
4. Thermographic test process according to any of the preceding claims, characterized by the fact that for the test of an elongated test object, a relative movement is generated between the tested object and a thermographic image recording set in such a way in a direction of movement that projects preferably in parallel to the longitudinal direction of the object being tested, that the surface areas, covered by thermographic images, reciprocally out of step in the direction of movement
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3/4 are mutually out of step in the direction of movement, with the surface areas of thermographic images, taken in immediate sequence, preferably overlap in an overlapping area.
[5]
5. Thermographic test process according to claim 4, characterized by the fact that the registration set is stationary mounted so that the elongated test object will be moved relative to the registration set.
[6]
6. Thermographic test process according to claim 4 or 5, characterized by the fact that the following steps are performed:
analysis of a first thermographic image, recorded at first, covering a sequence of thermographic images to identify at least one first sought-after image clipping that contains a surface clipping with a defect-like feature;
automatic location of a second image clipping, corresponding to the first image clipping, in a second registered thermographic image, at a temporal distance to the first thermographic image in a second later moment;
joint assessment of thermographic data from the first image cutout and the second image cutout, and preferably in identifying defect-like characteristics, a maximum of localized temperature values will be sought within the temperature profiles.
[7]
7. Thermographic test process according to claim 4, 5 or 6, characterized by the fact that for the automatic location of a predicted position of the surface cutout, containing the characteristic similar to a defect, in the second thermographic image, in the base of the relative speed between the tested object and the set
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4/4 recorder, the direction of movement and the time elapsed between the first moment and the second moment will be determined, and preferably the relative speed, especially the speed of the tested object, will be measured.
[8]
8. Thermographic test device for detection with resolution and local identification of defects close to the surface in an object tested with, characterized by the fact that it comprises:
a heater assembly (120) to heat a segment of the test object (180) in such a way that there is a thermal imbalance between the defective areas and the material of the test object free from defects, with an environment free from defects, of a defective area, it will not be heated, or it will be heated to a lesser extent than the defective area;
at least one recorded set (120) to record a sequence of at least two subsequent thermographic images in temporal distance; and a set for evaluating thermographic data from thermographic images, the test device being configured to carry out the process as defined in one of the preceding claims.
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法律状态:
2018-12-26| B06F| Objections, documents and/or translations needed after an examination request according art. 34 industrial property law|
2019-07-16| B07A| Technical examination (opinion): publication of technical examination (opinion)|
2020-02-04| B09A| Decision: intention to grant|
2020-04-07| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/04/2011, OBSERVADAS AS CONDICOES LEGAIS. |
优先权:
申请号 | 申请日 | 专利标题
EP10003756A|EP2375243A1|2010-04-08|2010-04-08|Thermographic testing method and device for carrying out the testing method|
PCT/EP2011/055386|WO2011124628A1|2010-04-08|2011-04-07|Thermographic test method and testing device for carrying out the test method|
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