• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The chuck for aligning a first planar substrate, e.g. a disc, parallel to a second planar substrate, e.g. a mask, comprises: an upper plate having an upper surface for disposing the first planar substrate, a lower plate, at least one distance measuring sensor configured, a distance between the upper surface of the upper plate and a surface of the second planar substrate and at least three linear actuators in contact with the upper plate and the lower plate. The method of adjusting a gap between a first planar substrate, e.g. a disc, on an upper plate of a chuck, and a second planar substrate, e.g. a mask, in particular by means of the chuck, comprises the steps of: measuring the thickness of the first planar substrate at at least one point; Measuring the distance between a surface of the second planar substrate and the top of the top plate by at least one pitch measuring sensor of the chuck; and adjusting the inclination between an upper surface of the first planar substrate or the chuck and the surface of the second planar substrate by means of at least three linear actuators of the chuck, preferably in combination with at least three spring-loaded bearings of the chuck.
    公开号:AT517796A2
    申请号:T9453/2013
    申请日:2013-12-04
    公开日:2017-04-15
    发明作者:Hansen Sven；Hülsmann Thomas；Schindler Katrin
    申请人:Suss Microtec Lithography Gmbh；
    IPC主号:
    专利说明:

    CHUCK, IN PARTICULAR FOR USE IN A MASK
    ALIGNER
    The invention relates to a chuck, in particular for use in a mask aligner for aligning a disk (or wafer) parallel to a mask, and a method for adjusting a gap between a disk (or wafer) on an upper disk of a disk chuck and a mask.
    In the following, the information will often be described with reference to the orientation of a slice relative to a mask. However, this reference to a disk and a mask should not be construed as limiting, i. The claimed chuck and method of adjusting a gap are also applicable to alignment of first and second planar substrates in general. For the fabrication of microelectronic, microoptical or micromechanical elements and devices, it is a common process to transfer a structure from a mask to a substrate, e.g. a silicon wafer to be transferred by photolithography. Photolithography uses light to generate these structures, e.g. geometric pattern to transfer from a mask on a photosensitive chemical covering agent, which is previously applied to the substrate. Chemical agents then etch the exposed structures in the substrate or allow deposition of another material in the transferred patterns on the substrate. Industrial production may require repeating this process up to 50 times.
    If the mask and substrate are not parallel, i. if there is a wedge between the mask and the wafer, the structures of the mask can not be uniformly transferred to the substrate, resulting in defects and inaccurate structures, generally a reduced processing window for the customer. In view of the numerous repetitions of the photolithography process, such a wedge error can lead to a high loss of production. Consequently, proper alignment of the disc and the mask with respect to each other is necessary. If the mask and substrate are not arranged repeatably at a correct pitch, patterns will not be transferred precisely to the substrate.
    As modern manufacturing processes increasingly use large substrates, the above-mentioned alignment becomes increasingly difficult. The compensation of the wedge error is typically performed by means of a wedge error compensation (WEC) head.
    Such a WEC head uses a passive mechanical system to align the disc top with the mask bottom. The WEC head has a base which is fixed and a top which is movably supported and connected to the base by means of springs. During the WEC process, the disk and mask are brought into mechanical contact (e.g., by high precision spacer balls), then the upper is fixed to the base at that position by means of brakes. As a result, the disk and the mask are aligned in parallel.
    However, such alignment is not sufficiently precise for large substrates as well as submicron structures. WO 2011/098604 A2 relates to a device for active WEC, wherein the above-mentioned known WEC head is supplemented with piezoelectric actuators to allow a finer alignment on the basis of mechanical sensors or a distance measuring device; however, this method only allows relative measurement during the WEC process and requires mechanical contact for each separate slice. In addition, the method is less suitable due to a relatively high wear for automatic machines. US 2002/063221 A1 relates to a gap adjusting device and a gap adjusting method for adjusting a gap between two objects. EP 0 722 122 A1 relates to a process and apparatus for adjusting the distance between a workpiece and a mask.
    Another prior art is listed as follows: JP 2004 233398 A, JP 11 194501 A, US 2007/190638 A1, EP 2 006 899 A2, JP 3 038024 A, JP 2008 310249 A, JP 58 103136A.
    It is an object of the invention to provide an apparatus and method for positioning two planar surfaces, in particular a wafer top and a mask, parallel to one another. In particular, it is an object of the present invention to provide a chuck, e.g. a disk chuck for use in combination with a WEC head or chuck that even replaces a WEC head of a mask aligner for aligning a disk parallel to a mask. In addition, it is an object of the invention to provide a method for adjusting a gap between a disk on an upper plate of a disk chuck and the mask.
    These objects are achieved with the features of the claims.
    According to a basic idea of the invention, a tensioning chuck having a top plate and a bottom plate is provided for mounting a first substrate on top of the top plate. The upper plate of the chuck faces a second planar substrate. Between the upper plate and the lower plate of the chuck are linear actuators, e.g. arranged three actuators. The linear actuators may be fixedly attached to both plates or only one of them. When the linear actuators are all moved the same travel, the top plate of the chuck and the first planar substrate are moved toward or away from the second planar substrate, thus reducing the distance between the first and second substrates without any change in possible skew is changed between them. However, by moving the linear actuator about different travel paths, a possible skew between the two substrates can be compensated.
    In order to determine the skew, the variation of the distance between the surface of the first substrate and the surface of the second substrate must be determined. Therefore, the distance between both surfaces facing each other must be measured at at least three different positions. The distance between the at least three different positions must be sufficiently large to accurately determine the full extent of skew.
    However, due to the limited space between the two substrates, it may not be practical to measure the distance directly. Thus, instead, according to one aspect of the invention, the distance between the top of the top plate and the surface of the second substrate may be measured at at least three different positions. Along with the information on the variation of the thickness of the first substrate, the variation of the distance between the surface of the first substrate and the surface of the second substrate can be calculated. This required information of the variation of the thickness of the first substrate can be obtained by measuring the thickness of the first substrate at different positions of the substrate. Based on the calculated variation in the distance between the surface of the first substrate and the surface of the second substrate, the skew between the first and second planar substrates can be detected and subsequently compensated for by suitable control of the linear actuators.
    The linear actuators may be disposed on a peripheral edge portion of the disk chuck. For example, the linear actuators are located at the outermost position of the disc chuck or at 70% to 100% of the radius of a circular disc chuck. In such an arrangement, the distance between the linear actuators is relatively large, such that a comparatively large amount of stroke of a linear actuator results in a small skew compensation compared to an arrangement where the linear actuators are close together. Consequently, the accuracy of skew compensation is comparatively high. Alternatively, the at least three actuators may be disposed in the central portion of the chuck, resulting in a greater skew compensation capability and lower compensation accuracy.
    In addition, the linear actuators may be supported by sprung bearings, e.g. three spring-loaded bearings are arranged, which are arranged between the upper and the lower plate. The sprung bearings are fixedly attached to both the top plate and the bottom plate, or are fixedly attached to only one of them. For example, the sprung bearings may be leaf springs and / or coil springs. The sprung bearings may be sized and arranged to withstand possible vibrations, e.g. the chuck or the system where the chuck is installed, or minimize the vibrations of the building in which the system is located. The sprung bearings can preload the at least three linear actuators.
    According to one embodiment of the invention, the at least three spring-loaded bearings are arranged adjacent to the at least three linear actuators and offset in the radial direction to the center of the disc chuck or radially outward.
    For measuring the distance between the upper surface of the upper plate and the surface of the second substrate, distance measuring sensors, e.g. three or four sensors may be arranged in the upper plate of the chuck. For example, the distance measuring sensors may be disposed in the top plate of the chuck so that the reference surface of the distance measuring sensors is flush with the top of the top plate. Alternatively, the difference between the reference surface of the distance measuring sensors and the upper surface of the upper plate can be detected, and this offset can be taken into account in determining the above-mentioned skew.
    According to one embodiment of the invention, the variation of the distance between the upper surface of the upper plate and the surface of the second substrate may be with a
    Measuring sensor movable on the upper plate, e.g. is arranged on a circular line. As a result, the at least three different positions are measured one after the other.
    In another embodiment, the distance measuring sensors may also be attached to a retaining ring which is attached to the outside of the edge region of the disc chuck. In particular, the distance measuring sensors may be mounted in the retaining ring in a manner that their reference surface is flush with the upper surface of the upper plate. The retaining ring may also be attached to the upper plate. The retaining ring may also comprise guiding and retaining cables from and / or to the measuring sensor (s) and / or the linear actuators.
    According to one embodiment of the invention, the chuck further comprises at least one thickness sensor, preferably a thickness sensor system. The thickness sensor system may be a pneumatic sensor system. The pneumatic sensor system may comprise a sensor lever with at least one pneumatic sensor head, e.g. have two pneumatic sensor heads. In the case of two or more sensor heads, the sensor heads are mounted on opposite sides of the sensor lever. Alternatively, only one sensor head is attached to the lever and a preloaded air bearing is mounted on the opposite side of the sensor lever. In addition, the pneumatic sensor system may further include pneumatic sensors mounted in the upper plate of the disc chuck. With this pneumatic sensor system, the thickness of the first planar substrate can be measured. By measuring the thickness at a plurality of points, the pneumatic sensor system can also measure the thickness distribution, i. measure a possible curvature of the first planar substrate. In addition, the sensor system may also measure the curvature of the first planar substrate and the curvature of the second planar substrate and the curvature of the top plate.
    However, it should be understood that each of the thickness sensor and the thickness sensor system is not limited to pneumatic sensors. It is also a capacitive sensor, an optical sensor, e.g. a laser sensor or an infrared sensor, an ultrasonic sensor or a magnetic induction sensor possible.
    According to one embodiment, the lower plate may be a single rigid plate or may have a plurality of rigid pieces. Also, the top plate may be a single rigid plate or may have several rigid pieces. Preferably, the plurality of rigid pieces of the top plate may be covered by a membrane.
    A chuck according to the invention can be used as a disk chuck for adjusting a mask and a disk in a mask aligner. Such a disk chuck can be placed on a wedge error compensation head of a mask aligner or placed as part of such a wedge error compensation head. The disk chuck may also be incorporated into the mask aligner, completely replacing an existing wedge error compensation head or making a wedge error compensation head redundant. A mask aligner in this context is a device for adjusting the mask relative to the disk.
    If the first substrate is a disk and the second substrate is a mask, the surface of the mask facing the disk is coated with chromium or any other suitable material, e.g. an electrically conductive material that supports the use of capacitive distance measuring sensors. The chromium or other suitable material may be patterned with the patterns that are applied to the disk or, in particular, it may be applied for use in the distance measurement process. Conveniently, the same material can be used for disk patterning and distance measurement.
    The mask aligner may include means for performing a photolithography comprising, for example, a light source, e.g. an ultraviolet light source and a suitable lamp system. However, the chuck may also be used in another device typically used for disc processing. In this sense, the present invention is also applicable to other means for processing the substrate, such as a mask coater, developer, bonder or mask cleaner. Thus, the mask aligner may also include other means for processing substrates such as the development of the resist and / or the cleaning of the photomask as separate functions or e.g. in a so-called litho cluster.
    It is understood that the above-mentioned chuck can not be just a disk chuck for adjusting a mask and a disk in a mask aligning device. The basic idea of the present invention can also be applied to a variety of technical fields and fields where it is generally desirable for two planar substrates to be aligned parallel to one another.
    The invention also relates to a computer program product comprising one or more computer-readable media, the computer-executable instructions for executing the steps of any of the previously described and / or the methods described below for adjusting a gap and skewing between a disk on a top plate of a disk chuck and a mask.
    The invention will be further disclosed with reference to the drawings:
    Fig. La shows schematically a plan view of a disc chuck according to a
    Embodiment of the invention;
    Fig. 1b shows schematically a perspective cross-section of a disc chuck according to an embodiment of the invention;
    Fig. 2a schematically shows a flowchart illustrating process steps for adjusting a gap between a disk and a mask according to an embodiment of the invention;
    Fig. 2b schematically shows a flowchart illustrating method steps for adjusting a gap between a disk and a mask with an additional height adjustment according to an embodiment of the invention;
    Fig. 3a shows schematically a front view of a pneumatic Dickensensorsysems system according to an embodiment of the invention;
    Fig. 3b schematically shows a front view of a pneumatic thickness sensor system according to another embodiment of the invention; and Fig. 3c shows schematically two front views of a pneumatic thickness sensor system according to another embodiment of the invention. Throughout the different figures, the same reference numerals are used for the same elements.
    FIG. 1a schematically shows a top view of a disk chuck 100 according to an embodiment of the invention. A plurality of control and scanning cables 109 for the three linear actuators 104 and the four distance measuring sensors 103 are arranged in the retaining ring 106. The pulley chuck 100 may be set on or disposed of as a part of a wedge error compensation head of a mask aligner. The disk chuck may also be incorporated into the mask aligner, replacing an existing wedge error compensation head or making a wedge error compensation head redundant. The embodiment of the invention will be further explained below with reference to FIG.
    Fig. 1b schematically shows a cross section of a disc chuck 100. The disc chuck 100 has an upper plate 101 having an upper side 101 '. The disc 200 (see Figs. 3a-3c) to be placed is placed on the top 10Γ.
    The disc 200 is attached to the top 10 Γ e.g. fixed by a vacuum applied via grooves 108 to which vacuum grooves (not shown) are connected. The disc chuck 100 also has four distance measuring sensors 103 (two of which are shown), which may be capacitance sensors. The distance measuring sensors may be mounted in a retaining ring 106 in a manner that their reference surface is flush with the top 10Γ. The retaining ring 106 is attached to the upper plate 101.
    The surface 301 of the mask 300 (see Figs. 3a-3c) faces the top 101 'of the disk chuck 100 when the mask 300 is mounted in the mask holder 302 of the mask aligner. The surface 301 of the mask 300 is generally coated with chromium patterned with the patterns to be applied to the disk 200. Consequently, the capacitance sensors 103 are capable of measuring the distance between the top surface 101 'of the disk chuck 100 and the coated surface 301 of the mask 300. In addition, the disc chuck 100 includes a lower plate 102 that is generally attached to a wedge error compensation head.
    The disc chuck 100 also has three linear actuators 104 (one shown), which are piezoelectric linear actuators in this embodiment. The three linear actuators 104 are in contact with the upper plate 101 and the lower plate 102, i. the three linear actuators 104 connect the upper plate 101 to the lower plate 102. In this embodiment, the holders for the linear actuators 104 are installed in the lower plate 102, and thus the lower plate 102 has the linear actuators 104. However, it should be understood that the linear actuator 104 retainer may also be incorporated in the upper plate 101, i. the upper plate 101 has the linear actuators 104. In the embodiment shown schematically in FIG. 1 b, the three linear actuators 104 are arranged on a peripheral edge region of the disk chuck 100. Consequently, the distance between the linear actuators is relatively large, so that a relatively large height of the stroke of a linear actuator leads to a small skew compensation. Consequently, the accuracy is high compared to an arrangement where the linear actuators in the center of the chuck 100 are close to each other. Nonetheless, the distance between the linear actuators 104 is large enough to ensure sufficient accuracy of skew compensation.
    When the three linear actuators 104 have the same travel, the upper plate 101 becomes in a direction perpendicular to the lower plate 102 and the lower one
    Plate 102 is moved between the lower plate 102 and the upper plate 101 without changing the inclination, if any. When at least one of the three linear actuators 104 has a travel that differs from the travel paths of the other two actuators, an inclination between the upper plate 101 and the lower plate 102 can be adjusted. In this context, the travel distance of at least one of the three linear actuators 104 may be zero.
    Adjacent to each linear actuator 104 is a corresponding spring-loaded bearing 105 in contact with the upper plate 101 and the lower plate 102, i. the three sprung bearings 105 also connect the upper plate 101 to the lower plate 102. In this embodiment, the sprung bearings 105 are fixedly secured to the lower plate 102 and the upper plate 101 by screws. The respective sprung bearings 105 are offset in a radial direction to the center of the disk chuck 100 with respect to the linear actuators 104. The sprung bearings 105 not only serve as bearings for the upper plate 101, but also provide a preload for the adjacent linear actuators 104, so that the upper plate 101 is driven to the lower plate 102.
    There are three load pins 107 arranged near the center of the disk chuck 100. The load pins 107 for lifting the substrate or disc assist the disk transfer to other parts of the mask aligner, e.g. by means of a robot handling.
    FIG. 2a schematically illustrates a flowchart illustrating method steps for adjusting the gap between the disk 200 and the mask 300 according to one embodiment of the invention.
    In a first step S1, the thickness of the disc 200 is measured at at least one, preferably three different points of the disc 200. Measuring the thickness of the disk 200 at three different points enables consideration of inhomogeneities in the thickness of the disk 200 or substrate, e.g. a slice wedge. If a disc 200 has a high homogeneity of thickness or variations in thickness can be neglected in favor of a higher processing speed, the thickness of the disc 200 can be measured at only one point. For more detailed analysis and / or more accurate positioning, thickness measurement at multiple points on the disk 200 is useful. However, this first step S1 may optionally be performed in a separate station of the mask aligner, e.g. on the pre-straightener before placing the disk 200 on the top 10Γ of the disk chuck 100.
    In a second step S2, the distance between the surface 301 of the mask 300 and the top 101 'of the top plate 101 is measured by the distance measuring sensors 103 of the disk chuck 100.
    In a third step S3, the inclination between the surface 201 of the disc 200 and the surface 301 of the mask 300 is adjusted by means of the linear actuators 104 of the disc chuck 100, preferably in combination with at least three spring-loaded bearings 105 of the disc chuck 100. The sprung bearings 105 preload the linear actuators 104. The skew is calculated using the information obtained in steps S1 and S2 and, if necessary, a previous calibration. The skew is adjusted until it completely disappears or is at least negligibly small, i. the surface of the disk 200 and the surface of the mask are aligned parallel to each other, and the gap is adjusted.
    Alternatively, the skew can be adjusted to a non-zero value, e.g. is specified by the user.
    Prior to the first step S1, during the setup of the mask aligning device, the distance measuring sensors 103 may be calibrated so that a possible height difference between the top of the measuring sensors 103 and the top 101 'is compensated or precisely measured. The resulting calibration values are then used in the further measurement process. This calibration enables embodiments where the reference surface of the distance measuring sensors 103 is e.g. can not be flush with the top 101 'due to design considerations.
    Fig. 2b shows schematically a flow chart illustrating process steps for adjusting the gap between the disk 200 and the mask 300 according to another embodiment of the invention.
    The steps S1 to S3 and the possible previous calibration are the same as in the embodiment shown in Fig. 2a. However, a fourth step S4 is added. In step S4, the distance between the disk surface 201 and the mask surface 301 is adjusted to a predetermined value by means of the linear actuators 104 of the disk chuck 100, preferably in combination with the sprung bearings 105 of the disk chuck 100. The predetermined value may be input to a control unit by a user before the first step S1. The maximum value for the distance adjustment by means of the linear actuators 104 is limited by their maximum travel.
    In addition, the distance can also be roughly adjusted by moving the entire chuck 100, and the fine adjustment is performed by means of the linear actuators 104.
    The steps S1 to S3 and the steps S1 to S4 may be repeated several times until the desired predetermined values for the inclination and the height are reached. Alternatively, the steps may be repeated two or three times, regardless of whether the desired values are reached. The steps S3 and S4 may also be performed in opposite order or even simultaneously.
    FIG. 3a shows another embodiment of the invention which discloses a pneumatic sensor system 400. The pneumatic sensor system 400 includes a sensor lever 401 having two pneumatic sensor heads 402 mounted on opposite sides of the sensor lever 401. In addition, the pneumatic sensor system 400 further includes pneumatic sensors 403 integrally mounted in the top plate 101 of the disk chuck 100. The two pneumatic sensor heads 402 measure the distance between the upper surface 201 of the disk 200 and the surface 301 of the mask 300 facing the upper surface 201 of the disk 200 along the entire disk 200 at a plurality of points by moving the sensor lever 401 over the disk , as indicated schematically by the arrows in Fig. 3a. The pneumatic sensors 403 measure the distance between the upper surface 10Γ of the upper plate 101 of the chuck 100 and the surface 301 of the mask 300.
    According to another embodiment, the measurement of the distance between the upper surface 10Γ of the upper plate 101 and the surface 301 may also be performed by the sensor heads 402, so that the pneumatic sensors 403 may be completely omitted.
    Both above-mentioned distance measurements can be repeated several times, with a three-time repetition being preferred. Based on both distance measurements-the distance between the top surface 201 and the surface 301 and the distance between the top surface 10Γ of the top plate 100 and the surface 301-the thickness of the disk 200 for use in the above-mentioned step S1 can be calculated. By measuring the distances at a plurality of points, the thickness distribution of the disk 200 can be calculated, revealing possible variations in thickness over the entire disk 200.
    In addition, the pneumatic sensor system 400 may therefore measure a possible curvature of the disk 200 and the disk surface 201, the mask 300, and the mask surface 301 or the top 101 '. Consequently, these parameters can be taken into account when calculating the skew between the surface of the disk 200 and the surface of the mask.
    3b shows another embodiment of the present invention wherein the pneumatic sensor system 400 comprises a preload air bearing 402 'mounted on the side of the lever 401 instead of two sensor heads 402 facing each other (FIG. 3a); which is opposite to the mask 300. However, the functionality of the pneumatic sensor system 400 in Figure 3b is the same as in Figure 3a.
    Fig. 3c shows another embodiment of the pneumatic sensor system 400 having only one sensor head 402 mounted on the side of the lever 401 facing the disk. Consequently, the sensor head 402 also measures the distance between the sensor head 402 and the surface 201 of the disk 200 and also, after a movement of the lever 401 in the direction of the dotted arrows in Fig. 3c, the distance between the sensor head 402 and the top 10Γ. The pneumatic sensors 403 then measure the distance between the top 101 'of the top plate 101 and the surface 301. Thus, the thickness of the disk 200 and the possible curvature of the disk 200 and the disk surface 201, the mask 300, and the mask surface 301 or Top 101 'measured and calculated.
    In addition, the results of the distance measurement sensors 103 and thickness data, as well as the compensated skew and height, number of repetitions of steps, accuracy, hysteresis, and travel of the linear actuators 104 may be recorded and used to monitor the performance of the particular chuck 100 and also the mask aligner in general. If performance degrades in specific patterns from a predefined standard or the performance of a new machine, maintenance can be planned. In addition, the type / pattern of deterioration indicates specific problems, e.g. the failure of one or more of the linear actuators 104 or one or more of the distance measurement sensors 103, or e.g. the skew must always be corrected in the same manner, which may indicate a problem with the head to which the pulley chuck 100 is attached. This provides important information to a service technician about the type of service action or about what kind of spare parts are required before the scheduled service date. As a result, downtime due to maintenance or unforeseen machine failure can be reduced.
    In addition, the distance measurement sensors 103 and the linear actuators 104 may be operated in an on-line feedback loop, i. the inclination and the height are continuously at any time, e.g. adjusted during the exposure. In very fast feedback loops even vibrations in the mask aligner can be compensated. This allows long exposure times with high nip accuracy and skew accuracy as well as high stability and reproducibility requirements.
    Since the distance measuring sensors 103 measure an absolute value for the distance between the surface of the mask and the top, no referencing operation is required during the disc processing. Consequently, the mechanical wedge error compensation process and the required mechanical parts can be removed from the design and the process. In addition, therefore, no mechanical contact between machine parts (e.g., the high-precision spacer balls used for the conventional wedge error compensation operation) and the customer's disk is more needed.
    According to this invention, the entire gap adjustment system is integrally incorporated into the disc chuck 101, providing the option of using the present chuck on an existing mask aligner with almost no changes to the mask aligner. While the invention has been illustrated and described in detail in the drawings and foregoing description, such explanation and description are to be considered illustrative or exemplary and not restrictive; the invention is therefore not limited to the disclosed embodiments. Modifications to the disclosed embodiments may be understood and carried out by a study of the drawings, the disclosure, and the appended claims by those skilled in the art who utilize the claimed invention. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality and may mean "at least one".
    权利要求:
    Claims (16)
    [1]
    claims
    A chuck (100) for aligning a first planar substrate (200), e.g. a disc parallel to a second planar substrate (300), e.g. a mask, wherein the chuck (100) comprises: (a) an upper plate (101) having an upper surface (10Γ) for disposing the first planar substrate; (b) a lower plate (102); (c) at least one distance measuring sensor (103) configured to measure a distance between the top surface (10Γ) of the top plate (101) and a surface (301) of the second planar substrate (300); and (d) at least three linear actuators (104) in contact with the upper plate (101) and the lower plate (102).
    [2]
    The chuck (100) of claim 1, wherein the at least three linear actuators (104) are provided on a peripheral edge portion of the disk chuck (100).
    [3]
    The chuck (100) of claim 1 or 2, wherein at least three linear actuators (104) are configured to move the top plate (101) in a direction perpendicular to the top of the bottom plate (102) of the disc chuck (100). or wherein the at least three linear actuators (104) are configured to incline the top plate (101) with respect to the bottom plate (102).
    [4]
    The chuck (100) according to any one of claims 1 to 3, further comprising at least three spring-loaded bearings (105) connected to the upper plate (101) and the lower plate (102).
    [5]
    The chuck (100) of claim 4, wherein the at least three sprung bearings (105) are configured to bias the at least three linear actuators (104).
    [6]
    The chuck (100) of claim 4 or 5, wherein the at least three spring-loaded bearings (105) are disposed adjacent the at least three linear actuators (104) in a radial direction toward the center of the disk chuck (100) or radially outwardly.
    [7]
    7. Chuck (100) according to one of claims 1 to 6, wherein the at least one distance measuring sensor (103) from the group of a capacitive sensor, an optical sensor, e.g. a laser sensor or an infrared sensor, an ultrasonic sensor, a magnetic induction sensor or a pneumatic sensor is selected.
    [8]
    The chuck (100) of any one of claims 1 to 7, wherein the at least three linear actuators (104) are piezoelectric linear actuators and / or ball screws and / or roller screws.
    [9]
    The chuck (100) according to any one of claims 1 to 8, further comprising at least one load pin (107) in the center of the chuck (100) or near the center.
    [10]
    The chuck (100) of any one of claims 1 to 9, further comprising at least one thickness sensor configured to measure at least one of the thickness of the first planar substrate (200), the curvature of the first planar substrate (200 ), the curvature of the second planar substrate (300) and / or the curvature of the upper plate (101), wherein the at least one sensor preferably from the group of a pneumatic sensor, a capacitive sensor, an optical sensor, eg a laser sensor or an infrared sensor, an ultrasonic sensor or a magnetic induction sensor is selected
    [11]
    11. A method of adjusting a gap between a first planar substrate (200), e.g. a disc, on an upper plate (101) of a chuck (100), and a second planar substrate (300), e.g. a mask, in particular by means of a chuck according to one of the preceding claims, the method comprising the steps of: (a) measuring the thickness of the first planar substrate (200) at at least one point; (b) measuring the distance between a surface (301) of the second planar substrate (300) and the top surface (10Γ) of the top plate (101) by at least one distance measuring sensor (103) of the chuck (100); and (c) adjusting the inclination between an upper surface (201) of the first planar substrate (200) or the chuck (100) and the surface (301) of the second planar substrate (300) by means of at least three linear actuators (104) of the chuck ( 100), preferably in combination with at least three spring-loaded bearings (105) of the chuck (100).
    [12]
    The method of claim 11, further comprising a step of: (d) adjusting the distance between the top surface (201) of the first planar substrate (200) and the surface (301) of the second planar substrate (300) to a predetermined value by means of the at least three linear actuators (104) of the chuck (100), in particular as means for one or more of the following: (dl) adjusting the gap without changing the inclination, (d2) adjusting the inclination without changing the gap, (d3) Skew adjustment before or after gap adjustment, and (d4) simultaneous skew adjustment and gap adjustment, (d5) means (dl) to (d4) either with or without a thickness measurement, (d6) skew adjustment between the surface (301) of the second substrate (300) facing the first substrate (200) and either the surface (201) of the first substrate (200) that faces the second substrate (300) or the top surface (10Γ) of the top substrate (200) Plate (101) of the chuck (100) is opposite, and (d7) means (dl) to (d6) with or without a predetermined value of the skew.
    [13]
    The method of claim 11 or 12, comprising the step of: (e) calculating a variation of the distance between the top surface (201) of the first planar substrate (200) and the surface (301) of the second planar substrate (300) prior to step (c), wherein the calculation of the variation is based on the thickness measurement of the first planar substrate (200), and wherein step (c) is based on the variation of the distance between the top (201) of the first planar substrate (200) and the surface (301) of the second planar substrate (300).
    [14]
    14. The method of claim 11, wherein step (a) is performed by: measuring the first distance between the top surface of the first planar substrate and the surface of the second planar substrate (300) at least one point, (a2) measuring the second distance between the top surface (10Γ) of the top plate (101) and the surface (301) of the second planar substrate (300) at at least one point, and subtracting (a3) the first distance from the second distance.
    [15]
    15. The method of claim 11, further comprising the step of: (f) measuring the curvature of the first planar substrate (200) and / or the second planar substrate (300) and / or the top surface (10Γ), and wherein step (c) is performed based on the variation of the curvature of the first planar substrate and / or the second planar substrate and / or the top surface (10Γ).
    [16]
    16. The method of claim 11, further comprising a step of: (g) adjusting the distance between the top surface of the first planar substrate and the surface of the second planar substrate a predetermined value by means of coarse adjustment means for moving the first substrate (200) relative to the second substrate (300) in the direction perpendicular to the surface (201) of the first substrate (200).
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    JP6285957B2|2018-02-28|
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    TW201434073A|2014-09-01|
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    DE112013003869T5|2015-06-03|
    JP2016503965A|2016-02-08|
    US20150294890A1|2015-10-15|
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    TWI604506B|2017-11-01|
    WO2014106557A1|2014-07-10|
    AT517796A3|2017-11-15|
    US9824909B2|2017-11-21|
    KR102169866B1|2020-10-27|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    EP13150260.1A|EP2752870A1|2013-01-04|2013-01-04|Chuck, in particular for use in a mask aligner|
    PCT/EP2013/075513|WO2014106557A1|2013-01-04|2013-12-04|Chuck, in particular for use in a mask aligner|
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