• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method for producing a printed circuit board (10) having at least one embedded sensor chip (3), wherein at least one sensor surface (5) and terminals (4) are arranged on a surface of the chip, comprising the following steps: a) providing an adhesive film ( 1), b) printing a conductor structure (2) of a conductive paste on a surface of the adhesive film, c) registered placement of the at least one sensor chip (3) with the at least one sensor surface (5) and the terminals (4) having surface d) curing the conductive paste, e) applying an insulating layer (6) with an overlying conductor layer (7) to the surface of the structure formed in the preceding steps, the chip (3), f) laminating the structure created in the preceding steps, g) structuring the conductor layer (7) and forming vias (9) from the conductor layer to L strip conductors (7b, 7c) of the conductor pattern on the surface of the adhesive film and h) removal of the adhesive film (1).
    公开号:AT515443A1
    申请号:T50154/2014
    申请日:2014-02-28
    公开日:2015-09-15
    发明作者:Gerald Weidinger
    申请人:Austria Tech & System Tech；
    IPC主号:
    专利说明:

    Method for producing a printed circuit board and printed circuit board
    The invention relates to a method for producing a printed circuit board with at least one embedded sensor chip, in which sensor surface and connections are arranged on a surface of the chip.
    The invention also relates to a printed circuit board, comprising at least one insulating layer and at least one structured conductor layer with at least one embedded sensor chip, in which at least one sensor surface and connections are arranged on a surface of the chip, which faces away from the structured conductor layer substantially coplanar lie a surface of the circuit board.
    In the context of the invention, sensor chips are understood to be semiconductor components which have a sensor which can react, for example, to electromagnetic radiation, to chemical influences, pressure, force, temperature, etc., the chip often not only the actual sensor but also semiconductor components, ICs and passive electrical components Contains components. A sensor has a region which is sensitive to the quantity to be detected, e.g. for incident light radiation, or receives a force, has a membrane, etc. and which is referred to here for simplicity as a sensor surface.
    From DE 10 2006 045 900 Al a method for producing a sensor module has become known in which a plurality of sensors with their sensing area (sensor surface) and with their contact points (terminals) on a support, which consists for example of polished copper, arranged and then with a molding material, such as an epoxy resin filled with a filler material. After cooling the hot molding material, the carrier is removed, which can be done, for example, chemically by means of nitric acid or mechanically, and after cutting individual modules are present. For connecting the contact points with contact structures protruding from the support made of gold-coated nickel, it is also possible to use a conductive and adhesive sealing material. The problem of protecting the sensor surfaces of a chip from chemical or mechanical effects during the production of the modules is described in this document, but not those of embedding a sensor element in a printed circuit board and thereby required contact with a conductor structure.
    An object of the invention is to embed a sensor chip, in which sensor surface and connections are arranged on a surface of the chip, in a printed circuit board and to contact a conductor structure of the printed circuit board, wherein this is done safely and with special protection of the sensor surface in the simplest possible way should. Another object is to provide an easy to manufacture and very thin executable circuit board with an embedded sensor chip.
    These objects are achieved by a method of the type mentioned above, which comprises the following steps: a) providing an adhesive film, b) imprinting a conductive pattern of a conductive paste on a surface of the adhesive film, c) registered placement of the at least one sensor chip with the f) curing the conductive paste, e) applying an insulating layer having an overlying conductor layer to the chip-containing surface of the structure created in the preceding steps, f) laminating g) patterning the conductor layer and forming vias from the conductor layer to the conductor pattern on the surface of the adhesive film; and h) removing the adhesive film.
    In an advantageous variant, the conductive paste is an epoxy resin adhesive.
    Furthermore, it is expedient if the curing takes place in step e) by application of UV light and / or heat.
    In a practice-proven embodiment, the insulating layer is a prepreg and / or the conductor layer is a copper layer.
    Particularly in the case of using an epoxy resin adhesive as a conductive paste, it is advantageous if the adhesive film is a silicone-based adhesive film to ensure easy and safe detachment of the adhesive tape without destroying the conductor structure.
    In a preferred variant, it can be advantageously provided that the printing in step b) takes place with the aid of a screen printing process.
    Furthermore, it is recommended that the insulating layer applied in step e) has a recess in the region of the at least one sensor chip.
    The stated objects are also achieved with a printed circuit board of the type specified above, in which, according to the invention, the connections of the sensor chip are connected to a conductor structure made of a conductive paste and plated-through holes run from this conductor structure to the structured conductor layer.
    The invention together with further advantages is explained in more detail below with reference to an exemplary embodiment, which is illustrated in the drawing. In this show
    1 in a section of a structure produced in the first steps of the method, consisting of an adhesive film with a printed conductive pattern of a conductive paste,
    2 shows the structure of FIG. 1 after placing a sensor chip,
    3 shows the structure after lamination with a prepreg having a conductor layer,
    4 shows the finished printed circuit board after removing the adhesive film,
    Fig. 5 in a section, the individual parts for a variant of the production and
    6 is a schematic and partial bottom view of the circuit board of FIG .. 4
    With reference to the figures, the method according to the invention and a circuit board according to the invention will now be explained. It should be noted that the terms " top " and " bottom " only refer to the illustrations in the drawings and used for ease of description.
    Fig. 1 shows an adhesive film 1, which is the starting point of the method according to the invention. This adhesive film 1 is preferably an adhesive film with a silicone-based adhesive layer, wherein the total thickness of the carrier film and adhesive layer may be in the range of 50 and 300 μm. Such adhesive films are commercially available, for example, under the names Tacsil F20 from Taconic. The single-sided adhesive film is supported on a smooth surface during the process described below, e.g. on a vacuum table.
    On a surface of this adhesive film 1, in the drawing, the upper, is now, preferably by means of a printing process, such as screen printing, flexographic printing, offset printing, inkjet printing, a conductive structure 2 applied from a conductive paste. The conductive paste is preferably an epoxy resin adhesive, the combination of "epoxy adhesive - silicone-based adhesive film " is particularly advantageous because it favors a later reliable and non-destructive peeling of the adhesive film. Such a conductive paste for screen printing is commercially available, for example, under the designation Epo-tek® H20E from Epoxy Technology, and obtains its conductivity by adding, for example, silver, which is in the range of more than 2500 Qr.rrr1. The layer thickness of the conductor structure 2 may preferably be in the range of 5 and 30 μm.
    In a next step, see Fig. 2, a sensor chip 3, the electrical connections 4 and the sensor surface 5 are on the same surface of the chip, placed on the conductive pattern 2 of conductive paste. The touchdown is registered, i. the terminals 4 of the sensor chip 3 are aligned with the corresponding contact points of the conductor structure 2. During this placement, the terminals 4 penetrate into the still soft
    Conductor structure 2, so that an electrical connection is created. The conductive paste of the conductor structure 2 is now cured, for example by thermal or UV curing.
    A further step now envisages that the structure according to FIG. 2 is combined in an insulating layer 6 with an overlying conductor layer 7, which is illustrated in FIG. 3. In the present case, a so-called core is made consisting of commercially available prepregs, e.g. FR 4, as an insulating layer 6, and a single conductor layer 7, wherein the insulating layer 6 in the region of the sensor chip 3 expediently has a recess 8 which receives the chip 3. The structure thus obtained is subjected to a conventional lamination process, which also leads to the curing of the insulating layer 6.
    It can be seen from FIGS. 2 and 3 that the film 1 is elastically deformed or bent away in the region of the conductor structure 2, although it should be noted that this is exaggerated in the drawing, since the drawing is not to scale for better visualization of the individual parts is created. In fact, the conductor pattern 2 is very thin compared to the film, namely, for example, 10pm versus, for example, 200pm.
    In the following, the conductor layer 7 can now be structured in a conventional manner in order to obtain individual conductor tracks 7a, 7b, 7c. Furthermore, via (vias) 9 are created between upper conductor tracks and the conductor structure 2. This is done in a known manner in that first holes are made by the structure and then filled or lined with a conductive material. For example, this can be done by depositing copper or by filling the holes with a conductive paste. It can now be deducted the film 1, whereby the sensor surface is exposed. As a result, the circuit board 10 shown in FIG. 4 is present.
    It should be clear that the illustrations of FIGS. 1 to 4 generally show only a section of a larger printed circuit board structure, and in practice several sensors and other components can be embedded or provided at different locations and connected to conductor structures on a printed circuit board. It is also possible to apply further insulating layers and conductive layers to a printed circuit board 10 according to FIG. 4. For example, the conductor structure 7a, 7b, 7c may be followed by an insulating layer and a conductor layer thereon, and it may likewise be arranged between all the conductive layers. In the invention, the conductive paste serves on the one hand for contacting and on the other hand for (temporarily) fixing the sensor chip 3 on the film 1, which, as already mentioned, does not permanently bond to the paste of the conductor structure 2. In the choice of the materials of conductive paste and the film 2 is therefore the requirement to take into account that the film 2 without destruction of the conductor structure 2 must be removable.
    As regards the recess 8 for receiving the sensor chip 3, reference is still made to Fig. 5, which shows a way in which the chip 3 can be embedded in the insulating layer 6. In this figure, the already known from the preceding figures, used for the process items are shown, but wherein the insulating layer 6 consists of two individual layers 60 and 6u, of which the lower single layer 6u has the sensor chip 3 receiving recess 8. The parts shown in Fig. 5 lead after lamination to a circuit board as shown in Fig. 5. It should be noted that the above as "Core". designated structure, where consisting of an insulating layer and a conductor layer, can also be produced in other ways and in other forms, without departing from the invention. Thus, the prepregs 6o, 6u in turn may consist of several prepregs, but so-called "bonding sheets" can also be used. asymmetric prepregs, liquid resin blends, or other methods of making the core.
    Since the sensor chip, as already noted above, is generally very thin, in many cases it will also be possible to refrain from the formation of a recess 8 in the insulating layer 6. Thus, in the case of application of the insulating layer in liquid form as well as in materials without glass fiber reinforcement on the recess can also be dispensed with.
    FIG. 6 shows a possible conductor structure 2 used in this example in a bottom view of FIG. 4. The rectangular sensor chip 3 with the sensor surface 5, which is approximately square here, can be seen on the "underside". of the chip, and four electrical terminals 4 which are electrically connected to the conductive pattern 2 made of a conductive paste and which are drawn by dashed lines. This conductor structure has the four terminals corresponding to four connection eyes 11, to which the vias 9 lead (see Fig. 4). The connection eyes 11 are connected via conductor tracks 12 with connection surfaces 13 for the chip connections 4.
    权利要求:
    Claims (9)
    [1]
    1. A method for producing a printed circuit board (10) having at least one embedded sensor chip (3), wherein at least one sensor surface (5) and terminals (4) are arranged on a surface of the chip, characterized by the following steps: a) Provide an adhesive film (1), b) imprinting a conductor structure (2) of a conductive paste on a surface of the adhesive film, c) registered placement of the at least one sensor chip (3) with which the at least one sensor surface (5) and the terminals (4) d) curing the conductive paste, e) applying an insulating layer (6) with an overlying conductor layer (7) on the chip (3) having surface in the preceding steps f) laminating the structure created in the preceding steps, g) structuring the conductor layer (7) and forming through-hole (9) from the conductor layer to conductor tracks (7b, 7c) of the conductor structure on the surface of the adhesive film and h) removing the adhesive film (1).
    [2]
    2. The method according to claim 1, characterized in that the conductive paste is an epoxy resin adhesive.
    [3]
    3. The method according to claim 1 or 2, characterized in that in step e) curing by application of UV light and / or heat takes place.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that the insulating layer (6) is a prepreg.
    [5]
    5. The method according to any one of claims 1 to 4, characterized in that the conductor layer (7) is a copper layer.
    [6]
    6. The method according to any one of claims 1 to 5, characterized in that the adhesive film (1) is a silicone-based adhesive film.
    [7]
    7. The method according to any one of claims 1 to 5, characterized in that the printing in step b) takes place by means of a screen printing process.
    [8]
    8. The method according to any one of claims 1 to 6, characterized in that in step e) applied insulating layer in the region of the at least one sensor chip (3) has a recess (8).
    [9]
    9. printed circuit board (10) consisting of at least one insulating layer (6) and at least one structured conductor layer (7a, 7b, 7c) with at least one embedded sensor chip (3), wherein at least one sensor surface (5) and terminals (4) on a Surface of the chip are arranged, which are facing away from the structured conductor layer substantially coplanar with a surface of the circuit board, characterized in that the terminals (4) of the sensor chip (3) with a conductive paste consisting of a conductor structure (2) are connected and Vias (9) of this conductor structure to conductor tracks (7b, 7c) of the structured conductor layer extend.
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    同族专利:
    公开号 | 公开日
    AT515443B1|2019-10-15|
    CN106465546B|2019-08-23|
    EP3111474A1|2017-01-04|
    US20170020001A1|2017-01-19|
    US10455703B2|2019-10-22|
    WO2015127486A1|2015-09-03|
    EP3111474B1|2021-06-23|
    CN106465546A|2017-02-22|
    引用文献:
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50154/2014A|AT515443B1|2014-02-28|2014-02-28|Method for producing a printed circuit board and printed circuit board|ATA50154/2014A| AT515443B1|2014-02-28|2014-02-28|Method for producing a printed circuit board and printed circuit board|
    US15/121,844| US10455703B2|2014-02-28|2015-02-20|Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board|
    CN201580022545.5A| CN106465546B|2014-02-28|2015-02-20|For producing the method and printed circuit board that are embedded in the printed circuit board of sensor wafer|
    PCT/AT2015/050046| WO2015127486A1|2014-02-28|2015-02-20|Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board|
    EP15711033.9A| EP3111474B1|2014-02-28|2015-02-20|Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board|
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