• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method of embedding a component in a printed circuit board or printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate has at least one insulating layer of a prepreg material and the component is defined by the resin of the prepreg material, is characterized by the following steps: a) provision of a composite (100) of the layers of the printed circuit board or of the intermediate printed circuit board product (200), this composite containing at least one curable prepreg material, b) producing an exemption (4) in the composite (100) for receiving the component (6) to be embedded, c) covering at least the region of the release (4) with a first temporary carrier layer (5) in the form of an adhesive tape on a first side of the composite, d ) Positioning of the component to be embedded (6) in the release (4) by means of the adhesive tape, e) covering at least the area of the release (4) f) pressing the composite (100) with the component (6) while curing the curable prepreg material, g) removing the temporary carrier layers (100) with a second temporary carrier layer (9), 5, 9).
    公开号:AT515101A4
    申请号:T50821/2013
    申请日:2013-12-12
    公开日:2015-06-15
    发明作者:Timo Schwarz；Andreas Zluc；Gregor Langer；Johannes Stahr
    申请人:Austria Tech & System Tech；
    IPC主号:
    专利说明:

    Method for embedding a component in a printed circuit board
    The present invention relates to a method for embedding a component in a printed circuit board or printed circuit board intermediate product, wherein the printed circuit board or the intermediate printed circuit board at least one insulating layer of a prepreg material and the component through the resin of the prepreg Material is determined as well as a printed circuit board or a printed circuit board intermediate.
    Circuit boards are used for the destruction and electrical connection of electronic components and their connection as a module in electronic devices. In general, printed circuit boards consist of a plurality of alternating layers of insulating material and conductive material, wherein the layers of electrically conductive material, such as copper, are patterned into circuit traces, which are in communication with the contact pads of the electronic components and correspondingly defaced them. In addition to the Pestlegung and connection of the electronic components together, printed circuit boards can also take over a static puncture in an electronic device due to their relatively high mechanical stability.
    In the sense of the ever-advancing miniaturization of electronic devices such as mobile phones, tablet computers and the like, the ever-shrinking electronic components are not only mounted on the surface of printed circuit boards and soldered, but increasingly integrated into the interior, the cross-section of the circuit boards. A conventional method for embedding electronic components in printed circuit boards in this case provides for the production of clearances or holes in the size and shape of the component to be embedded in the printed circuit board, so that in a subsequent step, the components can be inserted into the respective holes and glued there. A disadvantage of the bonding of the components in the circuit board, however, is that the adhesive is necessarily a different material than the material of the insulating layer in the circuit board. While the insulating layers in the printed circuit board are made of prepreg materials, such as FR4, that is, resin systems, the adhesives for inserting the components are mostly solvent-based. When bonding the components thus inevitably results in inhomogeneities, which due to the relatively high heating of the components in the circuit board due to different coefficients of thermal expansion of the materials used cracks bil the time, which has a negative effect on the longevity of the circuit board and thus the corresponding electronic Affects devices.
    In WO 2012/100274 Al, therefore, a method was specified in which the determination of the components in the circuit board is not done with adhesive, but is accomplished with the resin of the insulating layers of the circuit board. In the manufacture of printed circuit boards, the insulating layers, which are made of a prepreg material, are bonded to the conductive layers by lamination and compression at elevated temperature. Prior to lamination and compression at elevated temperature, the resin of the prepreg materials is in a non-cured state, referred to as a B-stage. B-stage prepreg is stored refrigerated on rollers to prevent premature curing of the resin. The method according to WO 2012/100274 A1 now provides that in a composite, the thermosetting prepreg material, i. Prepreg material in the B-stage contains exemptions for the components are prepared, the components in the exemptions equipped and covers the exemptions or openings with the components with other prepreg layers in the B-stage and possibly other contact layers or electrically conductive layers become. This is followed by the compression of this composite to the finished printed circuit board, in which the prepreg material is cured, which hardened state is referred to in the art as C-stage.
    A disadvantage of this method is the fact that inevitably an overlapping of the exemptions with the components with further layers is required, so that the printed circuit boards, which were produced by the method according to WO 2012/100274 Al, were relatively thick, which runs counter to the idea of miniaturization ,
    The invention is therefore based on the object to improve a method of the type mentioned in that the exemptions and components covering prepreg layers can be avoided, so that the smallest possible circuit boards are feasible.
    To solve this problem, a method of the type mentioned in the invention is characterized by the following steps: a) providing a composite of the layers of the printed circuit board or the printed circuit board intermediate product, said composite containing at least one curable prepreg material, b) producing an exemption in the composite for receiving the component to be embedded, c) covering at least the area of the release with a first temporary carrier layer in the form of an adhesive tape on a first side of the composite, d) positioning the component to be embedded in the release by means of the adhesive tape, e) covering at least the region of the release on the second side of the composite with a second temporary carrier layer, f) pressing the composite with the component with curing of the hardenable prepreg material, g) removing the temporary carrier layers.
    Thus, in the method according to the invention, a composite of all the layers of the printed circuit board or of the printed circuit board intermediate product is provided, which composite has prepreg material in the B-stage, i. still contains curable prepreg material in contrast to already cured prepreg material. After the release of the component, at least the region of the release is covered in accordance with step c) with a first temporary carrier layer in the form of an adhesive tape, so that the component to be embedded can be fitted onto the now facing the release adhesive layer of the adhesive tape, wherein the adhesive effect the adhesive tape positioning or temporary attachment of the component takes place. Now, the covering of the area of the release with the component positioned therein takes place on the second side of the composite with a second temporary carrier layer, which however need not necessarily be an adhesive tape like the first temporary carrier layer. Rather, here also any kind of release film can be used, which only after curing of the prepreg material to the C-stage must be removable. The curing of the prepreg material takes place in step f) and is carried out by methods that are well known in the art. As a rule, the composite of the layers of the printed circuit board or of the printed circuit board
    Intermediate with the assembled component and the two temporary support layers subjected to mechanical pressure and heated simultaneously, so that cross-linking of the resin of the prepreg material of the insulating layer or the insulating layers takes place. When pressing according to step f), the resin of the prepreg material flows around the component, experiences a spatial boundary on the temporary carrier layers and thus also hardens in the region of the components, so that a continuous resin phase through the prepreg layers, the insulating Form layers of the printed circuit board or of the printed circuit board intermediate, results. In this way, during operation of the circuit board, when the components are heated, only low voltages occur, which can be dissipated directly into the surrounding areas without the presence of a boundary layer, as occurs in the bonding between adhesive and resin. Since the area of the embedded component did not have to be covered by additional prepreg layers in order to enable compression, after the removal of the temporary carrier layers according to step g) an extremely thin product is obtained which excellently meets today's requirements of miniaturization.
    The method of the invention is defined in terms of a component being embedded. However, it is clear to those skilled in the art that in industrial production, a plurality of components can be embedded in one and the same composite, but the invention is understood to mean that only one component is used in each case an exemption. In the present specification, therefore, the component may be referred to in the singular or a plurality of components, but this does not alter the spirit and the essence of the present invention.
    The invention can be based on different types of a composite of the layers of the printed circuit board or the printed circuit board intermediate product. According to a preferred variant of the method according to the invention, it is provided that the composite of the layers of the printed circuit board or of the intermediate printed circuit board product consists of a plurality of layers of a prepreg material. When using such a composite in step a) of the inventive method results in a particularly homogeneous printed circuit board or a particularly homogeneous printed circuit board intermediate, since there are no conductive layers between the layers of a prepreg material and therefore the resin of the prepreg material before Curing will flow unhindered and consequently the one to embed
    Component or einzubettenden components can flow around. After pressing and after removal of the temporary carrier layers, in this preferred embodiment of the present invention, the wiring or unbundling of the embedded component or components must generally take place in a subsequent processing step, in which conductor tracks are formed on the outer sides according to known methods become.
    In order to facilitate the formation of circuit traces, the invention according to a preferred embodiment is further developed such that the composite of the layers of the printed circuit board or the printed circuit board intermediate product consists of a plurality of layers of prepreg material and copper layers on both sides. In this case, after the pressing and after the removal of the temporary carrier layers, copper layers are provided on both sides on the outside of the printed circuit board or of the printed circuit board intermediate, from which suitable conductor tracks can be formed, for example by photolithographic methods.
    If the printed circuit board or the printed circuit board intermediate product to be produced by the method according to the invention are to meet special mechanical stability requirements, according to a preferred embodiment of the present invention, the composite of the layers of the printed circuit board or of the intermediate printed circuit board of a Consist of layers of prepreg material and a centrally located core. A core is understood in the art as a layer of a cured prepreg material, for example FR4, with mutually auflamminierten copper layers. Such cores can be obtained industrially as a standard component and in the process according to the invention provide a certain stability even before the compression of the thermosetting prepreg material in the composite of the layers of the printed circuit board or of the printed circuit board intermediate product, which results in better handling during processing and increased Strength of the finished product leads. Optionally, the centrally located core for the formation of conductor tracks can be structured accordingly.
    According to a further preferred embodiment of the present invention, the composite consists of a plurality of layers of prepreg material and a centrally located core and on both sides of outer copper layers, which corresponds to a combination of the two preceding variants, whereby the advantages already described are achieved in combination.
    Moreover, according to a preferred embodiment of the present invention, it is conceivable that the composite of the layers of the printed circuit board or of the printed circuit board intermediate product consists of an inner layer of a prepreg material and outer cores on both sides.
    The inventive method enables the production of printed circuit boards or printed circuit board intermediates with embedded components of particularly small thickness. According to a preferred embodiment of the present invention, the method according to the invention is therefore further developed in that the composite of the layers of the printed circuit board or of the printed circuit board intermediate essentially has the thickness of the components to be embedded. Too small a thickness would cause the components to protrude above the cross-section of the circuit board and consequently not be completely enclosed by the resin of the prepreg material. However, a thickness of the composite of the layers of the printed circuit board or of the printed circuit board intermediate, which substantially exceeds the thickness of the components, is likewise not necessary in order to ensure sufficient embedding in the resin of the prepreg material.
    As already mentioned above, the inventive method can be applied to a plurality of components, so that a plurality of components is embedded in the circuit board. However, it is essential here that the method, as defined in the main claim, is carried out for each individual component, so that in each case an exemption is established for each component to be embedded.
    According to a preferred embodiment of the present invention, it is provided that components of different thicknesses are fitted in the respective exemptions and the second temporary carrier layer is aligned with a non-adhesive surface for bonding the layers of the printed circuit board or of the printed circuit board intermediate product. In this case, the thickness of the composite of the layers of the printed circuit board or of the printed circuit board intermediate product is selected according to the thickest component or the thickest components, so that thinner components do not completely penetrate the cross section of the composite. For this reason, the second temporary carrier layer must be aligned with a non-adherent surface for bonding the layers of the printed circuit board or the printed circuit board intermediate, respectively, in order to prevent the component from becoming temporary when compressing an adhesive layer on the second temporary carrier layer Carrier layer is lifted.
    Preferably, the first side of the composite is a contact side of the printed circuit board or the Lei terplatten intermediate product and the component to be embedded is fixed face-up to this contact side in the release.
    According to a preferred development of the present invention, both the first side and the second side of the composite is a contact side of the printed circuit board. In this case, both sides of the circuit board can have conductor tracks, whereby a highly integrated and therefore space-saving circuit board is obtained.
    This is particularly advantageous when a component with contacts is embedded on two opposite sides of the component, as is the subject of a preferred embodiment of the present invention. This configuration allows vertical flow of current, i. a current flow through the cross section of the circuit board, wherein the electronic component serves as a current bridge.
    Preferably, the component is selected from the group consisting of an integrated circuit, an LED, and a heat sink. It will be apparent to those skilled in the art that any type of electronic component can be embedded with the method of the invention, so that this list should not be considered exhaustive.
    According to a particularly preferred embodiment of the present invention, the components is an IMS component. The abbreviation IMS stands for "insulated metal substrate". and denotes a component in which a thin insulator layer, for example based on epoxy resin, is disposed between a thick, metallic base layer, for example of aluminum or copper, and a relatively thin conductive layer, for example of aluminum or copper. IMS components are used for contacting and simultaneous cooling of power components, since on the one hand the conductive layer can be structured into contact points and conductor tracks and on the other hand is electrically insulated by the insulator layer against the base layer, the insulator layer ensures a good heat transfer to the base layer, where of the Power component accumulating heat can be dis-siped.
    The invention will be explained in more detail with reference to an embodiment schematically illustrated in the drawing. In this show the
    Fig.la) to le) variants of a composite of the layers of the printed circuit board or the printed circuit board intermediate according to step a) of the method according to the invention,
    2 shows a representation of step b) of the method according to the invention,
    3 shows a representation of step c) of the method according to the invention,
    4 shows a representation of step d) of the method according to the invention,
    5 shows a representation of step e) of the method according to the invention,
    6 shows a representation of step f) of the method according to the invention,
    7 shows a representation of step g) of the method according to the invention,
    8 shows a possible way of further processing the printed circuit board or printed circuit board intermediate produced by the method according to the invention with a contacting of the embedded components in the plane of the contact pads of the embedded components,
    9 shows a possible type of further processing of the printed circuit board or the printed circuit board intermediate product produced by the method according to the invention with a contacting in a contact layer lying above the plane of the contact pads of the embedded components,
    10 shows a representation corresponding to step e) of the method according to the invention, wherein components of different thickness have been positioned in the clearances,
    11 shows the further processing of the intermediate product according to FIG. 10 in the sense of the steps f) and g) of the method according to the invention,
    12 shows a possible way of contacting the components embedded according to FIGS. 10 and 11,
    13 a representation of a variant in which components of different thickness are positioned with the contact side in the direction of the first temporary carrier layer in the clearances,
    14 shows a representation of the result of the further processing according to the invention of the semi-finished product according to FIG. 13, FIG.
    Fig. 15 shows a variant of a printed circuit board produced by the process according to the invention or a printed circuit board intermediate and the
    16-19 show a variant of the present invention using an IMS component as the component to be embedded.
    1a) to le) show variants of the composite of the layers of the printed circuit board or the printed circuit board intermediate, as they can be provided in the context of the present invention according to step a). 1 a) shows a composite 100 which consists only of layers of a prepreg material 1 (prepreg layers). FIG. 1 b) shows a composite 100 consisting of prepreg layers 1 and copper layers 2 on both sides, FIG 1c) shows a composite 100 which consists of outer prepreg layers 1 and a centrally located core 3, FIG. 1d) shows a composite 100 which consists of cores 3 on both sides and an inner prepreg layer 1, and FIG. le) shows a composite 100 which consists of an inner core 3 of a plurality of layers of prepreg material 1 and copper layers 2 on both sides.
    In Fig. 2 is an example of a composite 100, as shown in Fig. Le), shown in step b) provided with exemptions 4 for receiving the components to be embedded. After the exemptions 4 have been produced, in accordance with step c) the exemptions 4 in the composite 100 are covered with a first temporary carrier layer 5 in the form of an adhesive tape on a first side of the composite 100 (FIG. 3). According to step d) and as shown in FIG. 4, in a next method step, the components 6 to be embedded are fitted in the exemptions 4 or positioned therein. As can be seen in Figure 4, the components can both " face down " as well as "face up" be positioned, in the first case with their contact side or their contact pads 7 and in the second case with its back 8 on the first temporary carrier layer, which is present on this first side of the composite in the form of an adhesive tape, adhere.
    To carry out the method according to the invention, it is in principle only necessary to cover at least the area of the free position or the areas of the clearances with a first temporary carrier layer 5. In industrial production, however, it is usually simpler not only to cover the area or the areas of the clearances with a first temporary carrier layer, but also to glue the entire area of the composite 100 to a continuous first temporary carrier layer 5.
    In Fig. 5 it can be seen that according to step e) the areas of the exemptions on the second side of the composite 100 are covered with a second temporary carrier layer 9, where it is also mostly economical, not only the scope of the exemption or to cover the areas of the exemptions, but to apply a continuous second temporary carrier layer 9 over the entire surface of the composite 100.
    FIG. 6 shows step f) of the method according to the invention, namely the pressing of the composite with the component or the components with curing of the curable prepreg material 1. As can be seen in Fig. 6, the cavities of the exemptions 4 are filled by the resin of the layers of prepreg material 1, so that when hardening a reliable fixing of the components 6 in the composite 100 takes place. Because the first temporary carrier layers 5 and 9 reliably confine the composite 100 spatially, the contact pads 7 of the components 6 after the removal of the temporary carrier layers 5 and 9 are located in the variant of the assembly 100 shown in the previous figures with components 6 (FIGS. Fig. 7) free and, as shown in Fig. 8, directly to Ankontaktierung and the structure of here not shown conductor tracks 10 in the same plane a and a 'of the printed circuit board or the printed circuit board intermediate product 200 subjected become. According to the variant shown in FIG. 9, however, a further construction of the printed circuit board intermediate product 200 can take place in which further layers of prepreg material 1 'and contact layers or copper layers 2' are applied by known methods, in which case the contacting the contact pads 7 of the components 6 via so-called microvias 11 takes place.
    In FIG. 10, it can be seen that components 6 of different thickness can be fitted in or positioned in the clearances 4, in which case, due to the fact that there is a gap between the components 6 and the second temporary carrier layer, and the components 6 may not be lifted from the first temporary carrier layer 5 during pressing, the second temporary carrier layer 9 in this case is not an adhesive tape. After pressing in accordance with step f) of the method according to the invention, a printed circuit board or a printed circuit board intermediate product 200 is obtained, as shown in FIG. 11, wherein a contacting of the components 6 takes place again via microvias 11 (FIG. 12). When equipping different thickness components 6 in the exemptions 4 with the contact pads in the direction of the first temporary carrier layer 5, which is in the form of an adhesive tape, the second temporary carrier layer must have a non-adhesive surface, the composite 100 of the layers of the circuit board or the PCB intermediate product is aligned (fig. 13). After pressing according to step f) of the method according to the invention, a printed circuit board intermediate product 201 (FIG. 14) is obtained, which in turn can be contacted as shown in FIG.
    FIG. 15 shows a variant of the present invention in which a component 6 with contacts 7 has been embedded on two opposite sides, thereby enabling a vertical flow of current from one side to the other side of the printed circuit board 200.
    16, according to a preferred embodiment of the present invention, the components 6 of IMS components 6 'are formed, wherein the insulator layer of the IMS component 6' is denoted by 12 and the conductive layer by 13. The IMS component 6 'can be contacted in a conventional manner, whereby it is also possible to make contact via microvia 11 (FIG. 18).
    Particularly useful is the use of IMS devices to dissipate heat, in the case of heat shown in FIG. 19, introduced by LED packages 14 into the intermediate PCB 200. FIG. 19 shows heat sinks 15 which additionally dissipate the heat dissipated via the IMS components 6 '.
    权利要求:
    Claims (15)
    [1]
    Claims 1. A method of embedding a component in a printed circuit board or printed circuit board intermediate product, wherein the printed circuit board intermediate has at least one insulating layer of a prepreg material and fixes the component by the resin of the prepreg material characterized by the following steps: a) providing a composite (100) of the layers of the printed circuit board or of the intermediate printed circuit board product (200), this composite containing at least one curable prepreg material, b) producing a clear position (4) in FIG c) covering at least the region of the release (4) with a first temporary carrier layer (5) in the form of an adhesive tape on a first side of the composite, d) positioning the component to be embedded (6) in the release (4) by means of the adhesive tape, e) covering at least the area of the release (4) f) pressing the composite (100) with the component (6) while curing the curable prepreg material, g) removing the temporary carrier layers (5, 9) ,
    [2]
    2. The method according to claim 1, characterized in that the composite (100) of the layers of the printed circuit board or of the intermediate printed circuit board product (200) consists of a plurality of layers of a prepreg material (1).
    [3]
    3. The method according to claim 1 or 2, characterized in that the composite (100) of the layers of the printed circuit board or the printed circuit board intermediate product (200) of a plurality of layers of a prepreg material (1) and on both sides of outer copper layers (2 ) consists.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that the composite (100) of the layers of the printed circuit board or the printed circuit board intermediate product (200) from a plurality of layers of prepreg material (1) and a centrally located core (3) exists.
    [5]
    5. The method according to any one of claims 1 to 4, characterized in that the composite (100) consists of a plurality of layers of prepreg material (1) and a centrally located core (3) and on both sides of outer copper layers (2).
    [6]
    6. The method according to any one of claims 1 to 5, characterized in that the composite (100) of the layers of the printed circuit board or the printed circuit board intermediate product (200) consists of an inner layer of a prepreg material and on both sides outer cores (3) ,
    [7]
    7. The method according to any one of claims 1 to 6, characterized in that the composite (100) of the layers of the printed circuit board or the printed circuit board intermediate product (200) has substantially the thickness of the component to be embedded (6).
    [8]
    8. The method according to any one of claims 1 to 7, characterized in that in the circuit board or the printed circuit board intermediate product (200) a plurality of components (6) is embedded.
    [9]
    9. The method according to claim 8, characterized in that components (6) of different thickness in the respective exemptions (4) are fitted and the second temporary carrier layer (9) with a non-adhesive surface to the composite (100) of the layers of the circuit board or of the printed circuit board intermediate (200).
    [10]
    10. The method according to any one of claims 1 to 9, characterized in that the first side of the composite (100) is a contact side of the printed circuit board or the printed circuit board intermediate product (200) and the component to be embedded (6) face-up to this contact side in the release (4) is attached.
    [11]
    11. The method according to any one of claims 1 to 10, characterized in that both the first side and the second side of the composite (100) is a contact side of the printed circuit board or the printed circuit board intermediate product (200).
    [12]
    12. The method according to claim 11, characterized in that a component (6) with contacts (7) on two opposite sides of the component (6) is embedded.
    [13]
    13. The method according to any one of claims 1 to 12, characterized in that the component (6) is selected from the group consisting of an integrated circuit, an LED and a heat sink.
    [14]
    14. The method according to any one of claims 1 to 13, characterized in that the component (6) is an IMS component (6 ').
    [15]
    15. Printed circuit board or printed circuit board intermediate produced by the method according to one of claims 1 to 14.
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    同族专利:
    公开号 | 公开日
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    US20200323081A1|2020-10-08|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50821/2013A|AT515101B1|2013-12-12|2013-12-12|Method for embedding a component in a printed circuit board|ATA50821/2013A| AT515101B1|2013-12-12|2013-12-12|Method for embedding a component in a printed circuit board|
    CN201480075486.3A| CN106063387B|2013-12-12|2014-12-12|Method for embedding a component in a printed circuit board|
    EP20214312.9A| EP3829273A1|2013-12-12|2014-12-12|Circuit board with embedded component|
    EP14825088.9A| EP3081056B1|2013-12-12|2014-12-12|Method for embedding a component in a printed circuit board|
    PCT/AT2014/050300| WO2015085342A1|2013-12-12|2014-12-12|Method for embedding a component in a printed circuit board|
    US15/103,826| US10779413B2|2013-12-12|2014-12-12|Method of embedding a component in a printed circuit board|
    US16/908,500| US20200323081A1|2013-12-12|2020-06-22|Method for Embedding a Component in a Printed Circuit Board|
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