• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Method for the positionally stable extension of at least one component contact surface (11) of an electronic component (1) with at least one corresponding carrier plate contact surface (12) of a carrier plate (2), comprising the following steps: a) mounting at least two glue points (3a, 3b, 8a, 8b, 9a, 9b) on the carrier plate (2), the position of each glue point (3a, 3b, 8a, 8b, 9a, 9b) being predetermined, b ) Bestücken the carrier plate (2) with the at least one electronic component (1), wherein the position of the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) in step a) is predetermined such that the at least an electronic component (1), the at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) substantially in one of the at least one side surface (5a, 5b, 5c, 5d) and the lower surface. 6 contacted edge portion formed and contacted the at least one Bauteilkontaktflächen (11) with the at least one support plate contact surface (12) at least t c) Waiting for a curing process of the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) for a predetermined period of time t, d) heating the leather material (13) to produce an electrical, mechanical and / or thermal connection between the at least one component contact surface (11) and the at least one carrier plate contact surface (12).
    公开号:AT515071A1
    申请号:T50541/2013
    申请日:2013-09-03
    公开日:2015-05-15
    发明作者:Dietmar Kieslinger；Peter Wurm
    申请人:Zkw Elektronik Gmbh；
    IPC主号:
    专利说明:

    Method for positionally stable soldering
    The invention relates to a method for the positionally stable soldering of at least one component contact surface of an electronic component having at least one corresponding carrier plate contact surface of a carrier plate, the at least one electronic component having a bottom and top surface and at least one side surface connecting the bottom surface to the top surface bottom surface is formed and the support plate contact surface has at least partially soldering material.
    The invention further relates to a carrier plate having at least one electronic component with at least one component contact surface, the carrier plate having at least one corresponding carrier plate contact surface, wherein the at least one electronic component has a lower and upper surface and at least one side surface connecting the lower surface with the upper surface, wherein the component contact surface is formed on the lower surface and the at least one support plate contact surface at least partially has soldering material.
    The attachment of electronic components to carrier plates, for example to printed circuit boards, is a very frequently required process in the production of electrical circuits. In this case, printed circuit boards generally have conductor tracks which connect individual or several terminal contacts to one another, wherein individual electronic components are connected to the electrical connection contacts. The connection may have several aspects, such as electrical, mechanical and / or thermal connection.
    From the prior art, various methods have become known by means of which a connection of an electronic component to a carrier plate can be realized. For example, contact surfaces of individual electronic components can be soldered to contact surfaces arranged on the carrier plates.
    At this point, reference is made to the SMT (Surface Mount Technology) method, in which the electrical connections or contact surfaces of the electronic component and the corresponding contact surfaces of the carrier plate are respectively at the surface thereof and the electronic components are fastened only to the surface of the carrier plate must be and can be dispensed with the provision of through-holes. The contact surfaces of the carrier plate are in this case first coated with a solder, usually a solder paste. Subsequently, the loading of the carrier plate with individual electronic components takes place.
    To produce a permanent electrical and / or thermal and / or mechanical connection of the electronic components to the carrier plate, for example, the reflow soldering method has become known, in which the solder paste and the contact surfaces are heated after the assembly with the electronic components in such a way that the solder paste melts and connects to the contact surfaces of the carrier plate and the respective electronic component.
    Typical electronic components weigh only a few milligrams. Due to the high density of the molten solder (solder paste), the electronic components float on the molten solder. Due to the surface tension of the liquid solder and possibly existing flux remnants can act minimal forces, which can cause shifting, twisting or blurring of individual electronic components in a frequently stable, but usually difficult to predict position.
    This shifting, twisting or blurring ("swim in") generally poses no problem for the electrical connection. Rather, this effect is even exploited in order to correct slightly misplaced electronic components. For applications in which the exact compliance with a desired position of these electronic components in relation to the support plate is important, this Einschwimmvorgang can cause unacceptable deviations from the respective target position.
    One method, by means of which the position of individual electronic components can be determined before the soldering process, is to clamp the components mechanically, for example, by means of screwed and / or clamped connections. However, the provision of such screw and / or clamp connections requires the presence of mechanical attack points on the support plates and the electronic components, thereby minimizing the miniaturization of the electronic components and / or the density of the components
    Support plate limits are set. Even conventional pre-adhesive methods, in which the adhesive is applied to the underside of the electronic components and can thus be glued to the electronic components with a carrier plate, presuppose the presence of free adhesive surfaces on the underside of the electronic component. This is often not the case, especially when the underside of the electronic components is formed substantially entirely of contact surfaces.
    It is therefore an object of the invention to provide a method for positionally stable soldering of the type mentioned, which is simple to implement, a space-saving arrangement of the electronic components allows and still a permanently stable electrical, mechanical and / or thermal connection of the electronic components with a Trä ¬gerplatte enabled.
    This object is achieved by a method of the aforementioned type which erfin¬dungsgemäß the following steps: a) attaching at least two adhesive dots on the support plate, wherein the position of each adhesive point is specified, b) loading the printed circuit board / support plate with the at least one electronic Component, wherein the position of the adhesive dots in step a) is predetermined such that the at least one electronic component contacts the at least two adhesive points substantially in an edge area formed by the at least one side surface and the lower surface and the at least one component contact surface with the at least one support plate contact surface at least partially overlapping, c) waiting for a hardening process of the adhesive dots for a predefinable period of time t, d) heating the solder material for producing an electrical, mechanical and / or thermal connection between the at least one component contact surface and at least one support plate contact surface.
    Thanks to the method according to the invention, it is possible to position a single or a plurality of electronic components in a positionally stable manner on a carrier plate, typically a printed circuit board, and to prevent slippage or blurring of individual electronic components during the soldering operation, while at the same time allowing a dense arrangement of the electronic components. In addition, the method according to the invention is simple and inexpensive to carry out and enables a permanently stable electrical, mechanical and / or thermal connection of the electronic components to the carrier plate. This method can be applied to known soldering methods such as reflow soldering or wave soldering. The term electronic components is understood to mean any electrical elements, for example resistors, coils, capacitors, transistors, sensors or diodes, in particular electronic components which have to assume an exact position on a carrier plate (for example LEDs in optical modules). Such components and carrier plates are used, for example, in vehicles (as "vehicle electronics"), in particular in vehicle headlights ("headlight electronics"). Especially in the case of headlight modules, the exact positioning and contacting of the light sources (which are increasingly formed as light-emitting diodes or semiconductor laser diodes in SMD design) has become increasingly important. The component contact area can match in shape and size with that of the carrier plate contact surface. Also, the component contact surface may overlap with (ie cover over) the support panel contact surface up to 20, 30.40, 50, 60, 70, 80, 90%, or completely.
    In an advantageous embodiment of the method according to the invention, the adhesive points are arranged such that an imaginary connecting straight line between the adhesive points forms a straight line through the center of the lower surface of the at least one electronic component. This allows a particularly simple and at the same time stable fixation of the at least one electronic component.
    In addition, it may be provided in a favorable development of the method according to the invention that the adhesive dots are arranged such that in each case a gluing point is arranged at a corner of the at least one electronic component. For example, two adhesive dots may be disposed on opposite corners of the electronic component. Under the term "corner of the electronic component " is meant a region where the course of an edge of the electronic component formed between the side surface and the lower surface changes so that a corner is formed. Alternatively, the electronic components may also have a abgerun¬dete, in particular a circular lower surface. For example, surface mounted devices (SMDs) having a circular bottom surface are known wherein the adhesive dots are attached to the edge formed between the bottom surface and the side surface of these electronic components.
    A particularly stable connection of the electronic component to the carrier plate can be realized by providing a corresponding glue point to each corner of the electronic component. The electronic component preferably has a quadrangular design, whereby in this case a total of four adhesive dots can be attached to corners of the electronic component.
    According to a further development of the method according to the invention, provision may be made for three adhesive dots whose imaginary connecting straight lines form an equilateral triangle, the center of gravity of this equilateral triangle coinciding with the center of the lower surface. The stability of the adhesive bond of the electronic component to the carrier plate can thereby be increased efficiently and inexpensively.
    In a particularly favorable embodiment of the method according to the invention, it can be provided that the at least two adhesive dots consist of a thermosetting adhesive material, the temperature required for heat curing being below the melting temperature of the soldering material. This ensures the production of a position-stable connection of the at least one electronic component with the carrier plate even before the melting of the solder material, whereby a shifting, twisting or swirling of the at least one electronic component can be reliably prevented. Alternatively, any other adhesive methods and adhesives may be used. It is important that the adhesive bonds are sufficiently cured prior to initiating the melting process of the brazing material.
    In a further development of the method it can be provided that the adhesive dots are arranged in positions which are subjected to heat curing in step c) and are exposed to substantially the same thermal conditions. Under the expression "substantially the same thermal conditions". For the purposes of this application, a maximum permissible temperature difference of 5 ° C between the individual gluing points during the thermosetting process is understood.
    According to a further advantageous embodiment of the method according to the invention, the volume of the adhesive dots can be predetermined in step a). The volume of the adhesive points can be influenced in a simple manner by a specific metering of the amount of adhesive applied per adhesive point. The method can thus be easily adapted to the requirements and dimensions of individual electronic components.
    In a first variant of the method according to the invention, provision may be made for a solder mask applied to the (printed circuit board surface) to cover a marginal area of the at least one substrate contact surface and for adhesive dots to be applied to the solder mask in step a). The adhesion and the height of the adhesive dots can thus be influenced in a targeted manner.
    In an alternative second variant of the method according to the invention, provision can be made for a solder resist applied to the printed circuit board surface to terminate in front of an edge region of the at least one support panel contact surface and adhesive dots in this edge region are applied to the solder mask in step a) Adhesive dots can thus be specifically influenced.
    The information on the adhesive points, unless otherwise stated, always refers to a single electronic component. If a plurality of electronic components are fixed in accordance with the method according to the invention, then the adhesive dots are attached to the respective electronic component in the manner described above.
    In order to enable a forward and return conduction of an electrical connection of the at least one electronic component to the carrier plate, it is provided in a favorable variant of the inventive method that the at least one electronic component at least two or three component contact surfaces and at least two or three korres Has ¬pondierende carrier plate contact surfaces. The at least two component contact surfaces are electrically insulated from one another (apart from the electrical connection required by the contact surfaces for the component function) and the two corresponding carrier plate contact surfaces are electrically insulated from one another. A circuit can therefore be provided via respectively corresponding contact surfaces (the carrier plate and the at least one an electronic component) via the at least one electronic component. A third contact surface (component and carrier contact surface) may for example be provided to allow a heat transfer from the electronic component to the support plate. The support plate could for this purpose be equipped with a cooling body or else be designed as a heat sink.
    In a particularly favorable embodiment of the method according to the invention, it can be provided that the at least one electronic component is an LED. The Abstrahl¬ direction and position of the LED can thus be set very precisely.
    A particularly space-saving arrangement of the at least one electronic component can be achieved by the at least one electronic component being an SMD component, in particular an SMD component without protruding connection pins or component contact surfaces ("flat nolead" component).
    Another aspect of the invention relates to a support plate of the type mentioned, wherein the support plate has at least two adhesive dots, wherein the position of each Klebepunktes is vorgebbar, wherein the support plate is equipped with the at least one electronic component, wherein the position of the adhesive points is predetermined such in that the at least one electronic component contacts the at least two adhesive spots substantially in an edge region formed by the at least one side surface and the lower surface and partially overlaps the at least one component contact surface with the at least one support plate contact surface, the adhesive points being arranged from an uncured to the electronic one Component to receive state in a cured, the electronic component mechanically stabilizing state, wherein the at least one component contact surface by heating the solder material with the at least one Trägerpl attenkontaktkontaktfläche electrically, mechanically and / or thermally connectable.
    The invention, together with further embodiments and advantages, is explained in more detail below with reference to an exemplary, non-limiting embodiment, which is illustrated in the figures. This shows
    1 is a plan view of an adhered to a carrier plate electronic component,
    2 shows a detail of a sectional representation of a first variant of an adhesive connection of the electronic component with the carrier plate according to the section line AA of FIG. 1, FIG.
    3 shows a detail of a sectional representation of a second variant of an adhesive bond of the electronic component with the carrier plate according to the section line AA of FIG. 1, FIG.
    Fig. 4 is a schematic representation of a temperature profile and
    5 shows an exemplary representation of a probability distribution function of a radial position error of an electronic component fastened using the method according to the invention.
    1 shows an electronic component 1 in a plan view, which is fastened to a cutout of a carrier plate 2 by means of two adhesive points 3a, 3b (the adhesive dots 3a and 3b were previously applied to the carrier plate 2 and the carrier plate 2 was connected to the electronic The adhesive dots 3a and 3b could theoretically also be applied to the carrier plate after being fitted with the electronic component 1, but there is a risk that the electronic component 1 will be displaced into position by application of the adhesive and resulting forces). The electronic component 1 has a substantially rectangular shape and is constituted by an upper surface 4, four side surfaces 5a, 5b, 5c and 5d and a lower surface 6 (see Figs. 2 and 3) facing the upper surface 4 between the two four Seiten¬ surfaces 5a to 5d extends limited. The electronic component 1 has a coupling surface 7 on the upper surface 4. The electronic component 1 can be, for example, a sensor or an LED, wherein the coupling surface 7 can be, for example, a sensor surface for recording external signals (light, temperature, etc.) or a light emission surface, for example a LED. The adhesive dots 3a and 3b are arranged such that an imaginary connecting line (which coincides with the section line AA in the example shown) between the adhesive dots divides the electronic component 1 into two equal halves and thus the connecting line intersects an imaginary center of the lower surface 6.
    In addition, in Fig. 1 alternative variants of adhesive dot arrangements angedeu¬tet. Thus, two adhesive spots 8a and 8b could be provided, which substantially correspond to a 90 ° rotation of the adhesive dots 3a and 3b, respectively. Alternatively, adhesive dots 9a and 9b could be provided which are arranged at corners 10a or 10b of the electronic component 1, whereby an imaginary connecting line intersects the center of the lower surface 6 which these imaginary corners 10a and 10bden respectively. In a further variant, each corner 10a, 10b, 10c, 10d could also have a glue dot. In addition, it could also be provided that the adhesive dots in the form of an equilateral triangle are arranged around the electronic component 1, with the center of gravity of this equilateral triangle preferably coinciding with the imaginary center of the lower surface 6.
    As already mentioned at the beginning, the term "corner of the electronic component 1 " a region understood at which the course of an edge formed between a Seitenflä¬che and the lower surface 6 of the electronic component changes such that a corner is formed. The corner 10a is therefore formed substantially by the common intersection of the side surfaces 5a and 5d with the bottom surface 6. As such, the corner 10b is formed substantially by the common intersection of the side surfaces 5a and 5b with the bottom surface 6 (the corners 10c and 10d may analogously be defined via the side surfaces 5b and 5c, 5c and 5d and the lower surface 6, respectively).
    FIG. 2 shows a section of a sectional view of a first variant of an adhesive bond of the electronic component 1 with the carrier plate 2 according to the section line AA of FIG. 1. The electronic component 1 has therein arranged on the lower surface 6Builderkontaktfläche 11, which kontak¬tiert a layer of soldering material 13 an underlying befindli¬che, arranged on the surface of the support plate 2 support plate contact surface 12. Under the expression "lower surface 6 " is understood that surface of the component 1 which faces the carrier plate 2. The upper surface 4 of the component 1 is accordingly averted from the carrier plate 2. The component contact surface 11 and the Trägerplattenkon¬taktfläche 12 need not be continuous but can consist of several individual contact surfaces for producing mehrer several separate contacts. Typically, two or three component contact surfaces as well as corresponding carrier plate contact surfaces may be provided. The surface of the carrier plate 2 further comprises, in sections, a coating with a solder resist 14 (not shown in FIG. 1), which extends as far as an edge region 15 of the carrier plate contact surface 12 and covers it. The adhesive point 3b (analogous to the opposite adhesive point 3a) is located on the Lötstopplack 14 within this Randbe¬reichs 15, wherein an edge formed by the side surface 5a and the lower surface 6 Kantenbe¬reich immersed in the adhesive point 3b and thus with this contacting is connected.
    In Fig. 3 is a detail of a sectional view of a second variant of a Klebever¬ bond of the electronic component 1 with the support plate 2 according to the section line AA derFig. 1, analogous to FIG. 2, unless otherwise stated, the same reference numerals describe the same features as in FIG. The variant of the invention shown in FIG. 3 differs from FIG. 2 in that the solder resist 14 already ends in front of the edge region 15 of the carrier plate contact surface 12 and the adhesion point 3b (and analogous further adhesive dots) ends directly in this edge region substantially on the carrier plate contact surface 12 is attached.
    For the purposes of this application, edge region 15 is understood to be that region of support plate contact surface 12 which is not covered by soldering material 13 and lies in the immediate vicinity of electronic component 1, typically at a maximum distance of 0.07 mm, 0.1 mm, 0, 2mm or 0.5mm.
    Referring now to FIG. 4, there is shown a schematic representation of a temperature profile to which the electronic component 1 is typically exposed before, during, and after a reflow soldering operation. The electronic component 1 is first heated and reaches a preheating zone (by way of example for a period of 150 seconds at temperatures of up to about 160 ° C.) in which, for example, thermosetting adhesive dots can harden and the soldering material 13 does not yet melt. After a defined period of time, the temperature is rapidly increased (e.g., within about 50 seconds to a temperature of about 250 ° C, which is considered to be about 50 seconds) to quickly melt the brazing material 13 and the two contact surfaces 11 and 12 permanently connect. After a defined period of time has elapsed (for example about 100 seconds, which requires rapid heating and maintaining the temperature of about 250 ° C.), the temperature can then be lowered again. The electronic component 1 is then electrically, mechanically and / or thermally connected to the carrier plate 2.
    5 shows an example representation of a probability distribution function of a radial position error of an electronic component 1 fixed by the method according to the invention. The arithmetic mean of this radial position error is on the order of more than 150 gm in conventional soldering methods. The frequency distribution of the radial position error (deviation in mm ) shows a clear maximum in the range between 25 and 50 μm, the maximum position error being 90 μm.
    For the sake of completeness, it should be pointed out that the carrier plate 2 can of course have a large number of electronic components 1 which, thanks to the invention, can be arranged on one side particularly close to one another and also positionally stable. Moreover, the technical structure of the method according to the invention described can be as well as the support plate 2 according to the invention with the at least one component 1 are changed in any way obvious to the person skilled in the way.
    权利要求:
    Claims (14)
    [1]
    Claims 1. A method for positionally stable soldering at least one component contact surface (11) of an electronic component (1) with at least one corresponding carrier plate contact surface (12) of a carrier plate (2), wherein the at least one electronic component (1) has a lower and upper surface (6 and 4) and at least one side surface (5a, 5b, 5c, 5d) connecting the lower surface with the upper surface (6 and 4), wherein the at least one component contact surface (11) is formed on the lower surface (6) and the at least one carrier plate contact surface (12) at least partially soldering material (13), characterized by the following steps: a) attaching at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) on the Trägerplat te (2), wherein the position of each glue point (3a, 3b, 8a, 8b, 9a, 9b) is given, b) loading the carrier plate (2) with the at least one electronic component (1), the position of the glue dots (3a, 3b, 8a, 8b . 9a, 9b) in step a) is predetermined in such a way that the at least one electronic component (1) projects the at least two adhesive points (3a, 3b, 8a, 8b, 9a, 9b) substantially in one through the at least one side surface (5a, 5b, 5c, 5d) and the lower surface 6 contacted edges and the at least one component contact surface (11) with the at least one support plate contact surface (12) at least partially overlapped, c) waiting for a hardening process of the adhesive dots (3a, 3b, 8a, 8b 9a, 9b) for a predeterminable time period t, d) heating the solder material (13) to establish an electrical, mechanical and / or thermal connection between the at least one component contact surface (11) and the at least one support plate contact surface (12).
    [2]
    2. The method according to claim 1, characterized in that the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) are arranged such that an imaginary connecting line between the gluing points (3a, 3b, 8a, 8b, 9a, 9b) a Just by the center of the lower surface (6) of the at least one electronic component (1) forms.
    [3]
    3. The method according to claim 1 or 2, characterized in that the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) are arranged such that in each case an adhesive point (3a, 3b, 8a, 8b, 9a, 9b) to a corner (10a, 10b, 10c, lod) of the at least one electronic component (1) is arranged.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that at each corner (10a, 10b, 10c, lOd) of the electronic component (1) has a corresponding adhesive point (3a, 3b, 8a, 8b, 9a, 9b) is provided.
    [5]
    5. The method according to claim 1 or 2, characterized in that three adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) are provided, the imaginary connecting straight lines form an equilateral triangle, wherein the center of gravity of this equilateral triangle with the center of the lower surface ( 6) coincides.
    [6]
    6. The method according to any one of claims 1 to 5, characterized in that the zumin¬dest two adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) consist of a thermosetting adhesive material, wherein the temperature required for the heat curing below the Schmelz¬ temperature of the solder material (13) is located.
    [7]
    7. The method according to any one of claims 1 to 6, characterized in that the adhesive points (3a, 3b, 8a, 8b, 9a, 9b) are arranged in positions which are exposed in step c) a Wärmehär¬tung and thereby are exposed to substantially the same thermal conditions.
    [8]
    8. The method according to any one of claims 1 to 7, characterized in that in step a) the volume of the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) is vorgebbar.
    [9]
    9. The method according to any one of claims 1 to 8, characterized in that a on the carrier plate upper surface applied solder mask (14) covers an edge region (15) zumin¬dest a carrier plate contact surface (12) and in step a) adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) in this edge region (15) on the Lötstopplack (14) are mounted.
    [10]
    A method according to any one of claims 1 to 8, characterized in that a solder resist (14) applied to the backing plate surface terminates in front of an edge region (15) of at least one backing plate contact surface (12) and in step a) adhesive dots (3a, 3b, 8a, 8b , 9a, 9b) are mounted in this edge region (15) on the solder resist (14).
    [11]
    11. The method according to any one of claims 1 to 10, characterized in that the at least one electronic component (1) has at least two or three component contact surfaces and at least two or three corresponding carrier plate contact surfaces.
    [12]
    12. The method according to any one of claims 1 to 11, characterized in that the zu¬mindest one electronic component (1) is an LED.
    [13]
    13. The method according to any one of claims 1 to 12, characterized in that the zu¬mindest one electronic component (1) is an SMD component.
    [14]
    A carrier plate (2) having at least one electronic component (1) with at least one component contact surface (11), the carrier plate (2) having at least one corresponding carrier plate contact surface (12), the at least one electronic component (1) having a lower and upper surface (6 and 4) and at least one of the lower surface (5a, 5b, 5c, 5d) connecting with the upper surface (6 and 4), wherein the at least one component contact surface (11) is formed on the lower surface (6) and at least a carrier plate contact surface (12) at least partially soldering material (13), characterized in that the carrier plate (2) at least two adhesive dots (3a, 3b, 8a, 8b, 9a, 9b), wherein the position of each adhesive point (3a, 3b, 8a , 8b, 9a, 9b) can be predetermined, wherein the support plate (2) with the at least one electronic component (1) is equipped, wherein the position of the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) can be predetermined , d the at least one electronic component (1) has the at least two adhesive spots (3a, 3b, 8a, 8b, 9a, 9b) substantially in one formed by the at least one side surface (5a, 5b, 5c, 5d) and the lower surface (6) Contacted edge region and the at least one Bauteilkon¬taktfläche (11) with the at least one support plate contact surface (12) partially overlapping, wherein the adhesive dots (3a, 3b, 8a, 8b, 9a, 9b) are adapted from an unbent, the electronic component (1) receiving state in a cured, the electronic component (1) mechanically stabilizing state, the zu¬mindest¬ at least one component contact surface (11) by heating the solder material (13) with zumin¬dest a support plate contact surface (12) electrically , is mechanically and / or thermally bondable.
    类似技术:
    公开号 | 公开日 | 专利标题
    AT515071B1|2019-03-15|Method for positionally stable soldering
    DE102005040058B4|2019-02-21|Power semiconductor module and method for producing the same
    EP1155602B1|2003-08-06|Electrical connection method and connection site
    EP3085211B1|2020-06-10|Electronic control module and method for producing an electronic control module
    DE102006048230A1|2008-04-17|Light-emitting diode system, method for producing such and backlighting device
    DE102011085170A1|2013-04-25|Control module for automatic transmission control of e.g. passenger car, has electronic package, circuit board and support plate mechanically connected with each other, where rigid portion of circuit board is glued with support plate
    DE102009000427A1|2010-07-29|Method for producing a sensor module
    DE102008031432B4|2011-07-28|lamp
    DE102008012256A1|2008-09-25|Electronic component mounting board
    DE102012020838A1|2014-04-24|circuit board
    DE3827473A1|1989-03-30|CIRCUIT BOARD TO EQUIP WITH SMD BLOCKS
    DE102007020475A1|2008-11-06|Method for producing a printed circuit board with a cavity for the integration of components and printed circuit board and application
    WO2014122021A1|2014-08-14|Laser component and method for the production thereof
    DE102009016762B4|2016-10-06|Method and component set for producing electronic assemblies using a potting compound
    DE102005043279A1|2007-03-15|Circuit board for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface for a connecting pin of a wired component
    DE102011088285B4|2020-02-13|ELECTRONIC DEVICE
    DE102005036563B4|2007-12-27|Electronic component
    DE112014004034T5|2016-08-04|System for attaching devices to elastic substrates
    DE102009054236A1|2011-05-26|Electronic component manufacturing method for automobile, involves electrically connecting electronic parts to conductor track structure by connecting medium, and processing connecting medium at temperature of less than preset value
    EP2953436B1|2020-07-22|Method for manufacturing an electronic connecting element
    EP3905861A1|2021-11-03|Barrier preventing the floating of smt components
    DE102019132852B4|2021-12-30|Method for producing a conductor structure element and conductor structure element
    DE102013220302A1|2015-04-09|Optoelectronic component
    WO2016094915A1|2016-06-23|Method for void reduction in solder joints
    EP3503694A1|2019-06-26|Method for producing a heat-conducting connection between a power component and a metallic layer of a circuit carrier
    同族专利:
    公开号 | 公开日
    JP6898908B2|2021-07-07|
    JP2016530723A|2016-09-29|
    AT515071B1|2019-03-15|
    JP2019071427A|2019-05-09|
    CN105594309A|2016-05-18|
    EP3042553A1|2016-07-13|
    US20160205785A1|2016-07-14|
    CN105594309B|2018-12-04|
    WO2015031928A1|2015-03-12|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US4314870A|1979-02-19|1982-02-09|Matsushita Electric Industrial Co., Ltd.|Method of mounting electronic components|
    JPH0196286A|1987-10-08|1989-04-14|Toyota Motor Corp|Liquid crystal composition|
    US5169056A|1992-02-21|1992-12-08|Eastman Kodak Company|Connecting of semiconductor chips to circuit substrates|
    JPH09207689A|1996-02-06|1997-08-12|Shin Caterpillar Mitsubishi Ltd|Vehicular exterior cover|
    JP2005026502A|2003-07-03|2005-01-27|Matsushita Electric Ind Co Ltd|Adhesive for electronic part and method for mounting electronic part|
    US20070035021A1|2005-08-10|2007-02-15|Daigo Suzuki|Printed circuit board and electronic apparatus including printed circuit board|
    US20090134529A1|2007-11-28|2009-05-28|Kabushiki Kaisha Toshiba|Circuit board module, electric device, and method for producing circuit board module|
    US20110220958A1|2008-11-26|2011-09-15|Ccs Inc.|Illumination device and method for manufacturing the same|
    US20120052633A1|2009-05-19|2012-03-01|Panasonic Corporation|Electronic component mounting method and electronic component mount structure|EP3905861A1|2020-04-30|2021-11-03|ZKW Group GmbH|Barrier preventing the floating of smt components|JPS59207689A|1983-05-11|1984-11-24|Hitachi Ltd|Method of soldering both-sides of printed board|
    JPS6179293A|1984-09-26|1986-04-22|Matsushita Electric Ind Co Ltd|Method of mounting electronic part|
    JPS63124772U|1987-02-03|1988-08-15|
    JPS63127171U|1987-02-10|1988-08-19|
    JPS6469092A|1987-09-10|1989-03-15|Matsushita Electronics Corp|Surface mount type electronic parts|
    JPH01209792A|1988-02-18|1989-08-23|Fujitsu Ltd|Heating block structure used for simultaneously soldering optical component and electric component|
    JPH01236636A|1988-03-17|1989-09-21|Sanyo Electric Co Ltd|Mounting process of electronic component|
    JPH04196286A|1990-11-27|1992-07-16|Murata Mfg Co Ltd|Coating method for chip component temporarily adhering adhesive|
    JPH057075A|1991-06-27|1993-01-14|Hitachi Cable Ltd|Electronic part packaging method|
    JPH08186357A|1994-12-28|1996-07-16|Sony Corp|Printed wiring board and manufacture thereof|
    JP3191149B2|1996-05-31|2001-07-23|ローム株式会社|Method of mounting terminals on circuit board, and circuit board|
    US6225573B1|1996-05-31|2001-05-01|Rohm Co., Ltd.|Method for mounting terminal on circuit board and circuit board|
    US5936846A|1997-01-16|1999-08-10|Ford Global Technologies|Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips|
    US6214650B1|2000-02-01|2001-04-10|Lockheed Martin Corporation|Method and apparatus for sealing a ball grid array package and circuit card interconnection|
    JP2002334906A|2001-05-09|2002-11-22|Matsushita Electric Ind Co Ltd|Method for mounting flip chip|
    JP2008300538A|2007-05-30|2008-12-11|Toshiba Corp|Printed circuit board, manufacturing method of printed circuit board, and electronic equipment|
    JP4560113B2|2008-09-30|2010-10-13|株式会社東芝|Printed circuit board and electronic device provided with printed circuit board|
    US8397380B2|2009-06-01|2013-03-19|Taiwan Semiconductor Manufacturing Company, Ltd.|Controlling warpage in BGA components in a re-flow process|
    TWM375225U|2009-08-26|2010-03-01|Chunghwa Picture Tubes Ltd|Light bar structure, back-light module and liquid crystal display thereof|
    JP2012054394A|2010-09-01|2012-03-15|Hitachi Ltd|Soldering device and soldering method|
    JP2012059814A|2010-09-07|2012-03-22|Nec Corp|Electronic component device and method of manufacturing the same|
    EP2490513A2|2011-02-20|2012-08-22|Essence Solar Solutions Ltd.|Light and heat resistant circuit board apparatus and method|
    JP2013004656A|2011-06-15|2013-01-07|Sumitomo Electric Printed Circuit Inc|Printed wiring board, electronic component mounting structure, and method of manufacturing electronic component mounting structure|
    US9622356B2|2013-03-14|2017-04-11|Lockheed Martin Corporation|Electronic package mounting|US10823355B2|2016-01-27|2020-11-03|Lite-On ElectronicsLimited|Light-emitting module for vehicle lamp|
    US10627568B2|2016-12-13|2020-04-21|Minebea Mitsumi Inc.|Planar illumination device and method of manufacturing planar illumination device|
    JP6619373B2|2016-12-13|2019-12-11|ミネベアミツミ株式会社|Planar illumination device and method of manufacturing planar illumination device|
    JP6829109B2|2017-03-01|2021-02-10|日本電波工業株式会社|Crystal device|
    CN108987550A|2017-06-02|2018-12-11|光宝电子有限公司|Luminescence component with viscose and the light emitting device using it|
    JP2020021905A|2018-08-03|2020-02-06|Ｊｏｈｎａｎ株式会社|Electronic component mounting method and three-dimensional molding circuit component|
    CN109473412B|2018-10-13|2020-09-18|长春希达电子技术有限公司|Flip LED light emitting chip die bonding structure and die bonding method thereof|
    CN111148370A|2018-11-05|2020-05-12|光宝电子有限公司|Semiconductor light emitting device and method for manufacturing the same|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50541/2013A|AT515071B1|2013-09-03|2013-09-03|Method for positionally stable soldering|ATA50541/2013A| AT515071B1|2013-09-03|2013-09-03|Method for positionally stable soldering|
    EP14777490.5A| EP3042553A1|2013-09-03|2014-09-03|Method for positionally stable soldering|
    JP2016535267A| JP2016530723A|2013-09-03|2014-09-03|Position-stable soldering method|
    US14/911,895| US20160205785A1|2013-09-03|2014-09-03|Method for positionally stable soldering|
    PCT/AT2014/050194| WO2015031928A1|2013-09-03|2014-09-03|Method for positionally stable soldering|
    CN201480048628.7A| CN105594309B|2013-09-03|2014-09-03|The method of the welding stable for position|
    JP2018224372A| JP6898908B2|2013-09-03|2018-11-30|Position-stable soldering method|
    [返回顶部]