Flip-chip contacting device and method

专利摘要:
Disclosed is a flip-chip contacting apparatus including: a pickup unit for picking up a semiconductor chip from a wafer cut into individual semiconductor chips, a bonding head including a bonding equipement device for picking up the semiconductor chip from the pickup unit and fixing the picked-up semiconductor chip on a board, and a disk imaging device; which has a predetermined distance from one side of the contacting insertion device to check a position of the disc on which the semiconductor chip is mounted, a dipping unit for receiving a flux into which bumps provided on a lower surface of the semiconductor chip accommodated by the contacting insertion device are immersed , an upwardly facing imaging device for testing the underside of the pick-and-place device incorporated in the flux of the immersion unit Semiconductor chips, a flux imaging device having a predetermined distance from the other side of the contact placement device to check a state of the flux received in the immersion unit, dipped a drive unit for moving the contacting head and the flux imager to an arbitrary position in an xy plane , and a contact table on which the disk is located, the disk imaging device inspecting the immersion unit to check a state of the flux before the semiconductor chip is immersed while the bonding-type mounting device receives the semiconductor chip from the recording unit, and the flux-imager checks the immersion unit to detect a state Condition of the flux to check after the semiconductor chip was immersed, while the upward-facing imaging device received by the Kontaktierungsbestückungsvorrichtung and in da s flux immersed semiconductor chip checks.
公开号:AT514134A2
申请号:T50223/2014
申请日:2014-03-27
公开日:2014-10-15
发明作者:
申请人:Hanmi Semiconductor Co Ltd；
IPC主号:

专利说明:

1
Cross reference to related application
This application claims the benefit of Korean Patent Application No. 2013-0033522 filed on Mar. 28, 2013 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.
Background 1st area
Embodiments of the present invention relate to a flip-chip contacting device and a method for checking a state of a flux both before and after dipping a flip-chip in the flux. 2. Description of the Related Art
In general, a process of attaching a semiconductor chip to a circuit board is performed very accurately. The plate has a plurality of mounting surfaces to which semiconductor chips are attached. A semiconductor chip is electrically connected to a corresponding mounting surface of the circuit board. It may be necessary to fix the semiconductor chip in a correct position (pattern) on the mounting surface to reduce an error rate.
The aforementioned semiconductor chip attaching operation may be referred to as a contacting operation. The overall position of the circuit board and the position of the semiconductor chip mounting surface of the circuit board are checked, and then the semiconductor chip is mounted on the circuit board in consideration of the peculiarities of the accuracy requiring operation. 2/72 2
A flip-chip contacting device is a device which separates an individual semiconductor chip (flip-chip) from a wafer, the underside (on which bumps are formed) of the flip-chip immersed in a flux received in an immersion plate, while the flip-chip Chip is picked up by a Kontaktierungsbestückungsvorrichtung, and contacted the flip-chip on a plate.
The bonding insertion device contacts (fixes) the flip chip on the board by a process of receiving the flip chip, a process of immersing the bottom of the flip chip in the flux, and a process of checking a state in which the flip Chip is covered with the flux, or position information about the flip-chip.
In each operation, a contacting head to which the contacting insertion device is attached may be moved to a predetermined position of the flip-chip contacting device to receive, dip, or fix the flip-chip. The contacting head may be moved to a predetermined position in an x-y plane by gantry-type moving devices installed in an overlapping manner in an x-axis direction and a y-axis direction. The contacting head can be accelerated or decelerated during the movement at high speed. When the acceleration or deceleration is repeated, vibrations and heat are generated from parts that form lines of movement. The accuracy of the movement can be reduced due to such vibrations and the thermal expansion of the parts due to the heat generated.
In particular, the accuracy of position information about the semiconductor chip and position information about the mounting surface of the circuit board due to thermal expansion and vibration can be reduced, thereby increasing an error rate and reducing the reliability and accuracy of the contacting operation. Consequently, it may be important to reduce the number of moving operations and the moving distance of the contacting head in the x-axis direction and the y-axis direction. In addition, the arrangement of parts may be important to the 3/72 3
Reduce the number of movement processes and the movement distance of the Kontaktierungskopfs in a particular axis direction.
Efforts to cover the bottom of the flip chip with flux have been done continuously to improve productivity and accuracy. The quality of the flip-chip covering flux is determined based on the amount and viscosity of the flux received in the dip plate. A process of testing the dip plate may be included as one of such efforts. However, compromise may be required in conjunction with overall productivity.
Korean Patent Application Laid-Open Publication No. 10-2000-0035067 discloses a flip-chip contacting device which turns over a semiconductor chip and then directly contacts the semiconductor chip to a disk.
Summary
It is an aspect of the present invention to provide a flip-chip bonding apparatus and method that improves the accuracy and units per hour (UPH) of the apparatus. To this end, there are provided a flip-chip bonding apparatus and method which reduce the number of moving operations and the moving distance of a bonding head in a specific axis direction, thereby reducing thermal expansion and vibration due to the movement of the bonding head.
It is another aspect of the present invention to provide a flip-chip contacting apparatus and method that inspects a dipping unit configured to receive a flux to be coated on a flip-chip before and after dipping a flip-chip, respectively into the immersion unit without lowering the UPH of the apparatus.
It is another aspect of the present invention to provide a flip-chip bonding apparatus and method that inspects a dipping unit before and after dipping a flip chip to increase the accuracy of flux application and production quality improve and determine if the amount of flux received in a dip plate is sufficient.
It is another aspect of the present invention to provide a flip-chip bonding apparatus and method that improves the accuracy of the flux inspection.
It is another aspect of the present invention to provide a flip-chip bonding method that detects clear pressure marks of a flux and to adjust a height relationship between a flux image and a bonding mounter or between the flux image, the bonding mounter and a plate image to form images both before and after immersion in an immersion plate during a process.
Additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
According to an aspect of the present invention, a flip-chip contacting apparatus includes: a pickup unit for picking up a semiconductor chip from a wafer cut into individual semiconductor chips, a bonding head including a bonding board device for picking up the semiconductor chip from the pickup unit, and fixing the picked up one Semiconductor chips on a disc and a disc image forming apparatus having a predetermined distance from one side of the contacting insertion apparatus to check a position of the disc on which the semiconductor chip is mounted, a dipping unit for receiving a flux into which an underside of the pad Submerged bumps provided by the bonding insertion device are immersed, an upward-looking imaging device for checking the underside of the bumping device received by the contacting placement device and inserted therein s flux of the immersion unit immersed semiconductor chips, a flux-measuring device having a predetermined distance from the other side of the contacting insertion device to check a state of the flux received in the immersion unit, a drive unit for moving the contacting head and the flux imager to any position in an xy plane, and a contacting table on which the disc is located, the disc imaging device inspecting the immersion unit to check a condition of the flux before the semiconductor chip is immersed while the contacting The pickup unit picks up the semiconductor chip from the pickup unit, and the flux imager checks the plunging unit to check a state of the flux after the semiconductor chip is immersed while the upward-facing imaging device detects the semiconductor chip which has been picked up by the contacting equipment and immersed in the flux.
The pickup unit, the immersion unit, and the upwardly facing imaging device may be positioned coaxially parallel to a y-axis and arranged in a line parallel to a moving direction of the flux imager, the contacting-populating device, and the disc imaging device.
The distance and the direction between the contacting-mounting apparatus and the disk-imaging apparatus correspond to the distance and the direction between the pick-up unit and the immersion unit, and the distance and the direction between the contacting-equipment and the flux-imager correspond to the distance and the direction between the upwardly facing imaging device and the immersion unit.
According to another aspect of the present invention, a flip-chip contacting apparatus includes: a pickup unit for picking up a semiconductor chip from a wafer cut into individual semiconductor chips, a bonding head including a bonding board device for picking up the semiconductor chip from the pickup unit, and fixing the chip and a plate imager having a predetermined distance from one side of the bonding insertion device to check a position of the board on which the semiconductor chip is mounted, a dipping unit for receiving a flux, immersed in the bump provided on a lower surface of the semiconductor chip accommodated by the bonding-loading apparatus, an up-facing imaging device for inspecting the underside of the bonding-charging device a flux-imaging device having a predetermined distance from the other side of the contacting-insertion device to check a state of the flux received in the immersion unit, a drive unit for moving the contacting head and the immersed in the flux of the immersion unit Flux imaging device to an arbitrary position in an xy plane, and a contacting table on which the plate is located, wherein the flux imaging device checks the immersion unit to check a state of the flux before the semiconductor chip is immersed while the contacting Picking device picks up the semiconductor chip from the pickup unit, and the flux imager checks the plunging unit to check a state of the flux after the semiconductor chip is immersed, while the upward-facing image is turned on orrichtung examines the recorded by the contacting-insertion device and immersed in the flux semiconductor chip.
The immersion unit, the receiving unit, and the up-facing imaging device may be coaxially positioned in parallel with a y-axis and arranged in a line parallel to a moving direction of the flux-imaging device, the contacting-mounting device, and the disc-imaging device.
The flux imaging device may include a plurality of imaging mirrors arranged on an axis parallel to a direction of movement of the contacting head, and the imaging mirrors may form a first side imaging mirror for reflecting an image of the immersion unit before the semiconductor chip is immersed, a second side imaging mirror for Reflecting an image of the immersion unit after the semiconductor chip has been immersed and including a central imaging mirror for reflecting the images reflected from the first side imaging mirror and the second side imaging mirror to the flux imaging device.
The length of an optical path of the image of the immersion unit via the first-side imaging mirror and the middle imaging mirror is equal to the length of an optical path of the image of the immersion unit over the second-side imaging mirror and the middle imaging mirror.
The middle imaging mirror may have an axially rotatable aperture structure to reflect the image reflected from the first side imaging mirror or the second image reflected image mirror.
The flux imaging device may include a plurality of imaging mirrors disposed on an axis parallel to a direction of travel of the bonding head, and the imaging mirrors may include a first-side imaging mirror to reflect an image of the immersion unit before the semiconductor chip is dipped, a first central imaging mirror in order to reflect the image reflected from the first side imaging mirror to the flux imager, a second side imaging mirror to reflect an image of the immersion unit after the semiconductor chip has been immersed, and a second central imaging mirror to detect the image from the imaging mirror the second side reflected image to reflect the flux-imaging device included.
The image of the dip unit that is reflected from the second side imaging mirror and the second center imaging mirror after the semiconductor chip has been dipped may be transmitted through the first central imaging mirror located above the second central imaging mirror and to the flux imaging device be transmitted. 8/72 8
The first median imaging mirror may include a semitransparent mirror or a half mirror to reflect the image reflected from the first side imaging mirror to the flux imaging device and the image reflected from the second side imaging mirror and the second medial imaging mirror to the flux imaging device transferred to.
The length of an optical path of the image of the immersion unit over the first side imaging mirror and the first central imaging mirror is equal to the length of an optical path of the image of the immersion unit over the second side imaging mirror, the second medial imaging mirror, and the first medial imaging mirror.
The distance and the direction between the contacting insertion device and the first side imaging mirror correspond to the distance and the direction between the receiving unit and the immersion unit, and the distance and direction between the contacting placement device and the second side imaging mirror correspond to the distance and the direction between the up-facing imaging device and the immersion unit.
The drive unit may include a first drive unit for moving the contacting head in a y-axis direction and a second drive unit for moving the contacting head in an x-axis direction, and the flux-imaging device may be provided on the contacting head such that the flux-imaging device together with the Contacting head is moved.
The immersion unit may include a dip plate for receiving the flux into which the semiconductor chip is dipped, and a flux tank for supplying the flux to the dip plate, the flux tank having a pressure unit formed on a dip plate contacting part and the dip plate and the fluxant tank can smooth the flux while the flux is supplied by sliding relative movement therebetween. 9/72 9
The dip plate can slide under the flux tank.
The immersion unit may further include a lighting unit to receive light on one side of the immersion plate, and the lighting unit may be opened in a moving direction of the contacting head to avoid mutual interference with the contacting head.
The lighting unit may include a light, a lamp, a light source or a mirror, and the lighting unit may be provided to the dipping unit or the printing unit to reflect an image of the flux or an image of the printing unit.
According to another aspect of the present invention, a flip-chip bonding method includes: receiving a semiconductor chip from a wafer cut into individual semiconductor chips by a pickup unit, picking up the semiconductor chip from the pickup unit by a bonding insertion device that is along an x-axis and a y Axis is movable, testing, by a flux-imaging device, which has a predetermined distance from the Kontaktierungsbestückungsvorrichtung, a state of a recorded in a dipping unit flux, immersion of a bottom of the semiconductor chip received by the Kontaktierungsbestückungsvorrichtung in the dipping unit, the flux state thereof has been checked, checking a state of the flux received in the immersion unit after immersing the semiconductor chip by the flux-imager, checking an image of the underside of the immersion unit immersed semiconductor chips by an up-facing imaging device located in a path of travel of the bonding insertion device to perform upward detection, and contacting the tested semiconductor chip on a board, wherein testing by the flux-imaging device and pick-up by a bonding insertion device simultaneously and the testing by the flux imaging device after the semiconductor chip has been immersed and the testing by the upward-looking imaging device are performed simultaneously. 10/72 10
According to another aspect of the present invention, a flip-chip bonding method using the flip-chip bonding apparatus having the above-described configuration includes: testing the immersion unit by the plate imaging device or the flux-imaging device to check a state of the flux before the flip-chip contacting device Semiconductor chip is immersed while the semiconductor chip is picked up by the contacting insertion device of the receiving unit, and testing the immersion unit by the flux-imaging device to check a state of the flux after the semiconductor chip was immersed, while through the upward-looking imaging device of the Contacting assembly device is recorded and immersed in the flux semiconductor chip is tested.
Brief description of the drawings
These and / or other aspects of the invention will become more apparent and readily apparent from the following description of the embodiments, taken in conjunction with the accompanying drawings, of which: FIG. Fig. 1 is a plan view showing a flip-chip contacting device according to an embodiment of the present invention; FIG. Fig. 2 is a plan view showing a main part of the flip-chip bonding apparatus according to the embodiment of the present invention; FIG. 3 is a detailed view illustrating part A in FIG. 2 shows; FIG. 4 is a conceptual view illustrating a process of dipping a flip chip; FIG. FIG. 5 is a side view showing a process in which an over-snap receptacle turns a flip-chip to a bonding pad. FIG
Placing device in the flip-chip contacting device according to the embodiment of the present invention transferred; FIG. Fig. 6 is a side view showing a process in which an upward-looking imaging device inspects the flip-chip in the flip-chip contacting device according to the embodiment of the present invention; FIG. Fig. 7 is a side view showing a process in which an over-snap receiving apparatus transfers a flip-chip to a bonding-loading apparatus in a flip-chip contacting apparatus according to another embodiment of the present invention; FIG. Fig. 8 is a side view showing a process in which an upward-looking imaging device inspects the flip-chip in the flip-chip contacting device according to the embodiment of the present invention; FIG. 9 is a side view showing a process in which an over-snap receiving apparatus transfers a flip-chip to a bonding-loading apparatus in a flip-chip contacting apparatus according to another embodiment of the present invention; FIG. Fig. 10 is a side view showing a process in which an upward-looking imaging device inspects the flip-chip in the flip-chip contacting device according to the embodiment of the present invention; FIG. Fig. 11 is a perspective view showing an immersion unit according to an embodiment of the present invention; FIG. Fig. 12 is a side view showing the immersion unit according to the embodiment of the present invention; FIG. Fig. 13 is a side view showing an immersion unit according to another embodiment of the present invention; FIG. Fig. 14 is a side view showing an immersion unit according to another embodiment of the present invention; 12/72 12 FIG. 15 is a plan view of FIG. 13 is; FIG. Fig. 16 is a plan view showing an immersion unit according to another embodiment of the present invention; FIG. Fig. 17 is a flow chart showing a flip-chip bonding method according to an embodiment of the present invention; FIG. Fig. 18 is a flowchart showing a flip-chip bonding method according to another embodiment of the present invention; and FIG. 19 is a flowchart showing a flip-chip bonding method according to another embodiment of the present invention.
Detailed description
There will now be described in detail preferred embodiments of the present invention with reference to the attached drawings. The preferred embodiments, which are described below and shown in the accompanying drawings, are merely illustrative and are not intended to depict all aspects of the invention, so it should be understood that various equivalents and modifications can be made without departing from the spirit of the invention , In the drawings, elements which are not related to the embodiments of the present invention are omitted from the description for the sake of clarity, and the size of the components may be exaggerated for ease of understanding.
A flip-chip bonding process is a process of sucking each semiconductor chip (flip-chip) 10 from a wafer cut into individual semiconductor chips using a saw machine, and fixing the flip chip 10 at a mounting position (mounting region) of a disk 710, on which the flip-chip 10 is arranged. 13/72 13
In general, the flip-chip bonding process may include: sucking a semiconductor chip (flip-chip) 10 cut from a wafer W by a snap-over receptacle 210; rotating the snap-over receptacle 210 180 degrees such that the Flip-chip 10 is reversed, transferring the flip-chip 10 received by the snap-over receptacle 210 to a bonding pad 520, moving the bonding pad 520, and immersing the flip chip 10 in flux such that bumps 11 (see FIG 4) formed on the underside of the flip-chip 10 with which flux is covered, checking a receiving position of the flux-covered flip-chip 10, and moving the contacting-populating apparatus 520 to a contacting table 720 and fixing the flip Chips 10 at a reference contacting position of the plate 710 located on the contacting table 720.
Hereinafter, a flip-chip contacting device 1 and a contacting operation will be described with reference to FIGS. 1 to 3 described. FIG. 1 is a plan view showing a flip-chip contacting device 1 according to an embodiment of the present invention, FIG. 2 is a plan view showing a main part of the flip-chip contacting device 1 according to the embodiment of the present invention, and FIG. 3 is a detailed view showing part A in FIG. 2 shows.
The flip-chip contacting device 1 may include: a wafer feeding unit 100 for feeding a wafer W cut into individual flip chips 10, a pickup unit 200 for picking up a flip chip 10 by suction, a contacting unit 500 for receiving the flip chip 10 from the receiving unit 200 and for mounting the received flip chip 10 on a plate 710, drive units 610 and 620 to drive the contacting unit 500, a dipping unit 300 with flux into which the flip chip 10 is immersed so that the underside of the Flip-chip 10 is covered with the flux, and a test unit 400 for testing the flip-chip 10 before the flip-chip 10 is mounted on the plate 710. 14/72 14
The wafer feeding unit 100 has a structure for supporting the wafer W by a wafer loading device 110 in a state where the surface of the wafer W is exposed. The wafer feeding unit 100 may deliver the wafer W to a position where the picking unit 200 is located by an additional transfer device (not shown). In addition, the wafer feed unit 100 may support a plurality of wafers W in a stacked state. The wafers W may be successively supplied to the position where the take-up unit 200 is located.
The pickup unit 200 may include a rollover pickup 210 for sucking a flip chip 10 from the wafer W, and a pickup drive unit 220 for driving the rollover pickup 210. The rollover pickup 210 may pick up each flip chip 10 from the wafer W and may be vertically rotated 180 degrees so that the flip chip 10 is reversed. The wafer feeding unit 100 may feed the wafer W so that bumps 11 (see FIG. 4) formed on the bottom surface of the flip chip 10 are directed upward. When the flip chip 10 is reversed by the flashover apparatus 210, the bottom surface of the flip chip 10 on which bumps 11 are formed may be downwardly directed. However, when the wafer W is fed by the wafer feeding unit 100 in a state in which the bumps 11 are directed downwards, it may be unnecessary to rotate the rollover taking-up device 210 by 180 degrees vertically. The direction of rotation and the angle of the rollover pickup 210 can be changed in various ways.
A suction operation of the rollover pickup 210 will be described in detail. Individual flip chips 10 may be separated from the wafer W by an ejector (not shown) located underneath the wafer W. The rollover pickup 210 may pick up a flip-chip 10 by suction. Alternatively, the rollover pickup 210 can pick up the flip chip 10 by a sticking or gripping operation.
The contacting unit 500 may include a contacting head 510 movable in an xy plane in any direction by the first driving unit 15/72 15 610 and the second driving unit 620, a contacting insertion device 520 located at the contacting head 510 Flux imager 530 and a plate imager 540 included.
The contacting-populating apparatus 520 may receive the flip-chip 10 from the flashover apparatus 210, move together with the movement of the contacting head 510 while maintaining a picking state, dip the flip-chip 10 into the immersion unit 300, and the flip-chip contact the plate 710 located on the contacting table 720. The flip-chip 10 can be picked up by suction. Alternatively, the flip-chip 10 may be received by an adhesive or gripping operation.
The contacting insertion device 520 may be configured to have a structure that is movable in an x-axis direction and a y-axis direction, movable up and down in an x-axis direction during a suction, a dipping, or a contacting operation and is rotatable about the z-axis in a Θ-direction. As a result, the contacting insertion device 520 may be configured to be movable to any position in an x-y-z space of the flip-chip contacting device 1. The flux imaging device 530 and the plate imaging device 540, which may be disposed with the contacting head 510, will be described below.
According to FIG. 4, the contacting-populating apparatus 520 may include a suction head 521 for directing a vacuum suction force to the flip-chip 10 to receive the flip-chip 10. The suction head 521 may be configured to rotate the sucked flip chip 10 clockwise and / or counterclockwise about an axis of rotation. As a result, the suction head 521 can correct the position of the flip chip 10 under the control of a controller Θ. The control by the control device will be described below. 16/72 16
The drive unit may drive the contacting head 510 using a gantry system. The gantry system may include a drive unit for moving the contacting head in an x-axis direction and a drive unit for moving the contacting head in a y-axis direction such that the contacting head can be moved to any position in an x-y plane. The drive unit may include a first drive unit 610 and a second drive unit 620. The first drive unit 610 may be connected to the contacting head 510 to move the contacting head 510 in the y-axis direction. The second drive unit 620 may move the first drive unit 610 in the x-axis direction and thus move the contacting head 510 in the x-axis direction. For this purpose, connection parts 611 connected to opposite ends of the first drive unit 610 may be configured to move on the second drive unit 620.
In FIG. 1, the contacting head 510 is shown connected to the first drive unit 610. Alternatively, the contacting head 510 may be connected to the second drive unit 620. In this case, connection parts (not shown) may be located at opposite ends of the second drive unit 620 such that the second drive unit 620 may move on the first drive unit 610.
The operation of the contacting head 510 based on the drive unit will be described in detail. The contacting head 510 connected to the first drive unit 610, the contacting equipment 520, the flux imaging apparatus 530, and the disk imaging apparatus 540 will be described by way of example. The contacting head 510 may move in the x-axis direction in accordance with the movement of a second transfer unit 611 onto the pickup unit 200 (specifically, the rollover pickup 210). If necessary, the first drive unit 610 may move the contacting head 510 in the y-axis direction. The contacting device 520 may move to the immersion unit 300 (specifically, an immersion plate 310) and the inspection unit 400 (specifically, an upward-looking imaging device 410). 17/72 17
In a case where the immersion unit 300, the receiving unit 200, and the inspection unit 400 are arranged coaxially in the y-axis direction, as shown in FIG. 1, the contacting head 510 may perform a semiconductor chip picking-up operation, a flux dipping operation, and a testing operation using the up-facing imaging device 410 without moving in the x-axis direction. As the movement of the contacting head 510 decreases, heat and vibration decrease, with the result that a positional error of the contacting head 510 decreases. In addition, the process time is shortened, thereby improving the productivity (units per hour (UPH)). After the position of the semiconductor chip has been checked by the test unit 400, the contacting head 510 moves to the contacting table 720 and fixes the semiconductor chip on the plate 710.
The contacting device 520 provided on the contacting head 510 may move from the receiving unit 200, the process of immersing the flip chip 10 in the flux, and the process of contacting the flip chip 10 to the plate 710 during the picking operation move in the z-axis direction. In addition, the contacting-populating apparatus 520 may move in the Θ-direction to correct a very small error. Furthermore, the contacting head 510 may move itself in the z-axis direction.
The process of immersing the flip chip 10 will be described with reference to FIGS. 3 and 4 described. The immersion unit 300 may include a dip plate 310 for receiving a flux, a flux tank 320 for supplying the flux to the dip plate 310, and a dipping unit driving device for driving the dip plate 310 or the flux tank 320. The flip-chip 10 received by the contact placement device 520 is immersed in the flux received in the dip plate 310 so as to be covered with the flux on the underside of the flip chip 10. The immersion unit 300 will be described in detail below. 18/72 18 FIG. 4 is a conceptual view illustrating a process of immersing the flip-chip 10. The dip plate 310 has a flux receiving unit 311 for receiving the flux. The flux is a viscous material that covers the bumps 11 on the underside of the flip chip 10. If the bumps 11 are excessively covered with the flux to such an extent that adjacent bumps are connected to each other via the flux, an electrical fault may occur in the semiconductor chip. On the other hand, if the bumps 11 are insufficiently covered with the flux, poor contact may occur when the flip chip 10 is mounted on the plate 710. For this reason, the flux may be required to exhibit an appropriate viscosity and properly cover the flip-chip 10.
Since the flux is a viscous material, pressure marks 11a corresponding to the shapes of the bumps 11 can be transmitted to the flux even after the dipping operation is completed. It may be necessary to remove the pressure marks 11a before a subsequent dipping operation takes place. Although the print marks 11a disappear over time, a process of smoothing the surface of the flux may be performed to increase the process speed.
According to the FIGN. 1 and 2, the test unit 400 may include an upward-looking imaging device 410 for collecting positional information about the flip-chip 10 picked up by the contacting-populating device 520 and a correction unit 420. The upward-looking imaging device 410 may determine whether the center of a suction surface of the contacting equipment 520 is aligned with the center of the flip-chip 10, information regarding a deviating distance or angle based on the determination that the center of the suction surface of the contacting equipment 520 is not is aligned with the center of the flip chip 10, and the arrangement of the bumps 11 formed on the underside of the flip chip 10 and a state in which the bumps 11 are covered with the flux, check. Such an inspection may be performed by detection using a camera. In addition, the up-facing imaging device 410 may be located halfway along a motion path of the contacting placement device 520 to perform an upward viewing detection. This is because information such as positional information can be easily detected when the bottom surface of the flip chip 10 picked up by the bonding board 520 is detected.
In addition, the up-facing imaging device 410 may determine a distortion amount of the flip-chip 10 and a displacement amount of the flip chip 10 in a certain direction based on initially input position information about the flip chip 10 only by detecting a point of the bottom side of the flip chip 10 determine. However, if two or more points are detected, a more accurate image can be obtained, thereby improving the accuracy of the information. In a case where the entire flip chip 10 is within a field of view (FOV) of the up-facing imaging device 410, two points may be detected by a detection process, and positions of the detected points may be checked from the image. On the other hand, in a case where the entire flip chip 10 is not within the field of view of the up-facing imager 410, two points may be detected by two detection operations.
Upward imaging device 410 may be of the flying type. The up-looking flying-type imaging device can detect a moving object. When the up-facing flying-type imaging device is used, it may be unnecessary to stop the apparatus, thereby improving productivity. In addition, a positional error of the flip chip 10, which may occur during the stopping and re-moving of the contactor mounting device 520, may be reduced, and heat may also be reduced. The flying type may be applied to the flux imager 530 and the disk imager 540 in addition to the up-facing imager 410.
Next, the flux-imager 530 and the plate imager 540 included in the contacting unit 500 will be described. The flux imaging device 530 examines the immersion unit 300. The test can be done by sensing. The flux imaging device 530 may examine the dip plate 310 to determine if a proper amount of flux is prepared, the flux is smoothed, the flux contains foreign matter, and the viscosity of the flux is within a predetermined range. The flux imaging device 530 may detect the image of the dip plate after the flip chip 10 is dipped by the contact placement device 520 or before the flip chip 10 is dipped. In addition, the flux imaging device 530 may detect the image of the dip plate after the flip chip 10 has been dipped and before the flip chip 10 is dipped to improve the accuracy of the flux state check.
Furthermore, the flux imaging device 530 may check the fluxant tank 320 to determine whether a proper amount of flux is stored in the flux tank 320 and the flux contains foreign matter. Instead of detecting both the dip plate 310 and the flux tank 320 by a flux imaging device 530, a plurality of flux mapping devices 530 may be provided to detect both the dip plate 310 and the flux medium tank 320.
The plate imaging device 540 may be provided to test the plate 710 to which the flip chip 10 immersed in the flux in the dip unit 300 is contacted. Such a test can be performed by detecting using a camera. The plate imaging device 540 may check the orientation of the plate 710 on the contacting table 720 to reflect a positional error of the plate 710 during a contacting operation. In addition, a lens surface of the plate image forming apparatus 540 may be disposed higher than the suction surface of the suction head 521 of the contacting equipment 520 to avoid the occurrence of spatial obstruction between the contacting equipment 520 and the disk image forming apparatus 540 when the contacting equipment 520 holds the flip board. Pick up chip 10 or dip the flip chip 10 in the flux. 21/72 21
The disc image device 540 may collect position information together with the up-facing imaging device 510 such that the flip-chip 10 is mounted in a correct contacting position of the disc 710. As described above, the upward-looking imaging device 410 detects the underside of the flip-chip 10 to detect an image used to determine a positional error of the flip chip 10 to be contacted. In addition, the plate imager 540 may detect the plate 710 located on the contacting table 720 to obtain an image to be used to determine a contacting position of the plate 710 to which the flip chip 10 is contacted. Further, the disc image forming device 540 may collect information as to whether the disc 710 is in a predetermined position of the contacting table 720 without distortion or collecting information regarding a positional error.
In the same manner as the upward-looking imaging device 410, the plate imaging device 540 may detect two or more points of the contacting position of the plate 710 to accurately determine the contacting position of the plate 710 located on the contacting table 720. Further, the disc image forming apparatus 540 may detect the plate 710 on which the contacting has been completed, in addition to the plate 710 on which the contacting is to be performed, to obtain an image used for checking any error during the contacting operation. In this case, the position of the semiconductor chip with respect to the plate 710 can be determined to check each error.
The plate imaging device 540 may detect the wafer W or the flux in addition to the plate 710. For example, the disc image device 540 may obtain position information about each semiconductor chip (or flip chip 10) on the wafer W and position information about a reference pad position of the disc 710 on which each flip chip 10 is mounted on the contacting table 720.
The control device (not shown) of the flip-chip contacting device 1 may include positions of the contacting device 520 or 22/72 22
Contacting table 720 based on position information of a comparison mark obtained by the orientation information supply unit and accurately controlled by the up-side imaging device 410 and the plate imaging device 540. In addition, the controller may rotate the suction head 521 of the contacting-populating apparatus 520 to correct errors of the flip-chip 10 or the plate 710, such as twisting (rotation), distortion and tilt. As described above, the contacting insertion device 520 may be rotatable about the z-axis (rotation axis) 522 in the Θ-direction. The contacting table 720 may also be rotatable in the Θ direction.
In addition, the controller may control the pickup drive unit 220 such that the rollover pickup 210 receives the flip chip 10, and controls the immersion unit 300 so as to maintain the amount and viscosity of the flux.
The flip-chip contacting device 1 according to the embodiment of the present invention may include one or more pairs of pickup device units 200, immersion units 300, contacting units 500, and test units 400 to improve the UPH. In FIG. 1, these components may be provided symmetrically with respect to the y-axis such that two picking devices 200 simultaneously perform operations on a wafer W.
Next, the operation of the contacting unit 500 of the flip-chip contacting device 1 according to the embodiment of the present invention will be described in detail with reference to FIGS. 5 to 10 described. FIG. 5 is a side view showing a process in which the rollover pickup device 210 transmits a flip chip 10 to the bonding pad device 520 in the flip chip bonding device 1 according to the embodiment of the present invention, and FIG. 6 is a side view showing a process in which the upward-looking imaging device 410 inspects the flip-chip 10. 23/72 23
In the lower part of the flip-chip contacting device 1, the immersion unit 300 (in particular, the immersion plate 310), the receiving unit 200 (in particular, the flashover apparatus 210), the inspection unit 400 (in particular, the upward-looking imaging apparatus 410), and the contacting table 720 may be sequentially accessed from be arranged from the left side. In addition, the components may be disposed on the same axis to minimize the x-axis movement of the contacting head 510 or the contacting assembly 520.
In the upper part of the flip-chip contacting device 1, the flux-imaging device 530, the contacting-populating device 520 and the plate-imposing device 540 may be sequentially arranged from the left side. In addition, the components may be connected to the contacting head 510 such that the components may move integrally and be disposed on the same axis to minimize the x-axis movement of the contacting head 510.
The cradle driving unit 220 for driving the rollover cradle 210 may be disposed below the dip plate 310 such that the cradle drive unit 220 and the dip plate 310 do not interfere with each other when the dip plate 310 is reciprocated in the x-axis direction , This arrangement can reduce the size of the flip-chip contacting device 1. The cradle drive unit 220 is located below the dip plate 310 in consideration of the rotation of the rollover cradle 210. The rollover cradle 210 receives a semiconductor chip (or flip chip 10) from the wafer W, reverses the flip chip 10, and conveys the flip-chip 10 to the bonding-loading device 520. The flashover-receiving device 210 can rotate 180 degrees in the x-axis direction to turn the flip-chip 10 over. As a result, the position of the cradle driving unit 220 is set so as to avoid mutual interference. 24/72 24
As shown in FIG. 5-5, at the same time that the contacting assembly 520 picks up the flip chip 10 from the rollover pickup 210, the flux imager 530 may capture the image of the dip plate 310 to determine if the amount of flux is sufficient to cover the flip-chip 10 with the flux, and the flux has a proper viscosity and flatness, thereby preventing a defectiveness of the flip-chip 10 due to a poor coverage of the flip-chip with the flux. In addition, the image of the dip plate may be detected before the flip chip is dipped in the flux to determine if the flux in the dip plate contains foreign matter or bubbles. If the flip-chip is immersed in the flux and it contains bubbles, it may happen that the bumps of the flip-chip are not uniformly covered with the flux, resulting in a contact failure in a subsequent contacting operation can.
In addition, as shown in FIG. 6, at the same time that the upward-looking imaging device 410 inspects the underside of the flip-chip 10, the flux imager 530 detects the image of the immersion plate 310 to check a state of the flux after the flip-chip 10 in FIG the flux was immersed. This is because the flux state can be determined more accurately based on a comparison between the times before and after the dip of the flip chip into the flux, rather than a determination only before the dip of the flip chip into the flux.
According to FIG. 4, the pressure marks 11a of the bumps 11 may be transferred to the flux after the flip-chip 10 has been immersed in the flux. The amount or viscosity of the flux can be determined based on an image showing the shapes of the print marks 11a. In addition, it may be determined whether the bonding board 520 is inclined or the flip chip 10 picked up by the bonding board 520 is inclined, and whether the flip chip is normally covered with the flux based on the transfer state of the printing marks 11a , That is, when the print marks 11a are formed uniformly for all the bumps 11, it can be determined that the flip chip 10 is not inclined.
The process in which the contacting-populating apparatus 520 picks up the flip-chip 10 from the rollover-receiving apparatus 210 and the process in which the flux-imposing apparatus 530 detects the image of the immersion plate 310 can be performed simultaneously. However, an operation may begin and end during another operation, or an overlap time may occur between operations. The same may be applied to the process in which the upward-looking imaging device 410 inspects the underside of the flip-chip 10, and the process in which the flux-imager 530 detects the immersion plate 310.
Images of the dip plate 310 before and after dipping the flip chip 10 in the flux can be obtained. However, if time is required to obtain the image of the dip plate 310 during the process, the equipment speed and the productivity may be impaired. Therefore, in a flip-chip bonding method according to an embodiment of the present invention, an image before immersion can be obtained at the same time the flip-chip is received by the capture unit 200, and an image after immersion can be obtained at the same time to which the up-facing imager 410 checks the bottom of the chip after dipping. Consequently, the equipment speed is not lowered.
Since the dip plate 310, rollover receiver 210, and up-facing imager 410 are sequentially arranged, the flux imager 530 may examine the dip plate 310 while the bonding head 510 receives the flip chip and the flux provided on one side of the bonding head 510 Imaging device 530 may detect the image of immersion plate 310 while contacting head 510 and flux imaging device 530 move in the y-axis direction toward up-facing imaging device 410 after the flip-chip has been immersed in the flux. However, such a movement can complicate the apparatus and provide blurred images. Thus, the flux imager 530 may include at least two imaging mirrors to vividly capture the image of the flux in the immersion plate 310 while the contacting head 510 is receiving the flip-chip or while the up-facing imager 410 is testing the flux-covered flip-chip 10 ,
As in the figures. 5 and 6, the imaging mirrors may include a first side imaging mirror 531 and a second side imaging mirror 533 coaxially arranged in the y-axis direction. The first side imaging mirror 531 may transmit an image of the surface of the flux prior to immersion via a redirect, and the second side imaging mirror 533 may transmit an image of the surface of the flux after submersion via a redirect. In addition, the first-side imaging mirror 531 transmits the image of the surface of the flux before immersion to a first central imaging mirror 532, and the image reflected by the first central imaging mirror 532 is transmitted to the center of the flux-imaging device 530. In the same manner, the second side imaging mirror 533 transmits the image of the surface of the flux after immersion to a second central imaging mirror 534, and the image reflected by the second central imaging mirror 534 is transmitted to the center of the flux imaging device 530. When the length of an optical path through the first-side imaging mirror 531 and the first intermediate imaging mirror 532 is equal to the length of one optical path through the second-side imaging mirror 533 and the second middle imaging mirror 534, the vividness of the image can be improved.
According to FIG. 6, the light reflected from the second central imaging mirror 534 passes through the first central imaging mirror 532. Thus, a half mirror or a half mirror may be used as the first middle imaging mirror 532. That is, when a semitransparent mirror that reflects a portion of the incident light and transmits a portion of the incident light, or a half-mirror having half reflectance and transmittance is used, the image transmitted through the first-side imaging mirror 531 may pass through the first median imaging mirror 532 may be reflected and transmitted to the center of the flux imaging device 530, and additionally, the image transmitted through the second median imaging mirror 534 may be transmitted by the first medial imaging mirror 532 and transmitted to the center of the flux imaging device 530.
In this embodiment, only the imaging mirror 531 or 533 of a page may be used. In this case, however, the distance from the image to the lens before immersion may be different from the distance from the image to the lens after immersion. As a result, one of the images may not be focused and therefore not vivid. This is because the focal point is changed depending on the distance from the image to the lens. FIG. 7 is a side view showing a process in which a rollover pickup device 210 displays a flip chip 10 to a bonding pad device 520 in a flip chip bonding device 2 according to another embodiment of the present invention, and FIG. 8 is a side view showing a process in which an upward-looking imaging device 410 inspects the flip-chip 10. Components of the flip-chip contacting device 2 which are identical with those of the flip-chip contacting device 1 are designated by the same reference numerals, and a description thereof will be omitted.
As in the figures. 7 and 8, imaging mirrors according to this embodiment may include a first side imaging mirror 535 and a second side imaging mirror 533 arranged coaxially in a y-axis direction. The first side imaging mirror 535 may transmit an image of the surface of a flux prior to submersion via a redirect, and the second side imaging mirror 533 may transmit an image of the surface of the flux after submersion via a detour. In addition, images of the surface of the flux reflected by the first side imaging mirror 535 and the second side imaging mirror 533 are reflected by a central imaging mirror 536 and transmitted to the center of a flux imaging device 530-1.
The center imaging mirror 536 may have a rotatable aperture structure to reflect the received images in different directions to the center of the flux imaging device 530-1. That is, the center imaging mirror 536 may be disposed in the same direction as the lens direction of the first side imaging mirror 535 when the bonding mounter 520 receives the flip chip 10 from the flashover apparatus 210 to capture the image of the flux before submersion to reflect the flux imaging device 530-1. After transferring the image, the middle imaging mirror 536 may be rotated about an x-axis direction by 90 degrees or 270 degrees clockwise or counterclockwise such that the center imaging mirror 536 is disposed in the same direction as the lens direction of the imaging mirror 533 of the second side when the flip chip 10 is inspected by the upward-looking imaging device 410. The rotation about the x-axis direction may be changed depending on whether the reflection is performed by one surface or both surfaces of the middle imaging mirror 536. That is, in a case where one surface of the middle imaging mirror 536 is used as a reflective surface, the middle imaging mirror 536 may be rotated 270 degrees clockwise or 90 degrees counterclockwise. On the other hand, in a case where both surfaces of the middle imaging mirror 536 are used as reflecting surfaces, the middle imaging mirror 536 may be rotated 90 degrees clockwise or 270 degrees counterclockwise. FIG. 9 is a side view showing a process in which a rollover receptacle 210 shows a flip-chip 10 to a bonding-loading device 520 in a flip-chip bonding device 3 according to another embodiment of the present invention, and FIG. 10 is a side view showing a process in which an upward-looking imaging device 410 inspects the flip-chip 10. Components of the flip-chip contacting device 3 which are identical to those of the flip-chip contacting device 1 are denoted by the same reference numerals, and a description thereof will be omitted.
In the lower part of the in FIG. 5-7, the dip plate 310, the rollover pickup 210, the up-facing imaging device 410, and the contacting table 720 are sequentially arranged from the left side. In the lower part of the in FIG. On the other hand, a rollover pickup device 210-1, a dip plate 310, an upside down imaging device 410, and a contact table 720 are sequentially arranged from the left side.
The sequence of a Kontaktierungskopfes 510 in the upper part of the in FIG. 9 can be identical to that of the contacting head 510 in the upper part of the FIG. 5 may be at different pitches.
As shown in FIG. As shown in FIG. 9, at the same time as the bonding pad device 502 receives the flip chip 10 from the flashover apparatus 210-1, a plate imaging device 540 may detect the dip plate 310 to determine whether the amount of the flux is sufficient in order to cover the image of the flip-chip 10 with the flux, and the flux has a proper viscosity and flatness. For this purpose, the distance and the direction between the center axis of the contacting equipment 520 and the central axis of the disk imaging device 540 may correspond to the distance and the direction between the central axis of the immersion plate 310 and the central axis of the rollover pickup 210-1.
In addition, as shown in FIG. 10, at the same time that the upward-looking imaging device 410 inspects the underside of the flip-chip 10, a flux imaging device 530-2 detects the image of the immersion plate 310 to detect a state of the flux after immersion of the flip-chip 10 to check in the flux. For this purpose, the distance and the direction between the central axis of the contacting 30/72 30
Placement device 520 and the central axis of the flux imaging device 530-2 correspond to the distance and the direction between the central axis of the up-looking imaging device 410 and the central axis of the immersion plate 310.
The flip-chip contacting device 3 of this embodiment can detect the image of the immersion plate 310 before and after the immersion of the flip-chip 10 by changing the arrangement in the lower part of the flip-chip contacting device 3 without using the imaging mirrors of the flip-chip -Contacting devices 1 and 2 according to the preceding embodiments. In addition, the plate imaging apparatus 540 may further detect a plate 710 or a wafer W in addition to the dip plate 310. The effects obtained by detecting the immersion plate before and after immersion of the flip chip 10 are the same as those in the flip-chip contacting device 1 of the previous embodiment, and therefore a description thereof will be omitted.
Next, the immersion unit 300 of the flip-chip contacting device 1 according to the embodiment of the present invention will be described in detail with reference to FIGS. 11 to 16 described. FIG. 11 is a perspective view showing an immersion unit 300 according to an embodiment of the present invention, and FIG. 12 is a side view of the immersion unit 300.
The immersion unit 300 may include a dip plate 310 for receiving a flux into which the flip chip 10 received by the contacting insertion device 520 is dipped, a flux tank 320 for charging or supplying the flux to the dip plate 310, and a dipping unit driving device 330 for driving the immersion plate 310 and the flux tank 320 so that the immersion plate 310 and the Flußmitteltank 320 perform a relative movement to each other.
The dip plate 310 has a flux receiving unit 311 for receiving the flux. The dip plate 310 may slide relative to the flow medium 320 so as to supply a required amount of the flux to the flux receiving unit 311. Relative movement between the dip plate 310 and the flux tank 320 may include sliding the flux tank 320 onto the fixed dip plate 310 or sliding the dip plate 310 below the fixed flux tank 320. Hereinafter, a structure in which the fluxant tank 320 is fixed and the dip plate 310 slides will be described by way of example.
At the same time that the dip plate 310 slides to receive a required amount of flux, the flux tank 320 may push the top of the dip plate 310 to flatten the top of the flux received in the flux accepting unit 311.
The sliding of the dip plate 310 for this purpose may be referred to as smoothing. Another task of smoothing is to adjust the viscosity of the flux to a predetermined range.
When the amount of the flux received in the flux-receiving unit 311 is small, the viscosity of the flux increases, which is closely related to the temperature of the flux. A friction occurs between the dip plate 310 and the flux tank 320 during continuous sliding of the dip plate 310 to increase the temperature of the flux received in the flux-receiving unit 311. As a result, the viscosity of the flux is kept within the predetermined range. However, if the amount of flux received in the dip plate 310 is progressively decreasing and a required amount of the flux is not replenished by the flux tank 320, the area of contact between the surface of the flux in the dip plate 310 and the flux tank 320 decreases. As a result, the frictional heat decreases, and therefore, the temperature of the flux decreases. Consequently, the viscosity of the flux is increased.
If the viscosity of the flux is high, much more time is needed to remove pressure marks than in the case where the viscosity of the flux is low. In addition, it may be difficult to flatten the flux. If the amount of flux is insufficient or the 32/72 32
Surface of the flux is not flat, the case may occur that bumps of the flip-chip are not properly covered with the flux, which may lead to a contact failure. According to the circumstances, the flip-chip 10 may be disconnected from the contacting unit and adhere to the flux due to the high viscosity of the flux.
For this reason, it may be necessary to ensure a proper amount of flux in the dip plate and to periodically check that the viscosity of the flux is maintained within the predetermined range.
When the dip plate 310 slides forward to dip the flip chip 10 into the flux, the bonding pad 520 may enter the upper space of the dip plate 310. Even if the immersion plate 310 slides backward, entry of the contacting equipment 520 into the upper space of the immersion plate 310 is not restricted. Effects obtained by the entrance of the contacting equipment 520 into the upper space of the immersion plate 310 are related to the smoothing.
When the top of the immersion plate 310 is exposed, the contacting-populating apparatus 520 is located above the flux-receiving unit 311 to immerse the flip-chip 10 in the flux. In addition, as described above, the dip plate 310 may slide under the flux tank 320 to smooth the flux. If the dip plate 310 does not slide, but the flux tank 320 slides, the contacting equipment 520 can not enter an immersion area when the flux tank 320 is in the immersion area. If the entrance of the contacting equipment is limited due to the obstruction by the flux tank 320, the UPH of the apparatus may be impaired. On the other hand, the contacting equipment 520 may be required to retreat from the immersion area before the flux tank 320 enters the immersion area for smoothing. That is, the smoothing time may be shortened to avoid mutual interference between the contacting-populating apparatus 520 and the fluxing-medium tank 320. As a consequence, the 33/72 33
Case occur that pressure marks formed on the top of the flux are not completely eliminated or the viscosity of the flux exceeds a reference value.
An opening may be formed on the underside of the flux tank 320 to supply flux to the flux receiving unit 311. In addition, the flux tank 320 may properly push the dip plate 310 to prevent the flux from leaking to locations other than the flux-receiving unit 311 and to smooth the surface of the flux of the flux-receiving unit 311. Hereinafter, the sliding method will be described with reference to FIGS. 11 and 12 described.
The flux tank 320 may include a pressure box 321 for receiving flux and a lower sliding portion 323 and an upper sliding portion 324 for pushing the pressure box 321. The lower slide member 323 may be hinged to a housing 326 to support the fluxant tank 320. A protrusion 322 may be formed on the side of the pressure box, and a groove 323 a corresponding to the protrusion 323 may be formed on the lower sliding part 323. Consequently, the projection 322 can be slid to push the pressure box 321. For a safer pushing, the upper sliding part 324 can push the lower sliding part 323. The upper sliding part 324 may be hinged to the housing 326.
The upper sliding part 324 may be connected to a side sliding part 325. The side slide member 325 may be hinged to the upper slide member 324. The side slide member 325 may have a detection projection 325a corresponding to a detection stage 326a formed on the housing 326 to prevent the upper slide member 324 from being separated from the housing 326.
A first elastic member (eg, a spring) 327a may be disposed between the upper slide member 324 and the lower slide member 323 such that the upper slide member 324 pushes the lower slide member 323 more effectively. The immersion plate 310 can effectively slide due to the first elastic member 327a, although the lower sliding member 323 pushes the immersion plate 310. Similarly, a second elastic member 327b between the upper 34/72 34
Slide part 324 and the side slide member 325 may be arranged. The second elastic member 327b may be disposed higher than a rotation axis of the side slide member 325 to surely achieve coupling between the detection stage 326a and the detection projection 325a.
The flux tank 320 may push the dip plate 310 through the above-described pusher. Next, an example of a structure for allowing sliding of the dip plate 310 will be described.
According to FIG. 12, a screw 331 and a nut 332 provided on the outer periphery of the screw 331 may be provided for sliding the immersion plate 310. The nut 332 is connected to the dip plate 310. By rotation of the screw 331, therefore, the immersion plate 310 can be displaced together with the nut 332. In addition, a ball (not shown) may be provided between the bolt 331 and the nut 332 to reduce a friction generated when the rotation is converted into a rectilinear motion. The screw 331 may be rotatable by the immersion unit driving device. The screw-type sliding device is merely a method of moving the immersion plate 310. The immersion plate 310 may be reciprocated in various ways other than by screw-type sliding.
According to FIG. 12, the flux tank 320 may further include a lighting unit. A light, a lamp, a light source or a mirror may be used as the lighting unit. However, embodiments of the present invention are not limited thereto. In this embodiment, by way of example, a flux center and a flux mirror are provided. However, another lighting unit may be used.
The flux center 340 is located on the side of the flux accepting unit 311 for assisting the disc image forming apparatus to capture a bright and vivid image in the inspection of the flux. The flux center 340 is not fixed to the dip plate 310 to avoid interference between the dip plate 310 and the flux tank 320 during sliding of the dip plate 310. In addition, the flux-light may be opened in the moving direction of the contacting-mounting apparatus (the contacting head) to avoid mutual interference between the flux-light and the contacting-mounting apparatus (the contacting head).
In a in FIG. 15, the receiving unit 200 is provided under the immersion plate 310 such that the contacting insertion device 520 moves forward and backward (see FIGS.3 and 5), and the flux center 340 is provided in the direction perpendicular to the sliding direction of the immersion plate 310 , In a in FIG. 16, the receiving unit 200 is provided above the immersion plate 310. In this case, it does not need to be required that the contacting insertion device 520 move toward the rear portion of the immersion plate 310. Thus, flux center lights are provided on the side and rear of the dip plate 310, but not in the front portion of the dip plate 310. The flux light 340 may be connected to and supported by the flux tank 320 or the take - up drive unit 220, although a detailed one A structure for supporting flux 320 in FIG. 12 is omitted.
When the flux light 340 is above the flux-receiving unit 311, light from the flux is reflected and excessively directed to the lens, with the result that a vivid image of the surface of the flux need not be detected. For this reason, the flux center 340 is located on the side of the flux-receiving unit 311. FIG. 13 is a side view showing an immersion unit 301 according to another embodiment of the present invention, and FIG. 14 is a side view showing an immersion unit 302 according to still another embodiment of the present invention.
According to FIG. 13, the fluxant tank 320 may further include a flux mirror 350 as the lighting unit. The printing box 321 may include a printing unit 321 a formed on a part contacting the immersion plate 310. The printing unit 321a can reduce a contact area to improve flatness. In addition, a rubber-like elastic member may be provided at the end of the pressure unit 321a to prevent escape of the flux. However, the flux taken in the flux tank is introduced into the dip plate, and the flux escaping at that time may collect on the pressure unit 321a and outside the pressure unit 321a to form a flux pool f. The flux accumulation f can be more easily formed as the viscosity of the flux increases. Foreign matter may be mixed with the flux accumulation f. The flux accumulation f may scratch on the top of the flux received in the flux-receiving unit 311 during smoothing. For this reason, it may be necessary to check and remove the flux accumulation f periodically.
The flux mirror 350 may be attached to the printing unit 321a to transmit the image of the printing unit 321a to the lens. That is, the flux imager 530 or the plate imager 540 may include the flux acceptor 311 and even the flux mirror 350 within the FOV. In this case, the flux imager 530 or the plate imager 540 may check a state of the flux and additionally check whether the flux accumulation is formed on the printing unit 321a. Alternatively, the contacting-populating apparatus 520 may slightly move in the immersion area in the x-axis direction to detect an image reflected by the flux mirror 350. Alternatively, the angle of the flux mirror 350 may be set so that a reflection angle is 90 degrees or more to transmit the image of the printing unit 321a directly to the lens. In addition, the flux mirror may be fixed to be driven directly.
In the same manner as in the flux light 340, the flux mirror 350 is not fixed to the dip plate 310, but is firmly over the dip plate 310 to prevent mutual interference between the dip plate 310 and the flux tank 320 during the sliding of the dip plate 310. In addition, the flux level may be formed in a direction perpendicular to the sliding direction of the immersion plate 310 to prevent mutual interference between the flux-light and 37/72 37 of the contacting-type mounting apparatus (the contacting head). FIG. FIG. 13 shows that a flux center 341 is integrally formed with the flux mirror 350. A space can be guaranteed by integration between them. The flux center 341 is fixed to the flux receiving unit 311, and the flux mirror 350 is fixed to the pressure box 321. Consequently, the integration between them is not hindered. FIG. 14 shows that a flux mirror 351 is attached to the pressure box 321 and another flux mirror 352 is attached to the flux-receiving unit 311. Print marks may be formed on the surface of the flux, and therefore, the detection of an image reflected directly from the surface of the flux may be insufficient to show three-dimensional print marks. Consequently, the flux mirror 352 is attached to the side of the flux-receiving unit 311 to effectively transmit an image reflected from the print marks to the lens. Although this is shown in FIG. 14 is not shown, the flux center 340 may be attached.
As described above, FIG. 15 is a plan view of the in FIG. 13 immersion unit 301, and FIG. 16 is a plan view showing an immersion unit 303 according to another embodiment of the present invention. FIG. FIG. 15 shows that the flux center 341 and the flux mirror 350 are not provided in the moving direction (y-axis direction) of the contacting equipment 520 to avoid mutual interference with the contacting equipment 520. According to the FIGN. 9 and 10, the dip plate 310 is located between the rollover cradle 210 and the up-facing imaging device 410, and therefore, the contacting-populating device 520 moves across the dip plate 310 (in a direction perpendicular to the sliding direction of the dip plate 310). As shown in FIG. 15, the flux center 341 and the flux mirror 350 are therefore opened in opposite y-axis directions to form a mutual 38/72 38
To avoid obstruction with the Kontaktierungsbestückungsvorrichtung 520.
According to the FIGN. 5-8, the immersion plate 310 is located on the outermost side, and therefore, it is not necessary for the contacting-populating apparatus 520 to cross the immersion plate 310.
The contacting insertion device 520 moves up to the immersion area of the immersion plate 310, and then returns. Thus, a flux mirror 353 may be formed in a region other than the moving range of the contacting-populating apparatus 520 in the y-axis direction. However, the flux mirror 353 is directed to the flux-receiving unit 311, unlike the flux mirror 350 directed to the printing unit 321a. In the same manner as the flux mirror 352 directed to the flux-receiving unit 311, as shown in FIG. As shown in Figure 14, the flux mirror 353 may transmit a vivid image of the pressure marks on the flux to the lens.
Next, flip-chip bonding methods according to embodiments of the present invention will be described. FIG. 17 is a flowchart showing a flip-chip bonding method according to an embodiment of the present invention.
The flip chip bonding method includes a first pickup operation (S100) of picking up a semiconductor chip from a wafer W by the pickup unit 200. The first picking operation (S100) may include picking up and sucking a semiconductor chip (flip chip) from a wafer W and the wafer Turning over the semiconductor chip so that bumps are directed downward by the rollover pickup 210 driven by the pickup drive unit 220.
The flip-chip bonding method includes a second picking-up operation (S200) of picking up the semiconductor chip from the pickup unit 200 by the padding apparatus 520 after the first pickup operation (S100). The second pick-up operation (S200) may include sucking and picking up the semiconductor chip from the flashover pickup 39/72 39
Device 210 by the powered by the contacting head 510 and the suction head 521 having contacting assembly device 520 included.
The flip-chip bonding method may include a dipping operation (S400) of immersing the semiconductor chip in the dipping unit 300 by the contacting jig 520 after the second picking operation (S200). The plunging process (S400) may include immersing the bottom of the semiconductor chip transferred from the contacting-populating apparatus 520 into a flux accommodated in the flux-receiving unit 311 of the immersion plate 310 to cover the bumps with the flux.
After the immersion process (S400), a post-dip inspection process (S500) and a semiconductor chip inspection process (S600) may be performed simultaneously. However, an operation may begin and end during another operation, or an overlap time may exist between operations. The post immersion inspection process (S500) is a process of inspecting the immersion unit 300 by the flux imaging device 530 after the semiconductor chip is immersed. The post immersion inspection process (S500) may include detecting pressure marks formed in the flux after the semiconductor chip is dipped by the flux imager to obtain information regarding the amount or concentration of the flux and information regarding a state to which the semiconductor chip is covered with the flux.
The semiconductor chip inspection process (S600) is a process of inspecting the lower side of the semiconductor chip immersed in the immersion unit 300 by the upward-looking imaging device 410. The semiconductor chip inspection process (S600) may detect the lower side of the flux-covered semiconductor chip by the upward-looking imaging device 410 to obtain information regarding a state in which the semiconductor chip is covered with the flux and information regarding a positional error of the semiconductor chip on the suction head of the contactor mounting device 520 with respect to a reference position thereof.
The distance and the direction between the upward-looking imaging device 410 and the immersion plate 310 may correspond to that between the contacting-mounting device 520 and the flux-imaging device 530 such that the post-immersion inspection process (S500) and the semiconductor-chip inspection process (S600) are performed simultaneously , In addition, the upward-facing imaging device 410 and the immersion plate 310 are coaxially arranged in the y-axis direction, and the contacting-populating device 520 and the flux-imaging device 530 are arranged coaxially in the y-axis direction. Furthermore, the flux imaging device 530 may include an imaging mirror to reflect an image at a position spaced from the central portion of the flux imaging device 530. The correspondence with respect to the distance and the direction is interpreted as corresponding to the distance and the direction to the imaging mirror of the flux imaging device 530.
The flip-chip bonding method may include an attaching operation (S800) of attaching a semiconductor chip inspected by the up-facing imaging device 410 to a board 710 after the post-dip inspection (S500) and the semiconductor chip inspection (S600) by the bonding board 520. The attaching operation (S800) may include contacting the semiconductor chip transferred by the bonding-type mounting device 520 to a contacting position of the plate 710 located on the contacting table 720 by suction. FIG. Fig. 18 is a flowchart showing a flip-chip bonding method according to another embodiment of the present invention.
The flip-chip bonding method of this embodiment differs from the flip-chip bonding method of the previous embodiment in that a pre-dip check operation (S310) is performed at the same time as the second pick-up operation 41/72 41 (S200) , be performed. The preliminary immersion inspection process (S310) is a process of inspecting the immersion unit 300 by the flux imaging device 530 before immersing the semiconductor chip. The pre-dipping inspection process (S310) may include detecting the dip plate 310 by the flux imager 530 to obtain information as to whether the flux is proper for the semiconductor chip to be dipped. That is, information as to whether the amount of the flux is proper before the semiconductor chip is immersed or information regarding the viscosity and the flatness of the flux may be obtained before the dipping operation (S400) to detect a defectiveness of the semiconductor chip due to improper coverage of the semiconductor chip Prevent semiconductor chips with the flux.
The distance and the direction between the rollover cradle 210 and the dip plate 310 may correspond to that between the contactor mounter 520 and the flux mover 530 such that the second pickup operation (S200) and the pre-dive check operation (S310) are performed simultaneously , In addition, the rollover cradle 210 and the dip plate 310 are coaxially arranged in the y-axis direction, and the contacting-populating apparatus 520 and the flux-imposing apparatus 530 are arranged coaxially in the y-axis direction. Furthermore, the flux imaging device 530 may include an imaging mirror to reflect an image at a position spaced from the central portion of the flux imaging device 530. The correspondence in distance and direction is interpreted as correspondence in distance and direction to the imaging mirror of the flux imaging device 530. FIG. 19 is a flowchart showing a flip-chip bonding method according to an embodiment of the present invention.
The flip-chip bonding method of this embodiment is different from the flip-chip bonding method of the previous one shown in FIG. 17, in that a pre-dive check operation (S320) may be performed at the same time as the second take-up operation (S200) is performed, and that the flip-chip contacting method performs a disk check operation (S700) before Mounting process (S800) may contain. The preliminary immersion inspection process (S320) is a process of inspecting the immersion unit 300 by the plate imaging device 540 before immersing the semiconductor chip. The preliminary immersion inspection process (S320) may include detecting the immersion plate 310 by the plate imaging device 540 to obtain information as to whether the flux is proper for the semiconductor chip to be dipped. That is, information as to whether the amount of the flux is proper before the semiconductor chip is dipped or information regarding the viscosity and the flatness of the flux may be obtained before the dipping operation to prevent the semiconductor chip from being defective due to insufficient coverage of the semiconductor chip To prevent flux.
The disk inspection process (S700) is a process of checking the top of the disk 710 by the disk imaging device 540 before attaching the semiconductor chip. The board inspection process (S700) may include checking a bonding position on the board 710 on which the semiconductor chip is to be mounted, and comparing the tested bonding position with position information of the semiconductor chip obtained by the upward-facing imaging device 410 to information regarding distortion or a degree of inclination of the plate 710. Finally, the controller may compare the position information of the semiconductor chip obtained from the upward-looking imaging device 410 and the position information of the disc obtained by the plate imaging device 540 to adjust the position and angle of the suction head 521 or the contacting table 720. that the semiconductor chip is fixed to the contacting position of the plate 710 without error.
As described above, the disk imaging device 540 may perform the pre-dive checking operation (S320) in addition to the disk check operation (S700). 43/72 43
As is apparent from the above description, according to the embodiments of the present invention, the number of moving operations and the moving distance of the contacting head in a certain axial direction are lowered, thereby reducing the thermal expansion and vibration due to the movement of the contacting head and improving the UPH of the apparatus.
In addition, according to the embodiments of the present invention, the immersion unit is checked before and after the semiconductor chip is immersed, thereby improving the accuracy of the test of the flux.
In addition, according to the embodiments of the present invention, the chip inspection by the up-facing imager and the flux inspection by the flux imager are performed at the same time, thereby avoiding a time for testing the flux and thus preventing deterioration of the UPH of the apparatus becomes.
In addition, according to the embodiments of the present invention, the process of picking up the chip by the bonding insertion device and the operation of checking the immersion unit before the semiconductor chip is immersed are performed at the same time, thereby avoiding a time for testing the flux, and thus a reduction of the UPH of the apparatus is prevented.
In addition, according to the embodiments of the present invention, two or more imaging mirrors are provided to inspect the immersion unit before and after immersion using only a flux imaging device while minimizing movement of the contacting head, thereby improving the accuracy of the flux inspection In addition, the UPH of the apparatus is improved.
In addition, according to the embodiments of the present invention, the plate imaging apparatus inspects the dip plate by disposing the rollover receiver and the dip plate, thereby forming a plate
Testing of the flux is obtained by a conventional plate imaging device without providing additional flux imaging devices.
In addition, according to the embodiments of the present invention, the flux density and the flux level are used, thereby improving the accuracy of the flux inspection and detecting pressure marks in the flux more vividly.
In addition, according to the embodiments of the present invention, the printing unit is used to improve the flatness of the flux, and the image of the printing unit is detected to find and remove a flux accumulation.
Although a few embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents. 45/72

权利要求:
Claims (20)
[1]
Claims 1. A flip-chip contacting apparatus comprising: a pickup unit for picking up a semiconductor chip from a wafer which has been cut into individual semiconductor chips; a contacting head comprising a contacting insertion device for receiving the semiconductor chip from the receiving unit and fixing the picked-up semiconductor chip on a plate and a plate imaging device having a predetermined distance from one side of the contacting insertion device to a position of the plate on which the Semiconductor chip is attached to test; an immersion unit for receiving a flux in which bumps provided on a lower side of the semiconductor chip accommodated by the bonding-type mounting device are immersed; an upward-looking imaging device for inspecting the underside of the semiconductor chip accommodated by the bonding insertion device and immersed in the flux of the immersion unit; a flux-imaging device having a predetermined distance from the other side of the contacting-mounting apparatus to check a state of the flux received in the immersion unit; a drive unit for moving the contacting head and the flux imaging device to an arbitrary position in an x-y plane; and a contacting table on which the disc is located, wherein the disc imaging device inspects the immersion unit to check a state of the flux before the semiconductor chip is immersed while the bonding insertion device receives the semiconductor chip from the receiving unit, and the flux imaging device Immersion unit 46/72 46 checks to check a state of the flux after the semiconductor chip is immersed, while the upward-looking imaging device inspects the semiconductor chip accommodated by the bonding-type mounting device and immersed in the flux.
[2]
2. The flip-chip contacting apparatus according to claim 1, wherein the pickup unit, the immersion unit, and the up-facing imaging device are coaxially positioned in parallel to a y-axis and in a line parallel to a moving direction of the flux im- age apparatus, the contacting equip- ment, and the disk imaging apparatus are arranged.
[3]
The flip-chip contacting apparatus according to claim 1, wherein a distance and a direction between the bonding-loading apparatus and the board-imaging apparatus correspond to a distance and a direction between the receiving unit and the dipping unit, and a distance and a direction between the contacting-mounting apparatus and of the flux imaging device correspond to a distance and a direction between the up-facing imaging device and the immersion unit.
[4]
4. A flip-chip contacting device, comprising: a pickup unit for picking up a semiconductor chip from a wafer which has been cut into individual semiconductor chips; a contacting head comprising a contacting insertion device for receiving the semiconductor chip from the receiving unit and fixing the picked-up semiconductor chip on a plate and a plate imaging device having a predetermined distance from one side of the contacting insertion device to a position of the plate on which the Semiconductor chip is attached to test; an immersion unit for receiving a flux, into which bumps provided on a lower side of the semiconductor chip accommodated by the contacting-mounting apparatus are immersed; an upward-looking imaging device for inspecting the underside of the semiconductor chip accommodated by the bonding insertion device and immersed in the flux of the immersion unit; a flux-imaging device having a predetermined distance from the other side of the contacting-mounting apparatus to check a state of the flux received in the immersion unit; a drive unit for moving the contacting head and the flux imaging device to any position in an x-y plane; and a contacting table on which the disc is located, wherein the flux imaging device checks the immersion unit to check a state of the flux before the semiconductor chip is dipped while the bonding insertion device receives the semiconductor chip from the receiving unit, and the flux The imaging device inspects the immersion unit to inspect a state of the flux after the semiconductor chip has been immersed, while the upward-facing imaging device inspects the semiconductor chip accommodated by the bonding placement device and immersed in the flux.
[5]
5. The flip-chip contacting apparatus according to claim 4, wherein the immersion unit, the receiving unit and the up-facing imaging device are positioned coaxially parallel to a y-axis and in a line parallel to a moving direction of the flux imager, the contacting equipping device and the Plate imaging device are arranged.
[6]
The flip-chip contacting apparatus according to claim 4, wherein said flux-imaging device has a plurality of imaging mirrors arranged on an axis parallel to a direction of movement of said contacting head, and 48/72 48 having imaging mirrors: a first-side imaging mirror to reflect an image of the immersion unit before immersing the semiconductor chip; an imaging mirror of a second side to reflect an image of the immersion unit after the semiconductor chip has been immersed; and a middle imaging mirror to reflect the images reflected from the first side imaging mirror and the second side imaging mirror to the flux imaging device.
[7]
7. The flip-chip contacting device according to claim 6, wherein a length of an optical path of the image of the immersion unit via the first side imaging mirror and the middle imaging mirror is equal to a length of an optical path of the image of the immersion unit via the second side imaging mirror and the second imaging mirror mean imaging mirror is.
[8]
8. The flip-chip contacting device of claim 6, wherein the center imaging mirror has an axially rotatable diaphragm structure to reflect the image reflected by the first side imaging mirror or the second side imaging mirror.
[9]
The flip-chip contacting device according to claim 4, wherein said flux-imaging device has a plurality of imaging mirrors arranged on an axis parallel to a direction of movement of said contacting head; and the imaging mirrors include: an imaging mirror of a first side for reflecting an image of the immersion unit before the semiconductor chip is immersed; a first central imaging mirror for reflecting the image reflected from the first side imaging mirror to the flux imaging device; an imaging mirror of a second side for reflecting 49/72 49 an image of the immersion unit after the semiconductor chip has been immersed; and a second median imaging mirror for reflecting the image reflected from the imaging mirror of the second side to the flux imager.
[10]
10. The flip-chip contactor of claim 9, wherein the image of the dip unit reflected from the second side imaging mirror and the second center imaging mirror after immersion of the semiconductor chip is transmitted through the first center imaging mirror located above the second center imaging mirror and transferred to the flux imaging device.
[11]
11. The flip chip contacting device of claim 9, wherein the first median imaging mirror comprises a semitransparent mirror or a half mirror to reflect the image reflected from the first side imaging mirror to the flux imager and that of the second side imaging mirror and the second median imaging mirror reflected image to the flux imaging device.
[12]
12. The flip-chip contacting apparatus according to claim 11, wherein a length of an optical path of the image of the immersion unit via the first side imaging mirror and the first central imaging mirror is equal to a length of an optical path of the image of the immersion unit over the second side imaging mirror, the second median imaging mirror and the first median imaging mirror.
[13]
13. The flip-chip contacting device according to claim 9, wherein a distance and a direction between the contacting-mounting device and the imaging mirror of the first side correspond to a distance and a direction between the recording unit and the immersion unit, and a distance and a direction between the contacting And the imaging mirror of the second side 50/72 50 correspond to a distance and a direction between the up-facing imaging device and the immersion unit.
[14]
The flip-chip contacting apparatus according to claim 1 or 4, wherein the drive unit has a first drive unit for moving the contacting head in a y-axis direction and a second drive unit for moving the contacting head in an x-axis direction, and the flux-imaging device so the contacting head is provided that the flux-imaging device is moved together with the contacting head.
[15]
15. The flip-chip contacting apparatus according to claim 1, wherein the immersion unit comprises: an immersion plate for receiving the flux into which the semiconductor chip is immersed; and a flux tank for supplying the flux to the dip plate, the flux tank having a pressure unit formed on a dip plate contacting part, and the dip plate and the flux tank smoothing the flux while supplying the flux by relative sliding movement therebetween ,
[16]
16. The flip-chip contacting device of claim 15, wherein the dip plate slides under the flux medium tank.
[17]
17. The flip-chip contacting apparatus according to claim 15, wherein the immersion unit further comprises a lighting unit for providing light on one side of the immersion plate, and the lighting unit is opened in a moving direction of the contacting head to avoid mutual interference with the contacting head.
[18]
18. The flip-chip contacting device of claim 17, wherein the lighting unit comprises a light, a lamp, a light source or a mirror and the lighting unit is provided to the immersion unit or the pressure unit to form an image of the flux or to reflect an image of the printing unit.
[19]
19. A flip-chip bonding method, comprising: receiving a semiconductor chip from a wafer cut into individual semiconductor chips by a pickup unit; Receiving the semiconductor chip from the pickup unit by a bonding inserter movable along an x-axis and a y-axis; Inspecting a condition of a flux received in an immersion unit by a flux imager having a predetermined distance from the contacting equipping device; Immersing an underside of the semiconductor chip accommodated by the bonding insertion device in the immersion unit whose flux state has been checked; Checking a state of the flux received in the immersion unit by the flux imaging device after the semiconductor chip is immersed; Inspecting an image of the underside of the semiconductor chip immersed in the immersion unit by an upwardly facing imaging device located on a path of travel of the bonding placement device to perform an upward-looking detection; and contacting the tested semiconductor chip on a disk, wherein the testing by the flux imaging device and the pickup are performed simultaneously by a bonding insertion device, and the testing by the flux imaging device after the immersion of the semiconductor chip and the review by the upward-looking imaging device are performed simultaneously become.
[20]
20. The flip-chip bonding method using the flip-chip bonding apparatus according to any one of claims 1 to 13 and 16 to 18, which comprises flip-chip bonding method: 52/72 52 testing the dip unit by the plate imager or the flux imager to check a state of the flux before the dipping of the semiconductor chip while the semiconductor chip is being picked up by the pick-and-place device by the pickup unit; and examining the immersion unit by the flux imaging device to check a state of the flux after immersing the semiconductor chip while inspecting the semiconductor chip accommodated by the bonding insertion device and immersed in the flux by the upward-looking imaging device. 53/72

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同族专利:

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公开号 | 公开日

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CN104078373B|2018-02-02|

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TWI620255B|2018-04-01|

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法律状态:
2017-11-15| REJ| Rejection|Effective date: 20171115 |

优先权:

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KR1020130033522A|KR101425613B1|2013-03-28|2013-03-28|Flip chip bonding apparatus and flip chip bonding method|

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